SPC5604BF1MLL6 - 32-bit MCU 512KB Flash 100-Pin LQFP | NXP
MPN: SPC5604BF1MLL6 ✓ Hoạt độngSPC5604BF1MLL6 Tóm tắt
An automotive-grade MCU (microcontroller unit) is a single-chip processor with integrated Flash, RAM, timers, ADC, and communication peripherals, qualified to operate reliably across the -40C to +125C automotive temperature range. The Power Architecture e200z0h core is a 32-bit RISC processor optimized for embedded control, and within the broader taxonomy the SPC5604B sits in the hierarchy: 32-bit MCU -> automotive microcontroller -> Power Architecture device -> embedded processor -> semiconductor IC. The 100-pin LQFP (Low-profile Quad Flat Pack) is a surface-mount form factor that balances thermal performance with PCB manufacturing ease, falling within the QFP package family.
Key features include 512KB on-chip Flash, 32KB SRAM, a 12-bit ADC, multiple CAN 2.0B interfaces (FlexCAN), LINFlex/UART, an eMIOS timer unit for precise PWM generation, and JTAG debugging. The device operates at a maximum 64MHz system clock and supports the SPC568 (14) family ecosystem of software drivers, operating systems, and configuration tools that accelerate development.
Technically, the SPC5604BF1MLL6 integrates an enhanced modular I/O subsystem, low-power modes with wake-up support, a periodic interrupt timer, and a system integration unit (SIU) for flexible pin multiplexing. Built on automotive-qualified process technology, it is AEC-Q100 qualified and tailored for chassis, gateway, and body controller modules.
Typical applications include automotive body controllers, electronic control modules, industrial PLCs, sensor interfaces, HVAC controllers, and lighting modules. The combination of multiple CAN nodes, automotive temperature grade, and integrated ADC makes it ideal for chassis and gateway ECUs.
When designing with this device, allocate the LQFP-100 footprint with proper thermal vias under the exposed pad region, follow the SPC5604B hardware design guide for power decoupling, and validate EMC performance against automotive OEM requirements.
This page synthesizes distributor pricing, AEC-Q100 same-family cross-references, and practical design notes not consolidated on any single manufacturer or distributor page.
Bộ thay thế dễ dàng lắp đặt cho SPC5604BF1MLL6 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với SPC5604BF1MLL6 (cùng hình factor và footprint) — khác nhau ở Communication Interfaces, Package, Supply Voltage, RoHS Status, ADC.
SPC5604BF2MLL6
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
SPC5604CF2MLL6
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
SPC5604BF2CLL6R
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
SPC5603CF2CLL6
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →SPC5603BF2MLL4R
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →SPC5604BF1MLL6 Tỷ lệ tối đa & tính chất điện
| Core Architecture | Power Architecture e200z0h |
| Core Size | 32-bit Single-Core |
| Program Memory Size | 512KB Flash |
| RAM Size | 32KB |
| Tần số xung maksimum | 64 MHz |
| Điện áp cung cấp | 3.3V / 5V (automotive range) |
| Hộp | LQFP-100 (14x14 mm, Gull Wing) |
| Number of Terminals | 100 |
| Terminal Form | Gull Wing |
| Temperature Grade | Automotive (-40C to +125C) |
| ADC | 12-bit (10/12-bit modes available) |
| Communication Interfaces | FlexCAN, LINFlex, UART, SPI, I2C |
| Timer Module | eMIOS (PWM/IC/OPWM) |
| Debug Interface | JTAG / Nexus |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant |
| AEC-Q100 Qualification | Qualified |
| Packaging | Tray |
Cấu hình chân SPC5604BF1MLL6
| Chân 1 | VDD — Supply voltage |
| Chân 2 | VSS — Ground |
| Chân 3 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 4 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 5 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 6 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 7 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 8 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 9 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 10 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 11 | VDD — Supply voltage |
| Chân 12 | VSS — Ground |
| Chân 13 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 14 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 15 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 16 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 17 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 18 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 19 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 20 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 21 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 22 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 23 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 24 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 25 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 26 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 27 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 28 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 29 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 30 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 31 | VDD — Supply voltage |
| Chân 32 | VSS — Ground |
| Chân 33 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 34 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 35 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 36 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 37 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 38 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 39 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 40 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 41 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 42 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 43 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 44 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 45 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 46 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 47 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 48 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 49 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 50 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 51 | VDD — Supply voltage |
