MT42L64M32D2HE-18 - 2Gbit LPDDR2 SDRAM 533MHz | Micron
MPN: MT42L64M32D2HE-18 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.79 | $8.79 |
| 10 | $8.35 | $83.50 |
| 100 | $7.91 | $791.00 |
| 500 | $7.47 | $3,735.00 |
| 1,000 | $7.03 | $7,030.00 |
Drop-in alternatives for MT42L64M32D2HE-18 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
MT42L64M32D2HE-18 AAT:D
β Drop-Inπ Reference alternative (not in catalog)
MT42L64M32D2HE-18 AUT:D
β Drop-Inπ Reference alternative (not in catalog)
MT42L64M32D2HE-18 IT
β Drop-Inπ Reference alternative (not in catalog)
MT42L64M32D2HE-18 AAT ES:D
β Drop-Inπ Reference alternative (not in catalog)
MT42L64M32D2HE-18 Maximum Ratings & Electrical Characteristics
| Memory Type | SDRAM - Mobile LPDDR2 |
| Memory Density | 2 Gbit |
| Memory Organization | 64M x 32 bit |
| Interface | Parallel |
| Maximum Clock Frequency | 533 MHz |
| Memory Standard | LPDDR2-S4 |
| Core Supply Voltage | 1.2 V (per LPDDR2 standard) |
| Package | 134-VFBGA (10 x 11.5 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (IT:D industrial variant) |
| Number of Balls | 134 |
| Package Dimensions | 10 mm x 11.5 mm |
| Lead-Free / RoHS | Yes (D suffix denotes lead-free RoHS-compliant package) |
| Access Type | Synchronous, burst |
| Power-Saving Modes | Power-down, self-refresh, deep power-down |
| Marking Code | D9XZH (per Jotrin, IT:D variant) |
| Lifecycle Status | Active (Legacy LPDDR catalog per Micron) |
MT42L64M32D2HE-18 10 mm x 11.5 mm Pin Configuration Guide
Complete pinout information for MT42L64M32D2HE-18 (10 mm x 11.5 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MT42L64M32D2HE-18.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
MT42L64M32D2HE-18 is suitable for 6 applications: Tablet and E-Reader Main Memory, Portable Media and Audio Players, Industrial HMI and Embedded Controllers, Networking and Communication Equipment, Automotive Infotainment (AAT:D variant), IoT Gateways and Smart Devices.
Tablet and E-Reader Main Memory
The MT42L64M32D2HE-18 fits tablet and e-reader designs where a single x32 LPDDR2 device supplies the full 32-bit memory bus, eliminating a second x16 chip and its associated trace lengthening. Its 533 MHz clock delivers adequate bandwidth for e-ink display refresh, UI rendering, and streaming decode in mid-range platforms. The 1.2V-class LPDDR2 signaling and deep power-down mode cut standby draw to protect battery life during weeks of idle shelf time typical of e-readers. The 134-VFBGA 10 x 11.5 mm outline keeps the memory footprint under 115 square millimeters on crowded main boards. Designers should budget board space for ZQ calibration resistor placement and follow length-matching rules from the Micron datasheet.
Recommended
Portable Media and Audio Players
In portable media players, the MT42L64M32D2HE-18 buffers audio and video streams with its 2 Gbit (256 MB) capacity and 64M x 32 organization, sustaining 533 MHz burst transfers to the application processor. LPDDR2 power-down and self-refresh modes let the platform hold buffer contents at minimal current during playback pauses, directly extending headphone listening time. The industrial IT:D temperature rating of -40C to +85C also supports outdoor and automotive-audio-adjacent use. Because the x32 bus avoids chip-select turnaround between two x16 devices, effective bandwidth utilization is higher for continuous media streaming. Pair the DRAM with adequate bulk capacitance near the VDDQ pins to handle burst current steps during decode peaks.
Recommended
Industrial HMI and Embedded Controllers
Industrial human-machine interfaces operate in temperature-cycled environments, and the MT42L64M32D2HE-18 IT:D rating of -40C to +85C matches typical factory-floor panel requirements. The 2 Gbit capacity supports graphical GUI frame buffers, while the 533 MHz interface keeps touch response latency low with modern LPDDR2-capable embedded processors. In this application the DRAM frequently operates in partial-array self-refresh, holding the UI state while the main CPU sleeps between touch events, which lowers average system power in always-on panels. The 134-ball VFBGA survives vibration better than fine-pitch TSOP alternatives because the ball array distributes mechanical stress across the board. Verify conformal-coating compatibility of the BGA under level-bump and damp-heat test plans.
Recommended
Networking and Communication Equipment
Line-card, router-management, and gateway designs use the MT42L64M32D2HE-18 as management-plane memory where packet buffers, routing tables, and firmware working sets demand reliable DRAM without excessive power. The x32 organization simplifies 32-bit controller buses common in embedded network processors, and the 533 MHz speed grade provides the bandwidth needed for Gigabit-class forwarding assist work. The industrial temperature rating suits telecom cabinets and outdoor equipment enclosures that lack active cooling. LPDDR2 self-refresh preserves table contents during brief power-fail save sequences, supporting graceful shutdown. Layout crews should pay attention to CA-bus timing margins and use the fly-by-free parallel routing that LPDDR2 permits at this speed class, keeping stubs minimal to protect signal integrity.
