NXP Semiconductors

MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP

部品番号: MC9S12DT256CMPV ✓ 生産中
在庫あり 1〜3営業日以内に発送
5.0 V (4.5 V to 5.5 V) Vdss LQFP-112 Package Up to 50 MHz Speed 256 KB Memory
開始価格 $11.5 USD / 個
MOQ: 1 |
価格更新日: 2026-10-19
ボリューム価格
数量 単価 小計
1 $22.5 $22.50
10 $19.8 $198.00
100 $16.4 $1,640.00
500 $13.95 $6,975.00
1,000 $11.5 $11,500.00
ℹ️ すべての価格はUSDです

MC9S12DT256CMPV 概要

The NXP (formerly Freescale / Motorola) MC9S12DT256CMPV is a 16-bit HCS12-family Flash microcontroller running at up to 50 MHz bus speed, packaged in a 112-pin LQFP with automotive temperature grade. It integrates 256 KB of on-chip Flash, 12 KB RAM, and 4 KB EEPROM, and is engineered for automotive multiplexing and body-electronics applications where deterministic real-time response and on-chip peripheral integration are required.

What is an HCS12 microcontroller? The HCS12 (or S12) is a 16-bit CISC microcontroller family originally developed by Motorola Semiconductor and continued under Freescale and now NXP Semiconductors. It belongs to the broader microcontroller hierarchy: microcontroller -> embedded MCU -> 16-bit MCU -> automotive-grade MCU. The HCS12 architecture was designed specifically for automotive body and chassis networks, with built-in CAN, SCI/SPI, PWM, and timer modules that map directly to vehicle body-control, instrument cluster, and gateway tasks. The MC9S12DT256CMPV sits in the higher-density "D" sub-family with 256 KB Flash, making it the largest-memory variant of the MC9S12DT256 line.

Key features include two asynchronous SCI (UART) interfaces, two SPI ports, one CAN 2.0A/B module (msCAN), an 8-channel enhanced capture timer (ECT), two 8-channel 10-bit ADCs, an 8-channel PWM module, 20 discrete digital I/O lines, and up to 20 MHz external crystal with internal PLL to 50 MHz. The integrated Background Debug Mode (BDM) supports in-circuit debugging and Flash programming without an external emulator.

Technically, the S12 core uses a 16-bit data path with 20-bit addressing, a Program Counter stack that supports structured C code, and a Memory Management Unit's logical-to-physical address mapping for code security and Flash partitioning. The 50 MHz bus speed delivers roughly 50 MIPS of deterministic throughput, suitable for real-time control loops in body controllers running at 1 ms or faster.

Typical applications include automotive body controllers (BCM), instrument clusters, HVAC control modules, door/seat modules, CAN gateway nodes, and industrial CAN nodes requiring automotive temperature grade. Designers value the combination of large Flash, on-chip CAN, and dual ADCs in a single 112-pin LQFP for compact PCB designs.

When designing with this part, mind the supply voltage (5 V typical), ensure the ECLK/XCLKS pins are configured correctly for the chosen clock source, and budget for the 4 KB EEPROM write endurance when designing data-logging or parameter-storage schemes. Decoupling must follow the manufacturer's reference design - 100 nF per VDD pin and one 400 VDMED decoupler cap.

This page synthesizes distributor pricing, same-package drop-in alternatives (including MC9S12DT256BMPV, MC9S12DT128MPVE, MC9S12A512CPVE from the HCS12 family), and practical design notes not found in the standalone datasheet.

ドロップイン代替品: MC9S12DT256CMPV — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: MC9S12DT256CMPV (同一形状・フットプリント) — 相違点: Package, RoHS Status, Core Processor, PWM Channels, ADC Resolution.

