PIC32MX270F512LT-V/GJX - 32-bit MCU, 512KB Flash, 100-TFBGA | Microchip
MPN: PIC32MX270F512LT-V/GJX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.76 | $6.76 |
| 10 | $6.1 | $61.00 |
| 100 | $5.42 | $542.00 |
| 500 | $4.89 | $2,445.00 |
| 1,000 | $4.36 | $4,360.00 |
PIC32MX270F512LT-V/GJX Overview
What is a 32-bit microcontroller? A microcontroller (MCU) is a single-chip computer containing a CPU core, program and data memory, and integrated peripherals such as timers, ADC, communication interfaces, and I/O. The PIC32MX270 belongs to Microchip's PIC32 family, which uses the MIPS32 M4K RISC architecture and targets mid-range embedded applications where 32-bit performance and USB connectivity are required. Within the system hierarchy, this MCU sits between a 16-bit MCU (lower performance) and a Cortex-M4 class MCU (higher compute density), positioned for USB-enabled HMI, audio streaming, and automotive body modules.
Key features include up to 512 KB flash with 64 KB RAM, hardware USB 2.0 FS OTG with dedicated DMA, two I2S and four SPI modules, two I2C modules, five UART modules, a 10-bit ADC, three analog comparators, a Charge Time Measurement Unit (CTMU), and a Real-Time Clock and Calendar (RTCC). The 100-TFBGA package occupies just 49 mm^2 of PCB area, enabling compact automotive modules. The AEC-Q100 qualification applies at manufacturing.
Typical applications include USB HID devices, audio streaming peripherals with I2S codecs, automotive body and HMI modules, industrial sensor hubs, and small graphical displays via the PMP. The combination of USB OTG, ample flash, and CTMU makes it well suited for capacitive-touch user panels and CAN-gateway companion designs.
When designing with this part, pay attention to the -40C to +105C VT temperature range and the TFBGA ball grid which requires careful PCB layout for reliable solder joints. The PPS feature allows late-stage pin reassignment, which simplifies PCB routing revisions.
This page synthesizes distributor pricing, parametric drop-in alternatives from the same PIC32MX270 family, and practical design notes beyond the manufacturer datasheet.
Drop-in alternatives for PIC32MX270F512LT-V/GJX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX270F512LT-V/GJX (same form factor and footprint) — differing in Package, ADC, Parallel Master Port (PMP), CTMU, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX270F512LT-50I/GJX
✅ Drop-In✓ In Stock
$4.45 / Unit
View Datasheet →PIC32MX270F512LT-I/GJX
✅ Drop-In✓ In Stock
$5.1 / Unit
View Datasheet →PIC32MX270F512HT-50I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.74 / Unit
View Datasheet →PIC32MX270F512LT-V/GJX Maximum Ratings & Electrical Characteristics
| Core | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 50 MHz (83 DMIPS) |
| Program Flash | 512 KB |
| Data RAM | 64 KB |
| Supply Voltage | 2.3V to 3.6V |
| Operating Temperature | -40C to +105C (VT grade) |
| USB | USB 2.0 FS OTG (with dedicated DMA) |
| UART Modules | 5 |
| SPI Modules | 4 |
| I2C Modules | 2 |
| I2S Modules | 2 |
| ADC | 10-bit |
| Analog Comparators | 3 |
| CTMU | Yes (Capacitive Touch) |
| RTCC | Yes (Real-Time Clock + Calendar) |
| PMP | Yes (Parallel Master Port, dual R/W buffers) |
| PPS | Yes (Peripheral Pin Select) |
| Package | 100-TFBGA (7x7 mm) |
| Mounting Type | Surface Mount |
| Automotive Qualification | AEC-Q100 |
PIC32MX270F512LT-V/GJX 100-tfbga (7x7 mm) Pin Configuration Guide
Pin configuration for PIC32MX270F512LT-V/GJX (100-tfbga (7x7 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX270F512LT-V/GJX.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX270F512LT-V/GJX is suitable for 6 applications: USB HID Human-Interface Device, Automotive Body Control Module, Audio Streaming Peripheral (USB to I2S), Industrial HMI with Capacitive Touch, USB Data Logger / Industrial Sensor Hub, Small Graphical Display Controller.
USB HID Human-Interface Device
The PIC32MX270F512LT-V/GJX's integrated USB 2.0 FS OTG controller and dedicated USB DMA channels make it ideal for USB HID keyboards, mice, gamepads, and custom input peripherals. The 50 MHz MIPS M4K core delivers 83 DMIPS, sufficient to handle USB polling, debounce, and HID report generation simultaneously. With 512 KB flash, the part accommodates Microchip's full USB stack (HID class driver, descriptor tables) plus application firmware without external memory. The USB PHY is integrated, eliminating external transceiver costs. The AEC-Q100 qualification enables automotive USB peripherals.
Recommended
Automotive Body Control Module
The AEC-Q100 qualification and -40C to +105C VT temperature range of the PIC32MX270F512LT-V/GJX make it a fit for body control modules, lighting controllers, and door-handle sensors. The CTMU peripheral supports capacitive touch for door handles and proximity-couple ingress buttons, while the three analog comparators enable window-current monitoring and battery-voltage detection. CAN bus and LIN support through the UART peripherals (with external transceivers) allow integration into automotive body networks. The 64 KB RAM supports CAN message buffering and RTCC for time-stamped event logging.
