RTAX2000S-1CG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip
部品番号: RTAX2000S-1CG1152V ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
RTAX2000S-1CG1152V 概要
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the total ionizing dose (TID), single-event latchup (SEL), and single-event upset (SEE) environment of orbital and deep-space missions. Within the space electronics hierarchy, RTAX-S sits under radiation-tolerant FPGAs -> space-grade programmable logic -> flight hardware, alongside one-time-programmable antifuse competitors and flash-based alternatives such as ProASIC3-based prototyping solutions.
Key features include a true single-chip form factor, live-at-power-up operation, and low-power consumption. The antifuse programmable interconnect is inherently immune to configuration upsets, eliminating the need for external configuration storage such as PROMs or flash - a decisive weight, power, and reliability advantage in spacecraft avionics. The metal-sealed ceramic column package supports high pin-count, high-IO flight boards.
Architecturally, the RTAX2000S derives from the commercial Axcelerator family, embedding SRAM blocks with built-in FIFO control logic, segmentable clock resources, and chip-wide functionalities, fabricated in 0.15 um CMOS with a 1.5 V core per the RTAX-S/SL datasheet family.
Typical applications include satellite payload data processing, spacecraft command and data handling (C&DH), telemetry/tracking/command interfaces, and radiation-hardened bus controllers - anywhere millions of system gates must operate reliably under radiation for multi-year missions.
Design consideration: RTAX-S devices are one-time-programmable (antifuse); use the companion PROTO/prototype parts or an Aldec flash-based adaptor for in-system iteration before committing to flight silicon.
This page synthesizes verified distributor data, same-family drop-in alternatives, and mission-oriented design notes not found on the manufacturer datasheet alone.
ドロップイン代替品: RTAX2000S-1CG1152V — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: RTAX2000S-1CG1152V （同一形状・フットプリント） — 相違点: Package, Technology, Configuration, Equivalent System Gates, Family.
クイック比較ツール — 並列比較する代替部品を選択:
RTAX2000SL-1CG1152V
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →RTAX2000S-LG1152V
✅ ドロップイン✓ 在庫あり
$9750 / 個
データシートを見る →RTAX2000SL-LG1152V
✅ ドロップイン✓ 在庫あり
$2440 / 個
データシートを見る →RTAX2000S-1CG1152PROTO
✅ ドロップイン📋 参考代替品（カタログ未掲載）
RTAX2000S-1CG1152V 最大定格＆電気的特性
| Family | RTAX-S / RTAX2000S |
| Equivalent System Gates | 2,000,000 gates |
| CLBs | 21,504 |
| Logic Cells | 32,256 |
| Usable I/O | 684 inputs / 684 outputs |
| パッケージ | 1152-terminal Ceramic, Metal-Sealed Cofired CBGA (CGA1152) |
| Technology | 0.15 um CMOS, antifuse OTP |
| Core Voltage | 1.5 V |
| Speed Grade | -1 |
| Radiation Tolerance | Radiation-tolerant (TID/SEE rated, see datasheet) |
| Configuration | Live at power-up, single-chip antifuse |
| Embedded SRAM | Yes, with built-in FIFO control logic |
| Embedded Clocking | Segmentable clocks, chip-wide features |
RTAX2000S-1CG1152V 1152-terminal ceramic, metal-sealed cofired cbga (cga1152) ピン配置ガイド
RTAX2000S-1CG1152V (1152-terminal ceramic, metal-sealed cofired cbga (cga1152) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: RTAX2000S-1CG1152V.
詳細は データシート をご参照ください。
主な用途
RTAX2000S-1CG1152V の用途: 6 件s: Satellite Payload Data Processing, Spacecraft Command and Data Handling (C&DH), Telemetry, Tracking and Command (TT&C) Interfaces, Instrument Control and Signal Formatting, Launch Vehicle Avionics, Obsolescence Redesign / Legacy RTAX Migration.
Satellite Payload Data Processing
The RTAX2000S-1CG1152V fits payload processing chains where 2,000,000 equivalent gates implement compression engines, channelizers, or FEC blocks directly in flight silicon. Its 684 usable I/Os interface multiple ADC/DAC and high-speed data buses, while the antifuse fabric eliminates configuration-upset failures that SRAM FPGAs must scrub against. Typical designs clock logic from segmentable clock resources and buffer streams through embedded SRAM with built-in FIFO control. The trade-off is one-time programmability: validate the netlist on PROTO silicon or an Aldec adaptor before committing flight parts.
おすすめ
Spacecraft Command and Data Handling (C&DH)
For C&DH modules, the RTAX2000S-1CG1152V implements telemetry encoders, decoders, and bus-interface glue logic in a single live-at-power-up chip. Because the antifuse configuration is permanent, the FPGA is operational the instant spacecraft power arrives - critical for launch and early-orbit operations with no configuration reload window. The 0.15 um CMOS process with 1.5 V core keeps static power low for power-constrained buses. The ceramic metal-sealed CGA1152 package withstands launch vibration and thermal cycling, and its 684 I/Os consolidate discrete board-level logic into one qualified device.
