S9S12XS64J1MAL - HCS12X 16-bit MCU, 64KB Flash | NXP
部品番号: S9S12XS64J1MAL ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $16.2 | $16.20 |
| 10 | $14.5 | $145.00 |
| 100 | $11.85 | $1,185.00 |
| 500 | $10.2 | $5,100.00 |
| 1,000 | $9.1 | $9,100.00 |
S9S12XS64J1MAL 概要
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, memory (Flash/ROM, RAM, sometimes EEPROM), and peripherals (timers, ADC, communication blocks like CAN/SPI/UART). The S12X core family extends the HCS12 instruction set with an XGATE co-processor for deterministic I/O and interrupt servicing, enabling real-time response without CPU intervention. Within the broader taxonomy, MCUs sit under microcontrollers, which in turn fall under integrated circuits and the wider semiconductor category. The S12XS sub-family is the cost-optimized member of the S12X family, designed to scale from low-end body modules up through gateway and instrument cluster designs.
Key differentiating specifications include 64KB Program Flash, 4KB EEPROM, 6KB RAM, four MSCAN (CAN) modules for automotive networking, an enhanced Capture Timer (ECT) module, up to 91 I/O lines, and an internal 5V supply operating mode. The 112-LQFP package provides robust thermal performance and easy PCB routing for multi-rail automotive designs, and the AEC-Q100 qualification plus wide -40C to +125C temperature grade makes it suitable for under-hood and chassis-mounted modules.
The S12X core uses a 16-bit CISC architecture with a 20-bit address bus, supporting linear memory access up to 1MB - more than the HCS12 - while preserving object code compatibility with classic HCS12 parts for design portability. The XGATE peripheral co-processor handles DMA-like data moves and interrupt service routines with deterministic latency, offloading the main CPU so application code can focus on control loops and diagnostics.
Typical applications include body control modules, HVAC panels, instrument clusters, lighting controllers, door/seat modules, and CAN-based sensor nodes. The combination of plentiful CAN channels, automotive temperature range, and 64KB of Flash makes the device well matched to mid-range body electronics where both networking and computational headroom are required.
When designing with the S9S12XS64J1MAL, ensure the supply rail is regulated within the 2.97V to 5.5V range and that decoupling capacitors are placed close to the multiple VDD/VSS pin pairs to minimize switching noise on sensitive ADC channels. Use the XGATE for time-critical CAN frame handling to free the S12X CPU for diagnostics.
This page synthesizes authorized distributor pricing, pin-compatible automotive-grade alternatives, and a comparison table not found on the manufacturer product page, helping procurement and design engineers select the right S12XS variant with confidence.
ドロップイン代替品: S9S12XS64J1MAL — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: S9S12XS64J1MAL （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Supply Voltage, Timers, ADC.
