RTAX1000SL-1CGS624V - 1M-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX1000SL-1CGS624V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1 | $1.00 |
| 10 | $1 | $10.00 |
| 100 | $1 | $100.00 |
| 500 | $1 | $500.00 |
| 1,000 | $1 | $1,000.00 |
Drop-in alternatives for RTAX1000SL-1CGS624V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX1000SL-CGS624E
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$3970 / Unit
View Datasheet →RTAX1000SL-1CGS624EV
✅ Drop-In📋 Reference alternative (not in catalog)
RTAX1000S-1CGS624V
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Contact for price
View Datasheet →RTAX1000SL-1LG624V
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$975 / Unit
View Datasheet →RTAX1000S-1LG624V
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$3600 / Unit
View Datasheet →RTAX1000SL-1CGS624V Maximum Ratings & Electrical Characteristics
| System Gates | 1,000,000 (1.00E6) |
| Logic Cells / Logic Blocks | 12096 |
| Logic Family | Digital CMOS |
| Programmable Technology | Antifuse (one-time programmable) |
| Package Type | CGA-624 (ceramic column grid array) |
| Pin Count | 624 |
| Operating Temperature | -55C to +125C |
| Speed Grade | -1 (standard) |
| SEU Immunity | SEU-hardened registers; SEU rate < 10-10 errors/bit-day |
| Radiation Tolerance | Radiation-tolerant (space-flight qualified family) |
| Configuration | Live at power-up, single chip, no external boot PROM |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clock resources |
| Routing Features | Chip-wide highway routing, carry logic |
| Mounting Type | Surface Mount |
RTAX1000SL-1CGS624V cga-624 (ceramic column grid array) Pin Configuration Guide
Complete pinout information for RTAX1000SL-1CGS624V (cga-624 (ceramic column grid array) package) with 624 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX1000SL-1CGS624V.
Refer to the datasheet for full pin configuration.
Estimated pin count: 624 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX1000SL-1CGS624V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Telemetry, Tracking & Command (TT&C), Launch Vehicle Avionics, Deep-Space Probe Instrument Control, Space-Grade Glue Logic Integration, Space Imaging & Sensor Front-End Processing.
Satellite Payload Data Processing
In LEO and GEO satellite payloads, the RTAX1000SL-1CGS624V formats, buffers, and pre-processes high-rate sensor and communication data. Its 1,000,000 system gates and 12,096 logic cells accommodate data framing, FIFO-based rate adaptation using embedded SRAM, and channel coding front-ends. The SEU-hardened registers, with SEU rates below 10-10 errors/bit-day per the Microchip datasheet, keep payload logic functional without heavy triple module redundancy, saving gates and timing margin. The antifuse fabric eliminates configuration upsets entirely - a decisive advantage over SRAM FPGAs in orbit. The SL low-power process reduces static current for solar/battery power budgets, and the 624-pin CGA package supplies enough I/O for wide parallel data buses at -55C to +125C.
Recommended
Spacecraft Telemetry, Tracking & Command (TT&C)
TT&C subsystems demand deterministic, always-on logic: the RTAX1000SL-1CGS624V is live at power-up thanks to its antifuse configuration, requiring no external boot PROM and no configuration load time - critical during launch and safe-mode events. The device implements command decoders, telemetry formatters, and watchdog logic across its 12,096 logic cells with chip-wide highway routing for global control signals. Operation from -55C to +125C covers eclipse-driven thermal swings, and the SEU-hardened flip-flops keep command paths immune to single-event upsets to the specified LET threshold. The CGA-624 ceramic package provides the mechanical robustness and solder-column reliability required for vibration-intensive launch environments.
Recommended
Launch Vehicle Avionics
Launch-vehicle flight computers and stage-control electronics operate for minutes in an extreme vibration and radiation environment, where live-at-power-up and configuration immunity are non-negotiable. The RTAX1000SL-1CGS624V's antifuse interconnect cannot suffer configuration single-event upsets, and its SEU-hardened registers deliver SEU rates below 10-10 errors/bit-day, per the Microchip datasheet - well suited to short, high-reliability flights. Segmentable clocks support multiple redundant timing domains, and dedicated carry logic accelerates guidance arithmetic datapaths within the 1M-gate fabric. The ceramic column grid array withstands launch shock better than plastic BGA packaging, and the -1 speed grade covers typical avionics timing closure with margin.
Recommended
Deep-Space Probe Instrument Control
Deep-space missions face total ionizing dose and upset environments far harsher than LEO, making the RTAX1000SL-1CGS624V's radiation-tolerant antifuse architecture a strong fit for instrument sequencing, detector timing, and science-data acquisition. The SL low-power process minimizes static draw when solar flux is weak at large heliocentric distances, directly extending mission power margins. Embedded SRAM with built-in FIFO control buffers instrument data bursts without external memory parts, reducing board-level component count and failure points. SEU-hardened registers eliminate mandatory triple module redundancy for many control paths, freeing logic for science functions within the 12,096 logic cells and 1M system gates. The EV screening variant is recommended for the most severe missions.
