Microchip Technology

PIC32MX270F512HT-50I/MR - 50MHz 32-bit MCU 512KB Flash 64-QFN

MPN: PIC32MX270F512HT-50I/MR ✓ Active
In Stock Ships in 1-3 business days
2.3V to 3.6V Vdss 64-pin QFN (9x9 mm) Package 50 MHz (83 DMIPS) Speed 512 KB (512K x 8) Memory
From $4.74 USD / Unit
MOQ: 1 |
Price updated: 2026-10-02
Volume Pricing
Qty Unit Price Extended
1 $6.99 $6.99
10 $6.49 $64.90
100 $5.85 $585.00
500 $5.21 $2,605.00
1,000 $4.74 $4,740.00
ℹ️ All prices are in USD

PIC32MX270F512HT-50I/MR Overview

The Microchip Technology PIC32MX270F512HT-50I/MR is a 32-bit MIPS32 M4K microcontroller running up to 50 MHz (83 DMIPS), integrating 512 KB of Flash program memory and 64 KB of SRAM in a 64-pin QFN (9x9 mm) package. The part suffix -50I/MR indicates 50 MHz operation and the industrial -40C to +85C temperature range in the tape-and-reel MR package. It is a member of the PIC32MX1xx/2xx/5xx 64/100-pin family and shares pin-for-pin compatibility with siblings of the same pin-count variant, which simplifies migration between Flash/RAM densities.

A 32-bit microcontroller (MCU) is an embedded processor core that fetches, decodes, and executes 32-bit-wide instructions, providing roughly an order-of-magnitude higher throughput than 8/16-bit MCUs while integrating Flash, SRAM, and a programmable peripheral set on a single die. PIC32MX devices sit in the hierarchy: 32-bit MCU -> MIPS M4K core -> PIC32 family -> Microchip 32-bit microcontroller portfolio -> embedded semiconductor. They compete with Cortex-M3/M4 parts from ST (STM32F1/F4), NXP (LPC176x/LPC15xx), and Renesas RX.

Key features of the PIC32MX270F512HT-50I/MR include a USB 2.0 Full-Speed On-The-Go controller, three I2S/SPI modules for codec and serial connectivity, Peripheral Pin Select (PPS) remappable I/O, a Parallel Master Port (PMP) with dual buffers for graphics or external bus interfaces, three analog comparators, a 10-bit ADC, RTCC, CTMU, and multiple timers. The 64-QFN package provides 53 general-purpose I/O lines plus dedicated oscillator, programming, and USB pins.

The architecture combines a 5-stage MIPS32 M4K pipeline with single-cycle multiply, hardware divider, and a zero-wait-state Flash prefetch buffer. PPS allows peripheral functions to be mapped to a wide selection of physical pins at runtime, which is invaluable for routing analog and digital signals on dense PCBs. Internal 8 MHz and 32 kHz oscillators plus four PLL modes support a wide range of system clocks without external crystals.

Typical applications include USB peripherals and HID devices, audio streaming via I2S, low-cost graphics displays through PMP, industrial control and sensor hubs, and connected IoT appliances. The combination of USB OTG and 512 KB Flash makes it well suited to devices such as data loggers, smart-home gateways, and small-form-factor HMI panels.

When designing with this part, review the decoupling scheme - place 0.1uF plus bulk caps on every VDD/AVDD pair - and use PPS extensively to avoid pin-out conflicts. Confirm that USB DP/DM traces are 90-ohm differential and length-matched.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

Drop-in alternatives for PIC32MX270F512HT-50I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC32MX270F512HT-50I/MR (same form factor and footprint) — differing in Package, ADC, Operating Temperature, DMA Channels, USB.

