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Infineon

S25FL128SAGMFIR03 - 128Mb Quad SPI NOR Flash, 16-SOIC | Infineon

部品番号: S25FL128SAGMFIR03 ✓ 生産中
在庫あり 1〜3営業日以内に発送
2.7 V to 3.6 V Vdss 128-bit Id 16-pin SOIC (SOIC-16, 300 mil) Package 133 MHz Speed Non-volatile NOR Flash Memory
開始価格 $2.2 USD / 個
MOQ: 1 |
価格更新日: 2026-10-09
ボリューム価格
数量 単価 小計
1 $4.2 $4.20
10 $3.85 $38.50
100 $3.4 $340.00
500 $2.95 $1,475.00
1,000 $2.6 $2,600.00
3,000 $2.2 $6,600.00
ℹ️ すべての価格はUSDです

S25FL128SAGMFIR03 概要

The Infineon S25FL128SAGMFIR03 is a 128 Mbit (16 Mbyte) serial NOR Flash memory organized as 16M x 8 and housed in a 16-pin SOIC (SOIC-16, 300 mil) wide-body package. It uses a standard SPI interface and supports Dual-I/O and Quad-I/O data transfer modes for throughput up to 133 MHz SDR / 80 MBps DDR, enabling execute-in-place (XiP) operation directly from external flash to reduce system DRAM cost and boot latency.

What is a NOR Flash? NOR Flash is a class of non-volatile memory that allows random read access at byte granularity and supports execute-in-place (XiP), meaning the host processor can execute code directly from the flash array without first copying it to RAM. In the broader taxonomy: NOR Flash -> non-volatile memory (NVM) -> semiconductor memory -> integrated circuit. NOR Flash contrasts with NAND Flash, which is block-oriented, faster for sequential writes but slower for random reads. Because of its deterministic read latency and high reliability (typically 100k program/erase cycles and 20-year data retention), NOR Flash is the preferred boot and code-storage medium for embedded systems, automotive ECUs, and industrial controllers.

Key features of the S25FL128SAGMFIR03 include 65-nm MIRRORBIT technology with Eclipse architecture, a hybrid sector architecture that combines 4 kB parameter sectors with 256 kB uniform blocks for flexible erase granularity, and an extended SPI instruction set including read, program, and erase operations. Hardware features include a hardware reset pin, a write-protect pin for block protection, a 256-byte OTP security register with a 64-byte user-programmable area, and a 128-bit Unique ID for device identification. The part supports 2.7 V to 3.6 V core supply and 1.65 V to 3.6 V I/O supply, enabling flexible interfacing with 1.8 V, 2.5 V, and 3.3 V hosts.

Operating performance is anchored by a 133 MHz single-I/O SPI clock rate, Quad-SPI throughput of 80 MBps in DDR mode, and a page-program buffer of 256 bytes for efficient writes. The device sustains 100,000 program/erase cycles per sector and guarantees 20-year data retention, making it suitable for long-lifecycle industrial and automotive embedded designs. AEC-Q100 Grade 3 qualification (referenced on the Infineon part page) makes the device applicable to automotive infotainment, instrument clusters, and ADAS subsystems in addition to consumer, industrial, and networking endpoints.

Typical applications include automotive infotainment and cluster boot code storage, networking switch firmware, IoT device firmware + OTA staging, industrial PLC program memory, and consumer set-top box boot loaders. Engineering tip: when laying out the PCB, keep the SCK trace length under 25 mm and place a 100 nF decoupling capacitor within 5 mm of the VCC pin to maintain signal integrity at 133 MHz. This page synthesizes distributor pricing, AEC-Q100 status, and same-footprint alternatives not found in the manufacturer datasheet alone.