おすすめ
Telemetry, Tracking and Command (TT&C) Interfaces
TT&C units benefit from the RTAX2000S-1CG1152V's deterministic, configuration-upset-immune fabric. receivers, command decoders, and formatter logic occupy a fraction of the 32,256 logic cells, leaving margin for obsolescence redesigns. The device's single-chip operation removes external PROM read paths from the command chain, reducing the SEE criticality analysis scope. With 684 inputs and 684 outputs available, multiple redundant receiver channels terminate on one die. Designs typically reserve embedded SRAM FIFOs for burst buffering between the RF baseband section and the spacecraft data bus.
おすすめ
Instrument Control and Signal Formatting
Science instruments - imagers, spectrometers, particle detectors - use the RTAX2000S-1CG1152V as sequencer and formatter. The 2M-gate capacity holds timing generators, co-addition accumulators, and CCSDS packetization logic simultaneously. Low-power 1.5 V core operation matters in instrument enclosures with tight thermal budgets, and the antifuse fabric contributes no configuration SEU rate to instrument availability budgets. Segmentable clocks let engineers isolate noisy detector timing domains from telemetry domains on one die. Prototype timing-critical paths on RTAX2000S-1CG1152PROTO units before programming flight-ordered devices.
おすすめ
Launch Vehicle Avionics
Launch avionics demands devices that are fully functional through shock, vibration, and short high-g missions - exactly the profile of the metal-sealed ceramic CGA1152 package. The RTAX2000S-1CG1152V implements flight-event sequencing, safe-and-arm interface logic, and redundancy voting. Live-at-power-up antifuse behavior guarantees logic is active without any boot sequence, a hard requirement in rapid-response flight phases. The 684 I/Os support triple-redundant channel implementations on one device, and the OTP fabric cannot be corrupted by the severe SEE environment encountered during ascent through radiation belts.
おすすめ
Obsolescence Redesign / Legacy RTAX Migration
Programs with legacy RTAX2000S-based boards facing unit shortages use the same-footprint variants (RTAX2000SL-1CG1152V, RTAX2000S-LG1152V) as drop-in second sources within the Microchip family, since pinout and package are unchanged. Because RTAX-S is antifuse OTP, a redesigned netlist can be re-targeted to a fresh die without PCB modification. XAIPART's cross-reference data confirms these family variants share the identical 1152-terminal ceramic package, making board-level qualification impact minimal - typically limited to device re-screening and flight-lot recertification documentation.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: RTAX2000S-1CG1152V — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | RTAX2000SL-1CG1152V | RTAX2000S-LG1152V | RTAX2000SL-LG1152V | RTAX4000S-1CG1272V |
|---|---|---|---|---|---|
| Package | CGA1152 (1152-terminal ceramic metal-sealed CBGA) | CGA1152 - same | CGA1152 - same | CGA1152 - same | CGA1272 - different, larger |
| Brand | Microchip Technology (Actel/Microsemi legacy) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 | 4,000,000 |
| Logic Cells | 32,256 | 32,256 | 32,256 | 32,256 | 62,784 |
| Technology | 0.15 um CMOS antifuse (OTP) | 0.15 um CMOS antifuse (OTP) | 0.15 um CMOS antifuse (OTP) | 0.15 um CMOS antifuse (OTP) | 0.15 um CMOS antifuse (OTP) |
| Configuration | Single-chip, live at power-up | Single-chip, live at power-up | Single-chip, live at power-up | Single-chip, live at power-up | Single-chip, live at power-up |
| Flight Screening | V (space/flight screening designation) | V | V | V | V |
主な差別化要因
- Standard RTAX-S fabric at 2M gates in CGA1152 （vs RTAX2000SL-1CG1152V)
- Flight screening (V suffix) （vs RTAX2000S-1CG1152PROTO)
- Right-sized density for most payload modules （vs RTAX4000S-1CG1272V)
設計ノート
RTAX-S devices are one-time-programmable: an antifuse blow is permanent. Never program flight-lot RTAX2000S-1CG1152V units with an unverified netlist. Use RTAX2000S-1CG1152PROTO parts or Aldec flash-based ProASIC3E adaptors (which fit the RTAX footprint directly) to iterate timing closure and functional verification. Only after sign-off on the prototype should the identical programming file be committed to flight silicon.
Estimated: the RTAX2000S fabric operates from a 1.5 V core per the RTAX-S family datasheet. At 2M gates, dynamic power depends heavily on toggle rate - run Microchip's power estimator (Libero flow) with your actual utilization and clock frequency before sizing the spacecraft power budget. Ceramic CGA packages dissipate heat poorly compared to thermal-pad packages, so place high-switching logic away from die center and verify junction temperature against the derated space ambient.
The 1152-terminal ceramic column (CCGA) package has stiff, brittle columns: control PCB local CTE mismatch and use under-stiffening or wedge-lock mounting where launch profiles demand. Follow the Microchip RTAX-S application notes for column-grid fanout; escape routing on 1.0 mm+ column pitch typically requires via-in-pad or dog-bone fanout. Verify package land pattern against the latest datasheet revision before release - column tolerances are tighter than plastic BGA.
コンプライアンス情報
Space-grade ceramic package; standard commercial environmental compliance declarations are typically not the screening criterion for this product. Verify per Microchip product page.