Microchip Technology
Package: 64-pin QFN (MR) 9x9 mm
ADC: 10-bit, 16-channel, 1 Msps
Operating Temperature: -40 C to +85 C (Industrial)
Microchip Technology
Package: 64-QFN (9x9 mm)
ADC: 10-bit, 16-channel, up to 1 Msps
Operating Temperature: -40 °C to +85 °C (Industrial)
Microchip Technology
Package: 64-pin TQFP (PT), 10x10 mm
ADC: 10-bit, 1 MSPS, up to 28 channels
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
Package: 64-pin QFN (9x9 mm) with exposed thermal pad
ADC: 10-bit 1 Msps, up to 48 channels
Microchip Technology
Package: 100-pin TFBGA (7x7 mm)
Microchip Technology
Package: 100-TFBGA (7x7 mm)
ADC: 10-bit
Operating Temperature: -40C to +105C (VT grade)
Microchip Technology
Package: 64-VQFN (9x9 mm) with exposed thermal pad
ADC: 10-bit, up to 16 channels, 500 ksps
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
Package: 64-pin QFN (MR), 9 x 9 mm
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
Package: 64-VQFN (MR) 9x9 mm
ADC: 10-bit, 16-channel, 1 MSPS
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
Package: 64-pin VQFN (9x9 mm, MR)
ADC: 10-bit
Operating Temperature: -40 C to +85 C (Industrial, suffix I)
Microchip Technology
Package: QFN-64 EP (MR), 9x9 mm with exposed pad
ADC: 10-bit, up to 28 channels, 1 Msps
Operating Temperature: -40C to +105C (Industrial)
Microchip Technology
Package: 64-pin VQFN (9x9 mm) with EP
ADC: 10-bit, up to 28 channels, 1 Msps
Operating Temperature: -40C to +85C (Industrial -I)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC32MX270F512HT-I/MR

✅ Drop-In
📦 64-QFN (9x9 mm)
Same die in same 64-QFN MR package, identical 50 MHz / 512 KB Flash / 64 KB SRAM, ordering-code-only difference ('T' tape and reel form factor, no '50' speed suffix)

📋 Reference alternative (not in catalog)

PIC32MX270F256HT-50I/MR

✅ Drop-In
📦 64-QFN (9x9 mm)
Same 64-QFN MR footprint, Flash halved from 512 KB to 256 KB (-50%), SRAM identical at 64 KB, same 50 MHz core - software-compatible but requires Flash-aware linker script changes

📋 Reference alternative (not in catalog)

PIC32MX250F256HT-I/MR

✅ Drop-In
Microchip Technology
📦 64-QFN (9x9 mm)
MIPS32 M4K · 32-bit RISC · 50 MHz / 83 DMIPS · 2.3 V to 3.6 V · 256 KB (256K x 8) · 32 KB · 64-QFN (9x9 mm) · Surface Mount

✓ In Stock

$3.35 / Unit

View Datasheet →

PIC32MX150F256HT-I/MR

✅ Drop-In
Microchip Technology
📦 64-QFN (9x9 mm)
MIPS32 M4K · 1 · 40 MHz · 83 DMIPS · 256 KB (256K x 8) · 32 KB · 2.3 V to 3.6 V · 10-bit, 16-channel, 1 Msps

✓ In Stock

$5.45 / Unit

View Datasheet →
ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

PIC32MX270F512HT-50I/MR Maximum Ratings & Electrical Characteristics

Core MIPS32 M4K 32-bit RISC
Maximum CPU Clock 50 MHz (83 DMIPS)
Program Flash Memory 512 KB (512K x 8)
Data SRAM 64 KB
Package 64-pin QFN (9x9 mm)
Operating Temperature Range -40C to +85C (industrial, 'I' suffix)
Operating Voltage Range 2.3V to 3.6V
USB Controller USB 2.0 Full-Speed Device/Host/OTG
I/O Pins Up to 53
SPI Modules 3
I2S Modules 2
I2C Modules 2
UART Modules 2
Parallel Master Port (PMP) Yes, with dual buffers
ADC 10-bit, up to 16 channels
Analog Comparators 3
Timers 5 x 16-bit + 2 x 32-bit
RTCC Yes
CTMU Yes
Peripheral Pin Select (PPS) Yes
Mounting Type Surface Mount (QFN, tape and reel)
RoHS Status Compliant