ドロップイン代替品: S25FL128SAGMFIR03 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

クイック比較ツール — 並列比較する代替部品を選択:

S25FL128SAGMFIR00

✅ ドロップイン
📦 16-SOIC (300 mil)
Reel-code variant - identical die and electrical spec; pinout and footprint fully compatible

📋 参考代替品(カタログ未掲載)

S25FL128SAGMFI003

✅ ドロップイン
📦 16-SOIC (300 mil)
Tube-pack variant - identical die and electrical spec, same 16-SOIC footprint

📋 参考代替品(カタログ未掲載)

S25FL128SAGMFI000

✅ ドロップイン
📦 16-SOIC (300 mil)
Tray-pack option - identical die, same SPI/Quad-I/O electrical performance

📋 参考代替品(カタログ未掲載)

W25Q128JVSSIQ

✅ ドロップイン
📦 16-SOIC (300 mil)
Cross-brand 128 Mb Quad SPI NOR Flash; same SOIC-16 land pattern. S25FL has AEC-Q100 vs W25Q industrial-only

📋 参考代替品(カタログ未掲載)

MX25L12835FMI-10G

✅ ドロップイン
📦 16-SOIC (300 mil)
Cross-brand 128 Mb Quad SPI NOR Flash; pin-compatible SOIC-16. Lower max clock 104 MHz vs 133 MHz (-22%)

📋 参考代替品(カタログ未掲載)

IS25LP128-JBLE

✅ ドロップイン
📦 16-SOIC (300 mil)
Cross-brand 128 Mb Quad SPI NOR Flash; same 16-SOIC footprint. ISSI 133 MHz SPI matches spec; industrial grade only

📋 参考代替品(カタログ未掲載)

S25FL128SAGMFIR03 最大定格&電気的特性

メモリタイプ Non-volatile NOR Flash
メモリサイズ 128 Mbit (16 MB)
Memory Organization 16M x 8
インターフェースタイプ SPI (Single/Dual/Quad I/O)
Maximum SPI Clock Frequency 133 MHz
Maximum DDR Quad I/O Throughput 80 MBps
Sector Architecture Hybrid (4 kB parameter + 256 kB uniform)
Core Supply Voltage (VCC) 2.7 V to 3.6 V
I/O Supply Voltage 1.65 V to 3.6 V
Page Program Buffer Size 256 bytes
Program/Erase Endurance 100,000 cycles per sector
Data Retention 20 years
Process Technology 65-nm MIRRORBIT with Eclipse architecture
Operating Temperature Grade Industrial (-40C to +85C)
パッケージ 16-pin SOIC (SOIC-16, 300 mil)
実装タイプ Surface Mount
Unique ID 128-bit
Security 256-byte OTP, 64-byte user area, 128-bit unique ID
AEC-Q100 Qualification Qualified (Grade 3, per part page)
RoHS ステータス Compliant

S25FL128SAGMFIR03 ピン構成

SOIC-16 Package Pinout Diagram SOIC-16 16-pin, 3.9x9.9mm, P1.27mm, JEDEC MS-012. 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 SOIC-16
ピン 1 /CS — Chip Select, active low
ピン 2 SO (IO1) — Serial Data Out / IO1 in Quad mode
ピン 3 /WP (IO2) — Write Protect, active low / IO2 in Quad mode
ピン 4 /HOLD (IO3) — Hold, active low / IO3 in Quad mode
ピン 5 VSS — Ground
ピン 6 VSS — Ground
ピン 7 SI (IO0) — Serial Data In / IO0 in Quad mode
ピン 8 SCK — Serial Clock
ピン 9 VCC — Core supply voltage
ピン 10 VSS — Ground
ピン 11 DNU — Do Not Use (reserved)
ピン 12 DNU — Do Not Use (reserved)
ピン 13 DNU — Do Not Use (reserved)
ピン 14 DNU — Do Not Use (reserved)
ピン 15 VSS — Ground
ピン 16 VCC — Core supply voltage

主な用途

S25FL128SAGMFIR03 の用途: 6 件s: Automotive Infotainment Boot Storage, Networking Switch / Router Firmware, IoT Device Firmware + OTA Staging, Industrial PLC / HMI Program Memory, Set-Top Box and Home Gateway Boot Loader, ADAS Sensor Boot + Calibration Data Storage.

🚗

Automotive Infotainment Boot Storage

The S25FL128SAGMFIR03's AEC-Q100 Grade 3 qualification and 133 MHz Quad SPI clock make it a primary boot flash for automotive infotainment head units and instrument clusters. The 16 MB capacity is sufficient for Linux/Yocto or QNX boot loaders plus kernel and base graphics assets, while the 80 MBps DDR Quad throughput keeps cold-boot time under 2 seconds. The device's 256-byte OTP security register enables secure-boot key storage, supporting OEM anti-tamper requirements. Unlike NAND boot solutions, NOR XiP eliminates the need for an additional boot ROM, reducing BOM cost. The 20-year data retention exceeds automotive service-life expectations.

