PIC32MX270F512LT-V/GJX - 32-bit MCU, 512KB Flash, 100-TFBGA | Microchip
部品番号: PIC32MX270F512LT-V/GJX ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6.76 | $6.76 |
| 10 | $6.1 | $61.00 |
| 100 | $5.42 | $542.00 |
| 500 | $4.89 | $2,445.00 |
| 1,000 | $4.36 | $4,360.00 |
PIC32MX270F512LT-V/GJX 概要
What is a 32-bit microcontroller? A microcontroller (MCU) is a single-chip computer containing a CPU core, program and data memory, and integrated peripherals such as timers, ADC, communication interfaces, and I/O. The PIC32MX270 belongs to Microchip's PIC32 family, which uses the MIPS32 M4K RISC architecture and targets mid-range embedded applications where 32-bit performance and USB connectivity are required. Within the system hierarchy, this MCU sits between a 16-bit MCU (lower performance) and a Cortex-M4 class MCU (higher compute density), positioned for USB-enabled HMI, audio streaming, and automotive body modules.
Key features include up to 512 KB flash with 64 KB RAM, hardware USB 2.0 FS OTG with dedicated DMA, two I2S and four SPI modules, two I2C modules, five UART modules, a 10-bit ADC, three analog comparators, a Charge Time Measurement Unit (CTMU), and a Real-Time Clock and Calendar (RTCC). The 100-TFBGA package occupies just 49 mm^2 of PCB area, enabling compact automotive modules. The AEC-Q100 qualification applies at manufacturing.
Typical applications include USB HID devices, audio streaming peripherals with I2S codecs, automotive body and HMI modules, industrial sensor hubs, and small graphical displays via the PMP. The combination of USB OTG, ample flash, and CTMU makes it well suited for capacitive-touch user panels and CAN-gateway companion designs.
When designing with this part, pay attention to the -40C to +105C VT temperature range and the TFBGA ball grid which requires careful PCB layout for reliable solder joints. The PPS feature allows late-stage pin reassignment, which simplifies PCB routing revisions.
This page synthesizes distributor pricing, parametric drop-in alternatives from the same PIC32MX270 family, and practical design notes beyond the manufacturer datasheet.
ドロップイン代替品: PIC32MX270F512LT-V/GJX — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MX270F512LT-V/GJX （同一形状・フットプリント） — 相違点: Package, ADC, Parallel Master Port (PMP), CTMU, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MX270F512LT-50I/GJX
✅ ドロップイン✓ 在庫あり
$4.45 / 個
データシートを見る →PIC32MX270F512LT-I/GJX
✅ ドロップイン✓ 在庫あり
$5.1 / 個
データシートを見る →PIC32MX270F512HT-50I/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4.74 / 個
データシートを見る →PIC32MX270F512LT-V/GJX 最大定格＆電気的特性
| Core | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 50 MHz (83 DMIPS) |
| Program Flash | 512 KB |
| Data RAM | 64 KB |
| 電源電圧 | 2.3V to 3.6V |
| 動作温度 | -40C to +105C (VT grade) |
| USB | USB 2.0 FS OTG (with dedicated DMA) |
| UART Modules | 5 |
| SPI Modules | 4 |
| I2C Modules | 2 |
| I2S Modules | 2 |
| ADC | 10-bit |
| Analog Comparators | 3 |
| CTMU | Yes (Capacitive Touch) |
| RTCC | Yes (Real-Time Clock + Calendar) |
| PMP | Yes (Parallel Master Port, dual R/W buffers) |
| PPS | Yes (Peripheral Pin Select) |
| パッケージ | 100-TFBGA (7x7 mm) |
| 実装タイプ | Surface Mount |
| Automotive Qualification | AEC-Q100 |
PIC32MX270F512LT-V/GJX 100-tfbga (7x7 mm) ピン配置ガイド
PIC32MX270F512LT-V/GJX (100-tfbga (7x7 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC32MX270F512LT-V/GJX.
詳細は データシート をご参照ください。
主な用途
PIC32MX270F512LT-V/GJX の用途: 6 件s: USB HID Human-Interface Device, Automotive Body Control Module, Audio Streaming Peripheral (USB to I2S), Industrial HMI with Capacitive Touch, USB Data Logger / Industrial Sensor Hub, Small Graphical Display Controller.
USB HID Human-Interface Device
The PIC32MX270F512LT-V/GJX's integrated USB 2.0 FS OTG controller and dedicated USB DMA channels make it ideal for USB HID keyboards, mice, gamepads, and custom input peripherals. The 50 MHz MIPS M4K core delivers 83 DMIPS, sufficient to handle USB polling, debounce, and HID report generation simultaneously. With 512 KB flash, the part accommodates Microchip's full USB stack (HID class driver, descriptor tables) plus application firmware without external memory. The USB PHY is integrated, eliminating external transceiver costs. The AEC-Q100 qualification enables automotive USB peripherals.
おすすめ
Automotive Body Control Module
The AEC-Q100 qualification and -40C to +105C VT temperature range of the PIC32MX270F512LT-V/GJX make it a fit for body control modules, lighting controllers, and door-handle sensors. The CTMU peripheral supports capacitive touch for door handles and proximity-couple ingress buttons, while the three analog comparators enable window-current monitoring and battery-voltage detection. CAN bus and LIN support through the UART peripherals (with external transceivers) allow integration into automotive body networks. The 64 KB RAM supports CAN message buffering and RTCC for time-stamped event logging.
