NXP Semiconductors

MPC875VR80 - 80MHz 32-Bit PowerQUICC MPU | NXP

部品番号: MPC875VR80 ✗ 生産終了
3.3 V Vdss 256-ball PBGA (23 x 23 mm) Package 80 MHz Speed Memory-management units included Memory
MOQ: 1 |

MPC875VR80 概要

NXP Semiconductors MPC875VR80 is a single-core, 32-bit Power Architecture communications microprocessor operating at 80 MHz in a 256-ball PBGA package measuring 23 x 23 mm. It supports a 3.3 V supply and operates from 0°C to 95°C. The device belongs to the MPC8xx PowerQUICC processor family and is designed for networking and communications equipment requiring deterministic real-time processing, memory management, and extensive peripheral integration.

A communications processor or MPU is a semiconductor category that combines a processor core, memory-management hardware, interfaces, and communication peripherals in one integrated device. The MPC875 belongs to the PowerQUICC communications-processor hierarchy, which combines the Power Architecture core with communications-oriented peripherals. This architecture is intended for embedded networking, industrial communication, and data-processing systems that need more peripheral integration than a general-purpose microcontroller provides.

Key verified features include a 32-bit data bus, a maximum clock frequency of 80 MHz, and a 0.18 µm process generation. The processor includes memory-management units and instruction and data caches according to the NXP MPC875/MPC870 hardware specification. Its MPC8xx communications role allows networking functions to share a single device with real-time control workloads while reducing component count compared with a discrete processor-plus-interface design.

The MPC875 architecture combines a 32-bit Power Architecture core with the MPC8xx communications peripheral set. Its caches support faster access to frequently used instructions and data, while the memory-management units provide the address translation and protection needed by modern embedded operating systems. The exact cache sizes, bus timing values, memory-interface details, and operating-current figures require the complete NXP hardware specification and are therefore not inferred from distributor summaries.

Typical applications include industrial routers, communication line cards, network bridges, protocol converters, embedded gateways, and control systems that process serial data alongside network traffic. In these systems, the processor can manage communication tasks and peripheral data movement while providing a single-chip implementation of communications-oriented control. The exact hardware interfaces and supported protocols must be confirmed against the complete manufacturer datasheet before schematic capture.

The most important design consideration is package and software continuity. The MPC875VR80 uses a 256-ball PBGA footprint with fine-pitch routing, so PCB layout, assembly capability, thermal management, and BGA inspection must be planned early. Designers should also verify the required firmware, driver, toolchain, and operating-system support because software compatibility can be as restrictive as electrical compatibility when replacing an older communications processor.

This page consolidates the verified NXP device identity, distributor availability context, package information, lifecycle caveats, and engineering-focused comparison guidance. It also distinguishes documented drop-in candidates from broader functional alternatives, helping procurement and design teams evaluate PCB, software, and supply risks without treating every similar communications processor as interchangeable.

ドロップイン代替品: MPC875VR80 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: MPC875VR80 (同一形状・フットプリント) — 相違点: Package, Operating Temperature, Core Architecture, Series, Process Technology.

NXP Semiconductors
Package: 256-PBGA (23 mm x 23 mm)
Operating Temperature: -40C to +100C
Series: MPC8xx (PowerQUICC)
比較対象 MPC875VR80 →
NXP Semiconductors
Package: 256-PBGA (23 x 23 mm)
Operating Temperature: -40C to +105C (industrial, per datasheet)
Series: PowerQUICC MPC866 family (Ethernet-only variant)
比較対象 MPC875VR80 →
NXP Semiconductors
Package: 256-PBGA (23x23 mm, 1.0 mm pitch)
Operating Temperature: -40C to +85C (industrial)
Core Architecture: PowerPC 32-bit (MPC8xx)
比較対象 MPC875VR80 →
NXP Semiconductors
Series: PowerQUICC, MPC8xx
比較対象 MPC875VR80 →
NXP Semiconductors
Package: 256-PBGA, 23 x 23 mm
Operating Temperature: 0 °C to +95 °C (commercial)
Core Architecture: PowerPC (MPC8xx)
比較対象 MPC875VR80 →
NXP Semiconductors
Package: 256-Pin PBGA (23x23 mm)
Core Architecture: PowerQUICC, Power Architecture technology (MPC8xx)
Process Technology: 0.18 um CMOS
比較対象 MPC875VR80 →
NXP Semiconductors
Package: 256-PBGA (23 x 23 mm)
Operating Temperature: 0 °C to +95 °C
Core Architecture: MPC8xx (PowerPC) - 32-bit
比較対象 MPC875VR80 →
NXP Semiconductors
Package: 256-PBGA (23x23 mm)
Series: MPC8xx / PowerQUICC
比較対象 MPC875VR80 →
NXP Semiconductors
Package: 357-PBGA (25 x 25 mm)
Operating Temperature: 0C to +95C
比較対象 MPC875VR80 →
NXP Semiconductors
Package: 357-ball PBGA (25x25 mm)
Operating Temperature: 0 C to 95 C
Core Architecture: Power Architecture (PowerPC) 32-bit
比較対象 MPC875VR80 →

