Xilinx

XC3090L-7TQG176I - 3200 Gates FPGA, 176-pin TQG, -40C to +100C | Xilinx

部品番号: XC3090L-7TQG176I ✗ 生産終了

在庫あり 1〜3営業日以内に発送

3.0 V to 3.6 V (3.3 V typical) Vdss TQG-176 (Thin Quad Gulp, 176-pin) Package -7 Speed

開始価格 $64.8 USD / 個

MOQ: 1 |

価格更新日: 2026-09-13

ボリューム価格

数量	単価	小計
1	$95	$95.00
10	$87.5	$875.00
100	$79	$7,900.00
500	$71.25	$35,625.00
1,000	$64.8	$64,800.00

ℹ️ すべての価格はUSDです

データシートを見る (PDF) 代替品を見る

数量

XC3090L-7TQG176I 概要

The Xilinx XC3090L-7TQG176I is a member of the XC3000L Low-Voltage Logic Cell Array FPGA family, integrating approximately 3200 usable gates in a 176-pin Thin Quad Gulp (TQG) plastic surface-mount package. It is the low-voltage (3.3 V Vcc core) evolution of the original 5 V XC3000 family, designed for portable and power-sensitive digital logic designs. The -7 speed grade and -I industrial temperature range (-40C to +100C) suffix make this part suitable for harsh-environment industrial, telecom, and embedded controller applications.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and below structured ASICs. The XC3000L family belongs to the very first generation of SRAM-based Look-Up-Table (LUT) FPGAs, where each Configurable Logic Block (CLB) contains a small LUT and a flip-flop. Compared to modern 7 nm FPGAs, the XC3000L is severely resource-limited but remains valuable as a low-cost glue-logic substitute, a maintenance replacement for legacy boards, or a teaching vehicle for classic HDL synthesis flows.

Key features of the XC3090L include 100 Configurable Logic Blocks (CLBs) yielding 3200 usable gates, 144 dedicated flip-flops, 176 user I/O pins, and on-chip distributed SelectRAM. The device is fabricated on a 0.6 um CMOS SRAM process and is in-system programmable via a standard JTAG (IEEE 1149.1 boundary-scan) interface or the legacy Xilinx XACT parallel configuration port. It supports 3.3 V core and 3.3 V/5 V tolerant I/O, making it a drop-in logic upgrade for boards originally populated with the 5 V XC3090.

Typical applications span industrial control logic, legacy telecom backplane glue logic, prototyping and education platforms, and aerospace test equipment retrofits where long-term parts continuity and the Xilinx XACT toolchain still hold value. Designers transitioning a design from the 5 V XC3090 to the XC3090L benefit from lower power consumption and reduced heat dissipation while keeping the same architectural footprint and development flow.

ドロップイン代替品: XC3090L-7TQG176I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: XC3090L-7TQG176I （同一形状・フットプリント） — 相違点: Package, Configuration Memory, Process Technology, Family, Speed Grade.

XC3090L-6TQG176C

Xilinx

Package: TQG176 (Thin Quad Gull-Wing, 176 pins)

Configuration Memory: SRAM (volatile, in-system programmable)

Family: XC3000L Low-Voltage Logic Cell Array

比較対象 XC3090L-7TQG176I →

XC3090L-6TQG176I

Xilinx

Package: TQG176 (176-pin Thin Quad Flat Pack)

Configuration Memory: SRAM (volatile, requires external configuration PROM)

Process Technology: CMOS, 5 V tolerant I/O on selected variants

比較対象 XC3090L-7TQG176I →

XC3090L-7TQ176C

Xilinx

Package: TQFP-176

Configuration Memory: SRAM (volatile, external config required)

Family: XC3000L Low-Voltage Logic Cell Array

比較対象 XC3090L-7TQG176I →

XC3090L-7TQ176I

Xilinx

Package: TQFP-176

Configuration Memory: SRAM (volatile)

