PIC32MX170F512LT-V/GJX - 50MHz 512KB MCU 100-TFBGA | Microchip
部品番号: PIC32MX170F512LT-V/GJX ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6.72 | $6.72 |
| 10 | $6.05 | $60.50 |
| 100 | $5.38 | $538.00 |
| 500 | $4.84 | $2,420.00 |
| 1,000 | $4.31 | $4,310.00 |
PIC32MX170F512LT-V/GJX 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and peripherals such as timers, ADC, communication controllers, and GPIO. The PIC32MX1xx family sits in Microchip's PIC32 portfolio as an entry-level 32-bit MCU bridging the gap between PIC16/PIC24 8-/16-bit parts and high-performance PIC32MZ devices, offering ARM Cortex-M-class capability with the MIPS32 M4K core, and targeting industrial control, USB-connected embedded products, and graphical user interfaces.
Key features include the MIPS32 M4K core with hardware multiply/divide, 50 MHz operation, 512 KB Flash, 64 KB SRAM, full-speed USB 2.0 with OTG, four SPI/I2S modules, five UART, five I2C, PMP, 10-bit ADC up to 1 Msps, four 16-bit timers, and a peripheral pin select mapping fabric. The 100-pin TFBGA package provides 78 user I/O, suiting space-constrained designs that require extensive connectivity.
On the architecture side, the M4K core executes most instructions in a single cycle and supports DSP-style instructions for signal processing. The PPS feature lets peripheral signals be mapped to a wide range of pins, easing PCB layout, while the PMP block offloads graphics tasks from the CPU by handling external memory or display read/write cycles autonomously.
Typical applications include industrial control, USB peripherals (HID, CDC, MSD), low-cost graphics interfaces, home appliances, sensor hubs, and IoT edge nodes. The wide operating temperature range (industrial, -40C to +105C) and on-chip USB make it particularly suited to connected industrial devices.
When designing with this device, plan for a 2.3V to 3.6V supply; the part is single-core. Use MPLAB X IDE with the XC32 compiler and MPLAB Harmony for peripheral drivers to accelerate development. The 100-TFBGA requires PCB pads with 0.8 mm pitch - check your assembly house capability. The PIC32MX170F512L is a fully compatible same-die, same-pin, different-package variant for boards that prefer QFP.
This page synthesizes distributor pricing, drop-in same-brand alternatives drawn from the PIC32MX1xx family, and practical design notes not found in the standalone manufacturer datasheet.
ドロップイン代替品: PIC32MX170F512LT-V/GJX — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MX170F512LT-V/GJX （同一形状・フットプリント） — 相違点: ADC, Package, USB, Core, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MX270F512LT-V/GJX
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4.36 / 個
データシートを見る →PIC32MX170F512L-I/PF
✅ ドロップイン✓ 在庫あり
$6.45 / 個
データシートを見る →PIC32MX170F512LT-I/PT
✅ ドロップイン✓ 在庫あり
$6.4 / 個
データシートを見る →PIC32MX250F512LT-V/GJX
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
PIC32MX230F512LT-V/GJX
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
PIC32MX170F512LT-V/GJX 最大定格＆電気的特性
| Core | MIPS32 M4K |
| Operating Frequency | 50 MHz |
| DMIPS | 83 |
| Program Memory (Flash) | 512 KB |
| Data Memory (SRAM) | 64 KB |
| パッケージ | 100-TFBGA (7x7 mm) |
| ピン数 | 100 |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| SPI / I2S Modules | 4 SPI, 2 I2S |
| UART | 5 |
| I2C | 5 |
| ADC | 10-bit, up to 1 Msps |
| Timers | 4 x 16-bit |
| Parallel Master Port (PMP) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| 動作温度 | -40C to +105C (industrial) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
PIC32MX170F512LT-V/GJX 100-tfbga (7x7 mm) ピン配置ガイド
PIC32MX170F512LT-V/GJX (100-tfbga (7x7 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC32MX170F512LT-V/GJX.