MPC875ZT80

✅ ドロップイン
NXP Semiconductors
📦 256-ball PBGA (23 x 23 mm)
Power Architecture (MPC8xx / PowerQUICC) · 1 · 32-bit · 80 MHz · 256-PBGA (23x23 mm) · 0 C to 95 C · MPC8xx / PowerQUICC

価格はお問い合わせください

データシートを見る →

MPC870VR80

✅ ドロップイン ⚠️ 仕様未検証
NXP Semiconductors
📦 256-ball PBGA (23 x 23 mm)
PowerPC (MPC8xx) · PowerQUICC MPC8xx · 1 · 32 bit · 80 MHz · 32 bit · Power Architecture (RISC) · 0.18 µm CMOS

価格はお問い合わせください

データシートを見る →

MPC870VR66

✅ ドロップイン ⚠️ 仕様未検証
NXP Semiconductors
📦 256-ball PBGA (23 x 23 mm)
NXP Semiconductors · PowerQUICC, MPC8xx · MPC8xx Power Architecture · 1 · 32-bit · 66 MHz · 87 MIPS · 3.3 V

価格はお問い合わせください

データシートを見る →

MPC875VR66

✅ ドロップイン ⚠️ 仕様未検証
NXP Semiconductors
📦 256-ball PBGA (23 x 23 mm)
Microprocessor (MPU) · PowerQUICC MPC8xx · MPC8xx (PowerPC) - 32-bit · 66 MHz · 87 MIPS · 1 · 0.18 µm CMOS · 3.3 V

価格はお問い合わせください

データシートを見る →

MPC852TCVR50A

✅ ドロップイン
NXP Semiconductors
📦 256-ball PBGA (23 x 23 mm)
NXP USA Inc. (formerly Freescale Semiconductor) · MPC8xx (PowerQUICC) · MPC8xx Power Architecture · 1 core, 32-bit · 50 MHz · Communications; CPM · DRAM · No

価格はお問い合わせください

データシートを見る →

MPC875VR80 最大定格&電気的特性

Processor Type MPC8xx communications microprocessor
Core Architecture 32-bit Power Architecture
Core Count 1 core
データバス幅 32 bit
最大クロック周波数 80 MHz
電源電圧 3.3 V
Process Technology 0.18 µm
Package Type 256-ball PBGA (23 x 23 mm)
Device Category Microprocessor (MPU)
動作温度 0°C to 95°C
Memory Management Memory-management units included
RoHS ステータス unknown
REACH Status unknown
AEC-Q100 Qualification not_applicable
実装タイプ Surface-mount BGA

MPC875VR80 256-ball pbga (23 x 23 mm) ピン配置ガイド

MPC875VR80 (256-ball pbga (23 x 23 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

MPC875VR80 の 256-ball pbga (23 x 23 mm) パッケージピン配置図

詳細なピン配置データはありません: MPC875VR80.

詳細は データシート をご参照ください。

主な用途

MPC875VR80 の用途: 6 件s: Industrial Communication Gateway, Network Router and Line Card Control, Protocol Converter, Embedded Network Control System, Data Acquisition and Serial Processing Unit, Legacy Communication Equipment Controller.

🏭

Industrial Communication Gateway

The MPC875VR80 fits an industrial communication gateway that must coordinate protocol processing, serial-data handling, and real-time control from one processor. Its 32-bit Power Architecture core operates at up to 80 MHz, providing more arithmetic capacity than an 8-bit MCU while integrating the communications-oriented features associated with the MPC8xx family. The device can sit between physical network interfaces and an application processor or supervisory controller. This integration reduces board partitioning, but engineers must confirm the required serial, Ethernet, memory, and DMA resources in the NXP hardware specification. The 256-ball PBGA also requires a PCB and assembly process capable of handling fine-pitch BGA routing and inspection.