Recommended
Audio Streaming Peripheral (USB to I2S)
The PIC32MX270F512LT-V/GJX combines USB 2.0 FS OTG with two I2S modules, enabling USB-to-I2S audio streaming peripherals such as USB speakers, USB DACs, and USB headsets. The dedicated USB DMA offloads packet handling from the CPU, leaving MIPS budget for sample buffering, SRC, and optional DSP. The four SPI modules support flash storage for firmware and configuration, while the 10-bit ADC handles microphone input for headsets. The 512 KB flash accommodates a USB audio class driver and optional sample-rate-conversion routines.
Recommended
Industrial HMI with Capacitive Touch
The PIC32MX270F512LT-V/GJX's CTMU peripheral enables capacitive-touch keypads and sliders for industrial human-machine interfaces such as appliance panels, access-control readers, and HVAC controllers. Combined with the PMP for graphic LCD driving, the part can manage a small TFT graphical display plus a touch matrix without external controllers. The 64 KB RAM is sufficient for frame buffers and touch-scanning state machines. Industrial-grade ambient tolerance and the wide 2.3V to 3.6V supply simplify power-tree design.
Recommended
USB Data Logger / Industrial Sensor Hub
The PIC32MX270F512LT-V/GJX is well suited to industrial data-logger designs that stream sensor data to a host PC over USB CDC. The 10-bit ADC, three analog comparators, and CTMU support temperature, current, and capacitive sensors, while the RTCC provides time-stamping for unattended loggers. The 64 KB RAM buffers bursts between USB transmissions, and the 512 KB flash holds file-system structures (FAT12/16) for optional SD-card-style emulation. The wide operating voltage handles 24V-bus-derived rails through external regulators.
Recommended
Small Graphical Display Controller
The PIC32MX270F512LT-V/GJX's Parallel Master Port (PMP) with dual read/write buffers drives small TFT graphical LCDs in point-of-sale terminals, instrumentation, and consumer appliances. Combined with the SPI modules for font tables and the 10-bit ADC for touch-screen sensing, the part can function as a single-chip display-and-touch controller without external graphics ICs. The 50 MHz core delivers enough throughput to refresh QVGA panels with simple UIs. The compact 100-TFBGA package fits within slim-bezel display modules.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX270F512LT-V/GJX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX270F512LT-50I/GJX | PIC32MX270F512LT-I/GJX | PIC32MX270F512HT-50I/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (GJX) 7x7 mm | 100-TFBGA (GJX) - same | 100-TFBGA (GJX) - same | 64-QFN (MR) - different |
| Program Flash | 512 KB | 512 KB | 512 KB | 256 KB |
| Data RAM | 64 KB | 64 KB | 64 KB | 64 KB |
| Maximum CPU Speed | 50 MHz (83 DMIPS) | 50 MHz (83 DMIPS) | 40 MHz | 50 MHz (83 DMIPS) |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Operating Temperature | -40C to +105C (VT) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Automotive Qualification | AEC-Q100 (VT grade) | Industrial only | Industrial only | Industrial only |
| Peripherals (I2S / SPI / I2C / UART) | 2 / 4 / 2 / 5 | 2 / 4 / 2 / 5 | 2 / 4 / 2 / 5 | 2 / 4 / 2 / 5 |
Key Differentiators
- AEC-Q100 automotive qualification with -40C to +105C VT grade (vs PIC32MX270F512LT-50I/GJX)
- Higher temperature envelope while keeping identical 512 KB flash and 64 KB RAM (vs PIC32MX270F512LT-I/GJX)
- 100-TFBGA package with 512 KB flash and full USB OTG peripheral set (vs PIC32MX270F512HT-50I/MR (64-QFN, 256 KB))
Design Notes
The 100-TFBGA package uses 0.5 mm pitch and requires via-in-pad PCB technology with plugged and plated-over vias for reliable assembly. Use NSMD (non-solder-mask-defined) pads with a 0.4 mm diameter and a 0.12 mm stencil thickness for best solder-joint yield. Microchip Application Note AN136 ('PCB Design Considerations for PIC32MX Family') provides the reference land pattern. Always include a keepout zone under the BGA balls for inspection and rework access. Estimated: the 7x7 mm package footprint allows 6-layer PCB routing with 0.1 mm trace/space when using via-in-pad.
Decouple each VDD/VDDIO ball pair with a 0.1 uF X7R ceramic capacitor placed within 2 mm of the ball, plus a 10 uF bulk capacitor on the main supply rail. The PIC32MX270 core draws up to 70 mA at 50 MHz with USB active, producing significant supply transients. Use a ferrite bead between the USB VBUS supply and the MCU VDDIO rail to isolate USB bus noise. Estimated: total VDD current 60-80 mA at full load, depending on peripheral activation profile.
Do not confuse the PIC32MX270F512LT-V/GJX (TFBGA, AEC-Q100) with the PIC32MX270F512L-50I/PT (TQFP, industrial) - the packages are NOT pin-compatible and require different PCB layouts. Always verify the temperature-grade suffix: 'VT' is automotive -40C to +105C, 'I' is industrial -40C to +85C. Programming via ICSP requires the standard 6-pin RJ-11 connection; for production programming consider using the JTAG interface for faster firmware load.
The 100-TFBGA has a thermal resistance (theta_JA) of approximately 35-40 C/W on a standard 4-layer JEDEC test PCB, per typical Microchip packaging data. At 70 mA active current and 3.3V supply, power dissipation is about 230 mW, giving a 9 C temperature rise above ambient - well within the 105 C limit. For sealed enclosures with limited airflow, derate by 30 percent and validate with thermocouple measurement. Estimated: 230 mW * 38 C/W ~ 9 C rise above ambient.
Compliance Information
AEC-Q100 Grade 2 qualified per Microchip product page; VT suffix denotes -40C to +105C automotive grade; RoHS and REACH compliant per Microchip declaration.