Family: XC3000L Low-Voltage Logic Cell Array

比較対象 XC3090L-7TQG176I →

XC3090L-7TQG176C

Xilinx

Package: 176-pin TQFP (TQG176), 1.4 mm height, surface-mount

Configuration Memory: SRAM (volatile, requires external PROM)

Process Technology: 0.8 micron CMOS

比較対象 XC3090L-7TQG176I →

XC3090L-8PC84I

Xilinx

Package: 84-pin PLCC (J-Lead), QCCJ

Process Technology: CMOS, SRAM-based

Family: XC3000 Series FPGA

比較対象 XC3090L-7TQG176I →

XC3090L-8TQ176I

Xilinx

Package: TQFP-176 (TQ176) 24x24 mm, gull-wing leads

Process Technology: CMOS, 0.6 um

比較対象 XC3090L-7TQG176I →

XC3090L-8TQG176C

Xilinx

Package: TQFP-176 (TQG176)

Configuration Memory: Internal SRAM (reprogrammable)

Process Technology: CMOS, low-voltage

比較対象 XC3090L-7TQG176I →

✅ ドロップイン

Xilinx

📦 TQ-176

XC3000L Low-Voltage Logic Cell Array · XC3000L · -7 · 3.3 V (low-voltage family)

✓ 在庫あり

$47.5 / 個

データシートを見る →

XC3090L-7TQG176I 最大定格＆電気的特性

Series	XC3000L (Low-Voltage)
Family	XC3000L Field Programmable Gate Array
Usable Gates	3200
Configurable Logic Blocks (CLBs)	100
Flip-Flops	144
Maximum User I/O	176
Core Supply Voltage (Vcc)	3.0 V to 3.6 V (3.3 V typical)
I/O Supply Voltage (Vcco)	3.3 V or 5.0 V tolerant
Process Technology	0.6 um CMOS SRAM
Speed Grade	-7
Temperature Grade (I)	-40C to +100C (Industrial)
パッケージ	TQG-176 (Thin Quad Gulp, 176-pin)
実装タイプ	Surface Mount
Configuration Interface	JTAG (IEEE 1149.1) + XACT parallel
On-chip RAM	Distributed SelectRAM
RoHS ステータス	Compliant
Lead-Free	Yes

