RTAX4000S-1CG1272V - 4M-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX4000S-1CG1272V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 10 | $8200 | $82,000.00 |
| 100 | $7900 | $790,000.00 |
| 500 | $7600 | $3,800,000.00 |
| 1,000 | $7300 | $7,300,000.00 |
Drop-in alternatives for RTAX4000S-1CG1272V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX4000SL-1CG1272V
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View Datasheet →RTAX4000S-CG1272V
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$10200 / Unit
View Datasheet →RTAX4000SL-CG1272E
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View Datasheet →RTAX4000S-1LG1272V
✅ Drop-In📋 Reference alternative (not in catalog)
RTAX4000S-1CG1272V Maximum Ratings & Electrical Characteristics
| Logic Cells | 60480 |
| CLBs (Combinatorial Logic Blocks) | 40320 |
| Equivalent System Gates | 4000000 gates |
| Family | RTAX-S Radiation-Tolerant FPGA |
| Supply Voltage (Nominal) | 1.5 V |
| Speed Grade | -1 |
| Package | CBGA1272 (CG1272) ceramic column grid array |
| Terminal Pitch | 1.000 mm |
| Ball/Column Count | 1272 |
| Operating Temperature Range | -55C to +125C |
| Programmability | One-Time Programmable (antifuse) OTP |
| Configuration | Live at power-up, true single-chip |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clock Architecture | Segmentable clocks, chip-wide highway routing |
| Mounting Type | Surface Mount |
| Application Domain | Space-flight systems (radiation-tolerant) |
RTAX4000S-1CG1272V cbga1272 (cg1272) ceramic column grid array Pin Configuration Guide
Complete pinout information for RTAX4000S-1CG1272V (cbga1272 (cg1272) ceramic column grid array package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX4000S-1CG1272V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX4000S-1CG1272V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control and Command and Data Handling, Space Instrument Front-End and Imaging Control, Redundant Avionics and Fault-Tolerant Systems, Telemetry, Tracking and Command (TT&C) Front Ends, Deep-Space and Radiation-Hard Mission Electronics.
Satellite Payload Data Processing
The RTAX4000S-1CG1272V fits payload processing chains where 4,000,000 equivalent gates of reconfigurable logic must survive the space radiation environment. Its 40320 CLBs implement parallel data formatting, convolution, and framer functions, while embedded SRAM blocks with built-in FIFO control absorb burst-rate mismatches between high-speed instrument interfaces and downlink encoders. Live-at-power-up antifuse configuration removes the boot-time and configuration-memory failure modes of SRAM FPGAs, critical for instruments that must image on the first pass after deployables open. The 1.5 V core keeps static power low for power-constrained orbits, and the -55C to +125C range covers both eclipse and direct-sun thermal cases on external payload panels.
Recommended
Spacecraft Bus Control and Command and Data Handling
In spacecraft command and data handling units, the RTAX4000S-1CG1272V implements telecommand decoders, telemetry formatters, time-code distribution, and mode-control state machines. Its true single-chip, live-at-power-up behavior guarantees that bus control logic is operational the instant power is applied - vital for safe-mode autonomy when a processor must be held in reset. The chip-wide highway routing and segmentable clock architecture support independent clock domains for redundant command chains. With a 1.5 V nominal supply and radiation-tolerant CMOS, the device sustains long missions, and its OTP configuration eliminates the single-event functional interrupt risk posed by external configuration memories in conventional FPGAs.
Recommended
Space Instrument Front-End and Imaging Control
Scientific imaging instruments - star trackers, hyperspectral cameras, and synthetic-aperture radar front ends - use the RTAX4000S-1CG1272V for detector timing generation, high-speed serial deserialization, and on-board correlation preprocessing. The 60480-cell architecture provides headroom for pipelined DSP datapaths implemented in fabric, while embedded SRAM/FIFO blocks buffer detector line data between acquisition and compression stages. Radiation tolerance and the -55C to +125C operating range suit instruments mounted on thermally extreme optical benches. Designers typically validate RTL on an Aldec flash-based ProASIC3E prototyping adaptor before programming the one-time-programmable flight device, since antifuse interconnect cannot be reworked after commit.
Recommended
Redundant Avionics and Fault-Tolerant Systems
Launch vehicles and crewed-adjacent spacecraft employ triple-modular-redundancy schemes where the RTAX4000S-1CG1272V implements voter logic, cross-strapping, and graceful-degradation controllers among redundant computing channels. The antifuse fabric's immunity to configuration upset makes it a natural host for the most safety-critical voting functions, since it cannot suffer configuration-memory single-event upsets the way SRAM FPGAs do. The 4M-gate capacity hosts multiple redundant channels of interface logic in a single CG1272 device, reducing part count and board area. SL-screened variants (RTAX4000SL-1CG1272V) with tighter ICCA current limits at 125C final test are preferred where leakage screening is mandated.
