S9S12HZ128J3CAL - 16-Bit 50MHz 128KB MCU | NXP
部品番号: S9S12HZ128J3CAL ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $21.8879 | $21.89 |
| 10 | $21.8879 | $218.88 |
| 100 | $21.8879 | $2,188.79 |
| 500 | $21.8879 | $10,943.95 |
| 1,000 | $21.8879 | $21,887.90 |
S9S12HZ128J3CAL 概要
A microcontroller is a programmable system-on-chip that integrates a CPU core, memory, timers, communication interfaces, analog resources, and I/O. The HCS12 MCU family belongs to the broader embedded-processor hierarchy, combining deterministic real-time control with automotive-oriented peripherals. The S9S12HZ128J3CAL is particularly suited to instrumentation, body electronics, motor control, and other control systems requiring 16-bit processing and substantial embedded Flash.
The verified product information identifies a 16-bit S12 core, 128 KB Flash, 50 MHz clock operation, 85 I/O ports, and automotive qualification. Its 112-LQFP package provides a conventional leaded footprint for PCB assembly, while the 20 x 20 mm body size offers ample routing space around the device. The supplied sources also identify an automotive temperature range of -40°C to +85°C and a 4.5 V to 5.5 V operating supply range.
The S12 architecture is designed for embedded control rather than host computing. Its integrated Flash allows firmware, calibration data, and application logic to be stored locally, while the 85 I/O ports support digital sensors, switches, actuators, communication transceivers, and human-interface circuitry. The 50 MHz maximum clock provides processing headroom for time-critical control loops, while the 16-bit architecture supports efficient arithmetic and register-oriented embedded programming.
Typical applications include automotive instrument-cluster and body-control systems, industrial automation equipment, sensor-conditioning platforms, actuator controllers, and communication gateways. Engineers should verify all peripheral assignments, electrical limits, reset behavior, and package details against the relevant NXP datasheet before production release, especially because the retrieved distributor snippets disagree on whether the catalog clock should be interpreted as 25 MHz or 50 MHz.
ドロップイン代替品: S9S12HZ128J3CAL — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: S9S12HZ128J3CAL （同一形状・フットプリント） — 相違点: Package, Mounting Type, Operating Temperature Range, Automotive Qualification, Core Architecture.
クイック比較ツール — 並列比較する代替部品を選択:
S9S12HZ128VAL
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
S9S12HZ64J3CAL
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →S9S12HZ64J3CAAR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$7.1 / 個
データシートを見る →S9S12HZ64J3VAL
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$10.95 / 個
データシートを見る →S9S12H128J2VFVE
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$8.6 / 個
データシートを見る →S9S12HZ128J3CAL 最大定格＆電気的特性
| Product Type | 16-bit microcontroller |
| Architecture | HCS12 S12 core |
| Maximum Clock Speed | 50 MHz |
| Flash Memory | 128 KB |
| データバス幅 | 16 bit |
| I/O Ports | 85 |
| 動作電源電圧 | 4.5 V to 5.5 V |
| 動作温度 | -40°C to +85°C |
| パッケージ | 112-LQFP, 20 x 20 mm |
| 実装タイプ | Surface mount |
| Automotive Qualification | Automotive qualified |
| Flash Type | Flash |
| Core | S12 |
| Supplier Description | HCS12 microcontroller |
| Manufacturer | NXP Semiconductors |
| ライフサイクル状態 | End of Life |
| RoHS ステータス | unknown |
| REACH Status | unknown |
| Lead-Free Status | unknown |
S9S12HZ128J3CAL 112-lqfp, 20 x 20 mm ピン配置ガイド
S9S12HZ128J3CAL (112-lqfp, 20 x 20 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: S9S12HZ128J3CAL.
詳細は データシート をご参照ください。
主な用途
S9S12HZ128J3CAL の用途: 6 件s: Automotive Instrument Cluster, Body Control Module, Industrial Sensor Controller, Actuator and Motor Control, Automotive Communication Gateway, Embedded Diagnostic Controller.
Automotive Instrument Cluster
The S9S12HZ128J3CAL fits an automotive instrument-cluster controller because it combines a 16-bit HCS12 core, 128 KB Flash, 85 I/O ports, and a stated -40°C to +85°C automotive temperature range. The MCU can host display, button, warning, and sensor-processing logic while retaining local firmware storage. Its 112-LQFP footprint provides a defined 112-pin assembly interface, although the exact LCD, communication, and diagnostic peripheral assignments must be verified in the NXP datasheet before layout release.
おすすめ
Body Control Module
For body-electronics applications, the S9S12HZ128J3CAL provides 85 I/O ports for switches, lamps, door modules, relays, and actuator interfaces, while its 128 KB Flash supports embedded control software. The 4.5 V to 5.5 V operating range is consistent with a 5 V-class embedded power architecture. Automotive qualification is stated in the supplied product data, but transient protection, diagnostic behavior, wake-up sources, and exact peripheral multiplexing require validation against the manufacturer documentation.