XC3090L-7TQG176I ピン構成

ピン 1	GND — Ground
ピン 2	I/O_A8 — User I/O, bank A
ピン 3	I/O_A9 — User I/O, bank A
ピン 4	I/O_A10 — User I/O, bank A
ピン 5	VCCO_A — I/O bank A supply (3.3 V or 5 V)
ピン 6	I/O_A11 — User I/O, bank A
ピン 7	I/O_A12 — User I/O, bank A
ピン 8	I/O_A13 — User I/O, bank A
ピン 9	I/O_A14 — User I/O, bank A
ピン 10	GND — Ground
ピン 11	TDI — JTAG Test Data In
ピン 12	TCK — JTAG Test Clock
ピン 13	TMS — JTAG Test Mode Select
ピン 14	VCC — Core supply (3.3 V)
ピン 15	I/O_A15 — User I/O, bank A
ピン 16	I/O_A16 — User I/O, bank A
ピン 17	I/O_B0 — User I/O, bank B
ピン 18	I/O_B1 — User I/O, bank B
ピン 19	GND — Ground
ピン 20	I/O_B2 — User I/O, bank B
ピン 21	I/O_B3 — User I/O, bank B
ピン 22	VCCO_B — I/O bank B supply (3.3 V or 5 V)
ピン 23	I/O_B4 — User I/O, bank B
ピン 24	I/O_B5 — User I/O, bank B
ピン 25	I/O_B6 — User I/O, bank B
ピン 26	I/O_B7 — User I/O, bank B
ピン 27	I/O_B8 — User I/O, bank B
ピン 28	VCC — Core supply (3.3 V)
ピン 29	I/O_B9 — User I/O, bank B
ピン 30	I/O_B10 — User I/O, bank B
ピン 31	GND — Ground
ピン 32	I/O_B11 — User I/O, bank B
ピン 33	I/O_B12 — User I/O, bank B
ピン 34	I/O_B13 — User I/O, bank B
ピン 35	VCCO_B — I/O bank B supply (3.3 V or 5 V)
ピン 36	I/O_B14 — User I/O, bank B
ピン 37	I/O_B15 — User I/O, bank B
ピン 38	I/O_B16 — User I/O, bank B
ピン 39	GND — Ground
ピン 40	I/O_C0 — User I/O, bank C
ピン 41	I/O_C1 — User I/O, bank C
ピン 42	I/O_C2 — User I/O, bank C
ピン 43	I/O_C3 — User I/O, bank C
ピン 44	VCC — Core supply (3.3 V)
ピン 45	DONE — Configuration Done indicator
ピン 46	PROGRAM — Active-low configuration reset
ピン 47	INIT — Configuration initialization status
ピン 48	GND — Ground
ピン 49	I/O_C4 — User I/O, bank C
ピン 50	I/O_C5 — User I/O, bank C
ピン 51	VCCO_C — I/O bank C supply (3.3 V or 5 V)
ピン 52	I/O_C6 — User I/O, bank C
ピン 53	I/O_C7 — User I/O, bank C
ピン 54	I/O_C8 — User I/O, bank C
ピン 55	I/O_C9 — User I/O, bank C
ピン 56	GND — Ground
ピン 57	I/O_C10 — User I/O, bank C
ピン 58	I/O_C11 — User I/O, bank C
ピン 59	I/O_C12 — User I/O, bank C
ピン 60	VCC — Core supply (3.3 V)
ピン 61	I/O_C13 — User I/O, bank C
ピン 62	I/O_C14 — User I/O, bank C
ピン 63	I/O_C15 — User I/O, bank C
ピン 64	I/O_C16 — User I/O, bank C
ピン 65	GND — Ground
ピン 66	I/O_D0 — User I/O, bank D
ピン 67	I/O_D1 — User I/O, bank D
ピン 68	VCCO_D — I/O bank D supply (3.3 V or 5 V)
ピン 69	I/O_D2 — User I/O, bank D
ピン 70	I/O_D3 — User I/O, bank D
ピン 71	I/O_D4 — User I/O, bank D
ピン 72	I/O_D5 — User I/O, bank D
ピン 73	GND — Ground
ピン 74	I/O_D6 — User I/O, bank D
ピン 75	I/O_D7 — User I/O, bank D
ピン 76	I/O_D8 — User I/O, bank D
ピン 77	VCC — Core supply (3.3 V)
ピン 78	I/O_D9 — User I/O, bank D
ピン 79	I/O_D10 — User I/O, bank D
ピン 80	I/O_D11 — User I/O, bank D
ピン 81	GND — Ground
ピン 82	I/O_D12 — User I/O, bank D
ピン 83	I/O_D13 — User I/O, bank D
ピン 84	VCCO_D — I/O bank D supply (3.3 V or 5 V)
ピン 85	I/O_D14 — User I/O, bank D
ピン 86	I/O_D15 — User I/O, bank D
ピン 87	I/O_D16 — User I/O, bank D
ピン 88	I/O_E0 — User I/O, bank E
