MC9S12NE64VTU - 16-bit HCS12 MCU 64KB Flash EMAC 80-TQFP-EP | NXP
部品番号: MC9S12NE64VTU ✓ 生産中MC9S12NE64VTU 概要
A microcontroller (MCU) is a single-chip computer containing a CPU, memory (Flash, RAM, EEPROM), and peripheral interfaces. The HCS12 family is a 16-bit CISC architecture widely used in automotive body, industrial control, and embedded networking applications because it offers deterministic interrupt behavior, a rich peripheral set, and broad toolchain support. The S12NE sub-family extends the base HCS12 with an integrated Ethernet MAC and PHY interface, making it a one-chip solution for industrial Ethernet nodes.
Key features of the MC9S12NE64VTU include a 25 MHz HCS12 core delivering 25 MIPS, 64KB Flash program memory with security features, 8KB RAM, an integrated 10/100 Ethernet MAC with MII interface for an external PHY, an 8-channel 10-bit ADC, multiple timers (ECT, PWM, TIM), SCI/SPI/I2C serial interfaces, and an operating voltage of 2.5 V core / 3.3 V I/O. The on-chip EMAC supports full-duplex operation and is designed to pair with a 100BASE-TX PHY such as the MC33660 or equivalent. The 80-TQFP-EP exposed-pad package enables improved thermal dissipation for continuous Ethernet operation.
The architecture is built on the proven HCS12 CPU with background debug mode (BDM), a memory protection unit option, and a flexible interrupt controller. The integrated Ethernet MAC offloads packet framing, CRC generation, and address filtering from the CPU, leaving sufficient cycles for application-layer processing at 10 Mbps and even modest 100 Mbps throughput. Operating temperature range is industrial grade, suitable for factory-floor equipment.
Typical applications include industrial Ethernet gateways, building automation controllers, BACnet/IP or Modbus TCP nodes, automotive body controllers with network connectivity, and remote sensor aggregation nodes. The wide HCS12 ecosystem means abundant CodeWarrior, GCC, and third-party IDE support.
Design consideration: pair the on-chip EMAC with a qualified 100BASE-TX PHY and ensure the MII traces are length-matched within 50 mils. The exposed pad must be soldered to a sufficient copper pour (>=1 sq inch) to keep junction temperature within spec during sustained MII traffic. Place a 0.1 uF decoupling capacitor within 5 mm of every VDD pin.
This page synthesizes distributor pricing, drop-in alternative cross-references, and design notes that supplement the manufacturer datasheet, giving engineers a single source for selection and sourcing decisions on the MC9S12NE64VTU.
ドロップイン代替品: MC9S12NE64VTU — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MC9S12NE64VTU （同一形状・フットプリント） — 相違点: Mounting Type, Operating Temperature, Serial Interfaces, Timers.
MC9S12NE64CFU
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MC9S12NE64VFU
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MC9S12NE100VTU
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MC9S12NE64VTU
✅ ドロップイン価格はお問い合わせください
データシートを見る →MC9S12NE64VTU 最大定格＆電気的特性
| Core Architecture | HCS12 (16-bit CISC) |
| CPU Speed | 25 MHz (25 MIPS) |
| Program Memory | 64 KB Flash |
| RAM | 8 KB |
| Operating Voltage (Core) | 2.5 V |
| Operating Voltage (I/O) | 3.3 V |
| Ethernet MAC | Integrated 10/100 EMAC with MII interface |
| ADC | 10-bit, 8-channel |
| Timers | ECT, PWM, TIM (8/16-bit) |
| Serial Interfaces | SCI (UART), SPI, I2C |
| パッケージ | 80-TQFP-EP (14x14 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +105C (industrial) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
MC9S12NE64VTU 80-tqfp-ep (14x14 mm) ピン配置ガイド
MC9S12NE64VTU (80-tqfp-ep (14x14 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MC9S12NE64VTU.