おすすめ
Industrial Sensor Controller
The S9S12HZ128J3CAL is suitable for an industrial sensor controller that gathers digital inputs, drives actuators, and performs local control without a host processor. Its 16-bit architecture and 50 MHz stated clock provide headroom for deterministic filtering, state-machine logic, and communication supervision. The 85 I/O ports simplify peripheral expansion, while 128 KB Flash holds application firmware and calibration tables. The 4.5–5.5 V supply requirement and -40°C to +85°C range should be checked against the enclosure environment.
おすすめ
Actuator and Motor Control
The S9S12HZ128J3CAL can serve as the supervisory controller in actuator or motor-control subsystems where deterministic embedded logic coordinates sensors, protection circuits, and external power stages. Its 16-bit S12 core handles fixed-point and control calculations, while the available I/O supports limit switches, encoders, enable signals, and fault inputs. Because the supplied data does not identify motor-control timers, PWM channels, analog channels, or fault-timer features, the exact peripheral fit must be confirmed in the NXP datasheet.
おすすめ
Automotive Communication Gateway
The S9S12HZ128J3CAL can be evaluated for a communication gateway that bridges vehicle-network signals to body or sensor subsystems. Its 128 KB Flash permits local protocol tables and routing logic, while the 16-bit CPU supports message handling and supervisory functions. The supplied sources confirm automotive qualification and a -40°C to +85°C range, but they do not identify CAN, LIN, FlexRay, Ethernet, or other network peripherals. Protocol capability and pin multiplexing must be confirmed before selecting the MCU.
おすすめ
Embedded Diagnostic Controller
The S9S12HZ128J3CAL is a reasonable candidate for an embedded diagnostic controller because it combines local Flash, a 16-bit control core, and extensive digital I/O in an automotive-qualified package. It can coordinate sensor monitoring, fault latching, status reporting, and service-test inputs in a compact control module. The supplied data does not specify diagnostic protocols, memory map, watchdog behavior, security features, or calibration mechanisms; those functions require review of the complete NXP documentation and reference design support.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: S9S12HZ128J3CAL — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | S9S12HZ128VAL | S9S12HZ64J3CAL | S9S12HZ64J3CAAR | S9S12HZ64J3VAL |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP, 20 x 20 mm | LQFP-144; compatibility unverified | 112-LQFP; compatibility unverified | 112-LQFP; compatibility unverified | LQFP-144; compatibility unverified |
主な差別化要因
- Automotive-oriented S9S12 positioning （vs S9S12HZ64J3CAL)
- Larger verified embedded Flash capacity （vs S9S12HZ64J3CAL)
- Broad verified digital-I/O availability （vs S9S12HZ128VAL)
設計ノート
Design the supply rail for the verified 4.5 V to 5.5 V operating range and verify every peripheral's voltage tolerance in the NXP datasheet. Because the supplied sources do not provide detailed current consumption or internal voltage-regulator characteristics, do not estimate the regulator budget from package size alone. Include local bulk and bypass capacitors according to the manufacturer reference circuit, and validate startup, reset, and brownout behavior across the full automotive or industrial supply profile.
The target uses a 112-LQFP 20 x 20 mm package. Before routing, confirm the official land pattern, pin-1 orientation, pad dimensions, solder-mask clearance, and assembly requirements; do not infer a footprint from the package name alone. Reserve short, direct connections for supply and ground, keep sensitive analog or sensor routes away from switching nodes, and check that every package-side thermal and exposed-pad requirement is represented correctly if the device includes a thermal pad.
The retrieved data contains a clock-speed conflict: the NXP-related results and DigChip listing state 50 MHz, while DigiKey describes the same MPN as 25 MHz. Resolve this discrepancy using the exact NXP datasheet and ordering information before setting clock, bus, peripheral, or qualification assumptions. Likewise, do not treat related S9S12 MPNs as drop-in replacements until pin names, package dimensions, Flash size, voltage, and software-reset behavior have been compared line by line.
Preserve signal integrity around the MCU by separating clock and high-current output paths from sensor inputs, following the manufacturer recommended decoupling topology, and keeping long external traces short where possible. For automotive systems, provide robust return paths and controlled grounding so that transient events do not create unintended current paths through digital I/O. The supplied data does not specify external bus timing, communication protocols, or analog accuracy, so those constraints must be added from the complete datasheet.
Calculate junction temperature from the actual MCU dissipation and the PCB thermal path rather than from the 50 MHz clock rating alone. The supplied data does not provide current, thermal resistance, or ambient derating values, so no defensible thermal estimate can be produced. In a production design, use the manufacturer junction-temperature and package limits, measure worst-case automotive or industrial conditions, and ensure the 112-LQFP footprint has adequate copper and assembly heat spreading without violating pin-clearance rules.
コンプライアンス情報
The NXP product-page result identifies the S9S12HZ128J3CAL as automotive qualified, but the supplied data does not explicitly state RoHS, REACH, lead-free, halogen-free, conflict-minerals, or exact AEC-Q100 qualification details.
