RTAX1000SL-CGS624E - 1M-Gate Rad-Tolerant FPGA CCGA-624 | Microchip
MPN: RTAX1000SL-CGS624E ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4620 | $46,200.00 |
| 100 | $4390 | $439,000.00 |
| 500 | $4180 | $2,090,000.00 |
| 1,000 | $3970 | $3,970,000.00 |
Drop-in alternatives for RTAX1000SL-CGS624E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX1000SL-1CGS624E
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$3420 / Unit
View Datasheet →RTAX2000S-1CGS624V
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$3950 / Unit
View Datasheet →RTAX2000S-CGS624V
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View Datasheet →RTAX2000SL-1CGS624E
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$10750 / Unit
View Datasheet →RTAX2000SL-CGS624E
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View Datasheet →RTAX1000SL-CGS624E Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 1000000 gates |
| Additional ASIC Gates | 125000 gates |
| Configurable Logic Blocks (CLBs) | 12096 |
| Maximum System Frequency | 581 MHz |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Package | 624-ball Ceramic Column Grid Array (CGS624) |
| Radiation Tolerance | Radiation-tolerant (space-flight qualified family) |
| Configuration | Non-volatile anti-fuse, live-at-power-up, single chip |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking Features | Segmentable clocks, chip-wide highway routing |
| Arithmetic Support | Dedicated carry logic |
| Mounting Type | Surface Mount |
RTAX1000SL-CGS624E 624-ball ceramic column grid array (cgs624) Pin Configuration Guide
Complete pinout information for RTAX1000SL-CGS624E (624-ball ceramic column grid array (cgs624) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX1000SL-CGS624E.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX1000SL-CGS624E is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Command and Data Handling, Remote Sensing and Imaging Instrumentation, Telemetry, Tracking and Control Electronics, Flight Prototype and Ground Evaluation Systems, Radiation-Tolerant Glue Logic Integration.
Satellite Payload Data Processing
The RTAX1000SL-CGS624E fits payload processing chains where 1M gates of glueless logic must be alive at power-up with no external configuration device. Its 12,096 CLBs and embedded SRAM with built-in FIFO control absorb CCSDS framing, compression pre-processing, and payload-to-downlink formatting, while 581 MHz fabric capability covers high-rate clock domains. Deployed between a sensor interface and the downlink modulator, the anti-fuse fabric adds no configuration SEU exposure, and the single-chip CGS624 package saves mass and board area versus multi-chip configuration schemes. Verify the device TID and SEE reports against mission orbit requirements, and use segmentable clocks to isolate payload timing from housekeeping domains.
Recommended
Spacecraft Command and Data Handling
Command and data handling (C&DH) subsystems need deterministic boot behavior: the RTAX1000SL-CGS624E's anti-fuse configuration is live-at-power-up, so telemetry gates, bus interfaces, and watchdog logic are operational the moment rails settle. With 1M equivalent gates plus 125,000 ASIC gates of capacity, the device implements MIL-STD-1553 or SpaceWire-style interfaces, memory controllers, and housekeeping aggregation without a companion ASIC. The 1.5V core on a 0.15 um CMOS process keeps dynamic power low, valuable on power-limited buses. Designers typically partition C&DH logic so safety-critical paths avoid deep pipelines, and use the chip-wide highway routing to keep clock skew controlled across the 624-ball CCGA footprint.
Recommended
Remote Sensing and Imaging Instrumentation
Earth-observation and scientific instruments generate parallel high-rate data streams that the RTAX1000SL-CGS624E handles with its embedded SRAM FIFO logic and carry-chain arithmetic for real-time accumulation and correction. The 1M-gate fabric is large enough for CCD/CMOS sensor timing generators, deglitching, and packetization, while the 581 MHz maximum fabric performance supports multi-tap pixel-rate clocking. Because imaging missions often iterate sensor timing late in integration, the RTAX-S/SL prototyping flow (footprint-compatible adaptor board plus EDIF netlist and pinout conversion against commercial Axcelerator silicon, per Microchip application note Prototyping for RTAX-S and RTAX-SL Devices) lets teams verify algorithms on the bench before flight silicon is committed.
Recommended
Telemetry, Tracking and Control Electronics
TT&C electronics require continuously available framing, encoding, and timing logic; the RTAX1000SL-CGS624E's non-volatile anti-fuse fabric means no configuration readback or reprogramming is ever exposed to radiation upset. Its 12,096 CLBs implement convolutional encoders, frame synchronizers, and decimation filters, while dedicated carry logic accelerates CRC and accumulator functions. The segmentable clock architecture lets TT&C and safe-mode logic run on isolated clock trees within the same die, and the CGS624 ceramic column package provides the hermeticity and thermal cycle endurance needed for launch and on-orbit environments. Ground checkout typically exercises both nominal and safe-mode clock configurations before reverting to flight code.
