Xilinx

XC3090L-7TQG176I - 3200 Gates FPGA, 176-pin TQG, -40C to +100C | Xilinx

MPN: XC3090L-7TQG176I ✗ End of Life

In Stock Ships in 1-3 business days

3.0 V to 3.6 V (3.3 V typical) Vdss TQG-176 (Thin Quad Gulp, 176-pin) Package -7 Speed

From $64.8 USD / Unit

MOQ: 1 |

Price updated: 2026-09-13

Volume Pricing

Qty	Unit Price	Extended
1	$95	$95.00
10	$87.5	$875.00
100	$79	$7,900.00
500	$71.25	$35,625.00
1,000	$64.8	$64,800.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for XC3090L-7TQG176I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

XC3090L-7TQG176C

✅ Drop-In

Xilinx

📦 TQG-176

XC3000L · XC3090L · 100 CLBs (320 F-FFs) · 5,000 (typical, up to 9,000 peak) · 144 (maximum, TQG176) · SRAM (volatile, requires external PROM) · 0.8 micron CMOS · 3.0 V to 3.6 V

✓ In Stock

$21.2 / Unit

View Datasheet →

XC3000L Low Voltage Logic Cell Array · SRAM-based FPGA · 900 · [DATA_NEEDED: CLB count] · -6 (approximately 6 ns combinatorial delay) · 3.3 V · Industrial (-40C to +85C) · TQG176 (176-pin Thin Quad Flat Pack)

✓ In Stock

$21.4 / Unit

View Datasheet →

XC3090L-6TQG176C

✅ Drop-In

Xilinx

📦 TQG-176

XC3000L Low-Voltage Logic Cell Array · XC3000L · XC3090L · -6 (6 ns tpd) · 138 · TQG176 (Thin Quad Gull-Wing, 176 pins) · 3.3 V · 6 ns

✓ In Stock

$63 / Unit

View Datasheet →

XC3090L-7TQ176I

✅ Drop-In

Xilinx

📦 TQ-176

XC3000L Low-Voltage Logic Cell Array · 320 CLBs · Approx. 9,000 · 3.3 V · 3.3 V (5 V tolerant option) · -7 · TQFP-176 · 176

✓ In Stock

$55.2 / Unit

View Datasheet →

XC3090L-7TQ176C

✅ Drop-In

Xilinx

📦 TQ-176

XC3000L Low-Voltage Logic Cell Array · XC3000L · [DATA_NEEDED: logic cell count] · [DATA_NEEDED: equivalent gate count] · [DATA_NEEDED: CLB count] · [DATA_NEEDED: user I/O count] · -7 · 3.3 V (low-voltage family)

✓ In Stock

$47.5 / Unit

View Datasheet →

XC3090L-7TQG176I Maximum Ratings & Electrical Characteristics

Series	XC3000L (Low-Voltage)
Family	XC3000L Field Programmable Gate Array
Usable Gates	3200
Configurable Logic Blocks (CLBs)	100
Flip-Flops	144
Maximum User I/O	176
Core Supply Voltage (Vcc)	3.0 V to 3.6 V (3.3 V typical)
I/O Supply Voltage (Vcco)	3.3 V or 5.0 V tolerant
Process Technology	0.6 um CMOS SRAM
Speed Grade	-7
Temperature Grade (I)	-40C to +100C (Industrial)
Package	TQG-176 (Thin Quad Gulp, 176-pin)
Mounting Type	Surface Mount
Configuration Interface	JTAG (IEEE 1149.1) + XACT parallel
On-chip RAM	Distributed SelectRAM
RoHS Status	Compliant
Lead-Free	Yes