🌐

Network Router and Line Card Control

The MPC875VR80 is appropriate for a router, bridge, or communication line card that needs an 80 MHz 32-bit processor for packet-oriented control and communications tasks. The MPC8xx communications-processor positioning supports embedded networking designs where deterministic control, memory management, caches, and multiple peripherals must operate together. Compared with a simple microcontroller, the processor provides a wider 32-bit computational path and a larger integration opportunity. Actual Ethernet or serial interface selection remains design-specific and must be checked against the complete NXP document. Validate protocol firmware, driver availability, memory timing, and thermal performance before committing the legacy BGA package to a new production design.

🔧

Protocol Converter

A protocol converter can use the MPC875VR80 to translate traffic between equipment interfaces while buffering and routing data through an embedded operating-system or real-time control environment. Its 80 MHz clock and 32-bit Power Architecture core suit communication-intensive workloads that require more processing headroom than a basic control MCU. The processor also supports memory management and instruction and data caches, which are useful when running modular gateway software. Because exact protocol engines and bus interfaces are not exposed in the retrieved excerpts, the complete datasheet must be consulted to confirm that every required interface is native. Software porting effort should be evaluated alongside pin and clock compatibility.

🖥️

Embedded Network Control System

The MPC875VR80 can serve as the central controller in an embedded network system that combines communications handling, supervisory logic, and real-time I/O control. The 3.3 V device and 0°C to 95°C stated operating range permit use in controlled industrial environments, although the system must provide suitable power regulation and thermal design. The 32-bit data bus and 80 MHz clock are more than sufficient for many supervisory tasks, provided the external memory interface and I/O requirements are confirmed. Designers should also verify device identity, boot behavior, firmware support, and peripheral mappings before treating an MPC8xx ordering variant as a functional replacement.

📡

Data Acquisition and Serial Processing Unit

The MPC875VR80 is suited to a data-acquisition unit that must process serialized sensor or equipment data while handling communications and control tasks in parallel. Its single-core, 32-bit architecture at up to 80 MHz provides a practical balance of processing capability and integration for legacy embedded equipment. Memory-management units and instruction and data caches can support larger firmware environments than a small microcontroller. The exact bus widths, cache capacities, DMA behavior, and electrical timing are not included in the verified excerpts and must not be inferred. System planning should include sustained processing load, BGA assembly yield, thermal rise, and long-term software-maintenance requirements.

📟

Legacy Communication Equipment Controller

The MPC875VR80 can be retained in legacy communication equipment where established PowerQUICC firmware, board layouts, and peripheral assignments already exist. Its 80 MHz 32-bit Power Architecture core is specifically associated with the MPC8xx communications-processor generation, making it a practical continuity choice for systems originally designed around this device family. The 256-ball PBGA footprint limits straightforward migration because few modern boards offer that land pattern. Replacement work must compare ball assignments, power pins, reset behavior, clock requirements, memory interfaces, and software configuration. Inventory provenance, date codes, and long-term supply plans should be addressed before this legacy architecture is extended into a new deployment.

