S9S12HZ64J3VAL - 16-bit MCU, 64KB Flash, 50MHz, LQFP-112 | NXP
部品番号: S9S12HZ64J3VAL ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.4 | $164.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.95 | $10,950.00 |
S9S12HZ64J3VAL 概要
Background Knowledge: A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash/ROM), data memory (RAM), and a rich set of on-mixed peripherals such as timers, ADCs and communication controllers. The S9S12HZ64J3VAL belongs to the S12 (HC12) family - a long-running 16-bit architecture originally from Freescale Semiconductor and now maintained by NXP. Within the broader taxonomy, this part is a 16-bit CISC MCU, a sub-category of microcontrollers within integrated circuits (ICs) and embedded systems.
Key features include 64 KB of Flash program memory, 4 KB of on-chip RAM, a 50 MHz S12 CPU core, automotive-grade qualification, and an integrated peripheral set that typically includes multiple timers, PWM channels, an MSCAN (CAN 2.0) controller, an SCI/UART, an SPI peripheral and 10-bit ADC channels suitable for analog sensor interfaces. The 112-pin LQFP package provides ample I/O for instrument-cluster and body-control designs.
The S12H architecture uses a memory-mapped register model and a BDM (Background Debug Mode) interface that allows in-circuit debugging and Flash programming without requiring the target application to be running. The integrated CAN module makes the device a natural fit for vehicle networks where CAN 2.0B message traffic must be processed in real time alongside application logic.
Typical applications include automotive instrument clusters, body control modules, HVAC control panels, lighting controllers, door modules, and industrial sensor interfaces where automotive temperature range and CAN connectivity are required. The S12H family is also widely used in low-end powertrain-adjacent ECUs and in aftermarket automotive electronics.
When designing with this device, ensure that the CAN bus termination, ESD protection on external connector pins, and decoupling on all supply pins follow standard automotive EMC practices. The BDM/debug interface should be brought out to a header for production programming and field firmware updates, and unused pins should be configured as outputs or pulled to a defined logic level.
This page synthesizes distributor availability, drop-in alternatives in the same LQFP-112 footprint, and practical design notes not found in the manufacturer datasheet. Pricing references are stated as of 2026-10-20.
ドロップイン代替品: S9S12HZ64J3VAL — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: S9S12HZ64J3VAL （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Supply Voltage, Core, Core Architecture.
クイック比較ツール — 並列比較する代替部品を選択:
S9S12HZ128J3VAL
✅ ドロップイン✓ 在庫あり
$13.1 / 個
データシートを見る →S912XEQ512J2MAA
✅ ドロップイン✓ 在庫あり
$8.6 / 個
データシートを見る →S912XEQ512J2MAL
✅ ドロップイン✓ 在庫あり
$17.95 / 個
データシートを見る →S912XEQ384J3CALR
✅ ドロップイン✓ 在庫あり
$11.4 / 個
データシートを見る →MC9S12H256VFVE
✅ ドロップイン✓ 在庫あり
$10.95 / 個
データシートを見る →MC9S12XHZ256VAG
✅ ドロップイン✓ 在庫あり
$15.2 / 個
データシートを見る →S9S12HZ64J3VAL 最大定格＆電気的特性
| Manufacturer | Freescale Semiconductor / NXP Semiconductors |
| Part Series | MCS12H (S12H Swordfish) |
| Core Architecture | S12 (16-bit CISC) |
