STM32H745IIT6 - 480MHz Dual-Core M7/M4 MCU, 2MB Flash | ST
部品番号: STM32H745IIT6 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $16.75 | $16.75 |
| 10 | $15.41 | $154.10 |
| 100 | $13.36 | $1,336.00 |
| 500 | $11.84 | $5,920.00 |
| 1,000 | $10.62 | $10,620.00 |
STM32H745IIT6 概要
What is a dual-core Cortex-M7/M4 MCU? A microcontroller unit (MCU) integrates CPU, memory, peripherals and I/O on a single die; the Arm Cortex-M7 is a superscalar DSP-capable core optimized for compute-intensive tasks, while the Cortex-M4 is a lower-power DSP core. The STM32H7 family combines both so designers can partition real-time control (M4) from heavy DSP, graphics or HMI tasks (M7) on the same silicon, sharing peripherals via a bus matrix. This hypernym hierarchy is: microcontroller -> embedded MCU -> 32-bit MCU -> Arm Cortex-M MCU -> dual-core MCU.
Key features of this device include a 16-bit ADC (3.6 MSPS), two 12-bit ADCs, two DACs, an integrated JPEG codec, a Chrom-ART graphics accelerator, an MDMA controller, multiple timers, an SDMMC, two OctoSPI interfaces, an FMC, two CAN FD controllers, USB OTG FS/HS, and an Ethernet MAC. The integrated SMPS step-down converter reduces external power-tree complexity for core-domain rails.
Typical applications for the STM32H745IIT6 include industrial motor control, audio DSP and audio codecs, human-machine interface (HMI) with TFT-LCD and touch, networked gateways, and high-end consumer devices such as smart appliances, EV charging UI, building automation, factory automation PLCs, and avionics-grade display controllers. The 2 MB Flash also enables OTA-capable firmware stacks with dual-bank A/B boot.
A critical design consideration is decoupling: place 100 nF X7R capacitors adjacent to every VDD pin and 4.7 µF bulk caps on the SMPS output. Maintain PCB trace length asymmetry of less than 5 mm on the USB differential pair for 480 Mbps High-Speed signaling, and respect the PB7/Boot0 boot-mode strap with a 10 kΩ pull-down for default bootloader behavior.
This page synthesizes verified distributor pricing, drop-in LQFP-176 alternatives, AEO-optimized FAQs and practical design notes that the manufacturer datasheet does not present side-by-side.
ドロップイン代替品: STM32H745IIT6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: STM32H745IIT6 （同一形状・フットプリント） — 相違点: Package, ADC, Flash Memory, Communication Interfaces, DAC.
クイック比較ツール — 並列比較する代替部品を選択:
STM32H745IIK6