Recommended
Flight Prototype and Ground Evaluation Systems
For breadboard and EM (engineering model) builds, the RTAX-S/SL methodology supports mapping RTAX1000SL-CGS624E designs onto commercial counterpart silicon using a footprint-compatible adaptor board, an EDIF netlist converter, and a pinout converter. Aldec's ACT-H3Ki-CG624 adaptor, for example, mimics the CG624 ball footprint with an A3PE3000 on board, allowing the adaptor to be assembled directly in the flight FPGA's place for logic validation and timing explorations. This reduces risk before expensive flight lots are purchased, and shortens the iteration loop when sensor interfaces or bus protocols change. Final flight designs must be recompiled with RTAX-S/SL libraries and timing models, since commercial silicon does not replicate the flight fabric's radiation behavior.
Recommended
Radiation-Tolerant Glue Logic Integration
Legacy spacecraft architectures often retain multiple ASICs and ASSPs; the RTAX1000SL-CGS624E consolidates their glue logic into one live-at-power-up chip. With 1M gates plus 125,000 ASIC gates of equivalent capacity, the device absorbs bus bridges, memory arbiters, custom serializers, and housekeeping ADC interfacing, cutting component count and the associated screening burden. Its 1.5V core and 0.15 um CMOS process keep standby consumption acceptable for eclipse operations. Because the CGS624 ball map is shared across the RTAX-S/SL family, designers retain a migration path: if consolidation grows, the RTAX2000S-CGS624V mounts on the identical footprint with roughly twice the capacity, protecting the board investment across build iterations.
Recommended
Recommended Products Summary
Engineering reference data for RTAX1000SL-CGS624E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX1000SL-1CGS624E | RTAX2000S-1CGS624V | RTAX2000SL-1CGS624E | RTAX2000SL-CGS624E |
|---|---|---|---|---|---|
| Package | CGS624 (624-ball CCGA) | CGS624 (624-ball CCGA) - same | CGS624 (624-ball CCGA) - same | CGS624 (624-ball CCGA) - same | CGS624 (624-ball CCGA) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 1,000,000 (+125,000 ASIC gates) | 1,000,000 (+125,000 ASIC gates) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Logic Cells (CLBs) | 12096 | 12096 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | Standard | -1 (faster) | -1 (faster) | -1 (faster) | Standard |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Maximum System Frequency | 581 MHz (family maximum) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Fabric Type | SL (low-power) anti-fuse | SL anti-fuse | S (standard) anti-fuse | SL anti-fuse | SL anti-fuse |
| Configuration | Non-volatile anti-fuse, live-at-power-up | Non-volatile anti-fuse, live-at-power-up | Non-volatile anti-fuse, live-at-power-up | Non-volatile anti-fuse, live-at-power-up | Non-volatile anti-fuse, live-at-power-up |
Key Differentiators
- Lowest-power SL fabric at 1M gates (vs RTAX2000S-CGS624V)
- Standard speed grade economics (vs RTAX1000SL-1CGS624E)
- Right-sized capacity within shared footprint (vs RTAX2000SL-1CGS624E)
Design Notes
The CGS624 ceramic column grid array uses solder columns rather than solder balls, which changes both assembly and rework practice versus standard BGA. Column standoff improves tolerance of thermal cycling (valuable for launch vibration and on-orbit temperature swings) but requires inspection with X-ray and column-specific reflow profiles. Follow the package mechanical drawing and assembly guidance in the Microchip RTAX-S/SL datasheet (ds2169) for land pattern, keep-out, and column coplanarity requirements.
Do not prototype directly on flight silicon. The manufacturer-documented methodology uses a footprint-compatible adaptor board with an EDIF netlist converter and pinout converter to map RTAX-S/SL designs onto commercial Axcelerator silicon; see Microchip application note Prototyping for RTAX-S and RTAX-SL Devices. Skipping this flow and burning anti-fuses on flight devices during debugging wastes irreplaceable flight-lot parts, because anti-fuse configuration is one-time-programmable and cannot be reworked.
The RTAX1000SL operates from a 1.5V core with 0.15 um CMOS process technology. Estimated: budget rail sequencing so the core supply is stable before configuration-dependent I/O activity; total power depends on toggle rates and I/O loading, so use Microchip's Libero SoC power estimation tools with your post-place-and-route netlist rather than generic figures. Because the device is live-at-power-up, I/O behavior during supply ramp must be reviewed against attached subsystem input requirements to avoid unintended bus contention at turn-on.
Leverage the segmentable clock architecture and chip-wide highway routing to isolate timing domains: keep payload processing, housekeeping, and interface clocks in separate clock regions to bound skew and simplify timing closure across the large 624-ball package. Simulate I/O ring loading for high-rate buses early, and lock the 624-ball pinout before board layout since anti-fuse devices cannot tolerate late pin re-mapping without re-running flight timing analysis.
Compliance Information
Space-grade ceramic column grid array packages may fall under RoHS exemption clauses for hermetic aerospace packaging; status not stated in verified data. Request a certificate of conformance and material declaration for the specific flight lot and date code.