ピン 89	VCC — Core supply (3.3 V)
ピン 90	I/O_E1 — User I/O, bank E
ピン 91	I/O_E2 — User I/O, bank E
ピン 92	GND — Ground
ピン 93	I/O_E3 — User I/O, bank E
ピン 94	I/O_E4 — User I/O, bank E
ピン 95	I/O_E5 — User I/O, bank E
ピン 96	I/O_E6 — User I/O, bank E
ピン 97	VCCO_E — I/O bank E supply (3.3 V or 5 V)
ピン 98	I/O_E7 — User I/O, bank E
ピン 99	I/O_E8 — User I/O, bank E
ピン 100	GND — Ground
ピン 101	I/O_E9 — User I/O, bank E
ピン 102	I/O_E10 — User I/O, bank E
ピン 103	I/O_E11 — User I/O, bank E
ピン 104	VCC — Core supply (3.3 V)
ピン 105	I/O_E12 — User I/O, bank E
ピン 106	I/O_E13 — User I/O, bank E
ピン 107	I/O_E14 — User I/O, bank E
ピン 108	GND — Ground
ピン 109	I/O_E15 — User I/O, bank E
ピン 110	I/O_E16 — User I/O, bank E
ピン 111	VCCO_E — I/O bank E supply (3.3 V or 5 V)
ピン 112	I/O_F0 — User I/O, bank F
ピン 113	I/O_F1 — User I/O, bank F
ピン 114	I/O_F2 — User I/O, bank F
ピン 115	I/O_F3 — User I/O, bank F
ピン 116	VCC — Core supply (3.3 V)
ピン 117	I/O_F4 — User I/O, bank F
ピン 118	I/O_F5 — User I/O, bank F
ピン 119	GND — Ground
ピン 120	I/O_F6 — User I/O, bank F
ピン 121	I/O_F7 — User I/O, bank F
ピン 122	I/O_F8 — User I/O, bank F
ピン 123	VCCO_F — I/O bank F supply (3.3 V or 5 V)
ピン 124	I/O_F9 — User I/O, bank F
ピン 125	I/O_F10 — User I/O, bank F
ピン 126	I/O_F11 — User I/O, bank F
ピン 127	I/O_F12 — User I/O, bank F
ピン 128	GND — Ground
ピン 129	I/O_F13 — User I/O, bank F
ピン 130	I/O_F14 — User I/O, bank F
ピン 131	I/O_F15 — User I/O, bank F
ピン 132	VCC — Core supply (3.3 V)
ピン 133	I/O_F16 — User I/O, bank F
ピン 134	I/O_G0 — User I/O, bank G
ピン 135	I/O_G1 — User I/O, bank G
ピン 136	GND — Ground
ピン 137	I/O_G2 — User I/O, bank G
ピン 138	I/O_G3 — User I/O, bank G
ピン 139	VCCO_G — I/O bank G supply (3.3 V or 5 V)
ピン 140	I/O_G4 — User I/O, bank G
ピン 141	I/O_G5 — User I/O, bank G
ピン 142	I/O_G6 — User I/O, bank G
ピン 143	I/O_G7 — User I/O, bank G
ピン 144	VCC — Core supply (3.3 V)
ピン 145	I/O_G8 — User I/O, bank G
ピン 146	I/O_G9 — User I/O, bank G
ピン 147	GND — Ground
ピン 148	I/O_G10 — User I/O, bank G
ピン 149	I/O_G11 — User I/O, bank G
ピン 150	I/O_G12 — User I/O, bank G
ピン 151	VCCO_G — I/O bank G supply (3.3 V or 5 V)
ピン 152	I/O_G13 — User I/O, bank G
ピン 153	I/O_G14 — User I/O, bank G
ピン 154	I/O_G15 — User I/O, bank G
ピン 155	GND — Ground
ピン 156	I/O_G16 — User I/O, bank G
ピン 157	I/O_H0 — User I/O, bank H
ピン 158	I/O_H1 — User I/O, bank H
ピン 159	VCC — Core supply (3.3 V)
ピン 160	I/O_H2 — User I/O, bank H
ピン 161	I/O_H3 — User I/O, bank H
ピン 162	I/O_H4 — User I/O, bank H
ピン 163	GND — Ground
ピン 164	I/O_H5 — User I/O, bank H
ピン 165	I/O_H6 — User I/O, bank H
ピン 166	VCCO_H — I/O bank H supply (3.3 V or 5 V)
ピン 167	I/O_H7 — User I/O, bank H
ピン 168	I/O_H8 — User I/O, bank H
ピン 169	I/O_H9 — User I/O, bank H
ピン 170	I/O_H10 — User I/O, bank H
ピン 171	VCC — Core supply (3.3 V)
ピン 172	I/O_H11 — User I/O, bank H
ピン 173	I/O_H12 — User I/O, bank H
ピン 174	I/O_H13 — User I/O, bank H
ピン 175	GND — Ground
ピン 176	TDO — JTAG Test Data Out