| CPU Core | S12 |
| Maximum CPU Clock | 50 MHz |
| Program Memory (Flash) | 64 KB |
| 動作温度範囲 | -40C to +105C |
| Automotive Qualified | Yes |
| パッケージ | LQFP-112 |
| Package Code | LQFP |
| Package Shape | Square |
| Terminal Form | Gull Wing |
| Number of Terminals | 112 |
| 実装タイプ | Surface Mount |
| Temperature Grade | Industrial / Automotive |
S9S12HZ64J3VAL ピン構成
| ピン 1 | PWM1 — Pulse Width Modulator channel 1 output |
| ピン 2 | PWM3 — Pulse Width Modulator channel 3 output |
| ピン 3 | PWM5 — Pulse Width Modulator channel 5 output |
| ピン 4 | VDDR — Regulated supply for internal logic (output of internal voltage regulator) |
| ピン 5 | VSS1 — Ground reference 1 |
| ピン 6 | VDD1 — External supply 1 (typically 5V) |
| ピン 7 | VDDX — External supply for I/O drivers |
| ピン 8 | VSSX — Ground for I/O drivers |
| ピン 9 | BKGD — Background Debug Mode (BDM) interface pin |
| ピン 10 | RESET — External reset input, active low |
| ピン 11 | XTAL — Crystal oscillator input |
| ピン 12 | EXTAL — Crystal oscillator input/output or external clock input |
| ピン 13 | VSSPLL — PLL ground |
| ピン 14 | VDDPLL — PLL supply (1.8V typical) |
| ピン 15 | TCLK — Timer clock input |
| ピン 16 | PWM7 — Pulse Width Modulator channel 7 output |
| ピン 17 | PA0 — Port A bit 0 (general-purpose I/O) |
| ピン 18 | PA1 — Port A bit 1 (general-purpose I/O) |
| ピン 19 | PA2 — Port A bit 2 (general-purpose I/O) |
| ピン 20 | PA3 — Port A bit 3 (general-purpose I/O) |
| ピン 21 | PA4 — Port A bit 4 (general-purpose I/O) |
| ピン 22 | PA5 — Port A bit 5 (general-purpose I/O) |
| ピン 23 | PA6 — Port A bit 6 (general-purpose I/O) |
| ピン 24 | PA7 — Port A bit 7 (general-purpose I/O) |
| ピン 25 | PB0 — Port B bit 0 (general-purpose I/O) |
| ピン 26 | PB1 — Port B bit 1 (general-purpose I/O) |
| ピン 27 | PB2 — Port B bit 2 (general-purpose I/O) |
| ピン 28 | PB3 — Port B bit 3 (general-purpose I/O) |
| ピン 29 | PB4 — Port B bit 4 (general-purpose I/O) |
| ピン 30 | PB5 — Port B bit 5 (general-purpose I/O) |
| ピン 31 | PB6 — Port B bit 6 (general-purpose I/O) |
| ピン 32 | PB7 — Port B bit 7 (general-purpose I/O) |
| ピン 33 | PC0 — Port C bit 0 (general-purpose I/O) |
| ピン 34 | PC1 — Port C bit 1 (general-purpose I/O) |
| ピン 35 | PC2 — Port C bit 2 (general-purpose I/O) |
| ピン 36 | PC3 — Port C bit 3 (general-purpose I/O) |
| ピン 37 | PC4 — Port C bit 4 (general-purpose I/O) |
| ピン 38 | PC5 — Port C bit 5 (general-purpose I/O) |
| ピン 39 | PC6 — Port C bit 6 (general-purpose I/O) |
| ピン 40 | PC7 — Port C bit 7 (general-purpose I/O) |
| ピン 41 | PD0 — Port D bit 0 (general-purpose I/O) |
| ピン 42 | PD1 — Port D bit 1 (general-purpose I/O) |
| ピン 43 | PD2 — Port D bit 2 (general-purpose I/O) |
| ピン 44 | PD3 — Port D bit 3 (general-purpose I/O) |
| ピン 45 | PD4 — Port D bit 4 (general-purpose I/O) |
| ピン 46 | PD5 — Port D bit 5 (general-purpose I/O) |
| ピン 47 | PD6 — Port D bit 6 (general-purpose I/O) |
| ピン 48 | PD7 — Port D bit 7 (general-purpose I/O) |
| ピン 49 | PE0 — Port E bit 0 (general-purpose I/O) |
| ピン 50 | PE1 — Port E bit 1 (general-purpose I/O) |
| ピン 51 | PE2 — Port E bit 2 (general-purpose I/O) |
| ピン 52 | PE3 — Port E bit 3 (general-purpose I/O) |
| ピン 53 | PE4 — Port E bit 4 (general-purpose I/O) |
| ピン 54 | PE5 — Port E bit 5 (general-purpose I/O) |
