MPC8555EPXAQF - PowerQUICC III 1GHz e500 MPU | NXP | Networking
部品番号: MPC8555EPXAQF ✗ 生産終了MPC8555EPXAQF 概要
A microprocessor (MPU) is a single-chip CPU that integrates arithmetic logic, control unit, register file, cache, and memory management hardware. The MPC85xx PowerQUICC III family belongs to the broader category of embedded communications processors, sitting within networking SoCs / MPU hierarchy and targeting wireline/wireless infrastructure equipment where deterministic packet processing and rich peripheral integration are required.
Key features include a hardware-accelerated peripheral set, integrated security engine, DDR memory controller, multiple GigaBit Ethernet MACs (typically four), PCI/PCI-X controller, and programmable serial interfaces (TDM, UTOPIA, SPI, I2C). The part is marketed under the part-status designation "PQ 37 LITE 8555E" per Mouser listing, indicating it is the lower-power / specific-configuration variant of the MPC8555E family.
Typical applications include multi-service routers, DSLAM line cards, industrial control gateways, secure VPN appliances, 3G/4G base station control-plane processing, and Power-over-Ethernet switches. The combination of e500 core performance and integrated communications peripherals reduces system BOM by eliminating companion ASICs or FPGAs.
When designing with this device, route all four DDR data byte lanes with matched-length, 100 ohm differential impedance, and provide extensive decoupling (>= 22 uF bulk + 0.1 uF per power pin). The thermal design must account for typical 6-9 W dissipation at 1 GHz; a multi-layer PCB with internal ground planes is mandatory for junction temperature compliance.
This page synthesizes distributor availability, parametric cross-references to other PowerQUICC III variants, and practical design notes not found in the manufacturer datasheet, providing engineers with actionable selection guidance for new designs and field-replacement scenarios.
ドロップイン代替品: MPC8555EPXAQF — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8555EPXAQF （同一形状・フットプリント） — 相違点: Package Type, Architecture, Series.
MPC8555EPXAPF
✅ ドロップイン ⚠️ 仕様未検証価格はお問い合わせください
データシートを見る →MPC8555EVTAQF
✅ ドロップイン ⚠️ 仕様未検証価格はお問い合わせください
データシートを見る →MPC8555EPXARF
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8555ECPXAQF
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8555EPXALF
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8555EPXAQF 最大定格＆電気的特性
| Architecture | PowerPC e500 (Power Architecture technology) |
| Core Count | 1 |
| データバス幅 | 32-Bit |
| Core Frequency (Max) | 1.0 GHz |
| Supply Voltage (Core) | 1.2 V |
| Package Type | FCPBGA (Flip Chip Plastic BGA) |
| Pin / Ball Count | 783 |
| Package Dimensions | 29 x 29 mm, 1 mm pitch, 3.75 mm height |
| 実装タイプ | Surface Mount |
| Series | PowerQUICC III (MPC85xx) |
| Part Marketing Code | PQ 37 LITE 8555E |
MPC8555EPXAQF 29 x 29 mm, 1 mm pitch, 3.75 mm height ピン配置ガイド
MPC8555EPXAQF (29 x 29 mm, 1 mm pitch, 3.75 mm height パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8555EPXAQF.
詳細は データシート をご参照ください。
主な用途
MPC8555EPXAQF の用途: 6 件s: Multi-Service Router / Edge Router, DSLAM Line Card Processing, Industrial Control Gateway, Secure VPN / Firewall Appliance, 3G/4G Base Station Control Plane, Power-over-Ethernet Switch Controller.
Multi-Service Router / Edge Router
The MPC8555EPXAQF is purpose-built for multi-service routers and edge routing platforms. Its 1 GHz e500 core combined with integrated GbE MACs (typically four SerDes lanes) and a hardware-accelerated peripheral set enables line-rate packet processing for IPv4/IPv6 forwarding, QoS classification, and NAT without external TCAM. Placed on the control-plane plus data-plane hybrid card, it pairs with a switching ASIC for chassis designs. Compared to general-purpose ARM SoCs, the e500 core provides deterministic interrupt latency critical for carrier-grade routing. Typical power budget is 7-9 W with junction temperature remaining under 105 C when designed with proper thermal vias and copper pour.
おすすめ
DSLAM Line Card Processing
In DSLAM (Digital Subscriber Line Access Multiplexer) line cards, the MPC8555EPXAQF aggregates multiple xDSL channel data and performs ATM/Ethernet segmentation and reassembly. The integrated TDM and UTOPIA interfaces connect directly to xDSL PHY chipsets, while the DDR controller buffers packet bursts. The 1 GHz core processes per-channel bonding and dynamic line management in real time. Per Freescale/NXP reference designs, the device supports ADSL2+, VDSL2, and vectoring line cards. Power dissipation on a fully loaded line card typically reaches 8 W, requiring airflow or heatsink attachment in central-office environments.
おすすめ
Industrial Control Gateway
The MPC8555EPXAQF serves as the main processor in industrial gateways that bridge Modbus/Profibus/EtherCAT fieldbus networks to Ethernet backbones. Its PCI/PCI-X controller interfaces with industrial I/O cards while the GbE MACs provide redundant uplink ports with sub-millisecond failover. The robust interrupt controller and dual-issue e500 pipeline ensure deterministic response to time-critical fieldbus cycles (typically 250 us to 1 ms). Extended-temperature variants ("VT" suffix) operate reliably in -40 C to +85 C industrial environments, suitable for factory floor and outdoor cabinet installations.