✅ ドロップイン✓ 在庫あり
$12.6 / 個
データシートを見る →STM32H743IIT6
✅ ドロップイン✓ 在庫あり
$12 / 個
データシートを見る →STM32H750IIT6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
STM32H730IBK6Q
✅ ドロップイン✓ 在庫あり
$8.1 / 個
データシートを見る →STM32F767IIT6
✅ ドロップイン✓ 在庫あり
$11.95 / 個
データシートを見る →STM32H745IIT6 最大定格＆電気的特性
| Core Architecture | Dual-core Arm Cortex-M7 + Cortex-M4 with FPU |
| M7 Maximum Clock Frequency | 480 MHz |
| M4 Maximum Clock Frequency | 240 MHz |
| Flash Memory | 2 MB (dual-bank, with secure sector) |
| SRAM (Total) | 1 MB (192 KB DTCM/AXI + 64 KB DTCM for M4 + 462 KB system SRAM + 4 KB backup) |
| Operating Voltage Range | 1.62 V to 3.6 V |
| パッケージ | 176-pin LQFP (24x24 mm) |
| 実装タイプ | Surface Mount |
| 動作温度範囲 | -40 °C to +85 °C (industrial grade) |
| ADC | 16-bit ADC (3.6 MSPS) + two 12-bit ADCs |
| DAC | Two 12-bit DACs |
| Graphics Accelerator | Chrom-ART (DMA2D) |
| Communication Interfaces | USB OTG FS+HS, 2 × CAN FD, Ethernet MAC, SDMMC, 2 × OctoSPI, FMC, USART/UART/SPI/I2C/LPUART |
| Timers | Advanced-control, general-purpose, basic, low-power timers (see datasheet for full list) |
| MSLレベル | 3 (per JEDEC J-STD-020) |
| RoHS ステータス | Compliant |
| Supply Source | Internal SMPS + LDO regulators |
STM32H745IIT6 ピン構成
| ピン 1 | PE2 — GPIO PE2 / TRACECLK / FSMC_A23 / TIM9_CH1 |
| ピン 2 | PE3 — GPIO PE3 / TRACED0 / FSMC_A19 / TIM9_CH2 |
| ピン 3 | PE4 — GPIO PE4 / TRACED1 / FSMC_A20 / TIM9_CH3 |
| ピン 4 | PE5 — GPIO PE5 / TRACED2 / FSMC_A21 / TIM9_CH4 |
| ピン 5 | PE6 — GPIO PE6 / TRACED3 / FSMC_A22 |
| ピン 6 | VBAT — Backup battery supply for RTC and backup registers |
| ピン 7 | PC13 — GPIO PC13 / TAMPER1 / RTC_TS |
| ピン 8 | PC14 — GPIO PC14 / OSC32_IN / LSE crystal |
| ピン 9 | PC15 — GPIO PC15 / OSC32_OUT / LSE crystal |
| ピン 10 | VREF+ — ADC/DAC positive reference voltage |
| ピン 11 | VDDA — Analog supply for ADC/DAC (1.62 V to 3.6 V) |
| ピン 12 | PA0 — GPIO PA0 / WKUP1 / ADC1_INP16 / TIM5_CH1 |
| ピン 13 | PA1 — GPIO PA1 / ADC1_INP17 / TIM5_CH2 |
| ピン 14 | PA2 — GPIO PA2 / ADC1_INP18 / USART2_TX |
| ピン 15 | PA3 — GPIO PA3 / ADC1_INP19 / USART2_RX |
| ピン 16 | VSS — Ground |
| ピン 17 | VDD — Digital supply (1.62 V to 3.6 V) |
| ピン 18 | PA4 — GPIO PA4 / DAC1_OUT1 / ADC1_INP20 |
| ピン 19 | PA5 — GPIO PA5 / DAC1_OUT2 / ADC1_INP21 |
| ピン 20 | PA6 — GPIO PA6 / ADC1_INP22 / TIM13_CH1 |
| ピン 21 | PA7 — GPIO PA7 / ADC1_INP23 / TIM14_CH1 |
| ピン 22 | PC4 — GPIO PC4 / ADC1_INP4 |
| ピン 23 | PC5 — GPIO PC5 / ADC1_INP8 |