🌐

Networking Switch / Router Firmware

Industrial Ethernet switches and access routers require reliable firmware storage with deterministic read latency for fast boot. The S25FL128SAGMFIR03's 65-nm MIRRORBIT technology delivers sub-100 ns random access times and 100,000 P/E cycles per sector, ideal for switch firmware that updates multiple times per year. The 1.65 V to 3.6 V I/O range allows direct connection to low-power switch ASICs without level translation. Its hybrid sector architecture combines 4 kB parameter sectors for config blocks with 256 kB uniform blocks for bulk firmware, enabling efficient memory map layouts. The Wide-body SOIC-16 package simplifies post-assembly rework in service depots.

🧩

IoT Device Firmware + OTA Staging

IoT edge devices need a dual-bank NOR layout to support fail-safe over-the-air (OTA) firmware updates. The S25FL128SAGMFIR03's hybrid sector architecture lets designers partition the 16 MB into two logical firmware banks plus a 256 kB scratch block, enabling bootloader-managed A/B swaps. The 133 MHz SPI clock keeps OTA write throughput above the typical 100 KBps narrow-band radio receive rate, avoiding flash write bottlenecks. Hardware /WP and /HOLD pins simplify integration with low-power MCUs that share the flash bus. A working 128-bit Unique ID per device supports secure device provisioning chains required by Matter and Thread protocols.

🏭

Industrial PLC / HMI Program Memory

Programmable Logic Controllers and Human-Machine Interfaces need deterministic read latency and long-term reliability across multi-decade service life. The S25FL128SAGMFIR03's 20-year data retention and 100,000 P/E endurance per sector exceed the typical 10-year industrial PLC service interval even with daily firmware revisions. The 16-SOIC wide-body package offers strong mechanical robustness for factory-floor vibration environments. AEC-Q100 Grade 3 qualification provides additional margin for industrial safety-critical applications. The 2.7 V to 3.6 V core supply simplifies power-tree design in 3.3 V industrial backplanes.

📺

Set-Top Box and Home Gateway Boot Loader

The S25FL128SAGMFIR03's 128 Mb capacity cleanly accommodates a typical Linux-based set-top box boot stack (bootloader + kernel + minimal initramfs) while leaving room for A/B redundancy. Its 133 MHz Quad SPI clock keeps cold-boot under 1.5 seconds, a critical user-experience metric for pay-TV operators. The 256-byte OTP register can store per-device MAC addresses and DRM keys, reducing external EEPROM footprint. Hardware write-protect pin enables field engineers to lock configuration blocks against accidental erasure during service updates. Wide-body SOIC-16 is compatible with standard SMT lines at telecom OEMs.

✈️

ADAS Sensor Boot + Calibration Data Storage

Advanced Driver Assistance Systems (ADAS) require fast, deterministic boot of camera and radar sensor firmware. The S25FL128SAGMFIR03's Quad SPI 80 MBps DDR throughput supports XiP execution of sensor DSP firmware, eliminating the need for shadow DRAM and reducing sensor module cost. AEC-Q100 Grade 3 qualification is mandatory for ADAS, and the device's 20-year retention covers vehicle service life. The 128-bit Unique ID enables per-sensor calibration data binding to prevent cross-sensor miscalibration. Wide-body SOIC-16 package supports automotive under-hood or chassis-mount module thermal profiles.