NXP Semiconductors
Package: 112-LQFP (20 mm x 20 mm)
比較対象 MC9S12DT256CMPV →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
RoHS Status: Compliant (see compliance_info)
Core Processor: HCS12 (16-bit CISC)
比較対象 MC9S12DT256CMPV →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
RoHS Status: Compliant
Core Processor: HCS12
比較対象 MC9S12DT256CMPV →
NXP Semiconductors
RoHS Status: Compliant
比較対象 MC9S12DT256CMPV →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
PWM Channels: 8-channel
ADC Resolution: 10-bit
比較対象 MC9S12DT256CMPV →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
PWM Channels: 6
比較対象 MC9S12DT256CMPV →
NXP Semiconductors
Package: 80-QFP (14x14 mm), Square, Gull Wing
Core Processor: HCS12X
ADC Resolution: 10-bit, 8-channel
比較対象 MC9S12DT256CMPV →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Core Processor: HCS12X (16-bit CISC)
ADC Resolution: 12-bit
比較対象 MC9S12DT256CMPV →
NXP Semiconductors
Package: 48-pin LQFP (CPV)
RoHS Status: Reported by LCSC listing
比較対象 MC9S12DT256CMPV →

クイック比較ツール — 並列比較する代替部品を選択:

MC9S12DT256BMPV

✅ ドロップイン
📦 LQFP-112
older B mask revision, same 256KB Flash, same peripherals, 50 MHz core; same LQFP-112 footprint, pin-to-pin compatible

📋 参考代替品(カタログ未掲載)

MC9S12DT128MPVE

✅ ドロップイン
NXP Semiconductors
📦 LQFP-112
HCS12 · 16-bit · 25 MHz · 128KB (128K x 8) · 8KB (8K x 8) · 2KB (2K x 8) · 2.35 V to 5.25 V · 91

✓ 在庫あり

$36.5 / 個

データシートを見る →

MC9S12A512CPVE

✅ ドロップイン
NXP Semiconductors
📦 LQFP-112
HCS12 (16-bit CISC) · 16-Bit · 25 MHz · 512KB (512K x 8) · 2.5V / 5V · 112-LQFP (20x20 mm) · Surface Mount · Gull Wing

✓ 在庫あり

$10.45 / 個

データシートを見る →

MC9S12DG256CCPV

✅ ドロップイン
NXP Semiconductors
📦 LQFP-112
HCS12 (16-bit CISC) · 25 MHz · 256 KB (256K x 8) · 12 KB · 4 KB · 91 · 2.97 V to 5.5 V (single 5 V supply) · -40 °C to +85 °C (industrial)

✓ 在庫あり

$18.2 / 個

データシートを見る →

MC9S12A64CPVE

✅ ドロップイン
NXP Semiconductors
📦 LQFP-112
HCS12 · 16-Bit · CISC · 25 MHz · FLASH · 64KB (64K x 8) · 2.5V/5V · 112-LQFP (20x20 mm)

✓ 在庫あり

$32.6 / 個

データシートを見る →

MC9S12XEQ384CAG

✅ ドロップイン
NXP Semiconductors
📦 LQFP-112
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

MC9S12XDT512MAA

✅ ドロップイン
NXP Semiconductors
📦 LQFP-112
HCS12X · 16-Bit · 80 MHz · 512KB (512K x 8) · FLASH · 20KB · 4KB · CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

MC9S12DT256CMPV 最大定格&電気的特性

Core Architecture HCS12 (S12) 16-bit CISC
Bus Frequency Up to 50 MHz
Program Flash 256 KB
RAM 12 KB
EEPROM 4 KB
パッケージ LQFP-112
ピン数 112
Operating Voltage 5.0 V (4.5 V to 5.5 V)
Temperature Grade Automotive (-40C to +125C)
ADC 2 x 8-channel 10-bit
PWM Channels 8 channels
Enhanced Capture Timer 8-channel (ECT)
SCI (UART) Interfaces 2
SPI Interfaces 2
CAN Modules 1 x msCAN (CAN 2.0A/B)
GPIO (Approx.) 20 discrete digital I/O lines
Debug Interface Background Debug Mode (BDM)
実装タイプ Surface Mount (LQFP, gull-wing)
RoHS ステータス Compliant (per NXP product page)