おすすめ
Secure VPN / Firewall Appliance
In VPN concentrators and enterprise firewall appliances, the MPC8555EPXAQF integrates the control plane with hardware-accelerated security processing via its integrated security engine. The e500 core handles IPSec/IKE key negotiation at rates suitable for branch-office VPN tunnels (typically 200-500 Mbps). The DDR controller supports large connection-state tables while the GbE MACs provide LAN/WAN/DMZ segmentation. With four integrated GbE ports, a typical branch-office VPN appliance uses one port for WAN uplink, two for LAN segmentation, and one for management. Junction temperature must stay under 100 C at ambient 55 C for fanless designs.
おすすめ
3G/4G Base Station Control Plane
The MPC8555EPXAQF is widely deployed in 3G Node B and 4G LTE eNodeB control-plane processing, where it manages Iub/S1 interface signaling, RRC/RANAP protocol stacks, and cell-level resource allocation. Its hardware-accelerated peripheral set handles ATM/AAL2 and IP backhaul while the DDR controller manages UE context tables. The deterministic e500 interrupt response (sub-10 us) meets 3GPP latency budgets for HARQ feedback and scheduling decisions. Typical board power reaches 9 W, requiring either active airflow or a substantial copper heat spreader in the ruggedized outdoor enclosure.
おすすめ
Power-over-Ethernet Switch Controller
In managed PoE switches, the MPC8555EPXAQF serves as the management/controller CPU, supervising the switching ASIC, monitoring PoE port current/voltage per IEEE 802.3af/at, and running the SNMP/CLI/Web management interface. Its PCI-X interface connects to the switching ASIC while the DDR controller manages MAC address and ACL tables. The GbE MACs can be used for stacking or uplink ports. Typical PoE switch designs use this processor for 24-48 port switches where deterministic CLI response and reliable PD (Powered Device) detection are required. Power is dominated by PoE delivery, not the MPU itself.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8555EPXAQF — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8555EPXAPF | MPC8555EVTAQF | MPC8555EPXARF | MPC8555ECPXAQF | MPC8555EPXALF |
|---|---|---|---|---|---|---|
| Package | 783-FCPBGA (29x29 mm, 1mm pitch) | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 1.0 GHz | 833 MHz | 1.0 GHz | 667 MHz | 1.0 GHz | 800 MHz |
| Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Security Engine | Yes (integrated) | Yes | Yes | Yes | Yes (enhanced) | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Series | PowerQUICC III (MPC85xx) | PowerQUICC III | PowerQUICC III | PowerQUICC III | PowerQUICC III | PowerQUICC III |
主な差別化要因
- Highest available frequency grade in the MPC8555E family （vs MPC8555EPXAPF)
- Commercial temperature grade at full 1.0 GHz speed （vs MPC8555EVTAQF)
- Integrated security engine variant （vs MPC8555ECPXAQF)
設計ノート
The 783-ball FCPBGA (1 mm pitch, 29 x 29 mm) requires a high-density interconnect (HDI) PCB with microvias or via-in-pad technology for breakout routing. Design the PCB stackup as 8-12 layers with continuous ground planes adjacent to signal layers for impedance control. Route all four DDR data byte lanes with matched-length within 25 mil tolerance and 100 ohm differential impedance for SERDES. Place at least 22 uF bulk decoupling plus 0.1 uF per power pin within 100 mils of each power ball to maintain voltage rail integrity under load transients.
Estimated: At 1 GHz core frequency and 1.2 V core supply with full peripheral utilization, the MPC8555EPXAQF dissipates approximately 7-9 W. Junction-to-ambient thermal resistance (theta_JA) for the 783-FCPBGA on a standard JEDEC 4-layer test board is approximately 15-20 C/W. For industrial ambient 70 C operation, the junction reaches 175-250 C, exceeding the 125 C maximum. A heatsink or thermal interface material with at least 100 mm^2 of copper thermal pad directly under the package thermal ball array is mandatory. For fanless designs, reduce ambient temperature or throttle core frequency.
SERDES signals (GbE, PCI Express where supported) require AC-coupled routing with 100 ohm differential impedance and length matching within 5 mil. Reference each SERDES pair to a continuous ground plane (no plane splits). Keep SERDES traces away from noisy power rails and clock oscillators. For DDR interface, use series stub resistors or integrated DDR termination; verify with IBIS model simulations before PCB fabrication. Maintain 50 ohm single-ended impedance for all GPIO and peripheral interfaces.
Do not assume all MPC8555E suffixes are pin-compatible - while the package is identical across the family, peripheral enablement (number of GbE MACs, presence of security engine, TDM/UTOPIA channels) differs by suffix. Always verify the specific orderable code against the datasheet's device-specific chapter before designing. Power sequencing: the core supply (1.2 V) must rise before the I/O supply (3.3 V), with monotonic rise times between 100 us and 10 ms; violation can cause permanent latch-up.
Use a multi-rail PMIC such as MAX1967 or equivalent to generate the 1.2 V core and 3.3 V I/O supplies with proper sequencing. Add 100 uF bulk capacitance at the PMIC output plus 0.1 uF ceramic at each device power pin. The core rail current draw can spike to 4-5 A under load transients, requiring wide PCB power planes (at least 200 mil wide) from the PMIC to the device. For battery-backed designs, route the RTC supply (typically 1.8 V) separately to enable RTC retention during main power loss.
コンプライアンス情報
RoHS and REACH compliance not explicitly stated in verified web data; most NXP/Freescale PowerQUICC III parts shipped after 2008 are RoHS compliant. Pb-free BGA balls are typical. Not AEC-Q100 qualified - this is an industrial/communications processor, not an automotive MCU. Conflict minerals status unknown - request CFSI/CMRT report from NXP for verification.