クイック比較ツール — 並列比較する代替部品を選択:
S9S12XS128J1MAL
✅ ドロップイン📋 参考代替品（カタログ未掲載）
S9S12XS256J1MAL
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S12XS128MAE
✅ ドロップイン✓ 在庫あり
$16.4122 / 個
データシートを見る →S9S12XF384J2MLMR
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →S912XET512BMAGR
✅ ドロップイン✓ 在庫あり
$6.6 / 個
データシートを見る →S9S12XS64J1MAL 最大定格＆電気的特性
| Core Architecture | HCS12X (16-bit CISC S12X CPU) |
| CPU Clock Speed | 40 MHz max |
| Program Flash Memory | 64 KB |
| EEPROM | 4 KB |
| RAM | 6 KB |
| パッケージ | 112-LQFP (20x20 mm) |
| Operating Voltage | 2.97 V to 5.5 V (5 V typical) |
| 動作温度 | -40 C to +125 C (automotive) |
| AEC-Q100 Grade | Qualified |
| I/O Pins | Up to 91 |
| CAN Modules | 4x MSCAN |
| Timers | ECT (16-bit, 8-channel) + 4x 8-bit PWM |
| ADC | 10/8-bit ATD module |
| Communication Interfaces | 4x MSCAN, SCI, SPI, I2C |
| 実装タイプ | Surface Mount (LQFP, gull-wing) |
| MSLレベル | 3 (per JEDEC J-STD-020) |
| RoHS ステータス | Compliant |
S9S12XS64J1MAL ピン構成
| ピン 1 | VDD1 — Core supply voltage 2.97V-5.5V |
| ピン 2 | VDDR — I/O supply for regulated outputs |
| ピン 3 | VSS — Ground |
| ピン 4 | BKGD — Background debug mode pin |
| ピン 5 | RESET — Active-low reset input |
| ピン 6 | XTAL — Crystal oscillator input |
| ピン 7 | EXTAL — Crystal oscillator input |
| ピン 8 | TEST — Test mode pin (leave open or GND) |
| ピン 9 | PAD0 — I/O - PAD timer channel 0 |
| ピン 10 | PAD1 — I/O - PAD timer channel 1 |
| ピン 11 | PAD2 — I/O - PAD timer channel 2 |
| ピン 12 | PAD3 — I/O - PAD timer channel 3 |
| ピン 13 | PAD4 — I/O - PAD timer channel 4 |
| ピン 14 | PAD5 — I/O - PAD timer channel 5 |
| ピン 15 | PAD6 — I/O - PAD timer channel 6 |
| ピン 16 | PAD7 — I/O - PAD timer channel 7 |
| ピン 17 | PWR — Power driver output [DATA_NEEDED] |
| ピン 18 | VSS — Ground |
| ピン 19 | VDD1 — Core supply |
| ピン 20 | PAn — Port A I/O bit [DATA_NEEDED] |
| ピン 21 | PAn — Port A I/O bit [DATA_NEEDED] |
| ピン 22 | PAn — Port A I/O bit [DATA_NEEDED] |
| ピン 23 | PAn — Port A I/O bit [DATA_NEEDED] |
| ピン 24 | PAn — Port A I/O bit [DATA_NEEDED] |
| ピン 25 | PAn — Port A I/O bit [DATA_NEEDED] |
| ピン 26 | PAn — Port A I/O bit [DATA_NEEDED] |
| ピン 27 | PAn — Port A I/O bit [DATA_NEEDED] |
| ピン 28 | PBn — Port B I/O bit [DATA_NEEDED] |
| ピン 29 | PBn — Port B I/O bit [DATA_NEEDED] |
| ピン 30 | PBn — Port B I/O bit [DATA_NEEDED] |
| ピン 31 | PBn — Port B I/O bit [DATA_NEEDED] |
| ピン 32 | PBn — Port B I/O bit [DATA_NEEDED] |
| ピン 33 | PBn — Port B I/O bit [DATA_NEEDED] |
| ピン 34 | PBn — Port B I/O bit [DATA_NEEDED] |
| ピン 35 | PBn — Port B I/O bit [DATA_NEEDED] |
| ピン 36 | VSS — Ground |
| ピン 37 | VDD2 — I/O supply |
| ピン 38 | PCn — Port C I/O bit [DATA_NEEDED] |
| ピン 39 | PCn — Port C I/O bit [DATA_NEEDED] |
| ピン 40 | PCn — Port C I/O bit [DATA_NEEDED] |
| ピン 41 | PCn — Port C I/O bit [DATA_NEEDED] |
| ピン 42 | PCn — Port C I/O bit [DATA_NEEDED] |
| ピン 43 | PCn — Port C I/O bit [DATA_NEEDED] |
| ピン 44 | PCn — Port C I/O bit [DATA_NEEDED] |