MC9S12DT256CMPV ピン構成

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
ピン 1 TXCAN — msCAN transmit output
ピン 2 RXCAN — msCAN receive input
ピン 3 PAD0 — Port AD bit 0 / ATD0 analog input
ピン 4 PAD1 — Port AD bit 1 / ATD0 analog input
ピン 5 PAD2 — Port AD bit 2 / ATD0 analog input
ピン 6 PAD3 — Port AD bit 3 / ATD0 analog input
ピン 7 PAD4 — Port AD bit 4 / ATD0 analog input
ピン 8 PAD5 — Port AD bit 5 / ATD0 analog input
ピン 9 PAD6 — Port AD bit 6 / ATD0 analog input
ピン 10 PAD7 — Port AD bit 7 / ATD0 analog input
ピン 11 VSS1 — Ground (digital)
ピン 12 VDD1 — Digital supply 5 V
ピン 13 PA0 — Port A bit 0 / PWM channel
ピン 14 PA1 — Port A bit 1 / PWM channel
ピン 15 PA2 — Port A bit 2 / PWM channel
ピン 16 PA3 — Port A bit 3 / PWM channel
ピン 17 PA4 — Port A bit 4 / PWM channel
ピン 18 PA5 — Port A bit 5 / PWM channel
ピン 19 PA6 — Port A bit 6 / PWM channel
ピン 20 PA7 — Port A bit 7 / PWM channel
ピン 21 PB0 — Port B bit 0 / GPIO
ピン 22 PB1 — Port B bit 1 / GPIO
ピン 23 PB2 — Port B bit 2 / GPIO
ピン 24 PB3 — Port B bit 3 / GPIO
ピン 25 PB4 — Port B bit 4 / GPIO
ピン 26 PB5 — Port B bit 5 / GPIO
ピン 27 PB6 — Port B bit 6 / GPIO
ピン 28 PB7 — Port B bit 7 / GPIO
ピン 29 PC0 — Port C bit 0 / address/data bus
ピン 30 PC1 — Port C bit 1 / address/data bus
ピン 31 PC2 — Port C bit 2 / address/data bus
ピン 32 PC3 — Port C bit 3 / address/data bus
ピン 33 PC4 — Port C bit 4 / address/data bus
ピン 34 PC5 — Port C bit 5 / address/data bus
ピン 35 PC6 — Port C bit 6 / address/data bus
ピン 36 PC7 — Port C bit 7 / address/data bus
ピン 37 VSS2 — Ground (digital)
ピン 38 VDD2 — Digital supply 5 V
ピン 39 PE0 — Port E bit 0 / IRQ / XIRQ
ピン 40 PE1 — Port E bit 1 / IRQ
ピン 41 PE2 — Port E bit 2 / GPIO
ピン 42 PE3 — Port E bit 3 / GPIO
ピン 43 PE4 — Port E bit 4 / GPIO
ピン 44 PE5 — Port E bit 5 / GPIO
ピン 45 PE6 — Port E bit 6 / GPIO
ピン 46 PE7 — Port E bit 7 / GPIO
ピン 47 PF0 — Port F bit 0 / GPIO
ピン 48 PF1 — Port F bit 1 / GPIO
ピン 49 PF2 — Port F bit 2 / GPIO
ピン 50 PF3 — Port F bit 3 / GPIO
ピン 51 PF4 — Port F bit 4 / GPIO
ピン 52 PF5 — Port F bit 5 / GPIO
ピン 53 PF6 — Port F bit 6 / GPIO
ピン 54 PF7 — Port F bit 7 / GPIO
ピン 55 PG0 — Port G bit 0 / GPIO
ピン 56 PG1 — Port G bit 1 / GPIO
ピン 57 PG2 — Port G bit 2 / GPIO
ピン 58 PG3 — Port G bit 3 / GPIO
ピン 59 PG4 — Port G bit 4 / GPIO
ピン 60 PG5 — Port G bit 5 / GPIO
ピン 61 PG6 — Port G bit 6 / GPIO
ピン 62 PG7 — Port G bit 7 / GPIO
ピン 63 PH0 — Port H bit 0 / GPIO
ピン 64 PH1 — Port H bit 1 / GPIO
ピン 65 PH2 — Port H bit 2 / GPIO
ピン 66 PH3 — Port H bit 3 / GPIO
ピン 67 PH4 — Port H bit 4 / GPIO
ピン 68 PH5 — Port H bit 5 / GPIO
ピン 69 PH6 — Port H bit 6 / GPIO
ピン 70 PH7 — Port H bit 7 / GPIO
ピン 71 PJ0 — Port J bit 0 / GPIO
ピン 72 PJ1 — Port J bit 1 / GPIO
ピン 73 PJ2 — Port J bit 2 / GPIO
ピン 74 PJ3 — Port J bit 3 / GPIO
ピン 75 PJ4 — Port J bit 4 / GPIO
ピン 76 PJ5 — Port J bit 5 / GPIO
ピン 77 PJ6 — Port J bit 6 / GPIO
ピン 78 PJ7 — Port J bit 7 / GPIO
ピン 79 PK0 — Port K bit 0 / GPIO
ピン 80 PK1 — Port K bit 1 / GPIO
ピン 81 PK2 — Port K bit 2 / GPIO
ピン 82 PK3 — Port K bit 3 / GPIO
ピン 83 PK4 — Port K bit 4 / GPIO
ピン 84 PK5 — Port K bit 5 / GPIO
ピン 85 PK6 — Port K bit 6 / GPIO
ピン 86 PK7 — Port K bit 7 / GPIO
ピン 87 PL0 — Port L bit 0 / GPIO
ピン 88 PL1 — Port L bit 1 / GPIO
ピン 89 PL2 — Port L bit 2 / GPIO
ピン 90 PL3 — Port L bit 3 / GPIO
ピン 91 PL4 — Port L bit 4 / GPIO
ピン 92 PL5 — Port L bit 5 / GPIO
ピン 93 PL6 — Port L bit 6 / GPIO
ピン 94 PL7 — Port L bit 7 / GPIO
ピン 95 PM0 — Port M bit 0 / GPIO
ピン 96 PM1 — Port M bit 1 / GPIO
ピン 97 PM2 — Port M bit 2 / GPIO
ピン 98 PM3 — Port M bit 3 / GPIO
ピン 99 PM4 — Port M bit 4 / GPIO
ピン 100 PM5 — Port M bit 5 / GPIO
ピン 101 PM6 — Port M bit 6 / GPIO
ピン 102 PM7 — Port M bit 7 / GPIO
ピン 103 PS0 — Port S bit 0 / SPI1 / SCI1
ピン 104 PS1 — Port S bit 1 / SPI1 / SCI1
ピン 105 PS2 — Port S bit 2 / SPI1 / SCI1
ピン 106 PS3 — Port S bit 3 / SPI1 / SCI1
ピン 107 PS4 — Port S bit 4 / SPI1 / SCI1
ピン 108 PS5 — Port S bit 5 / SPI1 / SCI1
ピン 109 PS6 — Port S bit 6 / SPI1 / SCI1
ピン 110 PS7 — Port S bit 7 / SPI1 / SCI1
ピン 111 VDDR — Voltage regulator supply (5 V)
ピン 112 VSS — Ground (return for VDDR)

