MT42L64M32D2HE-18 - 2Gbit LPDDR2 SDRAM 533MHz | Micron
部品番号: MT42L64M32D2HE-18 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $8.79 | $8.79 |
| 10 | $8.35 | $83.50 |
| 100 | $7.91 | $791.00 |
| 500 | $7.47 | $3,735.00 |
| 1,000 | $7.03 | $7,030.00 |
MT42L64M32D2HE-18 概要
LPDDR2 SDRAM is a class of DRAM optimized for low power consumption in battery-operated and thermally constrained systems. Unlike standard DDR SDRAM, LPDDR2 uses a 1.2V core supply, operates at lower voltages on its I/O, and supports power-down, self-refresh, and deep-power-down modes that dramatically reduce standby current. Within the memory hierarchy, LPDDR2 sits between the older LPDDR (LPDDR1) and the newer LPDDR3/LPDDR4 standards, offering a fly-by-free parallel interface with CA pin command/address multiplexing.
Key features of this device include the 2 Gbit density in a single 64M x 32 organization, 533 MHz operation (LPDDR2-S4 class), industrial temperature rating of -40C to +85C for the IT:D variant, and the compact 134-VFBGA (10 x 11.5 mm) package that conserves board area in space-limited designs. The D suffix in the part number denotes die revision and a lead-free/RoHS-compliant package.
Architecturally, the MT42L64M32D2HE implements multiple internal banks with burst access, supporting both non-multiplexed and multiplexed addressing. The x32 I/O organization reduces bus turnaround latency compared with narrower organizations, improving effective bandwidth in real-time embedded workloads. Low-voltage signaling lowers I/O switching power, which is critical for handheld and connected devices.
Typical applications include portable media players, tablet and e-reader main memory, networking and communication equipment buffers, industrial human-machine interfaces, and automotive infotainment (using the AAT:D/AUT:D temperature variants of the same die).
Design consideration: LPDDR2 requires careful PCB length matching on the CA, DQ, and DQS signal groups, plus regulated 1.2V core and VDDQ rails; consult the Micron LPDDR2 datasheet for tCK tolerances and ZQ calibration requirements before layout.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: MT42L64M32D2HE-18 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
MT42L64M32D2HE-18 AAT:D
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MT42L64M32D2HE-18 AUT:D
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MT42L64M32D2HE-18 IT
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MT42L64M32D2HE-18 AAT ES:D
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MT42L64M32D2HE-18 最大定格＆電気的特性
| メモリタイプ | SDRAM - Mobile LPDDR2 |
| Memory Density | 2 Gbit |
| Memory Organization | 64M x 32 bit |
| インターフェース | Parallel |
| 最大クロック周波数 | 533 MHz |
| Memory Standard | LPDDR2-S4 |
| Core Supply Voltage | 1.2 V (per LPDDR2 standard) |
| パッケージ | 134-VFBGA (10 x 11.5 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +85C (IT:D industrial variant) |
| Number of Balls | 134 |
| Package Dimensions | 10 mm x 11.5 mm |
| Lead-Free / RoHS | Yes (D suffix denotes lead-free RoHS-compliant package) |
| Access Type | Synchronous, burst |
| Power-Saving Modes | Power-down, self-refresh, deep power-down |
| Marking Code | D9XZH (per Jotrin, IT:D variant) |
| ライフサイクル状態 | Active (Legacy LPDDR catalog per Micron) |
MT42L64M32D2HE-18 10 mm x 11.5 mm ピン配置ガイド
MT42L64M32D2HE-18 (10 mm x 11.5 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MT42L64M32D2HE-18.
詳細は データシート をご参照ください。
主な用途
MT42L64M32D2HE-18 の用途: 6 件s: Tablet and E-Reader Main Memory, Portable Media and Audio Players, Industrial HMI and Embedded Controllers, Networking and Communication Equipment, Automotive Infotainment (AAT:D variant), IoT Gateways and Smart Devices.