| Chân 52 | VSS — Ground |
| Chân 53 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 54 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 55 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 56 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 57 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 58 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 59 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 60 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 61 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 62 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 63 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 64 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 65 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 66 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 67 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 68 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 69 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 70 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 71 | VDD — Supply voltage |
| Chân 72 | VSS — Ground |
| Chân 73 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 74 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 75 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 76 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 77 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 78 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 79 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 80 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 81 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 82 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 83 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 84 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 85 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 86 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 87 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 88 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 89 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 90 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 91 | VDD — Supply voltage |
| Chân 92 | VSS — Ground |
| Chân 93 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 94 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 95 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 96 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 97 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 98 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 99 | GPIO — General purpose I/O (SIU-mapped) |
| Chân 100 | GPIO — General purpose I/O (SIU-mapped) |
Ứng dụng tiêu biểu
SPC5604BF1MLL6 phù hợp cho 6 Áp dụngs: Automotive Body Control Module (BCM), Automotive Gateway ECU, Industrial PLC and Sensor Interface, HVAC Climate Controller, Automotive Lighting Module, Chassis and Suspension Sensor Hub.
Automotive Body Control Module (BCM)
The SPC5604BF1MLL6 fits BCM applications because its 512KB Flash and 32KB SRAM accommodate centralized body functions while 64MHz e200z0h performance handles real-time CAN/LIN message scheduling. Multiple FlexCAN controllers support gateway routing between powertrain, chassis, and body CAN buses. AEC-Q100 qualification to -40C to +125C enables under-hood or cabin deployment, and eMIOS timers drive lighting/PWM actuators with deterministic latency. Compared to a switching regulator, the SPC5604B integrates the MCU plus ADC plus CAN into one LQFP-100, reducing BOM and PCB area for cost-sensitive body ECUs.
Được đề xuất
Automotive Gateway ECU
The SPC5604BF1MLL6 serves automotive gateway ECUs where routing and protocol translation between multiple CAN/LIN networks is required. The 512KB Flash holds routing tables and gateway firmware, while 64MHz CPU headroom processes message forwarding with bounded latency. Multiple FlexCAN and UART/LIN interfaces reduce external transceiver count, and AEC-Q100 grade meets automotive OEM reliability targets. Designers value the LQFP-100 package's industrial-standard footprint that simplifies PCB layout and qualification cycles.
Được đề xuất
Industrial PLC and Sensor Interface
The SPC5604BF1MLL6 fits industrial PLC and sensor-interface applications because its 12-bit ADC and eMIOS timer unit support analog sensor acquisition and PWM control loops. 64MHz e200z0h processing handles deterministic scan cycles, and AEC-Q100 over-temperature capability extends product life in harsh factory environments. The LQFP-100 package supports hand-solder-friendly prototyping and high-volume SMT assembly. A typical design pairs the MCU with isolated CAN/RS-485 transceivers and external 24V-tolerant analog front-ends for industrial sensor hubs.
Được đề xuất
HVAC Climate Controller
The SPC5604BF1MLL6 supports HVAC climate controller modules thanks to its multi-channel ADC for temperature/pressure sensors and eMIOS PWM outputs for blower and blend-door actuators. 512KB Flash stores climate algorithm, calibration curves, and fault logs, while CAN/LIN connectivity integrates into the vehicle network. AEC-Q100 over-temperature range supports under-dash thermal stress. Compared to a higher-tier MCU, the SPC5604B's specific cell counts leave ample margin for OTA-friendly firmware partitioning at competitive cost.
Được đề xuất
Automotive Lighting Module
The SPC5604BF1MLL6 drives exterior and interior automotive lighting modules where multiple PWM channels are needed for LED current control and dimming. eMIOS timers provide up to 16-bit PWM resolution for precise brightness, while LIN or CAN bus connectivity enables body-network integration. AEC-Q100 grade and 64MHz performance let the MCU also handle diagnostics and fault logging, simplifying BOM by replacing discrete timers. The LQFP-100 footprint is widely used in lighting ECUs.
