RTAX1000SL-1CGS624E - 1M-Gate Rad-Tolerant FPGA CCGA-624 | Microchip
部品番号: RTAX1000SL-1CGS624E ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4500 | $4,500.00 |
| 10 | $4180 | $41,800.00 |
| 100 | $3900 | $390,000.00 |
| 500 | $3650 | $1,825,000.00 |
| 1,000 | $3420 | $3,420,000.00 |
RTAX1000SL-1CGS624E 概要
A radiation-tolerant FPGA is a programmable logic device engineered to survive the particle-rich environment of space flight, where ionizing radiation causes single-event upsets (SEUs) and total ionizing dose (TID) degradation. Within the programmable logic hierarchy, the RTAX-SL family sits at the space-flight tier above commercial FPGAs, derived from the commercial Axcelerator family and qualified on a 0.15 um CMOS process.
Key features include SEU-hardened flip-flops that eliminate the need for Triple Module Redundancy (TMR) in many designs, immunity to single-event upsets to a specified LET threshold with a soft-error rate below 10-10 errors per bit-day, embedded SRAM blocks with built-in FIFO control logic, segmentable clock circuitry, and true single-chip, live-at-power-up operation enabled by non-volatile antifuse interconnect.
Architecturally, the RTAX1000SL is based on the Microsemi (Actel) Axcelerator fabric, combining sea-of-modules logic clusters, embedded FIFO/ECC-controlled SRAM, and a hierarchical routing structure that supports system performance up to 581 MHz. The antifuse fabric is programmed once and cannot be reprogrammed, which provides inherent protection against configuration upsets and readback attacks - a decisive advantage over SRAM-based FPGAs in orbit.
Typical applications include satellite payload data processing, spacecraft on-board computers, telemetry and telecommand interfaces, and instrument control on deep-space and Earth-observation missions where the -55C to +125C ceramic package and radiation tolerance are mission-critical.
Design consideration: antifuse devices are one-time programmable, so radiation testing, SEU strategy validation, and full timing closure must be completed before flight lot submission; Microchip provides Libero SoC tools and an adapter-board prototyping flow with EDIF netlist conversion for RTAX-S/SL designs.
This page synthesizes verified distributor data, family drop-in variants, and space-design engineering notes not found together on the manufacturer datasheet.
ドロップイン代替品: RTAX1000SL-1CGS624E — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: RTAX1000SL-1CGS624E （同一形状・フットプリント） — 相違点: Package, Family, Radiation Tolerance, Speed Grade, Configuration.
クイック比較ツール — 並列比較する代替部品を選択:
RTAX1000SL-CGS624E
✅ ドロップイン✓ 在庫あり
$3970 / 個
データシートを見る →RTAX1000SL-1CGS624V
✅ ドロップイン✓ 在庫あり
$1 / 個
データシートを見る →RTAX1000SL-1CG624E
✅ ドロップイン📋 参考代替品（カタログ未掲載）
RTAX1000SL-CG624E
✅ ドロップイン📋 参考代替品（カタログ未掲載）
RTAX1000SL-1CGS624EV
✅ ドロップイン📋 参考代替品（カタログ未掲載）
RTAX1000SL-1CGS624E 最大定格＆電気的特性
| System Gates | 1,000,000 |
| ASIC Gates (embedded) | 125,000 |
| Configurable Logic Blocks (CLBs) | 12096 |
| Family | RTAX-S/SL (radiation-tolerant, antifuse) |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum System Performance | 581 MHz |
| パッケージ | CGA-624 (ceramic column grid array, 624 pins) |
| Speed Grade | -1 |
| 動作温度 | -55C to +125C |
| Programming Technology | Antifuse (one-time programmable, live at power-up) |
| SEU Immunity | SEU-hardened registers; soft-error rate < 10-10 errors/bit-day |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| 実装タイプ | Surface Mount |
| Application Domain | Space flight systems |
| Embedded FIFO Control | Yes |
RTAX1000SL-1CGS624E cga-624 (ceramic column grid array, 624 pins) ピン配置ガイド
RTAX1000SL-1CGS624E (cga-624 (ceramic column grid array, 624 pins) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: RTAX1000SL-1CGS624E.