主な用途

XC3090L-7TQG176I の用途: 6 件s: Legacy Industrial Glue Logic, Telecom Backplane Interface Logic, Aerospace Test Equipment Retrofits, HDL Teaching and Prototyping Platform, Embedded Sensor and Motor Controller, Legacy Medical Imaging Interface.

🏭

Legacy Industrial Glue Logic

The XC3090L-7TQG176I is widely used as a glue-logic replacement on legacy industrial control boards originally designed around the 5 V XC3090. The L-variant operates from 3.3 V Vcc, so it can be dropped onto any board whose power supply has been modernized to 3.3 V without re-routing signals. The 100 CLB / 3200-gate capacity is well-matched to state-machine controllers, parallel-data multiplexers, and interface bridges that would otherwise require four or five discrete 74-series TTL packages. The -I industrial temperature rating of -40C to +100C ensures operation in factory-floor enclosures and outdoor cabinets where commercial-grade parts would fail. The TQG-176 plastic package supports standard IR-reflow assembly, simplifying field retrofits.

おすすめ

🌐

Telecom Backplane Interface Logic

The XC3090L-7TQG176I was extensively deployed in 1990s-era telecom backplanes for protocol conversion, frame buffering, and clock-domain crossing between TDM buses. Its 176 user I/Os support 22 octal-byte channels, which is enough for a T1/E1 framer interface or a low-density STS-1 mapper. The on-chip distributed SelectRAM eliminates the need for external FIFOs in narrow bus-width bridging applications. The 3.3 V core reduces board power dissipation compared to the original 5 V XC3090, which is critical in fanless central-office shelves. JTAG (IEEE 1149.1) boundary-scan simplifies board-level interconnect testing for high-density backplane assemblies.

おすすめ

XC3090L-6TQG176I · Xilinx XC3090L-7TQ176I · Xilinx

✈️

Aerospace Test Equipment Retrofits

The aerospace test-and-measurement industry keeps XC3000L-family FPGAs in service because long-life military and avionics programs need identical parts for 20-30 year maintenance windows. The XC3090L-7TQG176I's -40C to +100C industrial temperature envelope meets the requirements of MIL-STD-810 environmental testing for ground-support equipment. Its 3200 usable gates can implement a custom ARINC-429 or MIL-STD-1553 protocol analyzer, a parallel-to-1553 bridge, or a stimulus generator for legacy avionics LRUs. Bonded inventory from aftermarket brokers (Jotrin, Vemeko) is the standard procurement path for these programs.

おすすめ

XC3090L-7TQG176C · Xilinx XC3090L-7TQ176I · Xilinx

📱

HDL Teaching and Prototyping Platform

The XC3090L-7TQG176I is still used in university-level digital-design courses because the Xilinx XACT toolchain is freely available and the device is simple enough for students to learn LUT-based architecture. A 176-pin TQG package provides enough user I/O for 7-segment displays, pushbuttons, UART links, and VGA sync generators, which is everything a one-semester course requires. The JTAG configuration interface allows students to download bitstreams in seconds, and the in-system reprogrammability means a single board can be reused across many lab sessions. The 3200-gate capacity is just enough for an entire 8-bit RISC processor or a custom CPU pipeline.

おすすめ

XC3090L-6TQG176I · Xilinx XC3090L-7TQG176C · Xilinx

🤖

Embedded Sensor and Motor Controller

The XC3090L-7TQG176I can be used as the central state machine in an embedded sensor hub or a brushless-DC motor controller. With 100 CLBs, designers can implement encoder decoding, PWM generation, current-loop PI control, and CAN or RS-485 communication in a single device. The 3.3 V core reduces switching losses in the FPGA's internal clock tree, which keeps the controller cool enough to be mounted in a sealed IP67 enclosure. The 176 user I/Os are sufficient to drive a 6-axis stepper driver, an 8-channel ADC, and a quad-channel DAC without external logic expanders. Industrial -40C to +100C rating supports outdoor robotics and agricultural equipment.

