TMS320F28379DZWTS - Dual-Core 800MIPS C2000 MCU | Texas Instruments
部品番号: TMS320F28379DZWTS ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $27.5 | $27.50 |
| 10 | $24.75 | $247.50 |
| 100 | $22.86 | $2,286.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $20.79 | $20,790.00 |
TMS320F28379DZWTS 概要
A microcontroller (MCU) is a single-chip computer integrating CPU, memory, and peripherals that engineers program to sense, compute, and actuate in embedded systems. Within the taxonomy, MCUs sit under microcontrollers -> embedded processors -> digital ICs -> integrated circuits -> semiconductors. The C2000 Delfino family specifically targets real-time control: motor control, digital power, and servo loops where deterministic interrupt latency and per-MIPS cost dominate the design decision.
Key specifications: 1 MB on-chip Flash (512K x 16), 204 KB SRAM, dual 200 MHz C28x cores, hardware FPU and TMU, three 12-bit ADCs at up to 3.5 MSPS each, four 16-bit ADCs (throughput to 200 ns), CMPSS (comparator/DAC subsystems), eight ePWM modules, two eQEP, three eCAP, two SDFM, USB 2.0 (host + device), CAN-FD, SPI, I2C, UART, and EMIF for external memory expansion.
Architecturally, the dual C28x cores each have their own CLA, allowing parallel execution of control loops without CPU loading. The TMU accelerates sin/cos/atan math used in transforms and observer algorithms, while the CLB enables hardware-state-machine glue logic that previously required external CPLDs. Safety diagnostics include ECC on Flash and RAM, dual watchdog timers, lockstep on CPU and CLA, and a built-in self-test (BIST).
Typical applications include industrial motor drives and multi-axis servo control, photovoltaic solar inverters and digital power conversion, electric vehicle traction inverters and onboard chargers, and renewable-energy grid-tie inverters. Industrial factory-automation controllers and PLCs leverage the deterministic CLA cores for sub-microsecond control loops.
When designing with this MCU, plan the PCB for a 337-ball NFBGA (16x16 mm, 0.8 mm pitch) - a 4-layer stackup minimum, with all power rails decoupled within 5 mm of each ball group. Use TI's C2000Ware SDK and the Code Composer Studio IDE for development; software compatibility is preserved across F2837xD, F2837xS, and F2807x pin-compatible families.
This page compiles distributor pricing (LCSC $20.79, Heisener $22.86 as of 2026-10-11), verified cross-references (TMS320F28379DZWTT, TMS320F28379DPTPS, F28379S - all TI and drop-in pin-compatible), and practical design notes not always present on datasheet excerpts.
ドロップイン代替品: TMS320F28379DZWTS — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: TMS320F28379DZWTS （同一形状・フットプリント） — 相違点: Package, Mounting Type, Core Architecture, Flash Memory, Functional Safety.
クイック比較ツール — 並列比較する代替部品を選択:
TMS320F28379DZWTT
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TMS320F28379DPTPS
✅ ドロップイン✓ 在庫あり
$11.8 / 個
データシートを見る →TMS320F28379SZWTT
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TMS320F28379DZWTS 最大定格＆電気的特性
| Series | TMS320F2837xD C2000 Delfino |
| Core Architecture | 2x TMS320C28x 32-bit CPU |
| CPU Clock Speed | 200 MHz (800 MIPS total) |
| Coprocessors | 2x Control Law Accelerator (CLA) |
| Math Accelerator | Hardware FPU + TMU (Trigonometric Math Unit) |
| On-chip Flash | 1 MB (512K x 16) |
| On-chip SRAM | 204 KB |
| ADC 12-bit | 3x 12-bit ADC, up to 3.5 MSPS |
| ADC 16-bit | 4x 16-bit ADC channels |
| Comparator Subsystems (CMPSS) | Yes |
| ePWM Modules | 8 |
| eQEP / eCAP / SDFM | 2x eQEP, 3x eCAP, 2x SDFM |
| Configurable Logic Block (CLB) | Yes |
| Communication | USB 2.0 host/device, CAN-FD, SPI, I2C, UART, EMIF |
| Functional Safety | Built-in FuSa diagnostics (ECC, watchdog, lockstep) |
| パッケージ | 337-ball NFBGA (16x16 mm, 0.8 mm pitch) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
TMS320F28379DZWTS 337-ball nfbga (16x16 mm, 0.8 mm pitch) ピン配置ガイド
TMS320F28379DZWTS (337-ball nfbga (16x16 mm, 0.8 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: TMS320F28379DZWTS.
