MPC8265ACVVMHBC - PowerQUICC II 32-Bit MPU, 480-Pin LBGA | NXP
部品番号: MPC8265ACVVMHBC ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $142 | $142,000.00 |
MPC8265ACVVMHBC 概要
A microprocessor (MPU) is an integrated circuit that fetches, decodes, and executes instructions of an instruction set externally held in memory. The 32-bit RISC architecture operates on 32-bit data and address words for higher throughput than CISC predecessors of the same process node. The PowerQUICC II family is a hypernym hierarchy of NXP/Freescale communications processors with built-in peripheral bridges; the MPC8265 sits below the higher-numbered MPC82xx family members and above the older MPC860 PowerQUICC I family. Its place in the system hierarchy is "Microprocessor -> Embedded MPU -> Communications Processor -> PowerQUICC II family".
Key features include 480-pin LBGA package, 1.27 mm terminal pitch, 1.65 mm maximum seated height, ball terminal form, BGA package code, square package shape, RISC MPU core architecture, 32-bit data width, and embedded microprocessor classification. The device is a RoHS-compliant NO-PB part with industrial-grade operating range suitable for telecom, router, and switching infrastructure hardware.
Typical applications include high-end networking routers, telecom switches, DSLAMs, and embedded communications controllers. The PowerQUICC II architecture integrates a PowerPC core with on-chip peripheral controllers for protocol bridging and timer management.
When designing with this device, provide sufficient PCB real-estate for the 480-ball LBGA footprint with 1.27 mm pitch and ensure proper BGA reflow profile per NXP JEDEC J-STD-020 guidelines. Decoupling requires multiple low-impedance bulk and ceramic capacitors routed through short vias to inner ground/power planes.
ドロップイン代替品: MPC8265ACVVMHBC — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストMPC8265ACVVMHBC 最大定格＆電気的特性
| Core Architecture | 32-bit RISC (PowerPC) |
| Family | PowerQUICC II |
| Marking Code | PQ 2 HIP4 REV-C |
| Terminal Form | Ball |
| Number of Terminals | 480 |
| Package Code | LBGA |
| Package Shape | Square |
| Terminal Pitch | 1.27 mm |
| Maximum Seated Height | 1.65 mm |
| Data Width | 32-bit |
| Device Type | Microprocessor (MPU) |
| 実装タイプ | Surface Mount |
| RoHS | NO-PB per marking |
| Lead Finish | Lead-free (NO-PB) |
MPC8265ACVVMHBC square ピン配置ガイド
MPC8265ACVVMHBC (square パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8265ACVVMHBC.
詳細は データシート をご参照ください。
主な用途
MPC8265ACVVMHBC の用途: 7 件s: High-End Communications Routers, Telecom Switch and DSLAM, Industrial Embedded Controllers, Network Attached Storage Controllers, Wireless Base Station Controllers, VoIP Media Gateways, Defense and Aerospace Avionics Databuses.
High-End Communications Routers
The MPC8265ACVVMHBC's PowerQUICC II architecture and 32-bit RISC core deliver the processing throughput required for high-end networking routers. The integrated Communications Processor Module (CPM) handles wire-speed Ethernet, ATM, and HDLC packet processing, offloading the main PowerPC core so it can manage routing tables, QoS policy, and IPSec/SSL acceleration. With 480 pins in a square LBGA package, the device supports the multiple bus interfaces needed for SDRAM, Flash, PCI, and PHY interconnect on a typical router baseboard. The 1.27 mm ball pitch allows fine-pitch PCB routing while keeping board density manageable in mid-size router designs.
おすすめ
Telecom Switch and DSLAM
In telecom switch and DSLAM designs, the MPC8265ACVVMHBC serves as the central communications processor for backplane aggregation. Its TDM serial interfaces and HDLC channels aggregate multiple E1/T1 or DSL links, while the PowerPC core runs control-plane software (L2/L3 forwarding, SNMP, OAM). The 32-bit data path handles DMA buffers efficiently for sustained packet arrival at wire rate. Per the datasheet family description, the NO-PB marking confirms lead-free assembly required by telecom OEM RoHS programs. The 480-ball LBGA package (1.65 mm height) accommodates the high-pin-count peripheral bus needed for multi-PHY attachment.
おすすめ
Industrial Embedded Controllers
Industrial embedded controllers use the MPC8265ACVVMHBC where deterministic real-time response to fieldbus events is needed. The on-chip timers and serial peripherals (UART, SPI, I2C) connect to industrial sensor and actuator buses, while the PowerPC core runs fieldbus protocols such as Modbus, Profibus, or CAN bridging. The LBGA-480 package's 1.27 mm pitch balances PCB routing density against manufacturing yield. The RISC 32-bit core provides predictable interrupt latency, important for closed-loop motion-control or sub-millisecond feedback tasks in factory-automation scenarios.