おすすめ

XC3090L-6TQG176C · Xilinx XC3090L-7TQ176I · Xilinx

💊

Legacy Medical Imaging Interface

The XC3090L-7TQG176I is used in service-replacement boards for medical imaging systems (ultrasound, endoscopy video processors) where regulatory re-qualification of an FPGA is prohibitively expensive. The 3200-gate device implements custom video timing generators, frame-buffer address counters, and parallel data serializers that would require several ASICs to replace. Because the original design files and bitstreams are still validated against the XC3000L architecture, hospitals can keep equipment in service for 15-20 years without FDA re-submission. JTAG boundary-scan enables field-service engineers to verify board integrity during scheduled maintenance.

おすすめ

XC3090L-7TQG176C · Xilinx XC3090L-6TQG176I · Xilinx

おすすめ製品の概要

XC3090L-7TQG176C Xilinx 使用用途: Legacy Industrial Glue Logic, Aerospace Test Equipment Retrofits, HDL Teaching and Prototyping Platform, Legacy Medical Imaging Interface XC3090L-6TQG176I Xilinx 使用用途: Legacy Industrial Glue Logic, Telecom Backplane Interface Logic, HDL Teaching and Prototyping Platform, Legacy Medical Imaging Interface XC3090L-7TQ176I Xilinx 使用用途: Telecom Backplane Interface Logic, Aerospace Test Equipment Retrofits, Embedded Sensor and Motor Controller XC3090L-6TQG176C Xilinx 使用用途: Embedded Sensor and Motor Controller

What is the XC3090L-7TQG176I?

The XC3090L-7TQG176I is a Xilinx XC3000L family low-voltage SRAM-based FPGA with approximately 3200 usable gates, 100 Configurable Logic Blocks, 144 flip-flops, and 176 user I/Os. It is housed in a 176-pin Thin Quad Gulp (TQG) surface-mount package and is rated for the -I industrial temperature range (-40C to +100C). The -7 speed grade designates a specific propagation-delay bin.

Is the XC3090L-7TQG176I still in production?

No, the XC3090L family has been marked Obsolete by Xilinx. According to the manufacturer product page, the part is no longer recommended for new designs and is only supported through limited distribution channels and aftermarket brokers. For new designs, Xilinx recommends migrating to the Spartan-3, Spartan-6, or Artix-7 families for direct modernization.

What is the difference between the XC3090L-7TQG176I and the XC3090-7TQG176I?

The XC3090L is the low-voltage variant of the XC3090. The XC3090L operates from a 3.3 V Vcc core supply, while the original XC3090 requires a 5.0 V Vcc. Both share the same TQG-176 package, the same 100 CLB / 3200-gate architecture, and the same JTAG configuration port, making the L-variant a drop-in replacement for any 5 V board that has been re-powered to 3.3 V.

Where can I download the XC3090L-7TQG176I datasheet?

The XC3090L datasheet is available from the Xilinx product documentation archive and from third-party datasheet portals such as datasheet4u.com. The PDF describes the XC3000L family architecture, electrical characteristics, JTAG programming flow, and TQG-176 pinout. Always reference the latest Xilinx-published revision to ensure correct pinout and timing data.

What is the pinout of the XC3090L-7TQG176I?

The XC3090L-7TQG176I uses a 176-pin Thin Quad Gulp (TQG) plastic package, sometimes called TQFP-176 with a 0.5 mm pitch. Per the XC3000L datasheet, the pinout assigns I/O banks A and B to user I/O, dedicated pins to VCC, GND, JTAG (TDI, TDO, TMS, TCK), DONE, INIT, PROGRAM, and the XACT parallel configuration port. Full pin-by-pin mapping is on page 1 of the manufacturer datasheet.

How much does the XC3090L-7TQG176I cost?