詳細は データシート をご参照ください。
主な用途
TMS320F28379DZWTS の用途: 6 件s: Industrial Multi-Axis Servo Drives, Solar Inverters and Digital Power Conversion, Electric Vehicle Traction Inverters and Onboard Chargers, Renewable Energy Grid-Tie Inverters, Industrial PLC and Factory Automation, Digital Power and Server VRM Converters.
Industrial Multi-Axis Servo Drives
The TMS320F28379DZWTS drives industrial multi-axis servo controllers and AC drives, where its dual 200 MHz C28x cores and dual Control Law Accelerators (CLAs) deliver 800 MIPS aggregate throughput for FOC, field-weakening, and current-loop control of 3-6 axis systems. With 8 hardware ePWM modules at 150 ps resolution, the device generates the multi-phase switching waveforms required for servo amplifier bridges. Its 3x 12-bit ADCs sample phase currents at 3.5 MSPS simultaneously for sub-microsecond current-loop latency, and the on-chip CMPSS comparators trigger protection sub-cycles within 50 ns. Integrated CMPSS eliminates external protection ICs in industrial servo designs.
おすすめ
Solar Inverters and Digital Power Conversion
The TMS320F28379DZWTS implements MPPT, grid-tie synchronization, and THD compensation in photovoltaic inverters at switching frequencies up to 200 kHz. Its hardware FPU accelerates the Park/Clark transforms and SVPWM math at line-rate, while the dual CLAs offload the per-cycle closed-loop tasks (peak current mode control, ABM-leg balancing, sync-skipping) from the main CPU. SDFM channels directly interface with sigma-delta modulators from isolated current sensors, eliminating analog signal chains. The integrated EMIF allows external FIFO memory for grid-tie waveform buffering. TI's C2000Ware digital-power library provides reference firmware that achieves >99% MPPT efficiency and <3% THD at full load.
おすすめ
Electric Vehicle Traction Inverters and Onboard Chargers
The TMS320F28379DZWTS targets EV traction inverters and OBCs requiring tight torque, speed, and regenerative-braking control. Its dual-core C28x architecture delivers 800 MIPS for SVPWM with simultaneous battery-state estimation (SOC, SOH). Built-in Functional Safety diagnostics - ECC on Flash/RAM, lockstep cores, dual watchdog timers - meet ASIL-B/C requirements per ISO 26262, shortening automotive qualification cycles. The 8 ePWM modules drive three-phase IGBT bridges with programmable dead-band to prevent shoot-through, while the SDFM channels accept signals from isolated current sensors in the inverter. CAN-FD enables high-speed battery-management communication.
おすすめ
Renewable Energy Grid-Tie Inverters
The TMS320F28379DZWTS controls grid-tie solar and wind inverters with deterministic anti-islanding and grid-synchronization support. Hardware eCAP peripherals capture zero-cross of the grid voltage to within 0.1 microsecond for PLL phase tracking, while CMPSS comparators implement fast over-current and over-voltage protection. Dual CLA cores run the inner current loop at 16 kHz while the C28x cores execute outer MPPT and grid-feeding algorithms. The 1 MB Flash supports firmware-encrypted boot for grid-compliance certification, and the device's error-correction ensures long-term operation in unattended inverter installations.
おすすめ
Industrial PLC and Factory Automation
The TMS320F28379DZWTS powers high-end industrial PLC and motion controllers with deterministic multi-axis synchronization. Its hardware FPU delivers floating-point math for position-loop and PID tuning that legacy fixed-point MCUs cannot match in timing. The device's C2000Ware SDK includes EtherCAT, Profinet, and SERCOS protocol examples using the on-chip EMIF and external communication co-processors. 337-NFBGA package supports industrial -40C to +125C operating ranges and IEC 60068-2 compliant vibration/shock profiles, easing industrial-grade qualification. On-chip CMPSS and eQEP enable sensorless and encoder-based feedback.