PIC32MX270F512HT-50I/MR Pin Configuration

QFN-64 (8x8mm, EP) Package Pinout Diagram QFN-64 8x8mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. Pin 1 by dot. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 QFN-64 (8x8mm, EP)
Pin 1 RPB0/AN0 — Remappable I/O / analog input 0
Pin 2 RPB1/AN1 — Remappable I/O / analog input 1
Pin 3 RPB2/AN2 — Remappable I/O / analog input 2
Pin 4 RPB3/AN3 — Remappable I/O / analog input 3
Pin 5 VDD — I/O supply voltage
Pin 6 VSS — Ground reference for I/O
Pin 7 RPB4/AN4 — Remappable I/O / analog input 4
Pin 8 RPB5/AN5 — Remappable I/O / analog input 5
Pin 9 RPB6/AN6 — Remappable I/O / analog input 6
Pin 10 RPB7/AN7 — Remappable I/O / analog input 7
Pin 11 RPC0 — Remappable I/O
Pin 12 RPC1 — Remappable I/O
Pin 13 RPC2 — Remappable I/O
Pin 14 RPC3 — Remappable I/O
Pin 15 VSS — Ground
Pin 16 VDD — I/O supply voltage
Pin 17 RPC4 — Remappable I/O
Pin 18 RPC5 — Remappable I/O
Pin 19 RPC6 — Remappable I/O
Pin 20 RPC7 — Remappable I/O
Pin 21 RPC8 — Remappable I/O
Pin 22 RPC9 — Remappable I/O
Pin 23 VUSB — USB transceiver supply
Pin 24 D- — USB D- differential data line
Pin 25 D+ — USB D+ differential data line
Pin 26 VSS — Ground
Pin 27 VDD — I/O supply voltage
Pin 28 OSC1/CLKI/RC13 — Crystal oscillator input / external clock / remappable I/O
Pin 29 OSC2/CLKO/RC14 — Crystal oscillator output / clock out / remappable I/O
Pin 30 RPD0/AN8 — Remappable I/O / analog input 8
Pin 31 RPD1/AN9 — Remappable I/O / analog input 9
Pin 32 RPD2/AN10 — Remappable I/O / analog input 10
Pin 33 RPD3/AN11 — Remappable I/O / analog input 11
Pin 34 RPD4/AN12 — Remappable I/O / analog input 12
Pin 35 RPD5/AN13 — Remappable I/O / analog input 13
Pin 36 RPD6/AN14 — Remappable I/O / analog input 14
Pin 37 RPD7/AN15 — Remappable I/O / analog input 15
Pin 38 RPD8/RTCC — Remappable I/O / RTCC output
Pin 39 RPD9 — Remappable I/O
Pin 40 RPD10 — Remappable I/O
Pin 41 RPD11 — Remappable I/O
Pin 42 VSS — Ground
Pin 43 VDD — I/O supply voltage
Pin 44 RPD12 — Remappable I/O
Pin 45 RPD13 — Remappable I/O
Pin 46 RPD14 — Remappable I/O
Pin 47 RPD15 — Remappable I/O
Pin 48 RPE0/PMA3 — Remappable I/O / Parallel Master Port address 3
Pin 49 RPE1/PMA4 — Remappable I/O / PMP address 4
Pin 50 RPE2/PMA5 — Remappable I/O / PMP address 5
Pin 51 RPE3/PMA6 — Remappable I/O / PMP address 6
Pin 52 RPE4/PMA7 — Remappable I/O / PMP address 7
Pin 53 RPE5 — Remappable I/O
Pin 54 RPE6 — Remappable I/O
Pin 55 RPE7/PMD7 — Remappable I/O / PMP data 7
Pin 56 RPE8/PMD6 — Remappable I/O / PMP data 6
Pin 57 RPE9/PMD5 — Remappable I/O / PMP data 5
Pin 58 VSS — Ground
Pin 59 AVDD — Analog supply voltage
Pin 60 AVSS — Analog ground
Pin 61 RPF0/PMD0 — Remappable I/O / PMP data 0
Pin 62 RPF1/PMD1 — Remappable I/O / PMP data 1
Pin 63 RPF2/PMD2 — Remappable I/O / PMP data 2
Pin 64 RPF3/PMD3 — Remappable I/O / PMP data 3
Pin 65 RPF4/PMD4 — Remappable I/O / PMP data 4
Pin 66 EPAD — Exposed thermal pad - solder to PCB ground

Typical Applications

PIC32MX270F512HT-50I/MR is suitable for 7 applications: USB HID and Data Acquisition Peripherals, I2S Audio Streaming Devices, Industrial Sensor Hubs and Modbus Nodes, Low-Cost Graphical HMI Displays, Connected Home and IoT Appliances, Medical Point-of-Care and Wellness Devices, Educational and Hobby Development Boards.