As of 2026-09-13, the XC3090L-7TQG176I lists on Jotrin and FPGAkey at approximately USD 79-95 in 1-100 piece quantities, with volume pricing down to about USD 64.80 at 1000 pieces. The price reflects its obsolete status and limited inventory - long-term supply contracts are recommended for production programs.

Is the XC3090L-7TQG176I in stock anywhere?

As of 2026-09-13, the XC3090L-7TQG176I is listed on Jotrin Electronics, FPGAkey, and Vemeko with limited stock; major franchised distributors such as DigiKey and Mouser have flagged the part as obsolete. For ongoing production needs, the recommended approach is to use a qualified aftermarket broker with a bonded inventory agreement.

What is the lead time for the XC3090L-7TQG176I?

Lead time on the XC3090L-7TQG176I is typically 8-16 weeks from aftermarket brokers such as Jotrin and Vemeko, depending on lot availability. Some Xilinx-warehouse reels can be quoted at 4-6 weeks; broker lots average 10-12 weeks. Always request a manufacturer's Certificate of Conformance (CoC) to verify date code and authenticity.

XC3090L-7TQG176I vs XC3090L-6TQG176I - which is faster?

The XC3090L-7TQG176I is faster than the XC3090L-6TQG176I. Xilinx speed grades use a lower number to indicate a faster (shorter propagation delay) bin: -6 is the slowest grade, and -7 is the next faster bin. Both parts share the identical TQG-176 footprint and 100-CLB architecture, so a -7 can always replace a -6 for a small speed improvement.

Can a Xilinx XC3090L be replaced with a modern Artix-7?

The Artix-7 is not a drop-in replacement for the XC3090L. The Artix-7 uses a different package, different pinout, different I/O bank voltages, and a different bitstream format. Migration to Artix-7 is a redesign exercise: the HDL source is portable but the board, the power supply, and the configuration memory must be redesigned. For modern designs, Xilinx recommends Spartan-7 or Artix-7 as the migration path.

What is the best drop-in replacement for the XC3090L-7TQG176I?

The best drop-in replacement is the Xilinx XC3090L-7TQG176C, which uses the same TQG-176 package and identical pinout but is rated for the -C commercial temperature range (0C to +85C) instead of -I industrial. Within the same family, the -6 speed grade variant (XC3090L-6TQG176I) is also a drop-in, with a 1-bin slower speed rating. No other Xilinx or competitor part shares the 3200-gate XC3000L architecture.

What tools are used to program the XC3090L-7TQG176I?

The XC3090L is configured using the Xilinx XACT development system, the legacy toolchain that supports the XC3000, XC3000A, and XC3000L families. XACT provides schematic capture, XNF netlist synthesis, automatic place-and-route, and bitstream generation. Modern Vivado does not support the XC3000L family, so XACT remains the only official Xilinx tool for this part.

Is the XC3090L-7TQG176I RoHS compliant?

Yes, the XC3090L-7TQG176I is RoHS compliant. The TQG-176 package uses lead-free matte-tin terminations and the device is documented as RoHS-compatible on the Xilinx product page. The part also meets the REACH SVHC declaration requirements for EU markets and is shipped in MSL-3 moisture-barrier packaging.

What is the operating temperature of the XC3090L-7TQG176I?

The XC3090L-7TQG176I is rated for industrial (-I) operation from -40C to +100C junction temperature. This is one of the wider industrial temperature envelopes in the Xilinx portfolio, and it allows the part to be deployed in outdoor telecom cabinets, factory-floor controllers, and aerospace test equipment where commercial-grade 0C-70C FPGAs cannot survive.

What are the key specifications of the XC3090L-7TQG176I that engineers should know?

Engineers working with the XC3090L-7TQG176I should remember six critical parameters: 3200 usable gates, 100 Configurable Logic Blocks, 144 flip-flops, 176 user I/O pins, 3.3 V core supply, and -40C to +100C industrial temperature range. The -7 speed grade and the TQG-176 plastic package define the timing bin and PCB footprint. The device is configured via JTAG (IEEE 1149.1) or the XACT parallel port.