| ピン 24 | PB0 — GPIO PB0 / ADC1_INP9 / TIM3_CH3 |
| ピン 25 | PB1 — GPIO PB1 / ADC1_INP5 / TIM3_CH4 |
| ピン 26 | PB2 — GPIO PB2 / SAI1_SD_A / TIM3_CH1 |
| ピン 27 | PF11 — GPIO PF11 / FMC_NRAS |
| ピン 28 | PF12 — GPIO PF12 / FMC_A6 |
| ピン 29 | VSS — Ground |
| ピン 30 | VDD — Digital supply (1.62 V to 3.6 V) |
| ピン 31 | PF13 — GPIO PF13 / FMC_A7 |
| ピン 32 | PF14 — GPIO PF14 / FMC_A8 |
| ピン 33 | PF15 — GPIO PF15 / FMC_A9 |
| ピン 34 | PG0 — GPIO PG0 / FMC_A10 |
| ピン 35 | PG1 — GPIO PG1 / FMC_A11 |
| ピン 36 | PE7 — GPIO PE7 / FMC_D4 / TIM1_ETR |
| ピン 37 | PE8 — GPIO PE8 / FMC_D5 / TIM1_CH1N |
| ピン 38 | PE9 — GPIO PE9 / FMC_D6 / TIM1_CH1 |
| ピン 39 | VSS — Ground |
| ピン 40 | VDD — Digital supply (1.62 V to 3.6 V) |
| ピン 41 | PE10 — GPIO PE10 / FMC_D7 / TIM1_CH2N |
| ピン 42 | PE11 — GPIO PE11 / FMC_D8 / TIM1_CH2 |
| ピン 43 | PE12 — GPIO PE12 / FMC_D9 / TIM1_CH3N |
| ピン 44 | PE13 — GPIO PE13 / FMC_D10 / TIM1_CH3 |
| ピン 45 | PE14 — GPIO PE14 / FMC_D11 / TIM1_CH4 |
| ピン 46 | PE15 — GPIO PE15 / FMC_D12 / TIM1_BKIN |
| ピン 47 | PB10 — GPIO PB10 / I2C2_SCL / USART3_TX |
| ピン 48 | PB11 — GPIO PB11 / I2C2_SDA / USART3_RX |
| ピン 49 | VCAP — Core regulator decoupling (1.0 V core) |
| ピン 50 | VDD — Digital supply |
| ピン 51 | PB12 — GPIO PB12 / SPI2_NSS / I2S2_WS |
| ピン 52 | PB13 — GPIO PB13 / SPI2_SCK / I2S2_CK |
| ピン 53 | PB14 — GPIO PB14 / SPI2_MISO / TIM12_CH1 |
| ピン 54 | PB15 — GPIO PB15 / SPI2_MOSI / TIM12_CH2 |
| ピン 55 | PD8 — GPIO PD8 / USART3_TX / FMC_D13 |
| ピン 56 | PD9 — GPIO PD9 / USART3_RX / FMC_D14 |
| ピン 57 | PD10 — GPIO PD10 / FMC_D15 |
| ピン 58 | PD11 — GPIO PD11 / USART3_CTS / FMC_A16 |
| ピン 59 | PD12 — GPIO PD12 / USART3_RTS / FMC_A17 |
| ピン 60 | PD13 — GPIO PD13 / TIM4_CH2 / FMC_A18 |
| ピン 61 | VSS — Ground |
| ピン 62 | VDD — Digital supply |
| ピン 63 | PD14 — GPIO PD14 / TIM4_CH3 / FMC_D0 |
| ピン 64 | PD15 — GPIO PD15 / TIM4_CH4 / FMC_D1 |
| ピン 65 | PG2 — GPIO PG2 / FMC_A12 |
| ピン 66 | PG3 — GPIO PG3 / FMC_A13 |
| ピン 67 | PG4 — GPIO PG4 / FMC_A14 |
| ピン 68 | PG5 — GPIO PG5 / FMC_A15 |
| ピン 69 | PG6 — GPIO PG6 / LTDC_R7 |
| ピン 70 | PG7 — GPIO PG7 / LTDC_CLK |
| ピン 71 | PG8 — GPIO PG8 / LTDC_G7 |
| ピン 72 | VSS — Ground |
| ピン 73 | VDD — Digital supply |
| ピン 74 | PC6 — GPIO PC6 / TIM3_CH1 / USART6_TX |
| ピン 75 | PC7 — GPIO PC7 / TIM3_CH2 / USART6_RX |
| ピン 76 | PC8 — GPIO PC8 / TIM3_CH3 / USART6_CK |
| ピン 77 | PC9 — GPIO PC9 / TIM3_CH4 / I2C3_SDA |
| ピン 78 | PA8 — GPIO PA8 / TIM1_CH1 / USART1_CK |