What are the key specifications of MPC875VR80 that engineers should know?
The MPC875VR80 is a single-core, 32-bit Power Architecture communications processor with an 80 MHz maximum clock, 32-bit data bus, and 3.3 V supply in a 256-ball PBGA package. According to the NXP MPC875/MPC870 hardware specification, the CPU includes memory-management units and instruction and data caches. The package measures 23 x 23 mm and the verified device range is 0°C to 95°C.
Where to buy MPC875VR80 online?
The MPC875VR80 can be found through NXP-authorized distributors, including the linked DigiKey and Mouser listings, as well as the Octopart marketplace listing. Digikey describes the part as available to buy and shipping today, while Mouser provides a product page with datasheet, inventory, and pricing functions. Current numeric prices and guaranteed stock quantities were not included in the retrieved data, so quote confirmation is required as of 2026-10-28.
What is the price of MPC875VR80?
The verified data does not expose a numeric unit price for the MPC875VR80, so the listed tiers use 0.00 only as a no-numeric-price placeholder rather than a claim that the processor is free. Live pricing can be checked through the DigiKey, Mouser, and Octopart links as of 2026-10-28. Volume pricing, traceable packaging, condition, and landed cost may vary by order quantity and distributor inventory.
What is the lead time for MPC875VR80?
The available data does not state a guaranteed lead time for the MPC875VR80. DigiKey's search result says the part can ship today, but that statement is inventory- and quantity-dependent and should not be treated as a contractual lead-time commitment. Procurement should request a dated quotation and stock confirmation from the selected authorized distributor as of 2026-10-28, especially for production quantities.
Is MPC875VR80 in stock?
The MPC875VR80 is advertised for immediate purchase and shipping on the linked DigiKey result, but no dependable stock quantity is included in the retrieved data. Availability can change rapidly for a legacy 256-ball PBGA processor. Confirm the exact quantity, condition, date code, and traceability with the distributor before issuing a purchase order; the stated availability reflects the retrieved result as of 2026-10-28.
Where to download the MPC875VR80 datasheet PDF?
The official NXP MPC875/MPC870 hardware specification is available directly from NXP at the supplied datasheet URL and includes power considerations, DC and AC electrical characteristics, and AC timing information. Third-party datasheet indexes also link to the document. Use the NXP copy as the controlling source for design decisions and verify whether it covers the exact VR80 ordering option and package.
Where to find the MPC875VR80 pinout?
The MPC875VR80 uses a 256-ball PBGA package, and its complete ball assignment should be taken from the pinout section and package drawing in the NXP MPC875/MPC870 hardware specification. The verified search excerpts do not reproduce all 256 ball numbers, signal names, and no-connect assignments, so a complete pinout has not been reconstructed here. Use the official PDF rather than secondary summaries when assigning PCB nets.
MPC875VR80 vs MPC875ZT80: which is the better drop-in option?
Both devices are identified as single-core, 32-bit, 80 MHz MPC8xx processors in 256-ball PBGA packages, making MPC875ZT80 the closest documented same-package candidate in the retrieved cross-reference data. The precise temperature, qualification, and ordering-code differences are not exposed by the snippets, so engineers must verify those fields in the manufacturer documentation before treating it as a production drop-in replacement.
What is the difference between MPC875VR80 and MPC870VR80?
The MPC875VR80 is explicitly verified as an 80 MHz MPC8xx processor, while the retrieved cross-reference data presents MPC870VR80 as a related MPC8xx comparison candidate without providing a complete parameter table. Both are associated with the PowerQUICC communications-processor generation, but internal peripheral sets, clock options, timing, and software support may differ. Treat MPC870VR80 as a family-level candidate rather than an automatically interchangeable device.
When should I choose MPC875VR80 over MPC875ZT80?
Choose MPC875VR80 when its documented operating-temperature range, ordering code, qualification status, and supply conditions match the original design. Choose MPC875ZT80 only after its suffix-specific requirements have been checked against the NXP documentation and the existing PCB. The shared 80 MHz, 32-bit, 256-ball PBGA description makes it mechanically promising, but package similarity alone does not establish full device compatibility.
Is MPC875VR80 suitable for networking and industrial communication equipment?
The MPC875VR80 is suitable for communications equipment that benefits from an 80 MHz 32-bit Power Architecture core and an integrated MPC8xx processor platform. The manufacturer material specifically identifies networking and communications applications, while the verified 256-ball PBGA supports dense mixed-signal board construction. Verify individual serial, Ethernet, memory, and timing interfaces against the complete hardware specification.
What can replace MPC875VR80?
MPC875ZT80 is the closest documented same-family candidate because the retrieved comparison identifies a 32-bit, 80 MHz MPC8xx processor in a 256-ball PBGA package. MPC870VR80 and other MPC8xx ordering variants may be considered for legacy redesigns, but their electrical and software differences require confirmation. No cross-brand pin-compatible replacement was verified in the supplied cross-reference results.
Is MPC875VR80 the same as MPC875ZT80?
No exact device identity can be concluded from the available snippets. MPC875VR80 and MPC875ZT80 share the stated 80 MHz, 32-bit, single-core MPC8xx configuration and 256-ball PBGA format, but an ordering suffix may encode qualification, temperature, or other commercial distinctions. Verify the complete ordering table, electrical limits, and device ID before substituting one for the other.
What is the best NXP equivalent for MPC875VR80?
The best-supported NXP family candidate in the supplied data is MPC875ZT80 because a direct comparison identifies the same 80 MHz, 32-bit, single-core MPC8xx architecture in a 256-ball PBGA package. It should receive a 90% provisional match rating, not a 100% rating, until suffix-specific temperature and qualification details are verified. Other MPC8xx candidates are less certain and require a complete electrical and software review.
How should engineers validate a legacy MPC875VR80 replacement?
Validate a replacement by comparing the ordering code, device identity, supply voltage, clock, cache and memory interfaces, communications peripherals, package-ball map, reset requirements, and operating-temperature limits against the NXP hardware specification. Then verify boot code, drivers, operating-system support, and timing margins. The highest risk in a legacy 256-ball PBGA migration is an electrically similar but software- or pin-map-incompatible substitution.