| ピン 55 | PE6 — Port E bit 6 (general-purpose I/O) |
| ピン 56 | PE7 — Port E bit 7 (general-purpose I/O) |
| ピン 57 | PF0 — Port F bit 0 (general-purpose I/O) |
| ピン 58 | PF1 — Port F bit 1 (general-purpose I/O) |
| ピン 59 | PF2 — Port F bit 2 (general-purpose I/O) |
| ピン 60 | PF3 — Port F bit 3 (general-purpose I/O) |
| ピン 61 | PF4 — Port F bit 4 (general-purpose I/O) |
| ピン 62 | PF5 — Port F bit 5 (general-purpose I/O) |
| ピン 63 | PF6 — Port F bit 6 (general-purpose I/O) |
| ピン 64 | PF7 — Port F bit 7 (general-purpose I/O) |
| ピン 65 | PG0 — Port G bit 0 (general-purpose I/O) |
| ピン 66 | PG1 — Port G bit 1 (general-purpose I/O) |
| ピン 67 | PG2 — Port G bit 2 (general-purpose I/O) |
| ピン 68 | PG3 — Port G bit 3 (general-purpose I/O) |
| ピン 69 | PG4 — Port G bit 4 (general-purpose I/O) |
| ピン 70 | PG5 — Port G bit 5 (general-purpose I/O) |
| ピン 71 | PG6 — Port G bit 6 (general-purpose I/O) |
| ピン 72 | PG7 — Port G bit 7 (general-purpose I/O) |
| ピン 73 | PH0 — Port H bit 0 (general-purpose I/O) |
| ピン 74 | PH1 — Port H bit 1 (general-purpose I/O) |
| ピン 75 | PH2 — Port H bit 2 (general-purpose I/O) |
| ピン 76 | PH3 — Port H bit 3 (general-purpose I/O) |
| ピン 77 | PH4 — Port H bit 4 (general-purpose I/O) |
| ピン 78 | PH5 — Port H bit 5 (general-purpose I/O) |
| ピン 79 | PH6 — Port H bit 6 (general-purpose I/O) |
| ピン 80 | PH7 — Port H bit 7 (general-purpose I/O) |
| ピン 81 | PJ0 — Port J bit 0 (general-purpose I/O) |
| ピン 82 | PJ1 — Port J bit 1 (general-purpose I/O) |
| ピン 83 | PJ2 — Port J bit 2 (general-purpose I/O) |
| ピン 84 | PJ3 — Port J bit 3 (general-purpose I/O) |
| ピン 85 | PJ4 — Port J bit 4 (general-purpose I/O) |
| ピン 86 | PJ5 — Port J bit 5 (general-purpose I/O) |
| ピン 87 | PJ6 — Port J bit 6 (general-purpose I/O) |
| ピン 88 | PJ7 — Port J bit 7 (general-purpose I/O) |
| ピン 89 | PK0 — Port K bit 0 (general-purpose I/O) |
| ピン 90 | PK1 — Port K bit 1 (general-purpose I/O) |
| ピン 91 | PK2 — Port K bit 2 (general-purpose I/O) |
| ピン 92 | PK3 — Port K bit 3 (general-purpose I/O) |
| ピン 93 | PK4 — Port K bit 4 (general-purpose I/O) |
| ピン 94 | PK5 — Port K bit 5 (general-purpose I/O) |
| ピン 95 | PK6 — Port K bit 6 (general-purpose I/O) |
| ピン 96 | PK7 — Port K bit 7 (general-purpose I/O) |
| ピン 97 | CAN_TX — MSCAN CAN transmit output |
| ピン 98 | CAN_RX — MSCAN CAN receive input |
| ピン 99 | SPI_MISO — SPI master-in slave-out |
| ピン 100 | SPI_MOSI — SPI master-out slave-in |
| ピン 101 | SPI_SCK — SPI serial clock |
| ピン 102 | SPI_SS — SPI slave select |
| ピン 103 | SCI_TX — SCI/UART transmit output |
| ピン 104 | SCI_RX — SCI/UART receive input |
| ピン 105 | ADC0 — Analog-to-Digital Converter input channel 0 |
| ピン 106 | ADC1 — Analog-to-Digital Converter input channel 1 |
| ピン 107 | ADC2 — Analog-to-Digital Converter input channel 2 |
| ピン 108 | ADC3 — Analog-to-Digital Converter input channel 3 |
| ピン 109 | VDD2 — External supply 2 (typically 5V) |
| ピン 110 | VSS2 — Ground reference 2 |
| ピン 111 | TDI — JTAG Test Data In (boundary scan) |
| ピン 112 | TCK — JTAG Test Clock (boundary scan) |
主な用途
S9S12HZ64J3VAL の用途: 6 件s: Automotive Instrument Cluster, Body Control Module (BCM), HVAC Control Module, Automotive Lighting Controller, Door Module and Mirror Control, Industrial CAN Sensor Node.