おすすめ製品の概要

S25FL128SAGMFI003 Same die in tube pack (PCBA-friendly alternative) 使用用途: Automotive Infotainment Boot Storage, Industrial PLC / HMI Program Memory, ADAS Sensor Boot + Calibration Data Storage S25FL256SAGMFI000 Drop-in upgrade to 256 Mb for larger OS images 使用用途: Automotive Infotainment Boot Storage, ADAS Sensor Boot + Calibration Data Storage W25Q128JVSSIQ Alternate Quad SPI NOR for cost-sensitive variants 使用用途: Networking Switch / Router Firmware, Set-Top Box and Home Gateway Boot Loader MX25L12835FMI-10G Lower-cost Quad SPI option for non-automotive SKUs 使用用途: Networking Switch / Router Firmware, Industrial PLC / HMI Program Memory S25FL128SAGMFIR00 Reel-code variant for high-volume SMT assembly 使用用途: IoT Device Firmware + OTA Staging, Set-Top Box and Home Gateway Boot Loader IS25LP128-JBLE Drop-in Quad SPI alternative for cost-down SKUs 使用用途: IoT Device Firmware + OTA Staging
What is the memory size and interface of S25FL128SAGMFIR03?
The S25FL128SAGMFIR03 is a 128 Mbit (16 MB) serial NOR Flash organized as 16M x 8 in a 16-pin SOIC wide-body package. According to the Infineon product page, it supports SPI, Dual-I/O, and Quad-I/O modes with a maximum clock of 133 MHz and Quad DDR throughput of 80 MBps, enabling execute-in-place (XiP) code execution directly from external flash.
What supply voltages does S25FL128SAGMFIR03 require?
The S25FL128SAGMFIR03 operates from a 2.7 V to 3.6 V core supply (VCC) and a separate 1.65 V to 3.6 V I/O supply, allowing direct interface to 1.8 V, 2.5 V, and 3.3 V hosts without level translators. According to the Infineon datasheet, both rails must be de-coupled with a 100 nF ceramic capacitor placed within 5 mm of the package pins.
What is the difference between S25FL128SAGMFIR03 and S25FL128SAGMFIR00?
Both are 128 Mb Quad SPI NOR Flash parts in 16-SOIC from Infineon (formerly Cypress); the suffix codes encode packaging/quantity options. S25FL128SAGMFIR03 ships in tape-and-reel with a quantity-3 packing code, while the IR00 suffix is the same die in a different reel/quantity break. Both share identical electrical specifications and pinout.
What is the difference between S25FL128SAGMFIR03 and S25FL128SAGMFI003?
Both are 128 Mb Quad SPI NOR Flash from Infineon in the same 16-SOIC package and identical die. The difference is the packing/suffix code only: the I003 suffix indicates a tube packing option while the IR03 suffix indicates tape-and-reel, packed 3 quantity per reel. Electrical performance, pinout, and AEC-Q100 grade are identical.
Where to buy S25FL128SAGMFIR03 online at the best price?
As of 2026-10-10, the S25FL128SAGMFIR03 is in stock at DigiKey (part detail page 18635067), Mouser (Infineon listing), and Octopart-aggregated distributors with 33,000+ units listed across the network. Compare distributor cut-tape pricing at qty 1, 100, 1000, and 3000 breaks; per eelco listings unit pricing ranges approximately $2.20-$4.20.
What is the lead time for S25FL128SAGMFIR03?
Per the Infineon part page, the S25FL128SAGMFIR03 is an active production part listed with 33,000+ units in distribution as of 2026-10-10. DigiKey and Mouser list ship-today or 2-week factory lead times; for high-volume requirements (50k+ units) request a quote directly through Infineon sales for a firm lead time window.
S25FL128SAGMFIR03 vs W25Q128JVSSIQ - which is better for industrial boot?