エンジニアリング参考データ: MPC875VR80 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the MPC875VR80 for an existing 256-ball PBGA communication platform that depends on its 80 MHz 32-bit Power Architecture core, MPC8xx peripherals, established firmware, and verified operating range of 0°C to 95°C. MPC875ZT80 is the closest candidate for same-footprint sourcing because the supplied comparison data confirms the same 32-bit, single-core, 80 MHz MPC8xx configuration, but suffix-specific qualification and temperature details must be checked before substitution. MPC870VR80 may suit a related MPC8xx design only after peripheral and software differences are resolved. The 66 MHz candidates trade approximately 17.5% of clock capability for potentially different ordering conditions, making them candidates for timing-tolerant designs rather than automatic replacements. MPC852TCVR50A falls outside the strict 30% clock-proximity threshold and therefore should not be labeled a drop-in replacement without a new engineering qualification.

代替品との比較

パラメータ この製品 MPC875ZT80 MPC870VR80 MPC870VR66 MPC875VR66 MPC852TCVR50A
Package 256-ball PBGA (23 x 23 mm) 256-ball PBGA (23 x 23 mm) 256-ball PBGA (23 x 23 mm) 256-ball PBGA (23 x 23 mm) 256-ball PBGA (23 x 23 mm) 256-ball PBGA (23 x 23 mm)
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Maximum Clock 80 MHz 80 MHz 80 MHz 66 MHz 66 MHz 50 MHz
Core Architecture 32-bit Power Architecture 32-bit Power Architecture Power Architecture Power Architecture Power Architecture Power Architecture
Core Count 1 core 1 core 1 core 1 core 1 core 1 core

主な差別化要因

  • Closest documented same-package family candidate (vs MPC875ZT80)
  • Higher clock than the lower-frequency MPC8xx candidates (vs MPC870VR66)
  • Documented processor classification and identity (vs MPC852TCVR50A)

設計ノート

Treat the 256-ball PBGA as a constrained fine-pitch layout rather than a generic BGA footprint. Preserve the ball map, power distribution, and escape routing from the approved NXP reference design, and confirm the PCB fabricator's BGA capability, pad definition, solder-mask policy, and inspection method before layout release. A visually similar package is not sufficient evidence of drop-in compatibility.

Use the complete NXP hardware specification to establish supply voltage tolerance, sequencing, input impedance, and current limits. The verified data confirms a 3.3 V device but does not expose operating-current or absolute-maximum values, so regulator selection and power estimation must not rely on the distributor summaries. Decouple each applicable supply group according to the manufacturer recommendation and validate steady-state and transient behavior on hardware.

The processor is specified from 0°C to 95°C, but that range is environmental and does not establish safe internal die temperature. Measure or calculate junction rise using the actual board construction, airflow, processor activity, and supply voltage. Because the verified excerpts omit thermal resistance and current limits, use the complete manufacturer electrical specification rather than estimating dissipation from processor frequency alone.

Do not assume that an MPC8xx family member with the same 256-ball package is electrically and software interchangeable. Compare the device ID, clock maximum, ordering suffix, temperature grade, supply pins, reset behavior, memory and communications interfaces, and boot configuration. Also validate compiler, debugger, operating-system, and driver availability because legacy software support can prevent an otherwise credible hardware substitution.

コンプライアンス情報

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
鉛フリー
Unknown
ハロゲンフリー
Unknown
紛争鉱物
Unknown

The retrieved technical snippets did not provide conclusive RoHS, REACH, lead-free, halogen-free, or conflict-minerals declarations. A third-party result contains an incomplete RoHS field, so no compliance status has been inferred.

データ検証日: 2026-10-28 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

MPC875VR80 MPC875VR80 datasheet PDF NXP MPC875VR80 processor MPC875VR80 80MHz 32-bit MPU MPC875VR80 256-ball PBGA MPC875VR80 communications processor MPC875VR80 vs MPC875ZT80 MPC875VR80 vs MPC870VR80 MPC875VR80 drop-in replacement MPC875VR80 buy price where to buy MPC875VR80 online MPC875VR80 pinout what can replace MPC875VR80 MPC875VR80 industrial networking

関連部品&用語

NXP Semiconductors MPC875VR80 MPC875ZT80 MPC870VR80 MPC870VR66 MPC875VR66 MPC852TCVR50A PowerQUICC MPC8xx Power Architecture communications processor microprocessor MPU embedded processor semiconductor 32-bit processor 80 MHz 256-ball PBGA BGA surface mount memory-management unit instruction cache data cache networking equipment industrial communication
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