おすすめ
Audio Streaming Peripheral (USB to I2S)
The PIC32MX270F512LT-V/GJX combines USB 2.0 FS OTG with two I2S modules, enabling USB-to-I2S audio streaming peripherals such as USB speakers, USB DACs, and USB headsets. The dedicated USB DMA offloads packet handling from the CPU, leaving MIPS budget for sample buffering, SRC, and optional DSP. The four SPI modules support flash storage for firmware and configuration, while the 10-bit ADC handles microphone input for headsets. The 512 KB flash accommodates a USB audio class driver and optional sample-rate-conversion routines.
おすすめ
Industrial HMI with Capacitive Touch
The PIC32MX270F512LT-V/GJX's CTMU peripheral enables capacitive-touch keypads and sliders for industrial human-machine interfaces such as appliance panels, access-control readers, and HVAC controllers. Combined with the PMP for graphic LCD driving, the part can manage a small TFT graphical display plus a touch matrix without external controllers. The 64 KB RAM is sufficient for frame buffers and touch-scanning state machines. Industrial-grade ambient tolerance and the wide 2.3V to 3.6V supply simplify power-tree design.
おすすめ
USB Data Logger / Industrial Sensor Hub
The PIC32MX270F512LT-V/GJX is well suited to industrial data-logger designs that stream sensor data to a host PC over USB CDC. The 10-bit ADC, three analog comparators, and CTMU support temperature, current, and capacitive sensors, while the RTCC provides time-stamping for unattended loggers. The 64 KB RAM buffers bursts between USB transmissions, and the 512 KB flash holds file-system structures (FAT12/16) for optional SD-card-style emulation. The wide operating voltage handles 24V-bus-derived rails through external regulators.
おすすめ
Small Graphical Display Controller
The PIC32MX270F512LT-V/GJX's Parallel Master Port (PMP) with dual read/write buffers drives small TFT graphical LCDs in point-of-sale terminals, instrumentation, and consumer appliances. Combined with the SPI modules for font tables and the 10-bit ADC for touch-screen sensing, the part can function as a single-chip display-and-touch controller without external graphics ICs. The 50 MHz core delivers enough throughput to refresh QVGA panels with simple UIs. The compact 100-TFBGA package fits within slim-bezel display modules.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MX270F512LT-V/GJX — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MX270F512LT-50I/GJX | PIC32MX270F512LT-I/GJX | PIC32MX270F512HT-50I/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (GJX) 7x7 mm | 100-TFBGA (GJX) - same | 100-TFBGA (GJX) - same | 64-QFN (MR) - different |
| Program Flash | 512 KB | 512 KB | 512 KB | 256 KB |
| Data RAM | 64 KB | 64 KB | 64 KB | 64 KB |
| Maximum CPU Speed | 50 MHz (83 DMIPS) | 50 MHz (83 DMIPS) | 40 MHz | 50 MHz (83 DMIPS) |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Operating Temperature | -40C to +105C (VT) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Automotive Qualification | AEC-Q100 (VT grade) | Industrial only | Industrial only | Industrial only |
| Peripherals (I2S / SPI / I2C / UART) | 2 / 4 / 2 / 5 | 2 / 4 / 2 / 5 | 2 / 4 / 2 / 5 | 2 / 4 / 2 / 5 |
主な差別化要因
- AEC-Q100 automotive qualification with -40C to +105C VT grade （vs PIC32MX270F512LT-50I/GJX)
- Higher temperature envelope while keeping identical 512 KB flash and 64 KB RAM （vs PIC32MX270F512LT-I/GJX)
- 100-TFBGA package with 512 KB flash and full USB OTG peripheral set （vs PIC32MX270F512HT-50I/MR (64-QFN, 256 KB))
設計ノート
The 100-TFBGA package uses 0.5 mm pitch and requires via-in-pad PCB technology with plugged and plated-over vias for reliable assembly. Use NSMD (non-solder-mask-defined) pads with a 0.4 mm diameter and a 0.12 mm stencil thickness for best solder-joint yield. Microchip Application Note AN136 ('PCB Design Considerations for PIC32MX Family') provides the reference land pattern. Always include a keepout zone under the BGA balls for inspection and rework access. Estimated: the 7x7 mm package footprint allows 6-layer PCB routing with 0.1 mm trace/space when using via-in-pad.
Decouple each VDD/VDDIO ball pair with a 0.1 uF X7R ceramic capacitor placed within 2 mm of the ball, plus a 10 uF bulk capacitor on the main supply rail. The PIC32MX270 core draws up to 70 mA at 50 MHz with USB active, producing significant supply transients. Use a ferrite bead between the USB VBUS supply and the MCU VDDIO rail to isolate USB bus noise. Estimated: total VDD current 60-80 mA at full load, depending on peripheral activation profile.
Do not confuse the PIC32MX270F512LT-V/GJX (TFBGA, AEC-Q100) with the PIC32MX270F512L-50I/PT (TQFP, industrial) - the packages are NOT pin-compatible and require different PCB layouts. Always verify the temperature-grade suffix: 'VT' is automotive -40C to +105C, 'I' is industrial -40C to +85C. Programming via ICSP requires the standard 6-pin RJ-11 connection; for production programming consider using the JTAG interface for faster firmware load.
The 100-TFBGA has a thermal resistance (theta_JA) of approximately 35-40 C/W on a standard 4-layer JEDEC test PCB, per typical Microchip packaging data. At 70 mA active current and 3.3V supply, power dissipation is about 230 mW, giving a 9 C temperature rise above ambient - well within the 105 C limit. For sealed enclosures with limited airflow, derate by 30 percent and validate with thermocouple measurement. Estimated: 230 mW * 38 C/W ~ 9 C rise above ambient.
コンプライアンス情報
AEC-Q100 Grade 2 qualified per Microchip product page; VT suffix denotes -40C to +105C automotive grade; RoHS and REACH compliant per Microchip declaration.