M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip
部品番号: M1AFS250-2FG256I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
M1AFS250-2FG256I 概要
A Fusion FPGA is a monolithic mixed-signal programmable logic device that combines flash-based fabric, configurable analog blocks, large flash memory, and clock management circuitry on one die. Within the power-management hierarchy, it belongs to the FPGA family of programmable logic devices, sitting above CPLDs in density and below high-end SRAM FPGAs in raw performance, while uniquely offering single-chip analog-plus-digital integration.
Key differentiating features include a nonvolatile flash-based fabric that retains its configuration when powered off, Live-at-Power-Up (LAPU) operation that eliminates the need for an external configuration device, and 350 MHz system performance on an advanced 130-nm 7-layer-metal flash CMOS process. The M1 prefix denotes Fusion parts with ARM Cortex-M1 support, enabling a soft-to-hard processor migration path.
Technically, the fabric stores configuration in FlashSwitch and Flash RAM cells, so no configuration load time exists at power-up, a significant advantage over SRAM FPGAs for industrial control, and the integrated analog block provides voltage, current, and temperature monitoring channels for total-system supervision.
Typical applications include industrial automation and motor control, power supply supervision and telemetry, embedded systems requiring a single-chip CPU-plus-FPGA-plus-analog solution, and military/aerospace control electronics where nonvolatile, instant-on logic is mandated.
When designing with this part, note that the standard FG (non-green) package option carries RoHS non-compliant lead content; the FGG variant is the lead-free alternative, and both share the same footprint.
This page synthesizes distributor stock data, same-family drop-in alternatives, and design guidance not consolidated in the manufacturer datasheet.
ドロップイン代替品: M1AFS250-2FG256I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: M1AFS250-2FG256I （同一形状・フットプリント） — 相違点: Family, System Gates, Package, Process Technology, Clock Management.
クイック比較ツール — 並列比較する代替部品を選択:
M1AFS250-2FGG256I
✅ ドロップイン✓ 在庫あり
$83.12 / 個
データシートを見る →M1AFS250-2FGG256
✅ ドロップイン✓ 在庫あり
$83.12 / 個
データシートを見る →AFS250-2FG256I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
M1AFS250-1FG256I
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$96.5 / 個
データシートを見る →M1AFS600-FG256
✅ ドロップイン✓ 在庫あり
$22 / 個
データシートを見る →M1AFS250-2FG256I 最大定格＆電気的特性
| Family | Fusion (M1AFS, ARM Cortex-M1 support) |
| System Gates | 250K |
| User I/O | 114 |
| Embedded RAM Bits | 36864 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS |
| System Performance | 350 MHz |
| Processor Core | ARM Cortex-M1 (hard IP) |
| Configuration Memory | Flash-based, nonvolatile |
| Power-Up Mode | Live at Power-Up (LAPU) |
| Analog Block | Configurable analog (voltage, current, temperature monitoring) |
| パッケージ | 256-ball FBGA (256-LBGA) |
| Speed Grade | -2 |
| Temperature Range | Industrial (-40C to +85C) |
| 実装タイプ | Surface Mount |
| RoHS ステータス | RoHS Non-Compliant (contains lead; FGG variant is lead-free) |
| Packaging | Tray |
M1AFS250-2FG256I 256-ball fbga (256-lbga) ピン配置ガイド
M1AFS250-2FG256I (256-ball fbga (256-lbga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: M1AFS250-2FG256I.
詳細は データシート をご参照ください。
主な用途
M1AFS250-2FG256I の用途: 6 件s: Industrial Automation and Motor Control, Power Supply Supervision and Telemetry, Single-Chip Embedded CPU-plus-FPGA Systems, Aerospace and Defense Control Electronics, Test and Measurement Instrumentation, Building Automation and Smart Sensors.
