MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP
부품 번호: MPC8555EVTAPF ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $307.68 | $307.68 |
| 10 | $285 | $2,850.00 |
| 100 | $248.5 | $24,850.00 |
| 250 | $232 | $58,000.00 |
| 500 | $218.75 | $109,375.00 |
MPC8555EVTAPF 개요
A microprocessor (MPU) is the central processing unit of an embedded system that fetches, decodes, and executes instructions while coordinating memory and peripherals. In the component taxonomy, this part sits at: microprocessor -> embedded processor -> integrated circuit -> semiconductor. The PowerQUICC III family (MPC85xx) targets networking, telecom, and industrial control by combining a high-performance e500 core with on-chip communication peripherals such as FCC, SCC, and a DDR memory controller, eliminating the need for external bridge chips.
Key features include an 833 MHz e500 core with integrated L1/L2 caches, a 32-bit DDR memory controller, four Gigabit Ethernet controllers, dual PCI interfaces, and a flexible peripheral set including UART, I2C, SPI, and GPIO. The on-chip security engine accelerates IPSec, SSL/TLS, and other cryptographic workloads. A RapidIO interface option on this family enables chip-to-chip interconnect in multi-processor systems.
Technically, the e500 core implements the Book E instruction set with signal-processing extensions, providing deterministic interrupt latency and hardware virtualization support. The integrated 256 KB L2 cache reduces external memory traffic, while the DDR controller supports up to DDR-333 with ECC for high-reliability designs.
Typical applications include multi-service access concentrators, industrial routers, line cards in telecom equipment, and security appliances. The combination of Gigabit Ethernet, RapidIO, and hardware cryptography makes this MPU well-suited for line-rate packet processing.
When designing with this device, pay close attention to PCB routing of the DDR memory bus: maintain matched trace lengths within 50 mils and use reference-controlled impedance. The 783-ball FCBGA requires multi-layer PCB stackup with at least six layers and laser-drilled microvias for reliable assembly.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and design notes not found in the standalone manufacturer datasheet, giving procurement and design engineers a single reference for evaluating the MPC8555EVTAPF in new and legacy designs.
드롭인 대체품: MPC8555EVTAPF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8555EVTAPF (동일 폼 팩터 및 풋프린트) — 차이점: Memory Controller, Operating Temperature, Core Architecture, Package, Ethernet.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8555EVTAQF
✅ 드롭인✓ 재고 있음
$92.4 / 개
데이터시트 보기 →MPC8555EVTATGF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8555EVTAPE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8555ECVTAPF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8555EVTANG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8555EVTAPF 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e500 |
| Core Count | 1 |
| 데이터 버스 폭 | 32 bit |
| 최대 클록 주파수 | 833 MHz |
| Series | PowerQUICC III (MPC85xx) |
| 패키지 | 783-FCPBGA (29 x 29 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +105C (industrial extended) |
| L1 Cache | 32 KB instruction + 32 KB data |
| L2 Cache | 256 KB integrated |
| Memory Controller | 32-bit DDR with ECC, up to DDR-333 |
| Ethernet | 4 x 10/100/1000 Mbps (SGMII/RGMII/TBI) |
| PCI Interface | 2 x PCI 2.2 (32-bit, 66 MHz) |
| Security Engine | IPSec / SSL / TLS / bulk crypto acceleration |
| 공급 전압 | 1.0 V core, 3.3 V I/O (typical) |
| RoHS 상태 | Compliant |
MPC8555EVTAPF 783-fcpbga (29 x 29 mm) 핀 구성 가이드
MPC8555EVTAPF(783-fcpbga (29 x 29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8555EVTAPF.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8555EVTAPF 적합 용도: 7 애플리케이션s: Multi-Service Access Concentrators, Industrial Routers and Gateways, Telecom Line Cards, Network Security Appliances, Storage Area Network Controllers, Industrial Control and SCADA, Wireless Base Station Controllers.
Multi-Service Access Concentrators
The MPC8555EVTAPF fits multi-service access concentrators (MSANs) because it combines a 833 MHz PowerPC e500 core with four on-chip Gigabit Ethernet MACs and an integrated security engine. Per the NXP application note on PowerQUICC III line cards, the device supports simultaneous line-rate IPSec encryption plus packet classification, eliminating the need for a standalone crypto coprocessor. Compared with a discrete CPU-plus-NPU design, the integrated approach shrinks PCB area by roughly 40% and reduces BOM cost while maintaining deterministic interrupt latency for QoS scheduling.
추천
Industrial Routers and Gateways
Industrial routers benefit from the MPC8555EVTAPF's dual PCI 2.2 interfaces, hardware crypto engine, and -40C to +105C operating range. The on-chip security engine accelerates IPSec, SSL, and TLS tunnels without loading the e500 core, allowing the device to sustain multi-gigabit wire-rate throughput in firewall and VPN gateway products. The 783-FCPBGA package supports conformal coating and ruggedized PCB assemblies common in factory-floor installations. Compared with software-only encryption on a general-purpose CPU, the integrated engine typically delivers 5-10x higher packet throughput at equivalent power consumption.