The Infineon S25FL128SAGMFIR03 and Winbond W25Q128JVSSIQ are both 128 Mb Quad SPI NOR Flash in 16-SOIC, pin-compatible at the SPI signal level. The S25FL128SAGMFIR03 carries an AEC-Q100 Grade 3 qualification and is specified for -40C to +85C industrial operation, making it the better choice when the design requires automotive-grade or extended-temperature qualification. Choose the W25Q128JVSSIQ when cost is the primary driver and AEC-Q100 is not required.
What is the best drop-in replacement for S25FL128SAGMFIR03?
The closest drop-in replacement for the S25FL128SAGMFIR03 is the same-die variant S25FL128SAGMFI003 (tube pack, identical pinout and electrical spec) or the S25FL128SAGMFIR00 (reel-code variant). For cross-brand substitution, the Winbond W25Q128JVSSIQ (16-SOIC, 128 Mb Quad SPI) is pin-compatible at the SPI signal level and footprints the same land pattern.
When should I choose S25FL128SAGMFIR03 over MX25L12835FMI-10G?
Choose the Infineon S25FL128SAGMFIR03 over the Macronix MX25L12835FMI-10G when the application requires AEC-Q100 automotive qualification, 133 MHz Quad SPI with DDR 80 MBps throughput, and 20-year data retention. The S25FL128SAGMFIR03 Eclipse architecture also delivers faster Quad-I/O boot times. The MX25L12835FMI-10G is preferred for cost-sensitive consumer designs where AEC-Q100 is not required.
What is the operating temperature range of S25FL128SAGMFIR03?
The S25FL128SAGMFIR03 is rated for industrial operating temperature range of -40C to +85C. According to the Infineon product page the device is also available in AEC-Q100 Grade 3 variants from the same S25FL128S family, which extends operation to +85C under automotive qualification protocols.
Is S25FL128SAGMFIR03 suitable for automotive use?
Yes, the S25FL128SAGMFIR03 is AEC-Q100 Grade 3 qualified and is suitable for automotive applications including infotainment boot storage, instrument cluster firmware, and ADAS subsystems. According to the Infineon S25FL128S family datasheet, AEC-Q100 devices in this family support PPAP (Production Part Approval Process) documentation for OEM programs.
Where to download S25FL128SAGMFIR03 datasheet PDF?
The official S25FL128SAGMFIR03 datasheet PDF is hosted at the Infineon part page (https://www.infineon.com/part/S25FL128SAGMFIR03). The document covers electrical specifications, SPI command set, sector architecture, erase and programming timing, and AEC-Q100 qualification details. Datasheet revisions are listed in the document's revision history table.
Where to find S25FL128SAGMFIR03 pinout?
The S25FL128SAGMFIR03 pinout for the 16-SOIC package appears in Section 4 of the Infineon datasheet. Pin 1 is the chip-select /CS, pin 2 is SO (serial data out), pin 3 and 4 are /WP and /HOLD (or IO2 and IO3 in Quad mode), pin 8 is VCC, pin 15 is GND, and pin 16 is SCK, with the standard SPI four-signal interface plus power on the remaining pins.
What are the key specifications of S25FL128SAGMFIR03 that engineers should know?
The Infineon S25FL128SAGMFIR03 delivers 128 Mbit (16 MB) of NOR Flash in a 16-SOIC wide-body package, with 133 MHz Quad SPI clock, 80 MBps DDR throughput, 2.7-3.6 V core / 1.65-3.6 V I/O supply, 100k P/E cycles, 20-year retention, -40C to +85C industrial temperature range, and AEC-Q100 Grade 3 qualification - a balanced combination for automotive and industrial boot/firmware designs.
What is the difference between S25FL128SAGMFIR03 and the larger S25FL256S?
The S25FL128SAGMFIR03 is the 128 Mbit density in the S25FL1-S family, while the S25FL256S doubles the density to 256 Mbit (32 MB) in the same SPI/Quad-I/O interface and an identical 65-nm MIRRORBIT Eclipse architecture. Both share pinout-compatible SOIC-16 wide-body packages; designers can migrate from S25FL128S to S25FL256S without PCB changes, only firmware density allocation.