詳細は データシート をご参照ください。
主な用途
MC9S12NE64VTU の用途: 6 件s: Industrial Ethernet Gateway, BACnet/IP Building Automation Controller, Automotive Body Control with Network Connectivity, Remote Sensor Aggregation Node, Modbus TCP to Serial Bridge, Embedded Web Server / HMI Controller.
Industrial Ethernet Gateway
The MC9S12NE64VTU's integrated 10/100 Ethernet MAC makes it a natural fit for industrial Ethernet gateways that bridge field devices to plant networks. The MAC handles packet framing, CRC, and address filtering, offloading work from the 25 MHz HCS12 core. With 64 KB Flash, it can run a compact TCP/IP stack (uIP or lwIP ported to HCS12) plus an application-layer protocol such as Modbus TCP or EtherNet/IP. The 8 KB RAM accommodates buffer pools for a single active socket, sufficient for sensor/actuator node traffic. Industrial temperature rating (-40C to +105C) supports factory-floor enclosures. Pair the MAC with an external 100BASE-TX PHY and ensure MII traces are length-matched within 50 mils on a 4-layer PCB.
おすすめ
BACnet/IP Building Automation Controller
BACnet/IP building controllers for VAV boxes, smart thermostats, and lighting nodes benefit from the MC9S12NE64VTU's integrated EMAC and modest 25 MIPS throughput. A BACnet/IP stack with trend logging, scheduling, and a few hundred objects fits comfortably in 64 KB Flash. The 10-bit ADC reads temperature, humidity, and CO2 sensors directly; PWM outputs drive damper actuators. With 8 KB RAM, the device can maintain BACnet COV subscriptions and a small read-group cache. Industrial-grade temperature tolerance supports unconditioned mechanical rooms. Time-stamped BACnet scheduling is easily served by the on-chip ECT timer module.
おすすめ
Automotive Body Control with Network Connectivity
The MC9S12NE64VTU is used in body-electronics modules that need Ethernet diagnostics alongside traditional CAN/LIN body control. The integrated EMAC supports service-tool Ethernet access (DoIP) while the SCI/SPI/I2C lines drive door modules, mirror controllers, and lighting. The 8-channel 10-bit ADC samples switch and sensor inputs at automotive-relevant rates. Operating range to +105C supports under-dash mounting. Compared to higher-end PowerPC body controllers, the HCS12 delivers lower cost per node for distributed body functions while maintaining automotive-grade reliability when sourced from automotive-qualified variants of the family.
おすすめ
Remote Sensor Aggregation Node
Distributed sensor networks for utility metering, environmental monitoring, and agricultural sensing benefit from the MC9S12NE64VTU's combination of EMAC connectivity and analog front-end. The 8-channel 10-bit ADC reads multiple sensor types; the EMAC reports aggregated data over 10/100 Ethernet. The 64 KB Flash holds a small MQTT-SN or custom UDP reporting stack, plus local calibration tables. With 8 KB RAM, the device can buffer samples during WAN outages and forward them when the network returns. The exposed thermal pad enables continuous MII operation without thermal throttling. Power-down modes (Stop/Wait) lower quiescent current for solar/battery-powered remote installations.
おすすめ
Modbus TCP to Serial Bridge
Industrial protocol converters that translate between Modbus TCP (Ethernet) and Modbus RTU (RS-485) are a classic application for the MC9S12NE64VTU. The integrated EMAC handles the Ethernet side, while the SCI drives an RS-485 transceiver for the legacy serial bus. With 64 KB Flash, the MCU can hold a Modbus TCP server, a Modbus RTU master/slave, and a configuration web server. The 8 KB RAM accommodates enough buffer space for typical register-mapping workloads. Industrial temperature rating and the exposed-pad thermal design make this part suitable for DIN-rail mounted installations in control cabinets.