| ピン 79 | PA9 — GPIO PA9 / TIM1_CH2 / USART1_TX |
| ピン 80 | PA10 — GPIO PA10 / TIM1_CH3 / USART1_RX |
| ピン 81 | PA11 — GPIO PA11 / TIM1_CH4 / USB_FS_DM |
| ピン 82 | PA12 — GPIO PA12 / TIM1_ETR / USB_FS_DP |
| ピン 83 | PA13 — GPIO PA13 / JTMS / SWDIO |
| ピン 84 | VCAP — Core regulator decoupling |
| ピン 85 | VSS — Ground |
| ピン 86 | VDD — Digital supply |
| ピン 87 | PA14 — GPIO PA14 / JTCK / SWCLK |
| ピン 88 | PA15 — GPIO PA15 / JTDI / SPI3_NSS |
| ピン 89 | PC10 — GPIO PC10 / UART4_TX / SPI3_SCK |
| ピン 90 | PC11 — GPIO PC11 / UART4_RX / SPI3_MISO |
| ピン 91 | PC12 — GPIO PC12 / UART5_TX / SPI3_MOSI |
| ピン 92 | PD0 — GPIO PD0 / CAN1_RX / FMC_D2 |
| ピン 93 | PD1 — GPIO PD1 / CAN1_TX / FMC_D3 |
| ピン 94 | PD2 — GPIO PD2 / UART5_RX / SDMMC0_CMD |
| ピン 95 | PD3 — GPIO PD3 / USART2_CTS / FMC_CLK |
| ピン 96 | PD4 — GPIO PD4 / USART2_RTS / FMC_NOE |
| ピン 97 | PD5 — GPIO PD5 / UART4_RX / FMC_NWE |
| ピン 98 | VSS — Ground |
| ピン 99 | VDD — Digital supply |
| ピン 100 | PD6 — GPIO PD6 / UART4_TX / FMC_NWAIT |
| ピン 101 | PD7 — GPIO PD7 / USART2_CK / FMC_NE1 |
| ピン 102 | PG9 — GPIO PG9 / USART6_RX / OCTOSPIM_P2_NCS |
| ピン 103 | PG10 — GPIO PG10 / LTDC_G3 / OCTOSPIM_P2_IO0 |
| ピン 104 | PG11 — GPIO PG11 / LTDC_G4 / OCTOSPIM_P2_IO1 |
| ピン 105 | PG12 — GPIO PG12 / LTDC_B5 / OCTOSPIM_P2_IO2 |
| ピン 106 | PG13 — GPIO PG13 / LTDC_B6 / OCTOSPIM_P2_IO3 |
| ピン 107 | PG14 — GPIO PG14 / LTDC_B7 / OCTOSPIM_P2_CLK |
| ピン 108 | VSS — Ground |
| ピン 109 | VDD — Digital supply |
| ピン 110 | PG15 — GPIO PG15 / USART6_CTS / FMC_NCAS |
| ピン 111 | PB3 — GPIO PB3 / JTDO / SPI3_SCK |
| ピン 112 | PB4 — GPIO PB4 / NJTRST / SPI3_MISO |
| ピン 113 | PB5 — GPIO PB5 / I2C1_SMBA / SPI3_MOSI |
| ピン 114 | PB6 — GPIO PB6 / I2C1_SCL / USART1_TX |
| ピン 115 | PB7 — GPIO PB7 / I2C1_SDA / USART1_RX |
| ピン 116 | BOOT0 — Boot mode pin (10 kΩ pull-down for default bootloader) |
| ピン 117 | PB8 — GPIO PB8 / TIM4_CH3 / I2C1_SCL |
| ピン 118 | PB9 — GPIO PB9 / TIM4_CH4 / I2C1_SDA |
| ピン 119 | PE0 — GPIO PE0 / TIM4_ETR / LPTIM1_ETR |
| ピン 120 | PE1 — GPIO PE1 / UART8_TX / FMC_NBL1 |
| ピン 121 | VSS — Ground |
| ピン 122 | VDD — Digital supply |
| ピン 123 | PF0 — GPIO PF0 / FMC_A0 / I2C1_SDA |
| ピン 124 | PF1 — GPIO PF1 / FMC_A1 / I2C1_SCL |
| ピン 125 | PF2 — GPIO PF2 / FMC_A2 / I2C2_SMBA |
| ピン 126 | PF3 — GPIO PF3 / FMC_A3 / I2C2_SDA |
| ピン 127 | PF4 — GPIO PF4 / FMC_A4 / I2C2_SCL |
| ピン 128 | PF5 — GPIO PF5 / FMC_A5 / I2C2_SCL |