詳細は データシート をご参照ください。
主な用途
RTAX1000SL-1CGS624E の用途: 6 件s: Satellite Payload Data Processing, Spacecraft On-Board Computer (OBC) Logic, Telemetry, Tracking and Command (TT&C) Interfaces, Earth Observation Instrument Control, Deep-Space Probe Avionics, Radiation Test and Prototyping Platforms.
Satellite Payload Data Processing
The RTAX1000SL-1CGS624E fits satellite payload processing because its 1,000,000 system gates, 12,096 CLBs, and 125,000 embedded ASIC gates implement high-throughput DSP pipelines, packetizers, and compression engines on a single chip. Its SEU-hardened registers deliver soft-error rates below 10-10 errors/bit-day, dramatically reducing or eliminating triple-module-redundancy overhead versus SRAM FPGAs, so more of the fabric remains available for payload logic. The antifuse configuration cannot be upset in orbit and requires no configuration flash, giving true live-at-power-up operation after launch. Embedded SRAM with FIFO control handles inter-packet buffering at line rate, while the CGA-624 hermetic ceramic package tolerates launch vibration and -55C to +125C thermal cycling. Data flows from ADC front ends through fabric DSP modules into downlink framers with timing closure certified at the -1 speed grade up to 581 MHz.
おすすめ
Spacecraft On-Board Computer (OBC) Logic
Spacecraft on-board computers rely on the RTAX1000SL-1CGS624E for housekeeping logic, memory controllers, and bus interfaces because a single device consolidates functions that would otherwise span several rad-tolerant ASSPs. The 1.5 V core and antifuse static architecture minimize power draw - critical for eclipse operation - while SEU-hardened flip-flops keep the register state intact against heavy-ion strikes to the certified LET threshold. Embedded FIFO-logic SRAM implements double-buffered RAM disks and EDAC-assisted memory interfaces, and the segmentable clock network isolates processor-domain timing from the RF and telemetry domains. The 624-pin CGA provides abundant I/O banks for Mil-Std-1553, SpaceWire, and CAN transceiver glue. Designers validate on the adapter-board prototyping flow, then commit to the antifuse device with timing signed off in Libero SoC at the -1 speed grade.
おすすめ
Telemetry, Tracking and Command (TT&C) Interfaces
TT&C subsystems deploy the RTAX1000SL-1CGS624E to frame telemetry, decode telecommand, and arbitrate uplink/downlink channels. Its live-at-power-up antifuse fabric means the TT&C chain is operational the instant spacecraft power is applied - a hard requirement for acquisition-of-signal after separation - without waiting for configuration load. The device's SEU rate below 10-10 errors/bit-day keeps command-decode error probability within mission assurance budgets even in MEO and GEO radiation belts. Embedded FIFO-controlled SRAM buffers CCSDS frames during band switching, and 581 MHz fabric capability supports convolutional and LDPC encoder front ends. Because the CGS624 footprint is shared across RTAX1000SL screening variants, engineering models built on 'E' parts migrate directly to flight 'V' parts with no PCB respin, cutting program schedule risk on the TT&C critical path.
おすすめ
Earth Observation Instrument Control
Imaging instruments for Earth observation use the RTAX1000SL-1CGS624E as focal-plane controller and image-chain sequencer. The 1M-gate fabric generates multi-phase CCD/CMOS sensor clocks, sequences exposure timing, and performs real-time gain and offset correction using embedded SRAM lookup tables with FIFO handshaking. Its -55C to +125C hermetic CGA-624 package survives the thermal swings of low-Earth-orbit eclipses, and the antifuse configuration is immune to the TID-adjacent configuration upsets that plague SRAM FPGAs at 600 km altitudes. SEU-hardened registers protect the instrument state machine without TMR cost, preserving gate budget for image pre-processing such as pixel aggregation and lossless pre-compression before the payload downlink. The -1 speed grade comfortably meets the sub-100 MHz pixel-clock domain while leaving generous timing margin across the full military temperature range.
おすすめ
Deep-Space Probe Avionics
Deep-space missions impose the harshest radiation environment in flight electronics, and the RTAX1000SL-1CGS624E addresses it with a single-chip, single-event-upset-hardened architecture. Beyond LET-hardened registers and antifuse configuration immunity, the device eliminates the configuration-memory scrubber circuits that SRAM FPGAs require, saving mass, power, and a failure mode in avionics boxes that must run unattended for a decade. The 12,096-CLB fabric implements autonomous fault management, watchdog logic, and propulsion sequencing, while the 125,000 ASIC-gate equivalent of hard macro capacity offloads time-critical interfaces. Live-at-power-up behavior guarantees safe-mode entry capability immediately after trans-lunar injection power cycles. Programs commonly qualify with 'E'-screened RTAX1000SL-1CGS624E units in environmental test, then fly the identical footprint in 'V'-screened parts, preserving all verification artifacts across the engineering-to-flight transition.