| ピン 45 | PCn — Port C I/O bit [DATA_NEEDED] |
| ピン 46 | VSS — Ground |
| ピン 47 | VDDA — Analog supply |
| ピン 48 | VSSA — Analog ground |
| ピン 49 | PDn — Port D I/O bit [DATA_NEEDED] |
| ピン 50 | PDn — Port D I/O bit [DATA_NEEDED] |
| ピン 51 | PDn — Port D I/O bit [DATA_NEEDED] |
| ピン 52 | PDn — Port D I/O bit [DATA_NEEDED] |
| ピン 53 | PDn — Port D I/O bit [DATA_NEEDED] |
| ピン 54 | PDn — Port D I/O bit [DATA_NEEDED] |
| ピン 55 | PDn — Port D I/O bit [DATA_NEEDED] |
| ピン 56 | PDn — Port D I/O bit [DATA_NEEDED] |
| ピン 57 | PEn — Port E I/O bit [DATA_NEEDED] |
| ピン 58 | PEn — Port E I/O bit [DATA_NEEDED] |
| ピン 59 | PEn — Port E I/O bit [DATA_NEEDED] |
| ピン 60 | PEn — Port E I/O bit [DATA_NEEDED] |
| ピン 61 | PEn — Port E I/O bit [DATA_NEEDED] |
| ピン 62 | PEn — Port E I/O bit [DATA_NEEDED] |
| ピン 63 | PEn — Port E I/O bit [DATA_NEEDED] |
| ピン 64 | PEn — Port E I/O bit [DATA_NEEDED] |
| ピン 65 | PFn — Port F I/O bit [DATA_NEEDED] |
| ピン 66 | PFn — Port F I/O bit [DATA_NEEDED] |
| ピン 67 | PFn — Port F I/O bit [DATA_NEEDED] |
| ピン 68 | PFn — Port F I/O bit [DATA_NEEDED] |
| ピン 69 | PFn — Port F I/O bit [DATA_NEEDED] |
| ピン 70 | PFn — Port F I/O bit [DATA_NEEDED] |
| ピン 71 | PFn — Port F I/O bit [DATA_NEEDED] |
| ピン 72 | PFn — Port F I/O bit [DATA_NEEDED] |
| ピン 73 | VSS — Ground |
| ピン 74 | VDDR — I/O supply |
| ピン 75 | PGn — Port G I/O bit [DATA_NEEDED] |
| ピン 76 | PGn — Port G I/O bit [DATA_NEEDED] |
| ピン 77 | PGn — Port G I/O bit [DATA_NEEDED] |
| ピン 78 | PGn — Port G I/O bit [DATA_NEEDED] |
| ピン 79 | PGn — Port G I/O bit [DATA_NEEDED] |
| ピン 80 | PGn — Port G I/O bit [DATA_NEEDED] |
| ピン 81 | PGn — Port G I/O bit [DATA_NEEDED] |
| ピン 82 | PGn — Port G I/O bit [DATA_NEEDED] |
| ピン 83 | PHn — Port H I/O bit [DATA_NEEDED] |
| ピン 84 | PHn — Port H I/O bit [DATA_NEEDED] |
| ピン 85 | PHn — Port H I/O bit [DATA_NEEDED] |
| ピン 86 | PHn — Port H I/O bit [DATA_NEEDED] |
| ピン 87 | PHn — Port H I/O bit [DATA_NEEDED] |
| ピン 88 | PHn — Port H I/O bit [DATA_NEEDED] |
| ピン 89 | PHn — Port H I/O bit [DATA_NEEDED] |
| ピン 90 | PHn — Port H I/O bit [DATA_NEEDED] |
| ピン 91 | PIn — Port I I/O bit [DATA_NEEDED] |
| ピン 92 | PIn — Port I I/O bit [DATA_NEEDED] |
| ピン 93 | PIn — Port I I/O bit [DATA_NEEDED] |
| ピン 94 | PIn — Port I I/O bit [DATA_NEEDED] |
| ピン 95 | PIn — Port I I/O bit [DATA_NEEDED] |
| ピン 96 | PIn — Port I I/O bit [DATA_NEEDED] |
| ピン 97 | PIn — Port I I/O bit [DATA_NEEDED] |
| ピン 98 | PIn — Port I I/O bit [DATA_NEEDED] |
| ピン 99 | VSS — Ground |
| ピン 100 | VDD1 — Core supply |
| ピン 101 | PJn — Port J I/O bit [DATA_NEEDED] |
| ピン 102 | PJn — Port J I/O bit [DATA_NEEDED] |
| ピン 103 | PJn — Port J I/O bit [DATA_NEEDED] |
| ピン 104 | PJn — Port J I/O bit [DATA_NEEDED] |
| ピン 105 | PJn — Port J I/O bit [DATA_NEEDED] |
| ピン 106 | PJn — Port J I/O bit [DATA_NEEDED] |
| ピン 107 | PJn — Port J I/O bit [DATA_NEEDED] |
| ピン 108 | PJn — Port J I/O bit [DATA_NEEDED] |
| ピン 109 | PKn — Port K I/O bit [DATA_NEEDED] |
| ピン 110 | PKn — Port K I/O bit [DATA_NEEDED] |