Industrial Automation and Motor Control
The M1AFS250-2FG256I fits industrial automation because its 250K-gate flash fabric delivers deterministic, Live-at-Power-Up logic for safety interlocks, while the ARM Cortex-M1 support runs the control loop and 114 user I/O drive PWM, encoders, and sensors. Fusion's configurable analog block monitors motor phase current and heatsink temperature on-chip, eliminating a separate supervisory ADC. Because configuration is nonvolatile, the controller is functional the instant 1.5V/2.5V/3.3V rails stabilize, unlike SRAM FPGAs that wait for a configuration load. Place the FBGA-256 device near the power stage; the trade-off is the 130-nm fabric's 350 MHz ceiling, well above typical 20-100 kHz motor control rates but below high-end SERDES-class FPGAs.
おすすめ
Power Supply Supervision and Telemetry
Fusion was designed for power-supply board management: the M1AFS250-2FG256I's configurable analog block measures multiple voltage rails, current shunts, and die/board temperature, and the flash-based fabric implements closed-loop trim and housekeeping logic without any boot delay. With 36864 bits of embedded RAM for fault logs and the ARM Cortex-M1 support for protocol stacks such as PMBus-style telemetry, one 256-ball FBGA replaces a microcontroller plus supervisory ASIC plus ADC cluster. Because the fabric is nonvolatile, power-good and crowbar protection logic are active during power sequencing itself, the moment supplies cross their thresholds. The design constraint is analog channel count and accuracy, which should be validated against the Fusion datasheet's analog block specifications for your rail tolerance targets.
おすすめ
Single-Chip Embedded CPU-plus-FPGA Systems
The M1AFS250-2FG256I suits embedded systems needing a processor plus glue logic on one chip: the ARM Cortex-M1 executes application firmware while the 250K-gate fabric implements custom peripherals, bus bridges, and state machines on the same die, removing the classic MCU-plus-CPLD two-chip split. Nonvolatile flash configuration means the system runs immediately at power-up with zero external boot flash, reducing BOM cost and improving tamper resistance. 114 user I/O provide ample pin budget for display, communication, and sensor interfaces in the 256-ball FBGA. Trade-off: the Cortex-M1 is a soft/migration-oriented core clocked well below modern application processors, so choose it for control-oriented workloads up to roughly 350 MHz system fabric performance, not for compute-heavy Linux-class tasks.
おすすめ
Aerospace and Defense Control Electronics
Flash-based Fusion FPGAs have a long heritage in aerospace and defense because nonvolatile configuration removes single-event configuration-upset recovery complexity associated with SRAM FPGAs, and the M1AFS250-2FG256I's industrial -40C to +85C rating covers many avionic equipment bays. The 250K-gate fabric implements sensor interfaces, PWM generators, and voting logic, while configurable analog channels feed redundant voltage/temperature monitoring directly to the logic. Live-at-Power-Up behavior matters for payload arming and power-switch sequencing circuits that must be correct the instant power appears. Note that this specific ordering code is an industrial part, not a military-flow part; for space or full mil-temperature programs, evaluate Microchip's RTAX/RTG4 families, which are also on this site, and use Fusion for commercial-adjacent defense subassemblies.
おすすめ
Test and Measurement Instrumentation
In bench and rack instrumentation, the M1AFS250-2FG256I implements front-panel sequencing, trigger logic, and interface glue (SPI, UART, parallel buses) while its analog block self-reports rail health and board temperature for calibration logs. The 114 user I/O in a 256-ball FBGA connect ADCs, DACs, and relay banks, and 36864 bits of embedded RAM buffer measurement metadata. Instant-on flash configuration means instruments pass self-test immediately at power-up, shortening lab warm-up sequences. The ARM Cortex-M1 support can host the instrument's housekeeping firmware, replacing a discrete microcontroller. Design consideration: at 350 MHz system performance the fabric comfortably handles measurement timing in the tens of MHz, but high-speed serial acquisition front ends above that range need higher-tier FPGA families.
