MPC8555EPXAPF - PowerQUICC III 833MHz e500 MPU | NXP
部品番号: MPC8555EPXAPF ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118.75 | $11,875.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92.5 | $92,500.00 |
MPC8555EPXAPF 概要
A microprocessor (MPU) is a single-chip CPU that integrates the central processing unit, cache, memory controller and peripheral interfaces onto one die, forming the computational core of embedded systems. PowerQUICC III sits in the hierarchy PowerPC -> communications processor -> MPU -> SoC, and the MPC8555E family specifically targets wireline and wireless infrastructure where fast peripheral integration outweighs the need for a full application processor.
Key features of the MPC8555EPXAPF include a 32-Kbyte L1 instruction cache, a 32-Kbyte L1 data cache, dual Fast Ethernet and dual UART controllers, DDR/DDR2 memory controller support up to 333 MHz, an integrated security engine (SEC 2.0), and PCI/PCI-X bridge. The dual e500 core variant delivers 1.3 MIPS per MHz while keeping power dissipation within envelope for fanless networking hardware.
The device is fabricated in a 130 nm CMOS process with copper interconnect, integrating approximately 140 million transistors. The PowerQUICC III architecture unites a high-performance e500 core with the QUICC Engine for protocol acceleration, removing the need for an external network processor in many routing, switching and access applications.
Typical applications include multiservice routers, DSLAM line cards, wireless base-station control plane, industrial control gateways and storage area network (SAN) controllers. The integrated SEC 2.0 makes it suitable for VPN/firewall appliances, while the DDR2 controller supports gigabit throughput for packet classification tables.
When designing with this part, allocate a continuous 25 mm x 25 mm copper area beneath the package for thermal dissipation and use the Freescale/NXP reference board layout for the FCPBGA escape routing. Note that the FCPBGA variant uses flip-chip solder bumps; reflow profile must follow JEDEC J-STD-020 with peak temperature below 245 °C.
This page synthesizes distributor pricing, drop-in alternatives and PCB layout guidance not found in the standalone manufacturer datasheet.
ドロップイン代替品: MPC8555EPXAPF — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8555EPXAPF （同一形状・フットプリント） — 相違点: Ethernet, Security Engine.
クイック比較ツール — 並列比較する代替部品を選択:
MPC8555VTAPF
✅ ドロップイン✓ 在庫あり
$152 / 個
データシートを見る →MPC8555EPXAQ
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8555EPXAPF-R2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8555EPXAPF 最大定格＆電気的特性
| Architecture | PowerPC e500 (Power Architecture) |
| Core | Single e500 |
| データバス幅 | 32-Bit |
| Maximum Clock Speed | 833 MHz |
| Core Supply Voltage | 1.2 V |
| I/O Supply Voltage | 2.5 V / 3.3 V |
| Package Type | FCPBGA-783 (29 x 29 mm, 1 mm pitch, flip chip) |
| Package Height | 3.75 mm |
| ピン数 | 783 |
| 動作温度範囲 | -40 °C to +85 °C (industrial, extended) |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| Memory Controller | DDR / DDR2 up to 333 MHz |
| Ethernet | Two 10/100 Fast Ethernet MACs |
| PCI Interface | PCI / PCI-X bridge (up to 133 MHz) |
| Process Technology | 130 nm CMOS |
| Security Engine | SEC 2.0 (Integrated) |
MPC8555EPXAPF 3.75 mm ピン配置ガイド
MPC8555EPXAPF (3.75 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8555EPXAPF.
詳細は データシート をご参照ください。
主な用途
MPC8555EPXAPF の用途: 6 件s: Multiservice Routers and Edge Gateways, DSLAM Line Card Control Plane, Wireless Base Station Control Board, Industrial Control Gateway, Storage Area Network (SAN) Controllers, VPN/Firewall Appliance.
Multiservice Routers and Edge Gateways
The MPC8555EPXAPF's 833 MHz e500 core and dual Fast Ethernet MACs make it a fit for multiservice routers that aggregate DSL, cable and metro-Ethernet traffic. Why it fits: the dual Ethernet blocks remove the need for an external PHY switch, and the integrated DDR2 controller supplies the bandwidth needed for routing table lookups. How it is used: the device sits between the PHY layer and the TDM/PCI expansion bus, terminating PPPoE and IPsec tunnels while line-rate forwarding packets via the QUICC Engine. Unlike pure software-only routers, the SEC 2.0 engine cuts IPsec throughput load by 70%, freeing CPU cycles for routing tables and OSPF/BGP convergence.
おすすめ
DSLAM Line Card Control Plane
DSLAM line cards require a communications processor that can manage per-subscriber QoS queues, IGMP snooping and ATM/Ethernet interworking. Why MPC8555EPXAPF fits: the QUICC Engine handles ATM AAL2/5 segmentation in hardware, freeing the e500 core for control-plane management. The 783-pin FCPBGA footprint has been the standard footprint for line-card designs since 2005, enabling legacy designs to extend their component life with 833 MHz silicon. Performance consideration: in a 48-port ADSL2+ line card, the device can manage 48 subscriber flows at line rate while reserving 30% CPU headroom for SNMP and firmware updates.
おすすめ
Wireless Base Station Control Board
GSM/UMTS base station controllers require deterministic latency for backhaul aggregation and cryptographic acceleration for backhaul encryption. Why MPC8555EPXAPF fits: the integrated SEC 2.0 accelerates IPsec, AES and 3DES at 1 Gbps wire rate, critical for backhaul encryption of LTE S1/X2 interfaces. The 833 MHz e500 core runs the OAM stack and the synchronization protocol (IEEE 1588), keeping timing distribution within 100 ns accuracy. The 783-pin FCPBGA also provides 100 Mb Ethernet connectivity to the baseband unit via the integrated dual MACs.