おすすめ
Radiation Test and Prototyping Platforms
Before committing one-time-programmable antifuse silicon, programs use the RTAX1000SL-1CGS624E family in radiation test and prototyping flows. Microchip's documented methodology employs a footprint-compatible adapter board with EDIF netlist and pinout conversion so designs prototype on AX-cell equivalents, then migrate directly to RTAX-S/SL flight devices - the CGS624 footprint stays constant. Heavy-ion test articles frequently use the 'E'-screened RTAX1000SL-1CGS624E because its identical die and package deliver representative SEU data at reduced unit cost, validating the sub-10-10 errors/bit-day soft-error claim and TID performance before flight-lot procurement. Libero SoC exports the final netlist once testing concludes, and timing closure at the -1 speed grade carries over unchanged. This flow shortens rad-hard program schedules by decoupling test-article availability from flight-lot lead times.
おすすめ
おすすめ製品の概要
この製品に関するFAQはありません。
エンジニアリング参考データ: RTAX1000SL-1CGS624E — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | RTAX1000SL-CGS624E | RTAX1000SL-1CGS624V | RTAX1000SL-1CG624E | RTAX1000SL-1CGS624EV |
|---|---|---|---|---|---|
| Package | CGA-624 (ceramic column grid array, 624 pins) | CGA-624 - same | CGA-624 - same | CGA-624 - same | CGA-624 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| CLBs / Logic Cells | 12096 | 12096 | 12096 | 12096 | 12096 |
| Speed Grade | -1 | Standard (slower than -1) | -1 | -1 | -1 |
| Screening Flow | E (extended temperature) | E | V (flight) | E | E/V variant |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| SEU Hardening | SEU-hardened registers, error rate < 10-10 errors/bit-day | Same | Same | Same | Same |
主な差別化要因
- Fastest certified speed grade in the 1M-gate 624-pin footprint （vs RTAX1000SL-CGS624E)
- Extended-temperature 'E' screening at lower cost than flight units （vs RTAX1000SL-1CGS624V)
- Radiation tolerance eliminates configuration-scrubber overhead （vs RTAX1000SL-1CGS624E vs SRAM-based FPGAs)
設計ノート
The RTAX1000SL-1CGS624E is antifuse-based and one-time programmable: a bitstream error is unrepairable in flight. Complete full functional simulation, timing closure at the -1 speed grade, and (if applicable) radiation lot acceptance before submitting the programming file. Microchip's application note 'Prototyping for RTAX-S and RTAX-SL Devices' describes the adapter-board flow with EDIF netlist and pinout conversion for validating the design before antifuse programming.
The 1.5 V core rail carries most of the device current and must be decoupled with bulk ceramic capacitance at the CGA-624 power columns per the RTAX-S/SL datasheet power-supply chapter; I/O bank rails (2.5 V typically) should each have local decoupling. Estimated: because the antifuse fabric is static (no configuration switching current), power scales with clock activity, not configuration - use Libero SoC power analysis on your actual netlist rather than worst-case gate-count estimates.
The 624-column CGA layout places I/O banks in defined regions; honor datasheet I/O bank voltage and simultaneous-switching-output (SSO) limits when assigning high-fanout or strobe-heavy signals. Route clock inputs to the segmentable clock resources on dedicated clock-capable pins, and verify column-grid landing pattern against the ceramic CGS624 mechanical drawing to avoid via-in-pad conflicts on the 1.27 mm-ish column pitch typical of ceramic CGA packages.
コンプライアンス情報
Space-grade hermetic ceramic device; RoHS/REACH declarations must be obtained from Microchip documentation, as high-lead solder columns in ceramic CGA packages are commonly used for space reliability and are often exempt. DLA drawing 5962-0422008 exists for family parts per the DLA Standard Microcircuit Cross-Reference, indicating Mil-Prf-38535 QML qualification for related part numbers.