詳細は データシート をご参照ください。
主な用途
PIC32MX170F512LT-V/GJX の用途: 7 件s: Industrial Control & Automation, USB Peripherals (HID, CDC, MSD, Vendor), Low-Cost Graphics Interfaces, Home Appliances & White Goods, IoT Edge Devices & Sensor Hubs, Connected Medical Accessories, Audio Codec & DSP Front-Ends.
Industrial Control & Automation
The PIC32MX170F512LT-V/GJX suits industrial controllers thanks to its 50 MHz/83 DMIPS MIPS32 M4K core and 64 KB SRAM, which handle real-time control loops, Modbus RTU/TCP stacks, and PID computation without offloading to a co-processor. The wide operating temperature range (-40C to +105C industrial grade) and USB 2.0 with OTG enable on-machine configuration, firmware update, and diagnostics via USB stick. The 100-TFBGA package reduces footprint for DIN-rail PLCs and HMI sub-modules where many I/O and signals coexist on a compact PCB.
おすすめ
USB Peripherals (HID, CDC, MSD, Vendor)
The PIC32MX170F512LT-V/GJX integrates a USB 2.0 Full-Speed controller with Device, Host, and OTG roles, eliminating an external USB interface chip and reducing BOM cost for HID keyboards, CDC virtual COM ports, MSD card readers, and custom vendor-class peripherals. The 48 MHz USB clock is derived from the on-chip PLL, removing the need for a USB-specific crystal. Microchip's MLA USB stack and Harmony framework supply ready-to-use HID, CDC, and MSD class drivers, cutting firmware development time from weeks to days for USB-enabled devices.
おすすめ
Low-Cost Graphics Interfaces
The PIC32MX170F512LT-V/GJX includes a Parallel Master Port (PMP) with dual read/write buffers that offload external memory and display read/write cycles from the CPU, making it well-suited for driving low-cost graphical LCDs and small TFT panels in appliance and industrial HMI designs. Combined with Peripheral Pin Select (PPS), PMP data, control, and address signals can be remapped to ease PCB routing. The 512 KB Flash accommodates graphic assets and framebuffer references, while the 64 KB SRAM keeps small UI buffers resident without external memory.
おすすめ
Home Appliances & White Goods
The PIC32MX170F512LT-V/GJX targets home appliances such as washing machines, induction cookers, smart ovens, and HVAC controllers where the combination of 50 MHz MIPS performance, USB diagnostics port, and industrial temperature range is highly valued. The 4 SPI/I2S modules enable codec and audio feedback for next-generation appliances with voice prompts, while the 5 UART handle multi-protocol connectivity (RS-485, RS-232, IR). The 512 KB Flash accommodates state-machine firmware and OTA update images for connected appliances.
おすすめ
IoT Edge Devices & Sensor Hubs
The PIC32MX170F512LT-V/GJX works as an IoT edge node aggregating sensor data over its 4 SPI/I2S, 5 I2C, and 5 UART interfaces, then forwarding pre-processed data via USB to a gateway or via UART to a wireless co-processor. The 50 MHz/83 DMIPS throughput handles edge filtering and thresholding before transmission, reducing wireless bandwidth requirements. The 64 KB SRAM supports ring buffers for multiple sensor streams, while 512 KB Flash stores persistent configuration and ML model weights for simple edge inference applications.
おすすめ
Connected Medical Accessories
The PIC32MX170F512LT-V/GJX serves connected medical accessories such as USB diagnostic tools, patient monitoring peripherals, and lab instrument interfaces that demand a stable USB link and a USB host for reading patient data from USB sticks. The 10-bit 1 Msps ADC captures analog sensor signals, while the 5 UART handle multi-channel medical sensor interfaces. The 100-TFBGA package and industrial temperature range suit compact, fan-less medical device enclosures with continuous operation requirements.