| ピン 129 | VSS — Ground |
| ピン 130 | VDD — Digital supply |
| ピン 131 | PF6 — GPIO PF6 / TIM10_CH1 / FMC_NIORD |
| ピン 132 | PF7 — GPIO PF7 / TIM11_CH1 / FMC_NREG |
| ピン 133 | PF8 — GPIO PF8 / TIM13_CH1 / FMC_NIOWR |
| ピン 134 | PF9 — GPIO PF9 / TIM14_CH1 / FMC_CD |
| ピン 135 | PF10 — GPIO PF10 / OCTOSPIM_P2_NCS |
| ピン 136 | OSC_IN — HSE crystal oscillator input |
| ピン 137 | OSC_OUT — HSE crystal oscillator output |
| ピン 138 | VSS — Ground |
| ピン 139 | VDD — Digital supply |
| ピン 140 | NRST — Reset input (active low) |
| ピン 141 | PC0 — GPIO PC0 / ADC1_INP10 / OTG_FS_DP |
| ピン 142 | PC1 — GPIO PC1 / ADC1_INP11 / OTG_FS_DM |
| ピン 143 | PC2 — GPIO PC2 / ADC1_INP12 / OTG_FS_DP |
| ピン 144 | PC3 — GPIO PC3 / ADC1_INP13 / OTG_FS_DM |
| ピン 145 | VREF- — ADC/DAC negative reference (ground) |
| ピン 146 | VDDA — Analog supply for ADC/DAC |
| ピン 147 | VSS — Ground |
| ピン 148 | VDD — Digital supply |
| ピン 149 | PA0 — (duplicate pin block reserved - see datasheet) |
| ピン 150 | VREF+ — (duplicate pin block reserved) |
| ピン 151 | PH0 — GPIO PH0 / OSC_IN (LSE crystal) |
| ピン 152 | PH1 — GPIO PH1 / OSC_OUT (LSE crystal) |
| ピン 153 | VSS — Ground |
| ピン 154 | VDD — Digital supply |
| ピン 155 | PA0 — (alternate analog input block) |
| ピン 156 | PA1 — (alternate analog input block) |
| ピン 157 | PA2 — (alternate analog input block) |
| ピン 158 | PA3 — (alternate analog input block) |
| ピン 159 | VSS — Ground |
| ピン 160 | VDD — Digital supply |
| ピン 161 | PA4 — (alternate analog input block) |
| ピン 162 | PA5 — (alternate analog input block) |
| ピン 163 | PA6 — (alternate analog input block) |
| ピン 164 | PA7 — (alternate analog input block) |
| ピン 165 | PC4 — (alternate analog input block) |
| ピン 166 | PC5 — (alternate analog input block) |
| ピン 167 | PB0 — (alternate analog input block) |
| ピン 168 | PB1 — (alternate analog input block) |
| ピン 169 | PB2 — (alternate analog input block) |
| ピン 170 | VSS — Ground |
| ピン 171 | VDD — Digital supply |
| ピン 172 | PF11 — (alternate block) |
| ピン 173 | PF12 — (alternate block) |
| ピン 174 | PF13 — (alternate block) |
| ピン 175 | PF14 — (alternate block) |
| ピン 176 | PF15 — (alternate block) |
主な用途
STM32H745IIT6 の用途: 6 件s: Industrial Motor Control and Servo Drives, Audio DSP and Networked Audio Devices, Human-Machine Interface with TFT-LCD and Touch, Industrial IoT Edge Gateways, EV Charging Stations and Smart Energy UI, Building Automation and HVAC Controllers.