Tablet and E-Reader Main Memory
The MT42L64M32D2HE-18 fits tablet and e-reader designs where a single x32 LPDDR2 device supplies the full 32-bit memory bus, eliminating a second x16 chip and its associated trace lengthening. Its 533 MHz clock delivers adequate bandwidth for e-ink display refresh, UI rendering, and streaming decode in mid-range platforms. The 1.2V-class LPDDR2 signaling and deep power-down mode cut standby draw to protect battery life during weeks of idle shelf time typical of e-readers. The 134-VFBGA 10 x 11.5 mm outline keeps the memory footprint under 115 square millimeters on crowded main boards. Designers should budget board space for ZQ calibration resistor placement and follow length-matching rules from the Micron datasheet.
おすすめ
Portable Media and Audio Players
In portable media players, the MT42L64M32D2HE-18 buffers audio and video streams with its 2 Gbit (256 MB) capacity and 64M x 32 organization, sustaining 533 MHz burst transfers to the application processor. LPDDR2 power-down and self-refresh modes let the platform hold buffer contents at minimal current during playback pauses, directly extending headphone listening time. The industrial IT:D temperature rating of -40C to +85C also supports outdoor and automotive-audio-adjacent use. Because the x32 bus avoids chip-select turnaround between two x16 devices, effective bandwidth utilization is higher for continuous media streaming. Pair the DRAM with adequate bulk capacitance near the VDDQ pins to handle burst current steps during decode peaks.
おすすめ
Industrial HMI and Embedded Controllers
Industrial human-machine interfaces operate in temperature-cycled environments, and the MT42L64M32D2HE-18 IT:D rating of -40C to +85C matches typical factory-floor panel requirements. The 2 Gbit capacity supports graphical GUI frame buffers, while the 533 MHz interface keeps touch response latency low with modern LPDDR2-capable embedded processors. In this application the DRAM frequently operates in partial-array self-refresh, holding the UI state while the main CPU sleeps between touch events, which lowers average system power in always-on panels. The 134-ball VFBGA survives vibration better than fine-pitch TSOP alternatives because the ball array distributes mechanical stress across the board. Verify conformal-coating compatibility of the BGA under level-bump and damp-heat test plans.
おすすめ
Networking and Communication Equipment
Line-card, router-management, and gateway designs use the MT42L64M32D2HE-18 as management-plane memory where packet buffers, routing tables, and firmware working sets demand reliable DRAM without excessive power. The x32 organization simplifies 32-bit controller buses common in embedded network processors, and the 533 MHz speed grade provides the bandwidth needed for Gigabit-class forwarding assist work. The industrial temperature rating suits telecom cabinets and outdoor equipment enclosures that lack active cooling. LPDDR2 self-refresh preserves table contents during brief power-fail save sequences, supporting graceful shutdown. Layout crews should pay attention to CA-bus timing margins and use the fly-by-free parallel routing that LPDDR2 permits at this speed class, keeping stubs minimal to protect signal integrity.
おすすめ
Automotive Infotainment (AAT:D variant)
For automotive infotainment head units and instrument clusters, the same die is available as MT42L64M32D2HE-18 AAT:D, rated -40C to +105C to survive cabin-near-glass and enclosed-module thermal profiles. The identical 134-VFBGA footprint allows a single PCB layout to serve both industrial and automotive builds, simplifying platform sharing across vehicle programs. In the cluster, the 2 Gbit device holds navigation map tiles and GUI layers; in the head unit it buffers media streams, with the x32 bus keeping decode latency low. LPDDR2 power modes support the rapid-resume behavior demanded by modern start/stop vehicle electrical systems. Designers must confirm AEC qualification scope and Micron automotive PCN coverage for the AAT:D suffix in their program documentation before release.