Recommended
Telemetry, Tracking and Command (TT&C) Front Ends
TT&C units rely on the RTAX4000S-1CG1272V for baseband functions such as PCM/PSK signal formatting, convolutional and Reed-Solomon companion logic, and antenna-pointing interface control. The segmentable clock structure allows independent clocking of the uplink decoder and downlink encoder domains, while chip-wide highway routing simplifies timing closure across the 1272-column die. The 1.5 V core supply minimizes power draw during continuous beacon transmission, and the ceramic CBGA package provides the hermeticity and thermal cycling robustness demanded by launch environments. OTP configuration guarantees the TT&C mode logic is instantly available at power-up for acquisition sequences after separation events.
Recommended
Deep-Space and Radiation-Hard Mission Electronics
For deep-space probes operating beyond low Earth orbit, where total ionizing dose and single-event effects are severe, the RTAX4000S-1CG1272V serves as the main programmable fabric for science data acquisition and autonomous fault management. Its antifuse interconnect, formed permanently at programming, is inherently immune to configuration-bit flip mechanisms, and the family's radiation performance is documented in the manufacturer RTAX-S/SL datasheet for TID and SEE environments. The 4M-gate density supports adaptive on-board autonomy algorithms that grow in importance as communication delays preclude ground intervention. Designers should budget power using datasheet ICC figures at 1.5 V and the -1 speed grade, and perform SEE analysis with Microchip-published test reports.
Recommended
Recommended Products Summary
Engineering reference data for RTAX4000S-1CG1272V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX4000SL-1CG1272V | RTAX4000S-CG1272V | RTAX4000SL-CG1272E | RTAX4000S-1LG1272V |
|---|---|---|---|---|---|
| Package | CBGA1272 (CG1272) | CBGA1272 - same | CBGA1272 - same | CBGA1272 - same | LG1272 (1272 terminals, land-grid variant) |
| Brand | Microchip Technology (Actel/Microsemi heritage) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 |
| Logic Cells | 60480 | 60480 | 60480 | 60480 | 60480 |
| CLBs | 40320 | 40320 | 40320 | 40320 | 40320 |
| Supply Voltage | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Screening / Flow | V-suffix space flow, -1 speed grade | SL: tighter ICCA screening at 125C final test | V-suffix space flow, standard speed bin | E: engineering/prototype flow, not for flight | V-suffix space flow, LG column attachment |
| Programmability | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up |
Key Differentiators
- Highest density in the RTAX-S family (vs RTAX2000S-1CGS624V)
- Tighter screening option within the same footprint (vs RTAX4000SL-1CG1272V)
- OTP live-at-power-up versus flash prototyping (vs A3PE3000-1FGG896I)
Design Notes
RTAX4000S is one-time programmable (antifuse): once programmed, the interconnect cannot be changed, and design errors require new silicon with months of lead time. Complete RTL simulation, formal verification, and hardware prototyping on Microchip's flash-based ProASIC3E flow (e.g., via the Aldec RTAX/RTSX prototyping adaptor) before releasing flight units. Reserve program-margin analysis and duplicate-device procurement in the program schedule, as re-spins of space-grade OTP FPGAs are among the longest lead-time items in spacecraft electronics.
The core runs at 1.5 V nominal; distribute the core rail with low-impedance planes and follow the RTAX-S datasheet decoupling guidance for the CG1272 package, which presents many simultaneous-switching outputs across 1272 terminals. Estimated: with dozens of simultaneously switching I/O banks, transient di/dt demands are far higher than commercial BGA parts of similar size - use bulk ceramic capacitance near each bank plus distributed 0.1 uF decoupling. Confirm exact ICC numbers from the manufacturer datasheet for your speed grade rather than estimating from this page.
The CG1272 uses solder-column attachment rather than conventional balls; per the manufacturer datasheet, only QA electrical and mechanical visual inspection is performed after column attachment at the factory. On the PCB side, design the land pattern to the CG1272 mechanical drawing and note that RTAX-DSP variants (RTAX4000D) use a slightly larger CG1272 body - do not copy land patterns between S and D devices. Use x-ray inspection for column solder joints after reflow, and verify warpage limits for thick ceramic packages during profile development.
Compliance Information
Space-grade ceramic hermetic package; compliance declarations (RoHS/REACH) were not present in the verified web data and must be obtained from Microchip product documentation or the distributor quote.