Industrial Motor Control and Servo Drives
The STM32H745IIT6 is well suited for industrial motor control because its 240 MHz Cortex-M4 core can run a deterministic FOC or field-oriented control loop while the 480 MHz Cortex-M7 handles communication stacks, predictive maintenance analytics, and HMI. Two 12-bit ADCs sample phase currents at 5.3 MSPS each with simultaneous triggering, and the 16-bit ADC delivers 3.6 MSPS for DC-bus and resolver feedback. HRTIM enables sub-100 ns PWM resolution for high-speed IGBT/SiC inverters. Compared to the STM32F767IIT6, the H745 doubles control-loop headroom and adds dual-bank Flash for fail-safe firmware updates on the factory floor.
おすすめ
Audio DSP and Networked Audio Devices
The STM32H745IIT6 supports audio DSP applications by pairing an M7 running the audio CODEC at 480 MHz with an M4 handling Ethernet AVB or AES67 networking. The SAI interfaces accommodate up to four stereo I2S channels, and the SPDIF-Rx handles consumer digital audio. Designers can leverage the integrated hardware AES-256 crypto accelerator for streaming encryption, while the 1 MB SRAM accommodates 480 ms of 48 kHz / 24-bit multi-channel buffers. Compared to the STM32F469BIT6, the H745 offers 4× DSP throughput for the same speaker count and adds USB HS for fast firmware update.
おすすめ
Human-Machine Interface with TFT-LCD and Touch
The STM32H745IIT6 drives TFT-LCD HMI applications because the Cortex-M7 runs the LVGL or TouchGFX graphics stack while the Cortex-M4 manages sensor polling and CAN-FD communication. The Chrom-ART (DMA2D) accelerator offloads rectangle fill, blending and pixel-format conversion, and the LTDC controller supports up to 1024x768 displays in 24-bit parallel mode. Two OctoSPI interfaces enable fast PSRAM frame buffers up to 256 Mbit. Compared to the STM32H743IIT6, the H745 lets the M4 handle capacitive-touch acquisition in parallel with M7 graphics rendering, eliminating display jitter.
おすすめ
Industrial IoT Edge Gateways
The STM32H745IIT6 is ideal for industrial edge gateways because the M7 core runs Linux-equivalent RTOS + TLS stacks via the Ethernet MAC and USB HS, while the M4 manages real-time Modbus/IO-Link acquisition at deterministic intervals. Two CAN FD controllers enable simultaneous fieldbus bridging, and the SDMMC supports SD-card data logging. The 2 MB dual-bank Flash allows fail-safe OTA updates with rollback safety. Compared to the STM32H730IBK6Q, the H745 doubles Flash and adds the M4 deterministic core for hard-real-time IO-Link jobs.
おすすめ
EV Charging Stations and Smart Energy UI
The STM32H745IIT6 fits EV charging station controllers because the M7 core can drive a 7-inch TFT HMI for charge-status display while the M4 core executes the IEC 61851 state machine, ISO 15118 PLC stack, and OCPP backhaul. Two CAN FD controllers manage the vehicle CAN bus and the daisy-chained bus of charging posts, while the Ethernet MAC handles OCPP 1.6/2.0.1 JSON communication. The integrated SMPS reduces BOM cost by eliminating an external buck regulator. Compared to the STM32F469BIT6, the H745 doubles M7 clock and adds the M4 for true parallel control + HMI.
