SPC5604BF1MLL6 - 32-bit MCU 512KB Flash 100-Pin LQFP | NXP
部品番号: SPC5604BF1MLL6 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.25 | $112.50 |
| 100 | $9.85 | $985.00 |
| 500 | $8.4 | $4,200.00 |
| 1,000 | $7.15 | $7,150.00 |
| 3,000 | $6.2 | $18,600.00 |
SPC5604BF1MLL6 概要
An automotive-grade MCU (microcontroller unit) is a single-chip processor with integrated Flash, RAM, timers, ADC, and communication peripherals, qualified to operate reliably across the -40C to +125C automotive temperature range. The Power Architecture e200z0h core is a 32-bit RISC processor optimized for embedded control, and within the broader taxonomy the SPC5604B sits in the hierarchy: 32-bit MCU -> automotive microcontroller -> Power Architecture device -> embedded processor -> semiconductor IC. The 100-pin LQFP (Low-profile Quad Flat Pack) is a surface-mount form factor that balances thermal performance with PCB manufacturing ease, falling within the QFP package family.
Key features include 512KB on-chip Flash, 32KB SRAM, a 12-bit ADC, multiple CAN 2.0B interfaces (FlexCAN), LINFlex/UART, an eMIOS timer unit for precise PWM generation, and JTAG debugging. The device operates at a maximum 64MHz system clock and supports the SPC568 (14) family ecosystem of software drivers, operating systems, and configuration tools that accelerate development.
Technically, the SPC5604BF1MLL6 integrates an enhanced modular I/O subsystem, low-power modes with wake-up support, a periodic interrupt timer, and a system integration unit (SIU) for flexible pin multiplexing. Built on automotive-qualified process technology, it is AEC-Q100 qualified and tailored for chassis, gateway, and body controller modules.
Typical applications include automotive body controllers, electronic control modules, industrial PLCs, sensor interfaces, HVAC controllers, and lighting modules. The combination of multiple CAN nodes, automotive temperature grade, and integrated ADC makes it ideal for chassis and gateway ECUs.
When designing with this device, allocate the LQFP-100 footprint with proper thermal vias under the exposed pad region, follow the SPC5604B hardware design guide for power decoupling, and validate EMC performance against automotive OEM requirements.
This page synthesizes distributor pricing, AEC-Q100 same-family cross-references, and practical design notes not consolidated on any single manufacturer or distributor page.
ドロップイン代替品: SPC5604BF1MLL6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: SPC5604BF1MLL6 （同一形状・フットプリント） — 相違点: Communication Interfaces, Core Size, Package, Program Memory Size, RAM Size.
クイック比較ツール — 並列比較する代替部品を選択:
SPC5604BF2MLL6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SPC5604CF2MLL6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SPC5604BF2CLL6R
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SPC5603CF2CLL6
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$7.85 / 個
データシートを見る →SPC5603BF2MLL4R
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$9.3 / 個
データシートを見る →SPC5604BF1MLL6 最大定格＆電気的特性
| Core Architecture | Power Architecture e200z0h |
| Core Size | 32-bit Single-Core |
| Program Memory Size | 512KB Flash |
| RAM Size | 32KB |
| 最大クロック周波数 | 64 MHz |
| 電源電圧 | 3.3V / 5V (automotive range) |
| パッケージ | LQFP-100 (14x14 mm, Gull Wing) |
| Number of Terminals | 100 |
| Terminal Form | Gull Wing |
| Temperature Grade | Automotive (-40C to +125C) |
| ADC | 12-bit (10/12-bit modes available) |
| Communication Interfaces | FlexCAN, LINFlex, UART, SPI, I2C |
| Timer Module | eMIOS (PWM/IC/OPWM) |
| Debug Interface | JTAG / Nexus |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| AEC-Q100 Qualification | Qualified |
| Packaging | Tray |
SPC5604BF1MLL6 ピン構成
| ピン 1 | VDD — Supply voltage |
| ピン 2 | VSS — Ground |
| ピン 3 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 4 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 5 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 6 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 7 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 8 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 9 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 10 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 11 | VDD — Supply voltage |
| ピン 12 | VSS — Ground |
| ピン 13 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 14 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 15 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 16 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 17 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 18 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 19 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 20 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 21 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 22 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 23 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 24 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 25 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 26 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 27 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 28 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 29 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 30 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 31 | VDD — Supply voltage |
| ピン 32 | VSS — Ground |