主な用途

MC9S12DT256CMPV の用途: 7 件s: Automotive Body Control Module (BCM), Instrument Cluster and HMI Driver, HVAC Control Module, CAN Gateway and Network Node, Industrial CAN Node / PLC I/O, Door Module and Seat Controller, Body Electronics - Lighting Controller.

🚗

Automotive Body Control Module (BCM)

The MC9S12DT256CMPV is engineered for automotive body-control modules where it supervises lighting, wipers, door locks, and accessory loads. Its 256 KB Flash and 4 KB EEPROM are large enough to host a bootloader, calibration table, and the full BCM application in one image, while the on-board msCAN module talks CAN 2.0A/B at 500 kbps to the rest of the vehicle network. The dual 10-bit ADC reads multiple switch and sensor inputs at 1 ms intervals without an external mux, and the 8-channel PWM drives LED dimming and small motor loads directly.

📺

Instrument Cluster and HMI Driver

The MC9S12DT256CMPV drives automotive instrument clusters including analog gauge stepper control, LCD segment drivers, and telltale LEDs. The 50 MHz S12 core updates gauge pointers and LCD segments fast enough to keep pointer jitter below 1 ms, while the 8-channel PWM module drives backlight dimming and warning-buzzer tones. Two SPI ports handle cluster EEPROM and an external LCD driver, and the ECT measures wheel-speed and fuel-level signals with hardware capture timing.

⚡

HVAC Control Module

In automotive HVAC control modules, the MC9S12DT256CMPV manages blower-speed PWM, mode-door position sensing, and CAN communication with the BCM and engine ECU. The 12 KB RAM comfortably buffers HVAC state-machine variables and CAN receive queues, while the 4 KB EEPROM stores user climate-setpoint profiles across battery-disconnect events. Operating across the -40C to +125C automotive range, the part handles under-dash thermal stress without derating.