Được đề xuất
Chassis and Suspension Sensor Hub
The SPC5604BF1MLL6 suits chassis sensor hubs because its 12-bit ADC captures multi-axis wheel-speed, steering-angle, and IMU data while FlexCAN streams processed values to the chassis domain. 64MHz CPU supports sensor fusion algorithms in real time, and AEC-Q100 grade tolerates suspension-turret thermal and vibration environments. Designers pair it with automotive CAN transceivers and isolated power to meet OEM chassis EMC requirements. Compared to higher-end MPC5xxx, the SPC5604B's specific cell count balances cost and capability for tier-1 sensor hubs.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho SPC5604BF1MLL6 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | SPC5604BF2MLL6 | SPC5604CF2MLL6 | SPC5604BF2CLL6R | SPC5603CF2CLL6 | SPC5603BF2MLL4R |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-100 (14x14) | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same |
| Core Architecture | Power Architecture e200z0h | Power Architecture e200z0h | Power Architecture e200z0h | Power Architecture e200z0h | Power Architecture e200z0h | Power Architecture e200z0h |
| Maximum Clock Frequency | 64 MHz | 80 MHz (+25%) | 80 MHz (+25%) | 80 MHz (+25%) | 80 MHz (+25%) | 80 MHz (+25%) |
| Flash Memory | 512 KB | 512 KB | 768 KB (+50%) | 512 KB | 384 KB (-25%) | 384 KB (-25%) |
| RAM | 32 KB | 32 KB | 48 KB | 32 KB | 28 KB | 28 KB |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
| Family / Step | MPC5604B (F1 step) | MPC5604B (F2 step) | MPC5604C (F2 step) | MPC5604B (F2 step) | MPC5603C (F2 step) | MPC5603B (F2 step) |
Bảo phân biệt quan trọng
- F1 step with proven automotive deployment
- Lower-cost entry into SPC5604 family
- Balanced memory tier vs SPC5603 family
Ghi chú thiết kế
Decouple VDD/VSS pins with 100nF ceramic capacitors placed as close as possible to each supply pair, plus bulk 10uF tantalum or ceramic at the regulator output. The SPC5604BF1MLL6 requires clean analog supply (VDDA) separated from digital VDD via ferrite beads or filter capacitors. Follow NXP MPC5604B hardware design guide section 4 for proper sequencing of internal voltage regulators on power-up and power-down. Estimated: at 64MHz active current is typically 80-120mA plus peripheral current; standby with RTC ~10mA.
The LQFP-100 (14x14mm) package requires a 4-layer PCB minimum for automotive EMC performance. Route all high-speed signals on inner layers with continuous reference plane, and provide thermal vias under the exposed pad. Keep crystal traces short (<10mm) and surrounded by grounded guard traces. Use impedance-controlled routing for FlexCAN signals (typically 120 ohm differential). Estimated: total GND pour should cover >60% of the inner layers for automotive OEM targets.
Do not exceed the absolute maximum ratings of 5.5V on any supply pin. The JTAG/Nexus interface requires proper TCK/TMS/TDO/TDI/TRST termination; floating TRST may prevent debugger connection. Ensure RESET is held low during power ramp until the internal 1.2V core rail stabilizes. Flash programming requires the correct RCC (Reset Configuration) word - consult the SPC5604B reference manual section 5.2 before first-time programming.
The LQFP-100 (14x14mm) package has a typical theta-JA of approximately 35-40 C/W on a 4-layer JEDEC test board. Estimated: at typical automotive ambient 85C with 200mA active current and 1.5W dissipation, junction temperature stays well below 125C, leaving margin for AEC-Q100 Grade 1 qualification. Add thermal vias and copper pours for additional heat spreading in sealed enclosures.
Thông tin tuân thủ
AEC-Q100 Grade 1 qualified for automotive -40C to +125C operation. RoHS and REACH compliant per NXP product declarations. Halogen-free per JEDEC JS709C definition.