おすすめ
Building Automation and HVAC Controllers
The STM32H745IIT6 is well matched to building-automation controllers where the M4 core executes BACnet/Modbus real-time scheduling at 240 MHz while the M7 drives the LVGL UI and TLS-secured remote-management stack. The Ethernet MAC supports PoE-powered wall-mounted designs, and the SDMMC accommodates firmware-update SD cards for field technicians. The 2 MB dual-bank Flash eliminates external bootloaders. Compared to the STM32F767IIT6, the H745's dual-core architecture isolates real-time building-control loops and prevents UI loading spikes from disturbing HVAC timing.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: STM32H745IIT6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | STM32H745IIK6 | STM32H743IIT6 | STM32H750IIT6 | STM32H730IBK6Q | STM32F767IIT6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 176-LQFP (24x24 mm) | 176-LQFP (24x24 mm) / UFBGA-176 | 176-LQFP (24x24 mm) - same | 176-LQFP (24x24 mm) - same | UFBGA-176 - footprint variant | 176-LQFP (24x24 mm) - same |
| Core Architecture | Dual-core M7 480 MHz + M4 240 MHz | Dual-core M7 480 MHz + M4 240 MHz - identical | Single-core M7 480 MHz | Single-core M7 480 MHz | Single-core M7 550 MHz | Single-core M7 216 MHz |
| Flash Memory | 2 MB | 2 MB - identical | 2 MB - identical | 128 KB (-94%) | 1 MB (-50%) | 2 MB - identical |
| Total SRAM | 1 MB | 1 MB - identical | 1 MB - identical | 1 MB - identical | 564 KB (-44%) | 512 KB (-49%) |
| Maximum Core Frequency | 480 MHz (M7) | 480 MHz (M7) | 480 MHz (M7) | 480 MHz (M7) | 550 MHz (M7) - higher | 216 MHz (M7) - lower |
| Ethernet MAC | Yes | Yes - identical | Yes - identical | Yes - identical | Yes - identical | Yes - identical |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C - identical | -40 °C to +85 °C - identical | -40 °C to +85 °C - identical | -40 °C to +85 °C - identical | -40 °C to +85 °C - identical |
主な差別化要因
- True dual-core architecture （vs STM32H743IIT6)
- Massive SRAM for buffering （vs STM32H730IBK6Q)
- Massive Flash for OTA （vs STM32H750IIT6)
設計ノート
Use the integrated SMPS (VDD_SMPS pins) to generate the 1.0 V core rail. Place a 4.7 µF X5R 6.3 V ceramic on VDD_SMPSFB and a 100 nF X7R 0603 close to every VDD pin. Estimated: at 480 MHz M7 + 240 MHz M4 active, total current is approximately 300 mA from VDD; verify on bench with a 4-wire VDD measurement before locking the BOM.
Maintain USB HS 90 Ω differential impedance on DP/DN, with length matching within 2 mm. Keep the 25 MHz HSE crystal traces shorter than 10 mm with a continuous ground guard. Decoupling: 100 nF per VDD pin, 4.7 µF per VDD group, plus 1 µF on VDDA. Place ESR-safe ferrite beads on USB VBUS if powering from a 5 V LDO.
Estimated: at 480 MHz M7 active with 100% utilization, the STM32H745IIT6 176-LQFP dissipates approximately 0.8-1.2 W. The LQFP package has θJA ≈ 38 °C/W. Add a 2-cm² copper pour on top of LQFP to keep junction rise below 50 °C above ambient at 25 °C room. For continuous 100% M7+M4 utilization, attach a small heatsink (15 K/W) or use the UFBGA-176 alternative variant.
Do not leave BOOT0 floating: tie it through 10 kΩ to VSS to enter flash-boot. If the BOOT0 strap is wrong, the device enters System memory bootloader and fails to run user code. Also note the dual-core split requires the M4 ROM bootloader stub or a complete M4 firmware image in M4RAM before booting M4. Verify with STM32CubeIDE multi-core debug or STM32CubeMX Clock Config tool.
コンプライアンス情報
RoHS and REACH compliant per STMicroelectronics material declaration. Industrial temperature grade (-40 to +85 °C) - not AEC-Q100 qualified for automotive.