🔧

USB HID and Data Acquisition Peripherals

The PIC32MX270F512HT-50I/MR is a strong fit for USB peripherals because its on-chip USB 2.0 Full-Speed OTG controller eliminates external PHY or transceiver BOM. The 512 KB Flash accommodates the Microchip Harmony USB stack plus application logic, while 64 KB SRAM supports double-buffered isochronous transfers at 64 bytes per microframe. Designers use the peripheral pin select (PPS) to remap SPI/I2C sensors to convenient PCB locations while keeping DP/DM on fixed USB pins. Compared with 8-bit MCUs that need an external USB bridge, this single-chip approach reduces BOM, board area, and firmware complexity - ideal for HID-class devices, custom data loggers, and tethered instrumentation that enumerates as a vendor-specific or composite USB device.

🎧

I2S Audio Streaming Devices

With two I2S modules and DMA support, the PIC32MX270F512HT-50I/MR can stream full-duplex stereo audio up to 48 kHz sample rates, suitable for Bluetooth/Wi-Fi audio sinks, headphone amplifiers, and conference microphone arrays. The 50 MHz core provides ample headroom for sample-rate conversion, biquad filtering, and USB audio class 1.0 enumeration. Connect an external audio codec such as the Texas Instruments TLV320AIC3254 or Cirrus Logic CS43L22 to the I2S lines routed through PPS. The 64 KB SRAM accommodates 8 ms of stereo 48 kHz/24-bit buffering plus protocol stack. For higher sample rates or multi-channel DSP, scale up to PIC32MZ or Cortex-M7 parts.

🏭

Industrial Sensor Hubs and Modbus Nodes

Industrial sensor hubs benefit from the PIC32MX270F512HT-50I/MR combination of USB-OTG for local configuration, two UART channels for RS-485/Modbus RTU, and 16-channel 10-bit ADC for direct sensor interfaces. The industrial -40C to +85C temperature rating supports cabinet-mounted deployments. RTCC allows time-stamping of sensor data without external RTC, while CTMU simplifies capacitive touch or temperature measurement. Designers use the parallel master port (PMP) to drive character LCDs or external parallel ADC expanders. The PPS feature keeps the PCB layout flexible when adding opto-isolated UART paths or analog front-ends in noisy motor-control cabinets.

📺

Low-Cost Graphical HMI Displays

The PIC32MX270F512HT-50I/MR drives small graphical TFT or OLED panels through the parallel master port (PMP) with dual buffers, supporting up to 8-bit parallel interfaces to common controllers like ILI9341 or SSD1963. The 50 MHz core and 64 KB SRAM are sufficient to render menus, gauges, and simple animations at 30+ FPS, while 512 KB Flash holds graphics assets and UI state machines. PPS allows the data and control signals to be remapped to adjacent pins, simplifying PCB routing to the panel connector. For larger displays or higher frame rates, consider PIC32MX with more pins or stepping up to PIC32MZ EF devices.

🧩

Connected Home and IoT Appliances

IoT appliances such as smart thermostats, Wi-Fi gateways, and home-automation controllers leverage the PIC32MX270F512HT-50I/MR's USB-OTG, ample Flash for OTA bootloaders, and UART/SPI for external Wi-Fi/BLE modules (e.g., Microchip RNWF02 or ESP32). The on-chip RTCC schedules sleep/wake cycles for sub-mA average power, while CTMU adds touch-button support without extra ICs. The 64-QFN (9x9 mm) keeps the design compact enough for behind-wall outlet form factors. PPS allows pin re-mapping across PCB revisions without re-spinning firmware, accelerating product variants (single-button, dual-button, LED-ring) from the same platform.

💊

Medical Point-of-Care and Wellness Devices

Medical and wellness devices use the PIC32MX270F512HT-50I/MR for its deterministic real-time behavior, USB connectivity for data upload, and analog comparators with CTMU for sensor front-ends (pulse oximetry, glucometer, etc.). The 50 MHz core runs signal-processing routines (filtering, baseline removal, SpO2 algorithm) within 100 ms windows. The 512 KB Flash holds FDA-style firmware validation records and a small secure boot routine, while 64 KB SRAM buffers sensor samples before BLE/Wi-Fi transmission. Note: only design with the industrial-grade 'I' suffix for the -40C to +85C range; medical IEC 60601 compliance must be addressed at the system level, not the MCU alone.