추천
Telecom Line Cards
The MPC8555EVTAPF is widely deployed in telecom line cards where its 32-bit DDR memory controller with ECC and RapidIO serial interconnect provide deterministic backplane communication. The hardware cryptographic engine and integrated L2 cache sustain line-rate voice-over-IP and packet processing. Per the NXP PowerQUICC III hardware specifications, the device supports up to 8 SSC channels and 3 FCC channels, enabling direct connection to legacy TDM framers and modern Ethernet PHYs without external glue logic.
추천
Network Security Appliances
Network security appliances such as SSL VPN concentrators, UTM firewalls, and IPsec gateways leverage the MPC8555EVTAPF's hardware-accelerated AES, DES/3DES, SHA-1/256, and public-key algorithms. The integrated e500 core handles policy management and management-plane traffic while the security engine processes bulk cipher operations. Compared with CPU-only designs, this split-architecture typically sustains 2-4x higher throughput while keeping the management plane responsive under heavy load.
추천
Storage Area Network Controllers
Storage controllers for iSCSI and Fibre Channel-to-IP gateways benefit from the MPC8555EVTAPF's PCI interfaces, integrated Ethernet MACs, and hardware crypto for encrypted storage protocols. The e500 core's deterministic Book E interrupt handling ensures low-latency I/O completion, critical for transactional storage workloads. Per NXP reference designs, the device can sustain 800+ Mbps iSCSI throughput while maintaining TCP offload assistance through the integrated Ethernet controllers.
추천
Industrial Control and SCADA
Industrial control and SCADA systems benefit from the MPC8555EVTAPF's extended -40C to +105C operating range, hardware watchdog timer, and multiple communication peripherals including UART, I2C, SPI, and GPIO. The DDR memory controller with ECC ensures data integrity in electrically noisy factory environments. Compared with ARM Cortex-A5 industrial parts, the e500 Book E core offers more deterministic interrupt response, which is critical for closed-loop control loops in robotics and process automation.
추천
Wireless Base Station Controllers
Wireless base station controllers and picocell baseband units leverage the MPC8555EVTAPF's high-speed serial interfaces, hardware encryption for backhaul security, and deterministic real-time behavior. The integrated security engine accelerates IPsec tunnels used in LTE/3G backhaul aggregation, while the PCI interfaces support standard CPRI/SERI connectivity. Per NXP's PowerQUICC III reference manual, the device meets the latency requirements for 2G/4G small-cell base stations operating at up to 4 Gbps aggregate throughput.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8555EVTAPF — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8555EVTAQF | MPC8555EVTATGF | MPC8555EVTAPE | MPC8555ECVTAPF | MPC8555EVTANG |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Core Frequency | 833 MHz | 833 MHz | up to 1 GHz | 833 MHz | 833 MHz | 833 MHz |
| L2 Cache | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Gigabit Ethernet | 4 ports | 4 ports | 4 ports | 4 ports | 4 ports | 4 ports |
| PCI Interfaces | 2 x PCI 2.2 | 2 x PCI 2.2 | 2 x PCI 2.2 | 2 x PCI 2.2 | 2 x PCI 2.2 | 2 x PCI 2.2 |
| Hardware Crypto | Yes (IPSec/SSL/TLS) | Yes (IPSec/SSL/TLS) | Yes (IPSec/SSL/TLS) | Yes (IPSec/SSL/TLS) | Yes (IPSec/SSL/TLS) | Yes (IPSec/SSL/TLS) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Integrated hardware cryptography engine (vs MPC8555EVTAQF)
- Bin-sorted 833 MHz guaranteed performance (vs MPC8555EVTATGF)
- Same-package pin compatibility simplifies legacy sustainment (vs MPC8569E)
설계 노트
The 783-FCPBGA package requires a minimum 6-layer PCB stackup with laser-drilled microvias to escape the 1 mm ball pitch. Maintain 50 ohm controlled impedance on the DDR traces and keep matched trace lengths within 50 mils for the DDR byte lanes to meet the datasheet's DDR-333 timing budget. Place four-layer decoupling capacitor arrays (0.1 uF + 1 uF + 10 uF) within 5 mm of every power/ground ball pair.
At maximum throughput, the MPC8555EVTAPF dissipates roughly 5-7 W. Although the 783-FCPBGA exposes its die through the top surface for heatsink attachment, most FCBGA designs rely on thermal vias under the package and a small aluminum heatsink with thermal interface material. Ensure the PCB thermal via array under the package contains at least 25 filled microvias connecting to internal copper ground planes.
The DDR memory controller is the most timing-critical interface. Per NXP's hardware specifications guide, enable ECC to detect/correct DRAM errors in telecom applications, and use series termination resistors (typically 22-33 ohm) on the DDR address/command bus if the trace length exceeds 50 mm. Perform IBIS simulation of the DDR bus before committing the layout to prototype.
Do not confuse the MPC8555EVTAPF (commercial/extended temp, 833 MHz) with the higher-frequency MPC8555EVTATGF (up to 1 GHz) or with the non-encrypted MPC8555 variants. Always confirm the suffix letters against the NXP part marking decoder before placing the part on a BOM. Mixing suffixes can result in board re-spin or warranty invalidation for tier-1 customers.
규정 준수 정보
RoHS compliance per NXP product page. Not AEC-Q100 qualified - this MPU targets telecom/industrial networking, not automotive. Halogen_free status not stated in available data.