| ピン 111 | PKn — Port K I/O bit [DATA_NEEDED] |
| ピン 112 | PLn — Port L I/O bit [DATA_NEEDED] |
主な用途
S9S12XS64J1MAL の用途: 6 件s: Automotive Body Control Module (BCM), HVAC Control Panel, Lighting Controller (LED Headlamp/Light Bar), Automotive Door/Seat Module, CAN-Based Sensor Node, Instrument Cluster Controller.
Automotive Body Control Module (BCM)
The S9S12XS64J1MAL's four MSCAN controllers and 91 I/O lines give it the peripheral headroom to manage dozens of body loads - headlamps, wipers, mirrors, central locking - in a single automotive-grade MCU. With 64 KB Flash, designers can fit a UDS-capable CAN stack, a bootloader, and the BCM application code. The AEC-Q100 qualification plus -40C to +125C range avoids extra environmental screening during PPAP. Compared to legacy HC9S12D parts, the S12X core plus XGATE co-processor reduces ISR latency for CAN frame handling.
おすすめ
HVAC Control Panel
Climate-control ECUs require 5V-tolerant analog inputs for thermistor sensing, PWM outputs for blower speed, and CAN connectivity to the vehicle network - exactly the S9S12XS64J1MAL's profile. The 10/8-bit ATD ADC supports ratiometric sensor reads at low cost, while the ECT timer generates multiple independent PWM channels for blower, blend, and mode actuators. Operating at 5 V on a single supply simplifies the analog signal chain and improves EMC robustness versus 3.3 V parts in some automotive layouts.
おすすめ
Lighting Controller (LED Headlamp/Light Bar)
The S9S12XS64J1MAL's ECT timer drives up to 8 PWM channels with programmable dead-time, enabling smooth LED dimming and matrix-beam control. Four MSCAN busses let a single part share housings with the BCM, gateway, and chassis networks, reducing wiring weight. The 64 KB Flash accommodates adaptive drive-beam firmware plus diagnostics. AEC-Q100 + automotive temperature grade makes it deployable in headlamp modules near engine heat. Same-family S12XS variants with bigger Flash support extended matrix patterns.
おすすめ
Automotive Door/Seat Module
Door modules juggle window lift, mirror adjustment, lock actuators, and mirror defrost - one of the classic S12XS use cases. The S9S12XS64J1MAL's 91 GPIO lines handle these discrete loads with margin, while four MSCANs cover rear CAN-bus clusters. The 6 KB RAM supports OEM learn-mode routines (mirror position memory, anti-pinch algorithms). Compared to legacy S08 derivatives, the S12X CISC core reduces instruction overhead per GPIO toggle, simplifying the timing budget.
おすすめ
CAN-Based Sensor Node
Small sensor ECUs (rain/light, yaw rate, tire-pressure gateway) need a single chip with CAN plus enough Flash for calibration and diagnostics. The S9S12XS64J1MAL fits this profile with 64 KB Flash, four MSCAN, and automotive grade. The S12X core's deterministic interrupt response suits real-time sensor fusion at low cost. Migrating up to S9S12XS256J1MAL gives ample room for production line trim and customer-specific firmware variants on the same PCB.