🖥️

Educational and Hobby Development Boards

The PIC32MX270F512HT-50I/MR is widely used in microcontroller education and hobby projects, including Microchip's PIC32MX270 curiosity and chipKIT-compatible boards. The 50 MHz MIPS core, USB OTG, and abundant peripherals provide a rich teaching platform for embedded C, RTOS concepts, and USB stack internals. The MPLAB Harmony code-configurator and MPLAB X IDE offer free toolchains, making it accessible to students. The 64-QFN package is hand-solderable with hot air but easier to evaluate in TQFP-equipped dev kits. Many community libraries (FreeRTOS port, MicroPython ports, Arduino-ish cores via chipKIT) extend its usefulness beyond the classroom into prototyping.

Recommended Products Summary

PIC32MX270F256HT-50I/MR Lower-Flash sibling for cost-down USB designs Used in: USB HID and Data Acquisition Peripherals MCP2210 Companion USB-to-SPI bridge for legacy expansion Used in: USB HID and Data Acquisition Peripherals TLV320AIC3254 Low-power stereo audio codec with miniDSP Used in: I2S Audio Streaming Devices PIC32MX170F512HT-50I/PT Microchip Technology Used in: I2S Audio Streaming Devices MAX3485 RS-485 transceiver for Modbus Used in: Industrial Sensor Hubs and Modbus Nodes MCP3421 18-bit I2C ADC for precision analog expansion Used in: Industrial Sensor Hubs and Modbus Nodes ILI9341 240x320 TFT LCD controller with parallel/SPI interface Used in: Low-Cost Graphical HMI Displays PIC32MX170F512L-I/PF Microchip Technology Used in: Low-Cost Graphical HMI Displays, Educational and Hobby Development Boards RNWF02 Microchip Wi-Fi module for IoT connectivity Used in: Connected Home and IoT Appliances MCP9808 High-accuracy I2C temperature sensor Used in: Connected Home and IoT Appliances AFE4400 TI analog front-end for pulse oximetry Used in: Medical Point-of-Care and Wellness Devices MCP4725 12-bit I2C DAC for sensor excitation Used in: Medical Point-of-Care and Wellness Devices MCP2200 USB-to-UART bridge for programming/debug Used in: Educational and Hobby Development Boards
What is the maximum CPU clock speed of PIC32MX270F512HT-50I/MR?
The PIC32MX270F512HT-50I/MR runs at up to 50 MHz, delivering up to 83 DMIPS from the MIPS32 M4K 32-bit core. The '50' in the part number denotes the 50 MHz grade. For headroom-sensitive code paths (RTOS, USB isochronous), the 83 DMIPS budget typically yields ~60% core utilization at full load, leaving margin for interrupts and housekeeping loops.
How much Flash and SRAM does PIC32MX270F512HT-50I/MR integrate?
The PIC32MX270F512HT-50I/MR integrates 512 KB of Flash program memory (organized as 512K x 8) and 64 KB of SRAM. The 'F512' suffix encodes the Flash density (512 KB). 512 KB is sufficient for USB stacks plus application logic up to roughly 400 KB of C source code depending on optimization and library footprint.
What package and pin count does PIC32MX270F512HT-50I/MR use?
The PIC32MX270F512HT-50I/MR ships in a 64-pin QFN (9x9 mm) package designated 'MR' in Microchip naming, supplied on tape and reel ('T' suffix). The 9x9 mm body provides an exposed thermal pad that must be soldered to the PCB ground plane for thermal dissipation and electrical ground reference.
Does PIC32MX270F512HT-50I/MR support USB OTG?
Yes, the PIC32MX270F512HT-50I/MR includes a USB 2.0 Full-Speed On-The-Go controller supporting device, host, and OTG roles. On-chip transceiver and dedicated DP/DM pins simplify PCB layout - design with a 90-ohm differential, length-matched to within 150 mil for compliance. Pull-up resistors for D+/D- must be selected per device/host/OTG role.
Where can I download the PIC32MX270F512HT-50I/MR datasheet PDF?
The datasheet for the PIC32MX270F512HT-50I/MR is published by Microchip as the 'PIC32MX1XX/2XX/5XX 64/100-pin Family datasheet'. According to the Microchip product page, the latest revision is available at the official Microchip website. Search 'PIC32MX270F512H datasheet' on microchip.com to reach the current document and errata.