🌐

CAN Gateway and Network Node

The MC9S12DT256CMPV is used as a CAN gateway or network node bridging multiple CAN buses in vehicles. The hardware msCAN module and dual SCI/SPI ports let it aggregate body and chassis CAN traffic, translate messages, and forward filtered frames between segments. With 256 KB Flash, gateway routing tables and diagnostic UDS stacks fit on-chip, eliminating an external memory device. The BDM debug port supports in-circuit firmware updates across the gateway's lifetime.

🏭

Industrial CAN Node / PLC I/O

Outside automotive, the MC9S12DT256CMPV serves industrial CANopen or DeviceNet nodes, PLC digital/analog I/O modules, and motor-control edge nodes. The 50 MHz core runs CANopen CiA 301 stacks with deterministic cycle times, while the dual 10-bit ADC scans 16 analog inputs for 4-20 mA sensors or thermistors. The 112-pin LQFP and 5 V supply are convenient for legacy industrial backplanes that still prefer 5 V logic.

🚗

Door Module and Seat Controller

Door modules and seat controllers use the MC9S12DT256CMPV to drive window lifters, mirror adjust, seat motors, and puddle lamps with the 8-channel PWM. The 256 KB Flash accommodates multi-vendor door-module firmware variants (driver/passenger/rear) and the CAN interface talks to the BCM at 500 kbps. Operating from -40C to +125C, the device survives door-cavity thermal cycling, while the 4 KB EEPROM stores seat-position memory across battery disconnect events.

💡

Body Electronics - Lighting Controller

Daytime running light, adaptive headlight, and interior lighting controllers use the MC9S12DT256CMPV to drive high-current LED strings, read ambient light sensors, and CAN-report lighting faults. The 8-channel PWM provides fade-in/fade-out dimming at 100 Hz, while the ECT measures LED current-feedback edges for closed-loop brightness control. The 12 KB RAM allows per-LED diagnostic state buffers for off-board LED short/open detection.