| ピン 33 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 34 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 35 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 36 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 37 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 38 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 39 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 40 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 41 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 42 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 43 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 44 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 45 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 46 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 47 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 48 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 49 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 50 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 51 | VDD — Supply voltage |
| ピン 52 | VSS — Ground |
| ピン 53 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 54 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 55 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 56 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 57 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 58 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 59 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 60 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 61 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 62 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 63 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 64 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 65 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 66 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 67 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 68 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 69 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 70 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 71 | VDD — Supply voltage |
| ピン 72 | VSS — Ground |
| ピン 73 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 74 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 75 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 76 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 77 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 78 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 79 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 80 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 81 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 82 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 83 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 84 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 85 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 86 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 87 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 88 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 89 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 90 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 91 | VDD — Supply voltage |
| ピン 92 | VSS — Ground |
| ピン 93 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 94 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 95 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 96 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 97 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 98 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 99 | GPIO — General purpose I/O (SIU-mapped) |
| ピン 100 | GPIO — General purpose I/O (SIU-mapped) |
主な用途
SPC5604BF1MLL6 の用途: 6 件s: Automotive Body Control Module (BCM), Automotive Gateway ECU, Industrial PLC and Sensor Interface, HVAC Climate Controller, Automotive Lighting Module, Chassis and Suspension Sensor Hub.
Automotive Body Control Module (BCM)
The SPC5604BF1MLL6 fits BCM applications because its 512KB Flash and 32KB SRAM accommodate centralized body functions while 64MHz e200z0h performance handles real-time CAN/LIN message scheduling. Multiple FlexCAN controllers support gateway routing between powertrain, chassis, and body CAN buses. AEC-Q100 qualification to -40C to +125C enables under-hood or cabin deployment, and eMIOS timers drive lighting/PWM actuators with deterministic latency. Compared to a switching regulator, the SPC5604B integrates the MCU plus ADC plus CAN into one LQFP-100, reducing BOM and PCB area for cost-sensitive body ECUs.
おすすめ
Automotive Gateway ECU
The SPC5604BF1MLL6 serves automotive gateway ECUs where routing and protocol translation between multiple CAN/LIN networks is required. The 512KB Flash holds routing tables and gateway firmware, while 64MHz CPU headroom processes message forwarding with bounded latency. Multiple FlexCAN and UART/LIN interfaces reduce external transceiver count, and AEC-Q100 grade meets automotive OEM reliability targets. Designers value the LQFP-100 package's industrial-standard footprint that simplifies PCB layout and qualification cycles.
おすすめ
Industrial PLC and Sensor Interface
The SPC5604BF1MLL6 fits industrial PLC and sensor-interface applications because its 12-bit ADC and eMIOS timer unit support analog sensor acquisition and PWM control loops. 64MHz e200z0h processing handles deterministic scan cycles, and AEC-Q100 over-temperature capability extends product life in harsh factory environments. The LQFP-100 package supports hand-solder-friendly prototyping and high-volume SMT assembly. A typical design pairs the MCU with isolated CAN/RS-485 transceivers and external 24V-tolerant analog front-ends for industrial sensor hubs.
おすすめ
HVAC Climate Controller
The SPC5604BF1MLL6 supports HVAC climate controller modules thanks to its multi-channel ADC for temperature/pressure sensors and eMIOS PWM outputs for blower and blend-door actuators. 512KB Flash stores climate algorithm, calibration curves, and fault logs, while CAN/LIN connectivity integrates into the vehicle network. AEC-Q100 over-temperature range supports under-dash thermal stress. Compared to a higher-tier MCU, the SPC5604B's specific cell counts leave ample margin for OTA-friendly firmware partitioning at competitive cost.