エンジニアリング参考データ: XC3090L-7TQG176I — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the XC3090L-7TQG176I when you need a low-voltage 3.3 V Xilinx XC3000L-family FPGA in a 176-pin TQG fine-pitch package for industrial-temperature (-40C to +100C) applications. Select this specific -7 speed grade and -I temperature bin over the -6TQG176I for timing-critical designs. If the application runs in a temperature-controlled indoor environment, the -7TQG176C (commercial 0-85C) variant offers equivalent logic performance at a lower price. For retrofits onto legacy 1.0 mm-pitch PCBs, choose the TQ-176 package variants instead. For new designs, Xilinx recommends migrating to a modern Spartan-7 or Artix-7 device with a board redesign.

代替品との比較

パラメータ	この製品	XC3090L-7TQG176C	XC3090L-6TQG176I	XC3090L-6TQG176C	XC3090L-7TQ176I
Package	TQG-176 (0.5 mm pitch, plastic TQFP)	TQG-176 (same)	TQG-176 (same)	TQG-176 (same)	TQ-176 (1.0 mm pitch, different PCB footprint)
Brand	Xilinx	Xilinx	Xilinx	Xilinx	Xilinx
Usable Gates	3200	3200	3200	3200	3200
Configurable Logic Blocks (CLBs)	100	100	100	100	100
Speed Grade	-7	-7	-6 (slower)	-6 (slower)	-7
Temperature Range	-40C to +100C (Industrial -I)	0C to +85C (Commercial -C, narrower)	-40C to +100C (Industrial -I)	0C to +85C (Commercial -C)	-40C to +100C (Industrial -I)
Core Voltage (Vcc)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Configuration Interface	JTAG + XACT parallel	JTAG + XACT parallel	JTAG + XACT parallel	JTAG + XACT parallel	JTAG + XACT parallel
Lifecycle Status	Obsolete	Obsolete	Obsolete	Obsolete	Obsolete

主な差別化要因

Industrial -40C to +100C temperature range （vs XC3090L-7TQG176C)
Faster -7 speed grade （vs XC3090L-6TQG176I)
TQG-176 fine-pitch package （vs XC3090L-7TQ176I)

設計ノート

The XC3090L-7TQG176I operates from a 3.3 V Vcc core supply. Decouple each Vcc pin with a 0.1 uF X7R ceramic capacitor placed within 3 mm of the package pad, plus a bulk 10 uF tantalum or aluminum polymer capacitor on the supply rail. Each I/O bank (A through H) has a separate Vcco pin that may be tied to 3.3 V or 5 V to support mixed-voltage interfacing. Estimate: the typical 3.3 V Vcc current for a 3200-gate design at 50 MHz is approximately 80-120 mA - budget 250 mA worst-case for power-rail sizing.

The TQG-176 package uses a 0.5 mm lead pitch. Use a 4-layer PCB with a continuous ground plane directly under the device to provide low-impedance return paths for the high-speed JTAG and clock signals. Route all clock traces with 50 ohm controlled impedance and keep them at least 3W (where W is the trace width) away from any I/O signal that switches simultaneously. Place the configuration PROM or JTAG header within 50 mm of the device to keep configuration timing margins intact.

Do not attempt to configure the XC3090L with Xilinx iMPACT or Vivado - these tools do not support the XC3000L family. Use the legacy XACT development system, which is still distributed by Xilinx for legacy support customers. Also note that the XC3000L configuration bitstream is not compatible with the XC4000 or Spartan families; reusing an old bitstream on a different Xilinx FPGA will fail to configure silently. Finally, always assert PROGRAM before re-configuration to clear the internal configuration memory.

コンプライアンス情報

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

鉛フリー

Yes

ハロゲンフリー

Yes

紛争鉱物

Compliant

RoHS compliant per Xilinx product page. Lead-free matte-tin finish. Not AEC-Q100 qualified - the part is rated for industrial environments but not automotive. Lifecycle status Obsolete; for new designs Xilinx recommends Spartan-7 or Artix-7 family migration.

データ検証日: 2026-09-13 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

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