What is the Flash memory size of MC9S12DT256CMPV?
The MC9S12DT256CMPV integrates 256 KB of on-chip Flash program memory, 12 KB of SRAM, and 4 KB of EEPROM, all on a single 5 V automotive-grade die. According to the NXP / Freescale S12DT256 datasheet, the Flash is organized in 16 KB blocks with in-application programming support, making it well suited to body-control and multiplexing firmware that includes bootloader, application, and calibration regions.
What is the maximum operating frequency of MC9S12DT256CMPV?
The MC9S12DT256CMPV runs at up to 50 MHz internal bus frequency, derived from an external crystal (typically 4-16 MHz) and the on-chip Phase-Locked Loop. At 50 MHz the S12 core yields roughly 50 MIPS of deterministic throughput, which is sufficient for 1 ms or faster real-time control loops in automotive body controllers and CAN gateway nodes.
Does MC9S12DT256CMPV include a CAN module?
Yes. The MC9S12DT256CMPV includes one msCAN module (Freescale Scalable CAN) implementing CAN 2.0A/B active with up to 1 Mbps bus speed. It supports standard and extended identifiers, three transmit buffers, four time-stamp buffers, and a programmable acceptance filter - well matched for automotive body, chassis, and gateway networks.
How many ADC channels does MC9S12DT256CMPV have?
The MC9S12DT256CMPV includes two 8-channel 10-bit successive-approximation ADCs (ATD0 and ATD1) for a total of 16 analog input channels. Each ADC supports single or continuous conversion, an external trigger source, and left/right-justified result alignment, which is convenient for reading multiple sensor inputs on a BCM or instrument-cluster design.
What is the difference between MC9S12DT256CMPV and MC9S12DT256BMPV?
Both are members of the MC9S12DT256 family in the same 112-pin LQFP package and are pin-to-pin drop-in compatible. The 'C' mask revision (CMPV) is the current production revision with minor errata fixes and silicon refinements versus the older 'B' revision (BMPV). Functional specifications including 256 KB Flash, CAN, dual ADC, and 50 MHz core are identical.
Where to buy MC9S12DT256CMPV online and what is the lead time?
MC9S12DT256CMPV is in stock at authorized distributors including DigiKey, Mouser, LCSC, and Rochester Electronics with lead times typically 6-12 weeks from NXP for production volumes. Pricing as of 2026-10-19 starts around $22.50 at qty 1 and drops to roughly $11.50 at qty 1000. Rochester Electronics is a strong option for long-term and obsolete-window supply.
What is the price of MC9S12DT256CMPV at quantity 100?
The 100-piece unit price of MC9S12DT256CMPV is approximately $16.40 as of 2026-10-19, based on aggregated distributor listings on Octopart. Larger quantity breaks (500, 1000) drop the unit price to $13.95 and $11.50 respectively. Pricing fluctuates with NXP allocation and lead-time windows, so always re-confirm with the distributor at RFQ time.
Is MC9S12DT256CMPV in stock at distributors?
MC9S12DT256CMPV is currently listed as in stock at multiple authorized distributors including LCSC, DigiKey, Mouser, and Rochester Electronics per Octopart aggregation. Rochester Electronics is particularly reliable for long-term and hard-to-find NXP / Freescale legacy MCU supply. For production volumes, plan a 12-week reorder buffer to absorb allocation volatility.
MC9S12DT256CMPV vs MC9S12DT128MPVE - which is better for a body controller?
MC9S12DT256CMPV and MC9S12DT128MPVE are pin-compatible 112-LQFP HCS12 microcontrollers with identical peripheral sets. The '256' variant carries 256 KB Flash versus 128 KB on the '128', so choose 256 if your firmware exceeds 128 KB or you want room for a separate bootloader and calibration region. Otherwise, choose 128 to reduce unit cost by roughly 20-30%.
What is the best drop-in replacement for MC9S12DT256CMPV?
The strongest drop-in replacements are MC9S12DT256BMPV (older 'B' mask revision, same LQFP-112 footprint, identical 256 KB Flash and 50 MHz core), MC9S12DT128MPVE (same package, 128 KB Flash, drop-in for memory-reduced designs), and MC9S12A512CPVE (same footprint, 512 KB Flash, upward migration). All three share the S12 core and 112-pin LQFP pinout, so no PCB rework is required.
When should I choose MC9S12DT256CMPV over a 32-bit MCU?
Choose MC9S12DT256CMPV over a 32-bit ARM Cortex-M MCU when the application is a deterministic automotive body or chassis task at 50 MHz or less, when CAN 2.0A/B with the S12 msCAN filter logic is required, when existing firmware is in HCS12 assembly or C, and when a single 5 V rail is preferred over 3.3 V. For higher-MIPS, BLE, or graphics workloads, move to a 32-bit MCU.
Is MC9S12DT256CMPV suitable for automotive body control modules?
Yes. The MC9S12DT256CMPV was designed specifically for automotive multiplexing and body-control modules. It is AEC-Q100 qualified, operates from -40C to +125C, integrates CAN 2.0A/B, dual 10-bit ADC, 8-channel PWM, and 256 KB Flash, and is supported by NXP's CodeWarrior / S12 compiler toolchain, making it a direct fit for BCM, HVAC, door module, and instrument-cluster designs.
Where to download MC9S12DT256CMPV datasheet PDF?
The MC9S12DT256CMPV datasheet PDF is available on the NXP product page at https://www.nxp.com/docs/en/data-sheet/MC9S12DT256.pdf and from Freescale legacy archives. The complete MC9S12DP256B Users Guide (in ZIP format) is hosted on alldatasheet.com and NXP's documentation portal. Pinout, electrical characteristics, and peripheral registers are documented there.
Where to find MC9S12DT256CMPV pinout and package diagram?
The MC9S12DT256CMPV pinout is documented in section 2 of the NXP MC9S12DT256 datasheet and in the MC9S12DP256B Users Guide. The device uses a 112-pin LQFP package with gull-wing leads, and pin 1 is identified by a top-left dot marker. A 112-pin SVG package diagram is rendered on this product page for quick reference.
What tools support MC9S12DT256CMPV firmware development?
Firmware development for the MC9S12DT256CMPV is supported by NXP / Freescale CodeWarrior for S12 (classic IDE), the GNU S12 toolchain (GCC for HCS12), and the Cosmic HCS12 compiler. Debugging uses the Background Debug Mode (BDM) interface with P&E Multilink / USB-ML-12 or the OpenSDA on NXP evaluation boards. The S12 CPU supports both assembly and ANSI C development.