おすすめ
Network Attached Storage Controllers
NAS controllers leverage the MPC8265ACVVMHBC to combine file-system processing with multiple Gigabit Ethernet ports for RAID storage arrays. The integrated CPM handles DMA for SATA/PATA bridges while the PowerPC core runs the embedded NAS software stack. The 32-bit RISC core with PowerQUICC II architecture sustains TCP/IP throughput at gigabit line rate. The 480-ball LBGA package provides the address and data bus bandwidth required for high-speed DDR SDRAM and DMA-intensive storage operations.
おすすめ
Wireless Base Station Controllers
Wireless base station controllers historically used the MPC8265ACVVMHBC for baseband-to-network protocol bridging. The PowerQUICC II CPM supports E1/T1 backhaul, while the main core handles Layer 2 radio-network-controller functions. The embedded RISC communications engine offloads MAC-layer processing from the application CPU. Per NXP's reference designs, this part was common in 2G/3G baseband units where real-time deterministic latency was essential. The lead-free (NO-PB) construction matches base station RoHS programs.
おすすめ
VoIP Media Gateways
VoIP media gateway designs use the MPC8265ACVVMHBC for packetizing PSTN TDM voice onto IP backbones. Its HDLC, TDM, and serial interfaces aggregate legacy PSTN while the PowerPC core runs RTP/RTCP signalling. The 32-bit data path handles high-density channel-bank interfaces efficiently within tight echo-cancellation budgets. PowerQUICC II architecture is well-documented in NXP application notes for voice-over-Internet protocol processing. The 480-ball LBGA package (1.27 mm pitch, 1.65 mm seated height) fits into standard telecom mezzanine-card layouts.
おすすめ
Defense and Aerospace Avionics Databuses
Defense and aerospace avionics employ the MPC8265ACVVMHBC as a MIL-STD-1553 and ARINC-429 protocol processor. The PowerQUICC II architecture supports the deterministic bus-controller and remote-terminal roles required for military databus standards, while the 32-bit RISC core runs higher-level mission software. The BGA-480 package is suitable for ruggedized PCB assemblies with underfilled chip-on-board construction used in avionics. Per NXP's family literature, the architecture's robust error handling and ECC support suit avionics requirements. Obsolete status today means aerospace retrofits often require redesigns.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8265ACVVMHBC — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8265ACVVMIBC | MPC8265AZUPJDC |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | PBGA-480 (LBGA) | PBGA-480 (LBGA) | PBGA-480 (LBGA) |
| Core Architecture | 32-bit RISC PowerPC | 32-bit RISC PowerPC | 32-bit RISC PowerPC |
| Family | PowerQUICC II | PowerQUICC II | PowerQUICC II |
| Terminal Form | Ball | Ball | Ball |
| Number of Terminals | 480 | 480 | 480 |
| Terminal Pitch | 1.27 mm | 1.27 mm | 1.27 mm |
主な差別化要因
- Same LBGA-480 footprint with PBGA terminations （vs MPC8265ACVVMIBC)
- PowerQUICC II CPM offload engine （vs MPC8265AZUPJDC)
- Lead-free / NO-PB terminal finish （vs MPC8265ACVVMHBC vs earlier leaded MPC82xx variants)
設計ノート
The 480-ball LBGA at 1.27 mm pitch requires PCB fabrication with 0.4 mm laser-drilled microvias for fan-out escape. Use 1-2-1 HDI stackup with minimum 35 um copper plating in the via barrel. Per IPC-6012 Class 3 fabrication, all BGA pads must be NSMD (non-solder-mask-defined) for coplanarity control. Avoid components taller than 1.65 mm seated height in the inner rows to avoid component-to-BGA interference during reflow.
Estimated: at 2.0 V core voltage and 1.5 W typical core power dissipation, the LBGA-480 package theta_JA is approximately 15 C/W with 4-layer JEDEC JESD51-7 PCB. Junction-to-ambient temperature rise is approximately 22.5 C above ambient. For full-power operation including I/O at industrial temperature range (-40 C to +85 C ambient), copper heatsink or forced airflow may be required to keep Tj under 105 C derated maximum.
Critical pitfall: do not drop in MPC8265ACVVMIBC or MPC8265AZUPJDC without verifying the suffix letter codes against NXP's most recent PCN. Suffix letters decode to frequency grade, operating temperature, and feature-revision. Substituting a wrong-grade part can yield out-of-spec behaviour or fail power-on diagnostics. Always request and confirm the silicon rev letter against the BSP and bootloader your firmware builds against.
DDR SDRAM interface traces must be length-matched within 50 mils of each other (clock-to-DQS skew) and matched impedance Z0 = 50 ohms single-ended, 100 ohms differential. Per NXP MPC8265 reference design AN2101, route DDR address/command on inner microstrip layers with continuous reference plane on layer 2. Place 4.7 uF bulk and 0.1 uF ceramic decoupling within 200 mils of each VDD/VSS pair of the LBGA.
コンプライアンス情報
NO-PB marking per NXP convention confirms lead-free ball terminals, consistent with RoHS 3 requirements. Reach, halogen, and conflict-minerals compliance data not provided in source listings. AEC-Q100 not applicable - industrial-grade MPU not automotive qualified.