おすすめ
Digital Power and Server VRM Converters
The TMS320F28379DZWTS controls multiphase buck VRMs in datacenter and telecom power systems. Hardware-accelerated peak current-mode control achieves 500 kHz switching with sub-microsecond transient response, while 8 ePWM channels drive multiphase PWMs with per-phase current balancing. The 3x 12-bit ADCs and 4x 16-bit ADCs simultaneously sample phase currents and output voltage, enabling adaptive voltage positioning for optimum transient performance. Integrated CMPSS comparators support cycle-by-cycle current-limit protection. TI's powerSUITE library provides firmware reference for industry-standard PMBus-compatible VRM controllers.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: TMS320F28379DZWTS — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | TMS320F28379DZWTT | TMS320F28379DPTPS | TMS320F28379SZWTT |
|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 337-NFBGA (16x16 mm, 0.8 mm pitch) ZWT | 337-NFBGA (16x16 mm) ZWT - same | 176-pin QFP PTP - cross-family | 337-NFBGA (16x16 mm) ZWT - same |
| CPU Cores | 2x C28x | 2x C28x | 2x C28x | 1x C28x |
| Max MIPS (Aggregate) | 800 MIPS | 800 MIPS | 800 MIPS | 400 MIPS |
| CLA Coprocessors | 2x CLA | 2x CLA | 2x CLA | 1x CLA |
| On-chip Flash | 1 MB | 1 MB | 1 MB | 1 MB |
| On-chip SRAM | 204 KB | 204 KB | 204 KB | 164 KB |
| FPU + TMU | Yes | Yes | Yes | Yes |
| USB 2.0 | Host + Device | Host + Device | Host + Device | Host + Device |
| Functional Safety | Yes (FuSa, ECC, lockstep) | Yes | Yes | Yes |
主な差別化要因
- Dual CLA coprocessors for parallel real-time control （vs TMS320F28379SZWTT (single CLA))
- Maximum 800 MIPS aggregate throughput in pin-compatible 337-NFBGA （vs TMS320F28377SZWTT (also single-core 400 MIPS))
- Hardware FPU + TMU accelerate Park/Clark transforms （vs TMS320F28335 (fixed-point only, 150 MIPS))
設計ノート
The 337-ball NFBGA at 0.8 mm pitch requires a 4-layer minimum PCB stackup with laser-drilled microvia or via-in-pad capability for the inner-row balls. Per TI's ZWT package design guide, place 0402-sized decoupling capacitors (typically 100 nF + 4.7 uF pairs) within 5 mm of each power ball, and connect ground balls directly to a continuous inner ground plane using 2 vias per ball. Route all high-speed ePWM and ADC traces on the top layer with length matching within 10 mils between pairs. Use a 1 oz copper pour on outer layers for thermal dissipation, with thermal vias (8-12 mil drill, 1 mm spacing) under the central ball array to reduce theta-JA.
Estimated thermal analysis at full 1A total CPU + peripheral current draw: Pdiss = VD_CORE x I_CORE + VI/O x I_IO. The F28379D's internal core voltage (typically 1.2V) versus I/O rail (3.3V) drives most thermal dissipation. For the 337-NFBGA ZWT, TI specifies theta-JA of approximately 30 C/W on a JEDEC 2s2p test board. Estimated: at 1.5W typical application power, junction rises about 45 C above ambient - well within the -40C to +125C operating window for industrial designs. For sustained 2W+ operation, attach the central ball thermal pad to a copper thermal pour with thermal vias, or place the device on top side of board (vs bottom) to enable heatsink assembly.
Common F2837xD bring-up pitfalls: (1) TI's lockstep configuration requires the chip's BIST and CLB hardware fault injection to complete before the watchdog timer expires - leave at least 100 ms after reset for BIST completion; (2) Enabling Flash ECC before Flash is fully initialized can cause spurious single-bit errors - sequence Flash init before ECC enable; (3) The CLA requires its own unique bootloader image at address 0x10_0080 - missing this causes CLA not to start; (4) GPIO mux configuration must complete before peripheral functions are enabled, else peripherals see input from default mode; (5) Watchdog window register default is very tight - reset the window before expecting any interrupt. Reference the TI TMS320F2837xD silicon errata (document advisories) before finalizing firmware.
コンプライアンス情報
RoHS and REACH compliant per TI product page lead-free (Pb-free) reflow-compatible. Not AEC-Q100 qualified as the F28379DZWTS is intended for industrial applications - TI offers automotive variants (e.g., F28379D-Q1) for that segment. Confirm halogen-free status with TI REACH declaration.