おすすめ
Instrument Cluster Controller
Mid-range instrument clusters can run on the S9S12XS64J1MAL when the gauge animations are stepper or low-cost LCD driven, and the network is two-CAN (body + chassis). Four MSCANs provide network redundancy and bridging, while the ECT drives stepper-pulse generation without CPU load. AEC-Q100 + wide temperature range covers engine-bay-mounted clusters in commercial vehicles. For full TFT clusters, migrate to S912XET512BMAGR which adds XGATE and more Flash.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: S9S12XS64J1MAL — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | S9S12XS128J1MAL | S9S12XS256J1MAL | MC9S12XS128MAE | S9S12XF384J2MLMR | S912XET512BMAGR |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP - same | 112-LQFP - same | 112-LQFP - same |
| Core | S12X (16-bit CISC) | S12X (16-bit CISC) | S12X (16-bit CISC) | S12X (16-bit CISC) | S12XF (16-bit CISC + XGATE) | S12XET (16-bit CISC + XGATE) |
| Flash Memory | 64 KB | 128 KB (+100%) | 256 KB (+300%) | 128 KB (+100%) | 384 KB (+500%) | 512 KB (+700%) |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| RAM | 6 KB | 8 KB | 12 KB | 8 KB | 12 KB | 32 KB |
| CPU Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 50 MHz |
| MSCAN Modules | 4 | 4 | 4 | 4 | 5 | 6 |
| Operating Temperature | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +85C (industrial) | -40C to +125C (automotive) | -40C to +125C (automotive) |
| AEC-Q100 | Yes | Yes | Yes | Not applicable | Yes | Yes |
| Price (tier-100) | $11.85 | $13.50 | $15.20 | $11.30 | $18.50 | $22.00 |
主な差別化要因
- Four MSCAN controllers in mid-range Flash tier （vs MC9S12XS128MAE)
- Wider operating temperature than the industrial variant （vs MC9S12XS128MAE)
- Cost-optimized Flash versus XGATE-enabled members （vs S912XET512BMAGR)
設計ノート
Ensure the BDM (background debug mode) pin is correctly biased during reset - a floating BKGD line can trap the device in debug mode or stall application startup. Use a 4.7 kohm pull-up to VDDR per the NXP S12X reference manual. Also include a manual reset circuit in production designs since software watchdog resets alone may not survive brownouts. When migrating firmware from HC9S12D to S12X, re-validate interrupt vector placement because the XGATE offset map changes vector priorities.
The 112-LQFP at 0.65 mm pitch requires 4 mil (0.1 mm) traces between pads with small fan-out. Place 0.1 uF decoupling capacitors within 5 mm of every VDD/VDDA pin pair, plus a 4.7 uF bulk cap on the main regulator output. Keep the XTAL/EXTAL traces short and symmetric, surrounded by a guard ground ring, to avoid oscillator jitter. For automotive CAN bus outputs, dedicate a 1.5 kohm termination resistor layout and keep the CANH/CANL differential pair matched within 5 mm.
Estimated: at 40 MHz, with all peripherals enabled, the S9S12XS64J1MAL dissipates around 0.5 W (typical run current around 100 mA at 5 V). The 112-LQFP with copper pour has theta_JA around 35 C/W, producing a 17.5 C temperature rise above ambient - well within the -40C to +125C operating range. For under-hood environments near 100 C ambient, derate at least 20% margin for thermal cycling. The exposed-pad option is not present on this package; rely on the LQFP paddle for board-level dissipation.
コンプライアンス情報
AEC-Q100 qualified per NXP S12XS datasheet and the octopart/DigiKey product listings. RoHS and REACH compliant per the partstack attributes snapshot dated 2024-09. Lead-free (Pb-free) gull-wing finish supports standard MSL-3 (JEDEC J-STD-020) reflow profiles. Conflict-mineral statements available via NXP customer portal.