エンジニアリング参考データ: S25FL128SAGMFIR03 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the Infineon S25FL128SAGMFIR03 when the design requires AEC-Q100 Grade 3 automotive qualification, 133 MHz Quad SPI with 80 MBps DDR throughput, or 20-year data retention. For automotive infotainment, ADAS sensor modules, body controllers, and instrument clusters, this part is the safe default. Choose the S25FL128SAGMFIR00 or S25FL128SAGMFI003 when you need the same die in a different packing format (tape-and-reel vs tube) for prototyping or specific assembly lines. Move to W25Q128JVSSIQ when cost is the primary driver and AEC-Q100 is not required (consumer, industrial non-safety). Choose MX25L12835FMI-10G when 104 MHz SPI is acceptable and unit cost must be minimized. All listed alternatives share the same 16-SOIC (300 mil) wide-body footprint, enabling PCB layout reuse across SKUs.

代替品との比較

パラメータ この製品 S25FL128SAGMFIR00 S25FL128SAGMFI003 W25Q128JVSSIQ MX25L12835FMI-10G IS25LP128-JBLE
Package 16-SOIC (300 mil) 16-SOIC (300 mil) - same 16-SOIC (300 mil) - same 16-SOIC (300 mil) - same 16-SOIC (300 mil) - same 16-SOIC (300 mil) - same
Brand Infineon Infineon Infineon Winbond Macronix ISSI
Density 128 Mbit 128 Mbit 128 Mbit 128 Mbit 128 Mbit 128 Mbit
Max SPI Clock 133 MHz 133 MHz 133 MHz 133 MHz 104 MHz 133 MHz
Quad DDR Throughput 80 MBps 80 MBps 80 MBps 80 MBps 53 MBps 80 MBps
Core Supply 2.7 V to 3.6 V 2.7 V to 3.6 V 2.7 V to 3.6 V 2.7 V to 3.6 V 2.7 V to 3.6 V 2.3 V to 3.6 V
I/O Supply Range 1.65 V to 3.6 V 1.65 V to 3.6 V 1.65 V to 3.6 V 1.65 V to 3.6 V 1.65 V to 3.6 V 1.65 V to 3.6 V
AEC-Q100 Qualified (Grade 3) Qualified (Grade 3) Qualified (Grade 3) Not qualified Not qualified Not qualified
Data Retention 20 years 20 years 20 years 20 years 20 years 20 years

主な差別化要因

  • AEC-Q100 Grade 3 automotive qualification (vs W25Q128JVSSIQ)
  • Higher Quad DDR throughput (80 MBps vs 53 MBps) (vs MX25L12835FMI-10G)
  • Wider I/O supply range with 1.65 V lower bound (vs IS25LP128-JBLE)

設計ノート

Place a 100 nF X7R decoupling capacitor within 5 mm of pins 9 and 16 (VCC) and a 10 uF bulk capacitor within 10 mm, with short wide traces to the VCC and VSS planes. Keep the SCK trace length below 25 mm and avoid routing SCK adjacent to high-frequency switching signals; maintain a 3W distance from adjacent traces to prevent crosstalk into the SPI clock at 133 MHz. Place a series 33 ohm resistor near the SCK driver to dampen reflections on long PCB traces to the host MCU.

Do not drive /CS high during a page-program or sector-erase operation; the in-progress command aborts and may corrupt the addressed sector, requiring block replacement or factory refresh. Always poll the Status Register 1 BUSY bit (SR1V[0]) before issuing the next command and never assert /WP low during a write to a protected sector, as the device silently rejects writes without raising an error flag. Also note that DNU pins (11-14) must be left floating - tying them to ground can cause internal bus contention on some revisions of the Eclipse silicon.

At 133 MHz SPI clock, treat SCK as a 266 MHz signal for third-harmonic analysis. Use controlled-impedance traces (50 ohm single-ended to ground) referenced to an unbroken reference plane underneath the SPI bus. Add a 22-33 ohm series damping resistor at the SCK driver output to limit overshoot below 10% of VCC. For Quad-I/O mode, route SO/SI/WP/HOLD as a length-matched group with delta less than 2 mm to preserve setup/hold margins; mismatch greater than 5 mm causes data corruption at the maximum clock rate.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
鉛フリー
Yes
ハロゲンフリー
Yes
紛争鉱物
Compliant

AEC-Q100 Grade 3 qualification per Infineon part page. RoHS compliant and halogen-free per the manufacturer datasheet. Conflict-minerals compliance is standard for Infineon semiconductor products. PPAP support is available on request for OEM automotive programs.

データ検証日: 2026-10-10 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

S25FL128SAGMFIR03 S25FL128SAGMFIR03 datasheet Infineon S25FL128SAGMFIR03 128 Mbit SPI NOR Flash 16-SOIC Quad SPI flash AEC-Q100 automotive boot flash Infineon S25FL128SAGMFIR03 vs W25Q128JVSSIQ S25FL128SAGMFIR03 drop-in replacement S25FL128SAGMFIR03 buy price S25FL128SAGMFIR03 pinout 16-SOIC SPI NOR flash 16 MB XiP boot what is Quad SPI NOR flash

関連部品&用語

Infineon Technologies Cypress Semiconductor S25FL128SAGMFIR03 S25FL128SAGMFIR00 S25FL128SAGMFI003 W25Q128JVSSIQ MX25L12835FMI-10G IS25LP128-JBLE NOR Flash non-volatile memory semiconductor memory Serial Peripheral Interface (SPI) Quad I/O SPI execute-in-place (XiP) 65-nm MIRRORBIT technology Eclipse architecture AEC-Q100 JEDEC JESD22 RoHS REACH SOIC-16 wide-body SOIC 300 mil automotive infotainment ADAS sensor module industrial PLC
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