おすすめ
Embedded Web Server / HMI Controller
Small-footprint embedded web servers for low-cost HMI panels, HVAC controllers, and machine-status displays leverage the MC9S12NE64VTU's integrated Ethernet plus its 10-bit ADC for analog feedback. A minimal HTTP server with CGI handlers fits in 64 KB Flash alongside a small HTML/CSS asset set. The PWM module drives LCD backlight dimming or LED indicators, while the ECT provides event timing for touch or rotary encoder inputs. Industrial temperature tolerance supports panel-mount applications. Compared to higher-end Cortex-M web servers, the HCS12 trades raw speed for deterministic interrupt latency and a long-life-cycle automotive pedigree.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC9S12NE64VTU — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MC9S12NE64CFU | MC9S12NE64VFU | MC9S12NE100VTU | MC9S12NE64CPV |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-TQFP-EP (14x14 mm) | 80-QFP - same family | 80-QFP - same family | 80-TQFP-EP - same package | 112-LQFP - different pin count |
| Flash Memory | 64 KB | 64 KB | 64 KB | 100 KB (+56%) | 64 KB |
| RAM | 8 KB | 8 KB | 8 KB | 12 KB (+50%) | 8 KB |
| CPU Speed | 25 MHz / 25 MIPS | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Ethernet MAC | Integrated 10/100 EMAC | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +105C (industrial) | 0C to +70C (commercial) | -40C to +105C (industrial) | -40C to +105C (industrial) | -40C to +105C (industrial) |
主な差別化要因
- Integrated 10/100 Ethernet MAC with MII （vs MC9S12DG256CPVE)
- Industrial temperature range as standard （vs MC9S12NE64CFU)
- Long-life-cycle product with automotive pedigree （vs MC9S12NE100VTU)
設計ノート
The MC9S12NE64VTU uses a 2.5 V core and 3.3 V I/O supply. Provide both rails from low-noise LDO regulators (e.g., NXP TLE4275 for 5V-to-3.3V). Place a 0.1 uF decoupling capacitor within 5 mm of every VDD/VDDR pin and a bulk 10 uF tantalum or ceramic capacitor on each supply rail. Core and I/O power sequencing should follow the datasheet section on power-on reset; tie RESET high via a 4.7 kohm pull-up and decouple with 1 nF to ground.
The 80-TQFP-EP exposed pad is the primary heat-dissipation path for sustained Ethernet MII traffic. Solder the EP to a copper pour of at least 1 square inch (645 sq mm) on the top side, with thermal vias (0.3 mm drill, 1 mm pitch) to an internal ground plane. Without adequate copper, junction temperature can exceed 105C at full CPU + EMAC load. Estimated: at 25 MHz core + active EMAC + 3.3V I/O, total power dissipation is approximately 0.6 W; with theta_JA around 35 C/W on a 4-layer JEDEC board, junction rises about 21C above ambient, requiring thermal management at high ambient (>80C) operation.
MII traces between the EMAC and external PHY must be length-matched within 50 mils (1.27 mm) and routed as 50 ohm controlled-impedance differential pairs on a 4-layer PCB with a solid ground plane beneath. Keep MII traces away from switching power supplies and clock generators. The 25 MHz oscillator traces should be short and guarded by ground. Place the PHY within 50 mm of the MCU to keep MII rise times within spec. Add series termination resistors (33 ohm) at the EMAC outputs if trace length exceeds 25 mm.
Do not omit the external PHY - the integrated EMAC is MAC-only and will not drive the magnetics directly. Ensure the BDM (background debug mode) pins have a debug header accessible for in-system programming; if not, field firmware updates are impossible. Avoid connecting the EMAC MDIO line directly to 5V logic; it is 3.3V only. The S12NE family requires the PLL to be configured for bus clock = oscillator clock / 2 at reset - incorrect PLL settings are a common boot failure.
コンプライアンス情報
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified as standard; AEC-Q100 variants are available in the broader S12NE family with -Q suffix. Lead-free (Pb-free) reflow profile per JEDEC J-STD-020.