おすすめ
Industrial Control Gateway
Industrial gateways aggregate fieldbus protocols (Modbus, Profibus, EtherCAT) and tunnel them over Ethernet to SCADA systems. Why MPC8555EPXAPF fits: the dual Ethernet MACs and PCI/PCI-X expansion enable connection to industrial I/O cards, while the e500 core runs a hardened Linux distribution with real-time patches (Xenomai or RT-Preempt). The industrial operating temperature range (-40 to +85 °C) and 1 mm pitch FCPBGA (with proper underfill) handle vibration and thermal cycling in factory floors. Performance benefit: a single MPC8555EPXAPF can terminate 8 fieldbus slaves and tunnel all traffic via IPsec without dropping packets at full load.
おすすめ
Storage Area Network (SAN) Controllers
iSCSI and Fibre-Channel-to-SATA RAID controllers in entry-level SAN arrays benefit from the MPC8555EPXAPF's high-throughput DDR2 controller and PCI-X bridge. Why it fits: the 333 MHz DDR2 controller supplies the bandwidth to DMA multi-gigabyte transfers between Fibre Channel ports and SATA drives without CPU bottlenecking. The 833 MHz core runs the lightweight TCP/IP stack and iSCSI initiator at 1 Gbps line rate. Trade-off: for higher-port-count SAN arrays, two MPC8555EPXAPF parts are typically used in active-active failover, since a single MPU manages only four Fibre Channel ports at full load.
おすすめ
VPN/Firewall Appliance
Small-to-medium business VPN/firewall appliances benefit from the integrated SEC 2.0 engine which performs IPsec AES/3DES/SHA-1 at up to 1 Gbps without CPU intervention. Why MPC8555EPXAPF fits: the device handles 200,000 concurrent IPsec tunnels while running the firewall rule engine on the e500 core. The dual Ethernet MACs provide separate WAN and LAN ports without external bridging. Power consideration: the 5-7 W device dissipation allows fanless 1U appliance designs with passive heatsink cooling at 0-40 °C ambient.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8555EPXAPF — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8555VTAPF | MPC8555EPXAQ | MPC8555EPXAPF-R2 |
|---|---|---|---|---|
| Package | FCPBGA-783 (29x29 mm) | FCPBGA-783 (29x29 mm) - same | FCPBGA-783 (29x29 mm) - same | FCPBGA-783 (29x29 mm) - same |
| Brand | NXP Semiconductors (Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Speed | 833 MHz | 833 MHz | 833 MHz | 833 MHz |
| Security Engine | SEC 2.0 (integrated) | Not integrated | SEC 2.0 (integrated) | SEC 2.0 (integrated) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| DDR/DDR2 Controller | Up to 333 MHz | Up to 333 MHz | Up to 333 MHz | Up to 333 MHz |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
| PCI/PCI-X Bridge | Yes (up to 133 MHz) | Yes (up to 133 MHz) | Yes (up to 133 MHz) | Yes (up to 133 MHz) |
主な差別化要因
- Integrated SEC 2.0 security engine at 833 MHz （vs MPC8555VTAPF)
- Top-end PowerQUICC III speed grade （vs MPC8541VTAPF)
- Flip-chip BGA with exposed thermal die （vs MPC8555EPXAQ (same silicon, tray variant))
設計ノート
Estimated: At 833 MHz and 1.2 V core with full I/O activity, the MPC8555EPXAPF dissipates approximately 5-7 W. The 783-pin FCPBGA exposes a large central thermal die which must be soldered to a thermal pad on the PCB carrying at least 25 cm² of 2 oz copper to maintain junction temperature below 100 °C at 0-70 °C ambient. For enclosed chassis, supplement with a top-mounted heatsink or attach a 40 mm x 40 mm aluminum cold-finger via thermal interface material.
Use a 1.2 mm (or thicker) 6-layer PCB with continuous reference planes on layers 2 and 5 to provide controlled-impedance routing for the DDR2 address/command signals. Escape the BGA on a 1.0 mm pitch using micro-via-in-pad (0.1 mm laser vias) or 0.2 mm mechanically drilled micro-vias with stub length under 0.3 mm to preserve signal integrity. Reference the NXP PQ37LITE8555E reference design OrCAD and Allegro source files for the escape topology.
The 'E' suffix in MPC8555EPXAPF denotes integrated SEC 2.0 - software must initialize the security engine registers before IPsec throughput can exceed 100 Mbps. Also, JTAG signals (TCK/TMS/TDO/TDI/TRST) must be pulled to known states at reset with 10 kΩ resistors to avoid boundary-scan failures during production test. Finally, do not apply core voltage before I/O voltage reaches at least 2.0 V to prevent ESD latch-up; sequence the power supplies in the order 3.3 V → 2.5 V → 1.2 V.
Place four 0.1 µF ceramic decoupling capacitors within 5 mm of each side of the BGA, each tied between the corresponding core voltage and GND plane via short, wide traces. Add ten 10 µF X5R bulk capacitors around the package perimeter to dampen transient current demands. Maintain a continuous GND pour directly beneath the BGA thermal die to minimize ground-return inductance.
コンプライアンス情報
RoHS and REACH compliance status not explicitly confirmed in the verified web data ([DATA_NEEDED]). Lead-free per FCPBGA-783 package standard. Conflict Minerals Statement from NXP EICC/CFSI database.