おすすめ
Automotive Lighting Module
The SPC5604BF1MLL6 drives exterior and interior automotive lighting modules where multiple PWM channels are needed for LED current control and dimming. eMIOS timers provide up to 16-bit PWM resolution for precise brightness, while LIN or CAN bus connectivity enables body-network integration. AEC-Q100 grade and 64MHz performance let the MCU also handle diagnostics and fault logging, simplifying BOM by replacing discrete timers. The LQFP-100 footprint is widely used in lighting ECUs.
おすすめ
Chassis and Suspension Sensor Hub
The SPC5604BF1MLL6 suits chassis sensor hubs because its 12-bit ADC captures multi-axis wheel-speed, steering-angle, and IMU data while FlexCAN streams processed values to the chassis domain. 64MHz CPU supports sensor fusion algorithms in real time, and AEC-Q100 grade tolerates suspension-turret thermal and vibration environments. Designers pair it with automotive CAN transceivers and isolated power to meet OEM chassis EMC requirements. Compared to higher-end MPC5xxx, the SPC5604B's specific cell count balances cost and capability for tier-1 sensor hubs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: SPC5604BF1MLL6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | SPC5604BF2MLL6 | SPC5604CF2MLL6 | SPC5604BF2CLL6R | SPC5603CF2CLL6 | SPC5603BF2MLL4R |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-100 (14x14) | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same |
| Core Architecture | Power Architecture e200z0h | Power Architecture e200z0h | Power Architecture e200z0h | Power Architecture e200z0h | Power Architecture e200z0h | Power Architecture e200z0h |
| Maximum Clock Frequency | 64 MHz | 80 MHz (+25%) | 80 MHz (+25%) | 80 MHz (+25%) | 80 MHz (+25%) | 80 MHz (+25%) |
| Flash Memory | 512 KB | 512 KB | 768 KB (+50%) | 512 KB | 384 KB (-25%) | 384 KB (-25%) |
| RAM | 32 KB | 32 KB | 48 KB | 32 KB | 28 KB | 28 KB |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
| Family / Step | MPC5604B (F1 step) | MPC5604B (F2 step) | MPC5604C (F2 step) | MPC5604B (F2 step) | MPC5603C (F2 step) | MPC5603B (F2 step) |
主な差別化要因
- F1 step with proven automotive deployment
- Lower-cost entry into SPC5604 family
- Balanced memory tier vs SPC5603 family
設計ノート
Decouple VDD/VSS pins with 100nF ceramic capacitors placed as close as possible to each supply pair, plus bulk 10uF tantalum or ceramic at the regulator output. The SPC5604BF1MLL6 requires clean analog supply (VDDA) separated from digital VDD via ferrite beads or filter capacitors. Follow NXP MPC5604B hardware design guide section 4 for proper sequencing of internal voltage regulators on power-up and power-down. Estimated: at 64MHz active current is typically 80-120mA plus peripheral current; standby with RTC ~10mA.
The LQFP-100 (14x14mm) package requires a 4-layer PCB minimum for automotive EMC performance. Route all high-speed signals on inner layers with continuous reference plane, and provide thermal vias under the exposed pad. Keep crystal traces short (<10mm) and surrounded by grounded guard traces. Use impedance-controlled routing for FlexCAN signals (typically 120 ohm differential). Estimated: total GND pour should cover >60% of the inner layers for automotive OEM targets.
Do not exceed the absolute maximum ratings of 5.5V on any supply pin. The JTAG/Nexus interface requires proper TCK/TMS/TDO/TDI/TRST termination; floating TRST may prevent debugger connection. Ensure RESET is held low during power ramp until the internal 1.2V core rail stabilizes. Flash programming requires the correct RCC (Reset Configuration) word - consult the SPC5604B reference manual section 5.2 before first-time programming.
The LQFP-100 (14x14mm) package has a typical theta-JA of approximately 35-40 C/W on a 4-layer JEDEC test board. Estimated: at typical automotive ambient 85C with 200mA active current and 1.5W dissipation, junction temperature stays well below 125C, leaving margin for AEC-Q100 Grade 1 qualification. Add thermal vias and copper pours for additional heat spreading in sealed enclosures.
コンプライアンス情報
AEC-Q100 Grade 1 qualified for automotive -40C to +125C operation. RoHS and REACH compliant per NXP product declarations. Halogen-free per JEDEC JS709C definition.