おすすめ
Audio Codec & DSP Front-Ends
The PIC32MX170F512LT-V/GJX handles low-power audio front-end tasks through its two I2S interfaces that connect directly to audio codecs, while four SPI modules drive additional DACs, ADCs, or display drivers. The MIPS32 M4K core executes DSP-style instructions (multiply-accumulate) for basic audio processing, filtering, and mix operations at 50 MHz. The 64 KB SRAM supports audio sample buffers, and USB OTG enables the device to function as a USB audio device. This combination makes the part a strong fit for USB speakers, headsets, and intercom panels.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MX170F512LT-V/GJX — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MX270F512LT-V/GJX | PIC32MX170F512L-I/PF | PIC32MX170F512LT-I/PT | PIC32MX250F512LT-V/GJX | PIC32MX230F512LT-V/GJX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TQFP - same silicon, different footprint | 100-TQFP - same silicon, different footprint | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same |
| Core | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| Operating Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 64 KB | 256 KB (+300%) | 64 KB | 64 KB | 128 KB (+100%) | 64 KB |
| USB | Full-Speed Device/Host/OTG | Full-Speed Device/Host/OTG | Full-Speed Device/Host/OTG | Full-Speed Device/Host/OTG | Full-Speed Device/Host/OTG | Full-Speed Device only |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +105C | -40C to +105C |
主な差別化要因
- Highest SRAM in same-footprint family （vs PIC32MX230F512LT-V/GJX)
- USB Host + OTG vs Device-only （vs PIC32MX230F512LT-V/GJX)
- Parallel Master Port for low-cost graphics （vs PIC32MX170F512LT-I/PT)
設計ノート
Decoupling: Place one 100 nF X7R 0402/0603 ceramic capacitor adjacent to each VDD pin and a single 10 uF X5R ceramic or low-ESR tantalum bulk capacitor within 5 mm of the IC. The PIC32MX170F512L is specified to operate from 2.3 V to 3.6 V; however, USB signaling requires a minimum of 3.0 V on the analog 3.3 V rail to meet USB 2.0 full-speed electrical specifications. Use a ferrite bead between the digital and analog 3.3 V rails if noise from the core couples into the USB transceiver. The on-chip voltage regulator generates 1.8 V internally for the core logic.
Layout for the 100-TFBGA package demands PCB pads with 0.65 mm ball pitch, microvia (laser-drilled) stack-ups, and a reflow profile compatible with lead-free (SAC305) solder. Verify the chosen assembly house supports 0.65 mm pitch BGA with appropriate stencil design (typically 0.4 mm aperture). Place decoupling capacitors on the top side directly under each VDD/VSS ball pair to minimize loop inductance. Keep the high-speed USB D+/D- traces matched within 2 mm and routed over a continuous ground reference; this is critical for USB 2.0 compliance and EMI.
Several common pitfalls should be avoided: (1) using a TQFP-100 footprint design when the BOM calls for the TFBGA-100 /GJX variant - the silicon is identical but the PCB pads are not interchangeable; (2) configuring USB without the 48 MHz USB PLL correctly - the system must use the on-chip PLL in USB PLL mode, not the primary oscillator directly; (3) not enabling Peripheral Pin Select (PPS) lock to prevent accidental remapping of UART/SPI/I2C pins at runtime; (4) leaving the ICSP/ICD pins (PGECx/PGEDx) unrouted - these are mandatory for in-system programming and debugging. Use MPLAB X IDE with XC32 compiler for firmware development.
Estimated: the PIC32MX170F512LT-V/GJX at 50 MHz core speed consumes approximately 30-40 mA typical active current at 3.3 V (around 100-130 mW). In a 100-TFBGA package with theta_JA around 35-45 C/W on a standard 4-layer JEDEC test PCB, the junction temperature rise above ambient is roughly 4-6 C under typical load - well within the -40C to +105C industrial operating range. For designs in enclosed housings without airflow, verify with thermal simulation, especially if USB host mode or full peripheral utilization is sustained.
コンプライアンス情報
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified (industrial grade, not automotive). Microchip maintains long-term product longevity program for PIC32 family.