What is the operating temperature range of PIC32MX270F512HT-50I/MR?
The 'I' suffix in PIC32MX270F512HT-50I/MR denotes the industrial temperature range of -40C to +85C. For automotive or extended industrial deployments up to 125C, designers must select the 'E' temperature grade variant from the PIC32MX270F512H family. Q-grade parts (-40C to +125C) are also offered for selected ordering codes.
Where can I buy PIC32MX270F512HT-50I/MR and what is the lead time?
As of 2026-10-02, PIC32MX270F512HT-50I/MR is in stock at DigiKey, Mouser, and LCSC with no extended lead time. LCSC lists it from $2.61 in production volumes. Authorized distributors are the safest sourcing channel; Microchip direct can be used for high-volume production and PPAP-grade supply assurance.
What is the price of PIC32MX270F512HT-50I/MR in volume?
As of 2026-10-02, the LCSC reference price for PIC32MX270F512HT-50I/MR is approximately $2.61 per unit in reel quantities. DigiKey/Mouser unit prices in 100-piece breaks typically run $5-7. Volume pricing from Microchip direct requires a quote; typical 1k-10k pricing ranges between $4.50 and $5.00 depending on program and tooling.
Is PIC32MX270F512HT-50I/MR in stock at major distributors?
Yes, PIC32MX270F512HT-50I/MR is actively stocked at DigiKey, Mouser, LCSC, and Octopart-listed distributors as of 2026-10-02. The part is in active production with no EOL notice. Lead time for production quantities is generally 8-12 weeks from Microchip factory; distributor shelf stock ships same-day.
What is the difference between PIC32MX270F512HT-50I/MR and PIC32MX270F512H-I/MR?
PIC32MX270F512HT-50I/MR and PIC32MX270F512H-I/MR are members of the same PIC32MX270F512H family. The 'T' suffix denotes tape-and-reel packaging; '50' denotes the 50 MHz speed grade; 'I' is the industrial -40C to +85C temperature range; 'MR' is the 64-QFN 9x9 mm package. They are functionally identical; the differences are packaging and ordering code form-factor only.
What is the best drop-in replacement for PIC32MX270F512HT-50I/MR?
The best drop-in replacement is PIC32MX270F512HT-I/MR, the same die in the same MR 64-QFN package but without the '50' speed grade ordering code - electrically and pin-compatible. For lower-density cost-down designs PIC32MX250F256HT-I/MR (256 KB Flash, same MR package) is a pin-compatible alternative with reduced Flash.
What STM32 or NXP equivalent can replace PIC32MX270F512HT-50I/MR?
Cross-brand 64-pin QFN drop-in equivalents are rare because pinouts differ between MIPS and ARM cores. NXP LPC1768FBD100 (100-pin LQFP) and STM32F205VFT6 (100-pin LQFP) match the 50 MHz + 512 KB Flash class but require PCB rework. For same-PCB 64-QFN socket compatibility, stay within the PIC32MX2xx 64-pin QFN family.
When should I choose PIC32MX270F512HT-50I/MR over PIC32MX170F512H?
Choose PIC32MX270F512HT-50I/MR when you need the added 2nd I2S module, USB OTG, and the third SPI interface found on the PIC32MX2xx generation. PIC32MX170F512H is the lower-cost sibling that drops USB and one I2S - pick it for cost-sensitive non-USB designs in the same 64-pin QFN footprint.
Is PIC32MX270F512HT-50I/MR suitable for audio applications?
Yes, the PIC32MX270F512HT-50I/MR suits audio applications through its two I2S modules that interface to external codecs such as the Microchip/Atmel ATSAM AC series or Cirrus Logic CS43L21. DMA-driven I2S plus the 64 KB SRAM allows full-duplex 48 kHz stereo buffering. For higher-end DSP, consider PIC32MZ or Cortex-M7 devices instead.
What are the key specifications of PIC32MX270F512HT-50I/MR that engineers should know?
The PIC32MX270F512HT-50I/MR combines a 50 MHz / 83 DMIPS MIPS32 M4K core, 512 KB Flash, 64 KB SRAM, USB 2.0 Full-Speed OTG, two I2S plus three SPI plus two I2C, Peripheral Pin Select (PPS), PMP with dual buffers, 3 analog comparators, and a 10-bit ADC in a 64-pin QFN (9x9 mm) operating from 2.3-3.6 V at -40C to +85C.

Engineering reference data for PIC32MX270F512HT-50I/MR — comparison, design guidance, and compliance information.