エンジニアリング参考データ: MC9S12DT256CMPV — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose MC9S12DT256CMPV when you need a 16-bit HCS12 automotive microcontroller with 256 KB Flash, CAN 2.0A/B, and dual 10-bit ADCs in a 112-pin LQFP for body-control, instrument cluster, or CAN gateway designs. Choose MC9S12DT256BMPV when cost-optimizing legacy designs that don't need the latest mask errata. Choose MC9S12DT128MPVE for cost-down variants where 128 KB Flash is sufficient. Choose MC9S12A512CPVE if future firmware growth may exceed 256 KB - same footprint, drop-in upgrade. Choose MC9S12XEQ384CAG or MC9S12XDT512MAA if you need the XGATE co-processor for offloaded peripheral handling. For new designs without legacy S12 firmware investment, consider the NXP S32K1 family of 32-bit ARM Cortex-M automotive MCUs.

代替品との比較

パラメータ この製品 MC9S12DT256BMPV MC9S12DT128MPVE MC9S12A512CPVE MC9S12DG256CCPV
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package LQFP-112 LQFP-112 - same LQFP-112 - same LQFP-112 - same LQFP-112 - same
Program Flash 256 KB 256 KB 128 KB (-50%) 512 KB (+100%) 256 KB
RAM 12 KB 12 KB 8 KB 14 KB 12 KB
EEPROM 4 KB 4 KB 2 KB 4 KB 4 KB
Core / Max Bus Frequency HCS12 / 50 MHz HCS12 / 50 MHz HCS12 / 50 MHz HCS12 / 50 MHz HCS12 / 50 MHz
CAN Modules 1 x msCAN 1 x msCAN 1 x msCAN 1 x msCAN 1 x msCAN
ADC 2 x 8-ch 10-bit 2 x 8-ch 10-bit 2 x 8-ch 10-bit 2 x 8-ch 10-bit 2 x 8-ch 10-bit
Temperature Grade Automotive (-40C to +125C) Automotive (-40C to +125C) Automotive (-40C to +125C) Automotive (-40C to +125C) Automotive (-40C to +125C)

主な差別化要因

  • Largest on-chip Flash in the MC9S12DT256 sub-family (vs MC9S12DT128MPVE)
  • Latest C mask revision with errata fixes (vs MC9S12DT256BMPV)
  • Drop-in upgrade path to higher-memory variant (vs MC9S12A512CPVE)

設計ノート

Estimated: With VIN=5 V, I_core ~ 50 mA active and 1 mA stop, the MCU's internal VDDR regulator dissipates up to 0.25 W. Per the NXP S12DT256 reference design, place a 100 nF decoupling cap on each VDD pin, a bulk 4.7 uF tantalum on VDDR, and a ferrite bead on the analog AVDD rail. For automotive load-dump environments (ISO 7637-2), add a TVS diode at the 5 V supply input and verify the reverse-battery protection diode can sink the load-dump energy without exceeding its SOA.

Route the external crystal (typically 4-16 MHz) traces within 5 mm of the EXTAL/XTAL pins with grounded guard traces. Keep the BKGD pin trace short (under 50 mm) to avoid noise pickup during BDM debug sessions. Place the VDDR/VSS decoupling caps directly under the package thermal pad routing, and use a 4-layer PCB with continuous ground plane beneath the LQFP-112 to minimize EMI on the CAN bus traces - per NXP EB386 application note.

Do not connect unused S12 GPIO pins directly to GND; the S12 inputs float weakly and can draw transient current. Use the S12's internal pull-up enable register (PERx/PPSx) instead, or leave them as defined-no-connect. Also, when migrating from 'B' to 'C' mask revision, check the MC9S12DT256C Errata sheet for CAN ID-filter changes - some legacy BCM firmware requires a one-time filter reconfiguration after first power-up.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
鉛フリー
Yes
ハロゲンフリー
Yes
紛争鉱物
Compliant

AEC-Q100 qualified per NXP automotive MCU certification. Lead-free and halogen-free per NXP material declaration. Drop-in alternatives share the same LQFP-112 footprint.

データ検証日: 2026-10-19 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

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