Recommended
Automotive Infotainment (AAT:D variant)
For automotive infotainment head units and instrument clusters, the same die is available as MT42L64M32D2HE-18 AAT:D, rated -40C to +105C to survive cabin-near-glass and enclosed-module thermal profiles. The identical 134-VFBGA footprint allows a single PCB layout to serve both industrial and automotive builds, simplifying platform sharing across vehicle programs. In the cluster, the 2 Gbit device holds navigation map tiles and GUI layers; in the head unit it buffers media streams, with the x32 bus keeping decode latency low. LPDDR2 power modes support the rapid-resume behavior demanded by modern start/stop vehicle electrical systems. Designers must confirm AEC qualification scope and Micron automotive PCN coverage for the AAT:D suffix in their program documentation before release.
Recommended
IoT Gateways and Smart Devices
IoT gateways aggregating multiple wireless stacks benefit from the MT42L64M32D2HE-18 combination of 256 MB working memory and LPDDR2-class low idle power, which suits always-on smart hubs that must remain responsive while conserving wall power. The 533 MHz interface comfortably supports Linux-class SoCs, and the industrial temperature rating covers unconditioned spaces such as garages and utility rooms. Deep power-down mode allows aggressive sleep between radio wake intervals, contributing to energy-efficiency compliance targets in home-automation platforms. The 134-ball VFBGA is reflow-compatible with standard lead-free profiles, easing manufacturing. Engineers should include the ZQ calibration network and follow the datasheet's power-ramp requirements to guarantee initialization across wide supply slew conditions.
Recommended
Recommended Products Summary
Engineering reference data for MT42L64M32D2HE-18 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MT42L64M32D2HE-18 AAT:D | MT42L64M32D2HE-18 AUT:D | MT42L64M32D2HE-18 IT | MT42L64M32D2HE-18 AAT ES:D |
|---|---|---|---|---|---|
| Package | 134-VFBGA (10 x 11.5 mm) | 134-VFBGA (10 x 11.5 mm) - same | 134-VFBGA (10 x 11.5 mm) - same | 134-VFBGA (10 x 11.5 mm) - same | 134-VFBGA (10 x 11.5 mm) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 2 Gbit | 2 Gbit | 2 Gbit | 2 Gbit | 2 Gbit |
| Organization | 64M x 32 | 64M x 32 | 64M x 32 | 64M x 32 | 64M x 32 |
| Max Clock Frequency | 533 MHz | 533 MHz | 533 MHz | 533 MHz | 533 MHz |
| Operating Temperature | -40C to +85C | -40C to +105C | Automotive grade | -40C to +85C | -40C to +105C (ES qualification) |
| Memory Interface | LPDDR2 (parallel) | LPDDR2 (parallel) | LPDDR2 (parallel) | LPDDR2 (parallel) | LPDDR2 (parallel) |
| Qualification Target | Industrial (IT) | Automotive (extended temp) | Automotive | Industrial (earlier die revision) | Engineering sample |
Key Differentiators
- Industrial temperature rating (vs MT42L64M32D2HE-18 AAT:D)
- Single-chip 32-bit bus (vs MT42L64M32D2HE-18 IT)
- Production-qualified silicon (vs MT42L64M32D2HE-18 AAT ES:D)
Design Notes
At 533 MHz, LPDDR2 signal integrity depends on careful CA, DQ, DQS, and DM length matching. Keep DQS-to-DQ skew within the datasheet window, route as tightly coupled groups over a solid reference plane, and minimize stubs. Although LPDDR2 does not use DDR3/4-style fly-by routing, maintain symmetric topologies within each byte lane. Use ODT settings per the Micron datasheet and simulate the full channel with IBIS models from Micron before committing the stackup, especially in 10-layer-or-less boards.
LPDDR2 requires sequenced 1.2V-class core and I/O rails plus VDDCA; follow the power-ramp requirements in the Micron datasheet to guarantee initialization. Estimated: bulk decoupling of at least 22 uF per supply pin group plus 0.1 uF local ceramics at each ball-side via reduces burst-induced rail droop. Verify IDD current figures from the official datasheet for your regulator sizing rather than using typical values, since self-refresh and deep-power-down currents are the dominant sleep-state contributors in battery designs.
The 134-ball VFBGA (10 x 11.5 mm, 0.8 mm-class pitch family) is best placed with microvia-in-pad or via-in-land escape routing on a 6+ layer board. Provide the ZQ calibration ball with its precision reference resistor tied to VSS per the datasheet, located within a few millimeters of the ball. Keep the BGA away from board edge bend zones and mounting holes; the ball array tolerates vibration well but corner balls should not carry flex strain. Follow Micron's LPDDR2 layout application guidance for ball fan-out patterns.
A frequent sourcing error is ordering the bare MPN without the temperature/die suffix - IT:D, AAT:D, AUT:D, and AAT ES:D share the base number but differ in grade and qualification. Micron lists this part in its Legacy LPDDR catalog, so plan lifetime buys or confirm long-term availability with distributors before design freeze. Engineering samples (ES) must never enter production builds. Finally, if migrating from the non-D to D die revision, review the applicable Micron PCN for electrical or timing deltas.
Compliance Information
The D suffix in MT42L64M32D2HE-18 IT:D denotes a lead-free, RoHS-compliant package per Micron naming conventions. AEC-Q100 qualification status for the AAT:D/AUT:D variants must be confirmed with Micron directly; not verified in the provided data.