おすすめ
IoT Gateways and Smart Devices
IoT gateways aggregating multiple wireless stacks benefit from the MT42L64M32D2HE-18 combination of 256 MB working memory and LPDDR2-class low idle power, which suits always-on smart hubs that must remain responsive while conserving wall power. The 533 MHz interface comfortably supports Linux-class SoCs, and the industrial temperature rating covers unconditioned spaces such as garages and utility rooms. Deep power-down mode allows aggressive sleep between radio wake intervals, contributing to energy-efficiency compliance targets in home-automation platforms. The 134-ball VFBGA is reflow-compatible with standard lead-free profiles, easing manufacturing. Engineers should include the ZQ calibration network and follow the datasheet's power-ramp requirements to guarantee initialization across wide supply slew conditions.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MT42L64M32D2HE-18 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MT42L64M32D2HE-18 AAT:D | MT42L64M32D2HE-18 AUT:D | MT42L64M32D2HE-18 IT | MT42L64M32D2HE-18 AAT ES:D |
|---|---|---|---|---|---|
| Package | 134-VFBGA (10 x 11.5 mm) | 134-VFBGA (10 x 11.5 mm) - same | 134-VFBGA (10 x 11.5 mm) - same | 134-VFBGA (10 x 11.5 mm) - same | 134-VFBGA (10 x 11.5 mm) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 2 Gbit | 2 Gbit | 2 Gbit | 2 Gbit | 2 Gbit |
| Organization | 64M x 32 | 64M x 32 | 64M x 32 | 64M x 32 | 64M x 32 |
| Max Clock Frequency | 533 MHz | 533 MHz | 533 MHz | 533 MHz | 533 MHz |
| Operating Temperature | -40C to +85C | -40C to +105C | Automotive grade | -40C to +85C | -40C to +105C (ES qualification) |
| Memory Interface | LPDDR2 (parallel) | LPDDR2 (parallel) | LPDDR2 (parallel) | LPDDR2 (parallel) | LPDDR2 (parallel) |
| Qualification Target | Industrial (IT) | Automotive (extended temp) | Automotive | Industrial (earlier die revision) | Engineering sample |
主な差別化要因
- Industrial temperature rating （vs MT42L64M32D2HE-18 AAT:D)
- Single-chip 32-bit bus （vs MT42L64M32D2HE-18 IT)
- Production-qualified silicon （vs MT42L64M32D2HE-18 AAT ES:D)
設計ノート
At 533 MHz, LPDDR2 signal integrity depends on careful CA, DQ, DQS, and DM length matching. Keep DQS-to-DQ skew within the datasheet window, route as tightly coupled groups over a solid reference plane, and minimize stubs. Although LPDDR2 does not use DDR3/4-style fly-by routing, maintain symmetric topologies within each byte lane. Use ODT settings per the Micron datasheet and simulate the full channel with IBIS models from Micron before committing the stackup, especially in 10-layer-or-less boards.
LPDDR2 requires sequenced 1.2V-class core and I/O rails plus VDDCA; follow the power-ramp requirements in the Micron datasheet to guarantee initialization. Estimated: bulk decoupling of at least 22 uF per supply pin group plus 0.1 uF local ceramics at each ball-side via reduces burst-induced rail droop. Verify IDD current figures from the official datasheet for your regulator sizing rather than using typical values, since self-refresh and deep-power-down currents are the dominant sleep-state contributors in battery designs.
The 134-ball VFBGA (10 x 11.5 mm, 0.8 mm-class pitch family) is best placed with microvia-in-pad or via-in-land escape routing on a 6+ layer board. Provide the ZQ calibration ball with its precision reference resistor tied to VSS per the datasheet, located within a few millimeters of the ball. Keep the BGA away from board edge bend zones and mounting holes; the ball array tolerates vibration well but corner balls should not carry flex strain. Follow Micron's LPDDR2 layout application guidance for ball fan-out patterns.
A frequent sourcing error is ordering the bare MPN without the temperature/die suffix - IT:D, AAT:D, AUT:D, and AAT ES:D share the base number but differ in grade and qualification. Micron lists this part in its Legacy LPDDR catalog, so plan lifetime buys or confirm long-term availability with distributors before design freeze. Engineering samples (ES) must never enter production builds. Finally, if migrating from the non-D to D die revision, review the applicable Micron PCN for electrical or timing deltas.
コンプライアンス情報
The D suffix in MT42L64M32D2HE-18 IT:D denotes a lead-free, RoHS-compliant package per Micron naming conventions. AEC-Q100 qualification status for the AAT:D/AUT:D variants must be confirmed with Micron directly; not verified in the provided data.