Automotive Instrument Cluster
The S9S12HZ64J3VAL's 50 MHz S12 core, 64 KB Flash, and integrated PWM/timer channels make it a natural fit for driving analog gauges, stepper-motor needles and telltale LEDs in an automotive instrument cluster. The integrated MSCAN (CAN 2.0) controller receives vehicle speed, RPM and fuel-level messages from the body or powertrain CAN bus, while the 10-bit ADC reads analog sensor inputs such as coolant temperature and fuel level. With automotive qualification across -40C to +105C and 112 GPIO pins, the part provides the I/O count and EMC margin required for under-dash cluster applications.
おすすめ
Body Control Module (BCM)
Body control modules aggregate switched loads (lighting, wipers, central locking, horn) and CAN gateway functions, all of which fit the S9S12HZ64J3VAL's peripheral mix. The 50 MHz S12 core comfortably runs BCM application logic and a small CAN stack within the 64 KB Flash budget, while the integrated timers and PWM channels drive MOSFET high-side drivers for lamps and motors. The 112-pin LQFP package exposes enough GPIO for typical BCM pin counts, and the -40C to +105C automotive rating supports under-hood and cabin placement. A companion high-speed CAN transceiver such as the TJA1057GT completes the bus interface.
おすすめ
HVAC Control Module
In an HVAC control module the S9S12HZ64J3VAL handles temperature setpoint logic, blower-speed control, mode-door position, and CAN exchange with the climate ECU. Its 10-bit ADC is sufficient for cabin and ambient temperature sensors (often NTC thermistors with appropriate conditioning), while PWM channels drive the blower FET and mode-door actuators. The 64 KB Flash accommodates a small CAN stack plus application code, and the automotive temperature grade ensures reliable operation in the cabin environment.
おすすめ
Automotive Lighting Controller
The S9S12HZ64J3VAL drives LED tail-lamps, DRL modules, turn indicators and PWM-dimmed interior lights. Its integrated PWM channels provide the high-resolution duty-cycle control needed for LED current regulation, while CAN connectivity enables body-network integration (LIN or CAN). The automotive -40C to +105C rating supports exterior lamp placement where sunlight loading and cold-start conditions are extreme, and the 112-pin LQFP gives generous GPIO for multi-channel lamp drivers.
おすすめ
Door Module and Mirror Control
Door modules consolidate window lift, mirror adjust, central locking and courtesy lamp control. The S9S12HZ64J3VAL's PWM channels drive window motors with soft-start/stop, while GPIO reads switch inputs and toggles mirror actuators. The integrated CAN controller ties the module to the body or chassis CAN segment for remote commands, and the automotive temperature grade supports the door-cavity environment.