Recommended
Space-Grade Glue Logic Integration
Radiation-tolerant designs historically consumed many rad-hard ASICs and SSI/MSI parts for bus interfacing, address decoding, and protocol adaptation. A single RTAX1000SL-1CGS624V integrates this scattered logic into one 624-pin CGA device, cutting component count, board area, and solder joints - each a reliability gain in space hardware. With 1,000,000 system gates, the device absorbs legacy bus bridges, memory controllers with FIFO control from embedded SRAM, and custom peripheral interfaces. Live-at-power-up behavior ensures the integrated logic is functional immediately at spacecraft power application, and the antifuse fabric's configuration immunity removes scrubbing infrastructure that glue-logic SRAM FPGAs would require. This consolidation approach shortens radiation design reviews compared with discrete rad-hard logic builds.
Recommended
Space Imaging & Sensor Front-End Processing
CCD and CMOS imaging payloads on Earth-observation satellites use the RTAX1000SL-1CGS624V to generate precise detector timing, perform correlated double sampling control, and pack image data for downlink. The -1 speed grade plus dedicated carry logic handles pixel-rate arithmetic, while embedded SRAM FIFOs absorb bursts between the sensor interface and the mass-memory. SEU-hardened registers protect timing generators whose corruption would create defective imagery, achieving sub-10-10 errors/bit-day upset rates without full TMR per the Microchip datasheet. The 624 I/O positions accommodate wide parallel sensor heads, and the CGA ceramic package maintains signal integrity and mechanical stability across the -55C to +125C orbital thermal range, making it a proven choice on imaging missions.
Recommended
Recommended Products Summary
Engineering reference data for RTAX1000SL-1CGS624V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX1000SL-CGS624E | RTAX1000SL-1CGS624EV | RTAX1000S-1CGS624V | RTAX1000SL-1LG624V |
|---|---|---|---|---|---|
| Package | CGA-624 (CCGA), 624 pins | CGA-624 - same footprint | CGA-624 - same footprint | CGA-624 - same footprint | 624-position ceramic (LG) - verify column construction |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology (Actel/Microsemi) | Microchip Technology (Actel/Microsemi) | Microchip Technology (Actel/Microsemi) | Microchip Technology (Actel/Microsemi) |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Cells | 12096 | 12096 | 12096 | 12096 | 12096 |
| Speed Grade | -1 | [DATA_NEEDED] | -1 | -1 | -1 |
| Screening Flow | V (radiation-tolerant flight) | E (standard/commercial) | EV (enhanced) | V (radiation-tolerant flight) | V (radiation-tolerant flight) |
| Static Power | Low (SL low-power process) | Low (SL process) | Low (SL process) | Higher (standard S process) | Low (SL process) |
| Operating Temperature | -55C to +125C | [DATA_NEEDED] | -55C to +125C | -55C to +125C | -55C to +125C |
Key Differentiators
- Low-power SL process for spacecraft power budgets (vs RTAX1000S-1CGS624V)
- Enhanced screening option available in same footprint (vs RTAX1000SL-1CGS624EV)
- Configuration immunity vs SRAM space FPGAs (vs SRAM-based rad-tolerant FPGAs (e.g. Xilinx Virtex-QV class))
Design Notes
The RTAX1000SL is one-time programmable: antifuse programming is performed at a certified programming house, not in the lab or in orbit. Freeze and fully verify the design (timing simulation, radiation-relevant analysis) before submitting the programming file, and use prototype-stage parts (E-suffix, e.g. RTAX1000SL-CGS624E) for hardware validation. There is no field update path - a functional bug after flight-unit programming cannot be patched, only respun at significant cost and schedule impact.
The SL process option significantly reduces static current versus the standard RTAX1000S, which matters on solar/battery-limited spacecraft buses. When estimating mission power, account for the difference if your prototype used an S-variant: the S die draws measurably higher standby current. Obtain per-device static current figures from the Microchip RTAX-S/SL datasheet tables for your voltage and temperature corner (-55C to +125C) rather than extrapolating from commercial FPGA experience.
The CGA-624 (ceramic column grid array) uses solder columns rather than solder balls, providing compliance for CTE mismatch between the ceramic package and the PCB during thermal cycling from -55C to +125C. Design the land pattern to the column geometry specified in the Microchip packaging section (not standard BGA ball pads), and for high-reliability assembly consider underfill or staking per your house assembly standard. Verify reflow profiles against the ceramic package's thermal mass, which exceeds plastic-packaged FPGAs.
Compliance Information
Space-grade ceramic-packaged device; RoHS/REACH exemptions typical for aerospace hermetic packages apply but were not stated in the provided data.