おすすめ
Building Automation and Smart Sensors
For building controllers, HVAC boards, and smart sensor nodes, the M1AFS250-2FG256I consolidates the supervisory MCU (ARM Cortex-M1 support), custom sensor interfaces on 114 I/O, and analog rail/temperature monitoring into one 1.5V-core device, cutting board area versus discrete MCU-plus-CPLD solutions. Nonvolatile Live-at-Power-Up configuration is valuable in unattended installations where the controller must act on power anomalies immediately, and flash security protects proprietary control algorithms. The 130-nm flash process draws modest static power, suiting always-on nodes. Design consideration: this FG256 part is RoHS non-compliant due to lead in the standard finish, so green-building products should specify the lead-free M1AFS250-2FGG256I instead, which is footprint-identical and requires no layout change.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: M1AFS250-2FG256I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | M1AFS250-2FGG256I | M1AFS250-2FGG256 | M1AFS250-1FG256I | M1AFS600-FG256 |
|---|---|---|---|---|---|
| Package | 256-ball FBGA (FG) | 256-ball FBGA (FGG) - same | 256-ball FBGA (FGG) - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250K | 250K | 250K | 250K | 600K |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| ARM Cortex-M1 Support | Yes (M1 prefix) | Yes | Yes | Yes | Yes (M1 variant) |
| Configuration Memory | Flash, nonvolatile, LAPU | Flash, nonvolatile, LAPU | Flash, nonvolatile, LAPU | Flash, nonvolatile, LAPU | Flash, nonvolatile, LAPU |
主な差別化要因
- Instant-on nonvolatile fabric （vs M1AFS600-FG256)
- Lead-free compliance option, identical footprint （vs M1AFS250-2FGG256I)
- Industrial temperature rating （vs M1AFS250-2FGG256)
- Mixed-signal integration （vs A3PE600-2FG256I)
設計ノート
Watch the ordering-code suffixes: the FG (standard) finish on this part is RoHS Non-Compliant and contains lead per distributor data, while FGG is the lead-free green package. Mixing FG and FGG in one BOM creates compliance documentation problems for export to RoHS jurisdictions even though they are footprint-identical. Similarly, I (industrial, -40C to +85C) versus no-suffix (commercial) variants must not be substituted silently in industrial or outdoor designs. Verify all four code fields (speed grade, package, finish, temperature) on incoming material labels.
The Fusion 250K device uses a 1.5V core supply, with separate I/O supply rails per Fusion family specifications. Because the flash fabric is nonvolatile and Live at Power-Up, I/O behavior during rail ramp is defined by the fabric contents, not a configuration controller - your power-sequencing design must assume the FPGA is instantly active. Decouple the 1.5V core with bulk plus high-frequency ceramic capacitors near the FBGA ball-out, and verify worst-case core current against the datasheet power calculator for your specific design rather than the family typical values.
The 256-ball FBGA (1.0 mm pitch class) requires an escape-routed PCB with via-in-pad or dog-bone fanout; plan at least four layers so the 1.5V core and I/O planes get solid, low-inductance returns. Do not route the configurable analog monitoring inputs across switching nodes such as gate drives - Fusion analog channels feed the fabric directly, and coupling into them corrupts supervision readings. Follow Microchip's Fusion PCB layout guidelines in the family datasheet for ball-map escape patterns and analog grounding.
At the -2 speed grade the fabric supports up to 350 MHz system performance, but source-synchronous interface margins depend on I/O bank supply and your trace topology, not just the speed grade. Keep length-matched pairs within the vendor-recommended tolerance for clock-forwarded buses, and reserve the FBGA's inner ball rows for power and ground so high-speed I/O occupy perimeter banks with short escapes. Simulate any interface above roughly 100 MHz with IBIS models from Microchip rather than relying on rule-of-thumb stub lengths.
コンプライアンス情報
Per digchip distributor data, M1AFS250-2FG256I is RoHS Non-Compliant and Contains Lead (standard FG finish). The FGG suffix variant (M1AFS250-2FGG256I) is the lead-free, RoHS-compliant alternative. REACH, halogen-free, and conflict-minerals status were not stated in the provided data.