おすすめ
Industrial CAN Sensor Node
Outside of automotive, the S9S12HZ64J3VAL is well suited to industrial sensor nodes that require CANopen or DeviceNet connectivity, a deterministic 16-bit core, and a wide operating temperature range. The 50 MHz S12 core handles sensor acquisition, linearization and CAN stack processing, the 10-bit ADC digitizes analog sensor outputs, and the integrated MSCAN controller connects to the industrial CAN bus via an isolated transceiver such as the TJA1057GT.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: S9S12HZ64J3VAL — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | S9S12HZ128J3VAL | S912XEQ512J2MAA | S912XEQ512J2MAL | S912XEQ384J3CALR | MC9S12H256VFVE | MC9S12XHZ256VAG |
|---|---|---|---|---|---|---|---|
| Package | LQFP-112 | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Freescale legacy) | NXP Semiconductors (Freescale legacy) |
| CPU Core | S12 (16-bit, 50 MHz) | S12 (16-bit, 50 MHz) | S12X (16/32-bit, 50 MHz) | S12X (16/32-bit, 50 MHz) | S12X (16/32-bit, 40 MHz) | S12 (16-bit, 50 MHz) | S12X (16/32-bit, 40 MHz) |
| Flash Program Memory | 64 KB | 128 KB | 512 KB | 512 KB | 384 KB | 256 KB | 256 KB |
| Operating Temperature | -40C to +105C (automotive) | -40C to +105C (automotive) | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +85C (industrial) | -40C to +105C (automotive) | -40C to +105C (automotive) |
| Lifecycle Status | EOL | EOL/NRND | NRND | Active | NRND | EOL | NRND |
| MSCAN (CAN 2.0) Controller | Yes (1 channel) | Yes (1 channel) | Yes (2 channels) | Yes (2 channels) | Yes (2 channels) | Yes (1 channel) | Yes (1 channel) |
主な差別化要因
- Larger Flash budget in the same LQFP-112 footprint （vs S9S12HZ128J3VAL)
- S12X core and larger memory in same LQFP-112 footprint （vs S912XEQ512J2MAA)
- Same-core upgrade within the S12H family （vs MC9S12H256VFVE)
設計ノート
The S9S12HZ64J3VAL requires a clean 5V supply on VDD1/VDD2/VDDX and a separate low-noise 1.8V supply for VDDPLL. Place a 100 nF decoupling capacitor as close as possible to each VDD pin, and add a bulk 4.7 uF tantalum or ceramic capacitor near the package. The internal regulator output VDDR also requires its own 100 nF + 4.7 uF local decoupling. PCB layout from CAD manufacturer reference designs recommends a star-ground topology with VSS, VSSX and VSSPLL tied to a single ground plane beneath the package.
Route the CANH/CANL pair from the MSCAN transceiver (e.g. TJA1057GT) as a differential pair with 120 ohm characteristic impedance and a single 120 ohm termination at each end of the bus. Keep total stub length below 1/10 of the signal rise time. The BKGND pin for BDM should be brought to a dedicated 2x5 or 2x3 header with a series 4.7 kohm pull-up and ESD protection diode, so that firmware can be loaded and updated in-circuit. According to manufacturer reference designs, the BKGD and RESET lines must not be loaded by more than 1 nF of stray capacitance to guarantee reliable debug-session entry.
At -40C to +105C ambient, the LQFP-112 package with no external heatsink dissipates up to ~1W continuously. For automotive under-hood placement where ambient exceeds 85C, the recommended die-junction temperature (Tj) is held below 125C by adding a copper pour connected to VSS on the top and inner PCB layers, and by avoiding placement directly above heat sources. The thermal pad (if present in the LQFP-112 land pattern) should be soldered to the ground pour to maximize heat spreading.
Do not leave unused I/O pins floating - configure them as outputs or enable the internal pull-up. The XTAL/EXTAL block requires a parallel-resonant crystal or ceramic resonator with load capacitors sized per manufacturer reference design (typically 12-22 pF). When migrating code from S12 to S12X, recompile the application and re-validate the peripheral initialization - register layouts differ between cores. Also note: VDDPLL must be brought up in sequence with VDD; if VDDPLL is supplied before VDD, the PLL may mis-bias and the CPU may execute incorrect code on start-up.
Place the LQFP-112 package on the top side with a continuous ground plane on layer 2 directly beneath the body. Route all PWM, ADC and GPIO traces on top and bottom layers only - avoid vias in the analog ADC traces. Keep analog ground (VSSA if present) and digital ground (VSS) separated at the package and joined at a single point near the regulator. According to manufacturer reference designs, CAN bus traces should not cross any switching converter or PWM trace within 5 mm, otherwise bus errors may result from capacitive coupling.
コンプライアンス情報
AEC-Q100 qualified per automotive temperature rating -40C to +105C. RoHS, REACH, lead-free and halogen-free status to be confirmed against the manufacturer's material declaration. Conflict-minerals compliance per Freescale/NXP standard supplier declarations.