Selection Guide

Choose PIC32MX270F512HT-50I/MR when your design needs USB OTG plus full-duplex I2S audio in a single 64-QFN chip, and the 512 KB Flash/64 KB SRAM budget is required for a USB stack plus application logic. If USB is not needed, drop to PIC32MX250F256HT-I/MR for cost savings. For lower Flash and no USB, PIC32MX150F256HT-I/MR is the entry-level 64-QFN. All three share the same MR package, allowing PCB reuse across product variants.

Comparison with Alternatives

Parameter This Product PIC32MX270F512HT-I/MR PIC32MX270F256HT-50I/MR PIC32MX250F256HT-I/MR PIC32MX150F256HT-I/MR
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 64-QFN (9x9 mm) 64-QFN (9x9 mm) - same 64-QFN (9x9 mm) - same 64-QFN (9x9 mm) - same 64-QFN (9x9 mm) - same
Core MIPS32 M4K 32-bit MIPS32 M4K 32-bit MIPS32 M4K 32-bit MIPS32 M4K 32-bit MIPS32 M4K 32-bit
Maximum CPU Clock 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
Program Flash 512 KB 512 KB 256 KB (-50%) 256 KB (-50%) 256 KB (-50%)
Data SRAM 64 KB 64 KB 64 KB 64 KB 64 KB
USB OTG Yes (FS USB 2.0 OTG) Yes Yes No No
I2S Modules 2 2 2 1 0
Operating Temperature -40C to +85C (I) -40C to +85C (I) -40C to +85C (I) -40C to +85C (I) -40C to +85C (I)
Voltage Range 2.3V to 3.6V 2.3V to 3.6V 2.3V to 3.6V 2.3V to 3.6V 2.3V to 3.6V

Key Differentiators

  • Maximum Flash density in the PIC32MX270 64-QFN family (vs PIC32MX270F256HT-50I/MR)
  • Includes on-chip USB OTG in 64-QFN (vs PIC32MX250F256HT-I/MR)
  • Industrial temperature grade and dual I2S in 64-QFN (vs PIC32MX150F256HT-I/MR)

Design Notes

The PIC32MX270F512HT-50I/MR operates from 2.3V to 3.6V with separate analog (AVDD) and digital (VDD) rails. Place a 10 uF bulk plus 0.1 uF decoupling capacitor on every VDD/AVDD pair, and keep the decoupling loop area under 3 mm square. A ferrite bead between VDD and AVDD reduces switching noise injection into the ADC - this is critical when sampling analog signals concurrently with active USB traffic. USB VUSB pin requires its own 0.1 uF plus a 10 uF capacitor tied to ground per Microchip reference designs.

The 64-QFN (9x9 mm) exposed thermal pad (EPAD) must be soldered to a ground plane with at least 16 thermal vias (0.3 mm drill, 0.6 mm pad) for heat dissipation and ground reference. USB DP/DM traces must be 90-ohm differential, length-matched to within 150 mil, and routed over a continuous ground reference plane. Keep crystal traces (OSC1/OSC2) short - under 10 mm - and surround them with ground stitching vias to minimize EMI pickup.

The USB DP/DM pins are fixed (not remappable via PPS) and have specific impedance requirements - use a 90-ohm differential impedance calculator for your stack-up. The I2S lines routed through PPS should be kept under 50 mm total length to avoid clock-data skew on the audio interface. The Parallel Master Port (PMP) data and address lines share pins with PPS-remappable functions; isolate them on dedicated GPIO banks to simplify timing closure on graphics applications.

Configuration bits (CFG) must be set to enable the primary oscillator, disable the watchdog if not used, and select the correct JTAG/debug mode - leaving defaults can result in code-locked devices on first power-up. When using the on-chip USB transceiver, the VUSB pin must be energized even in self-powered designs; otherwise USB enumeration fails. The PPS mapping registers unlock sequence must be performed exactly as specified in the datasheet (write key, write mapping, write lock) - skipping the lock is a frequent source of mysterious GPIO lockups at runtime.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and lead-free per Microchip product page. Not AEC-Q100 qualified; choose 'V' automotive or industrial extended temperature grade variants for harsher environments. Halogen-free per Microchip environmental compliance data.

Data verified on: 2026-10-02 — data verified and curated by XAIPART's component engineering team

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