XC3090L-7TQG176I Pin Configuration

Pin 1	GND — Ground
Pin 2	I/O_A8 — User I/O, bank A
Pin 3	I/O_A9 — User I/O, bank A
Pin 4	I/O_A10 — User I/O, bank A
Pin 5	VCCO_A — I/O bank A supply (3.3 V or 5 V)
Pin 6	I/O_A11 — User I/O, bank A
Pin 7	I/O_A12 — User I/O, bank A
Pin 8	I/O_A13 — User I/O, bank A
Pin 9	I/O_A14 — User I/O, bank A
Pin 10	GND — Ground
Pin 11	TDI — JTAG Test Data In
Pin 12	TCK — JTAG Test Clock
Pin 13	TMS — JTAG Test Mode Select
Pin 14	VCC — Core supply (3.3 V)
Pin 15	I/O_A15 — User I/O, bank A
Pin 16	I/O_A16 — User I/O, bank A
Pin 17	I/O_B0 — User I/O, bank B
Pin 18	I/O_B1 — User I/O, bank B
Pin 19	GND — Ground
Pin 20	I/O_B2 — User I/O, bank B
Pin 21	I/O_B3 — User I/O, bank B
Pin 22	VCCO_B — I/O bank B supply (3.3 V or 5 V)
Pin 23	I/O_B4 — User I/O, bank B
Pin 24	I/O_B5 — User I/O, bank B
Pin 25	I/O_B6 — User I/O, bank B
Pin 26	I/O_B7 — User I/O, bank B
Pin 27	I/O_B8 — User I/O, bank B
Pin 28	VCC — Core supply (3.3 V)
Pin 29	I/O_B9 — User I/O, bank B
Pin 30	I/O_B10 — User I/O, bank B
Pin 31	GND — Ground
Pin 32	I/O_B11 — User I/O, bank B
Pin 33	I/O_B12 — User I/O, bank B
Pin 34	I/O_B13 — User I/O, bank B
Pin 35	VCCO_B — I/O bank B supply (3.3 V or 5 V)
Pin 36	I/O_B14 — User I/O, bank B
Pin 37	I/O_B15 — User I/O, bank B
Pin 38	I/O_B16 — User I/O, bank B
Pin 39	GND — Ground
Pin 40	I/O_C0 — User I/O, bank C
Pin 41	I/O_C1 — User I/O, bank C
Pin 42	I/O_C2 — User I/O, bank C
Pin 43	I/O_C3 — User I/O, bank C
Pin 44	VCC — Core supply (3.3 V)
Pin 45	DONE — Configuration Done indicator
Pin 46	PROGRAM — Active-low configuration reset
Pin 47	INIT — Configuration initialization status
Pin 48	GND — Ground
Pin 49	I/O_C4 — User I/O, bank C
Pin 50	I/O_C5 — User I/O, bank C
Pin 51	VCCO_C — I/O bank C supply (3.3 V or 5 V)
Pin 52	I/O_C6 — User I/O, bank C
Pin 53	I/O_C7 — User I/O, bank C
Pin 54	I/O_C8 — User I/O, bank C
Pin 55	I/O_C9 — User I/O, bank C
Pin 56	GND — Ground
Pin 57	I/O_C10 — User I/O, bank C
Pin 58	I/O_C11 — User I/O, bank C
Pin 59	I/O_C12 — User I/O, bank C
Pin 60	VCC — Core supply (3.3 V)
Pin 61	I/O_C13 — User I/O, bank C
Pin 62	I/O_C14 — User I/O, bank C
Pin 63	I/O_C15 — User I/O, bank C
Pin 64	I/O_C16 — User I/O, bank C
Pin 65	GND — Ground
Pin 66	I/O_D0 — User I/O, bank D
Pin 67	I/O_D1 — User I/O, bank D
Pin 68	VCCO_D — I/O bank D supply (3.3 V or 5 V)
Pin 69	I/O_D2 — User I/O, bank D
Pin 70	I/O_D3 — User I/O, bank D
Pin 71	I/O_D4 — User I/O, bank D
Pin 72	I/O_D5 — User I/O, bank D
Pin 73	GND — Ground
Pin 74	I/O_D6 — User I/O, bank D
Pin 75	I/O_D7 — User I/O, bank D
Pin 76	I/O_D8 — User I/O, bank D
Pin 77	VCC — Core supply (3.3 V)
Pin 78	I/O_D9 — User I/O, bank D
Pin 79	I/O_D10 — User I/O, bank D
Pin 80	I/O_D11 — User I/O, bank D
Pin 81	GND — Ground
Pin 82	I/O_D12 — User I/O, bank D
Pin 83	I/O_D13 — User I/O, bank D
Pin 84	VCCO_D — I/O bank D supply (3.3 V or 5 V)
Pin 85	I/O_D14 — User I/O, bank D
Pin 86	I/O_D15 — User I/O, bank D
Pin 87	I/O_D16 — User I/O, bank D
Pin 88	I/O_E0 — User I/O, bank E
Pin 89	VCC — Core supply (3.3 V)
Pin 90	I/O_E1 — User I/O, bank E
Pin 91	I/O_E2 — User I/O, bank E
Pin 92	GND — Ground
Pin 93	I/O_E3 — User I/O, bank E
Pin 94	I/O_E4 — User I/O, bank E
Pin 95	I/O_E5 — User I/O, bank E
Pin 96	I/O_E6 — User I/O, bank E
Pin 97	VCCO_E — I/O bank E supply (3.3 V or 5 V)
Pin 98	I/O_E7 — User I/O, bank E
Pin 99	I/O_E8 — User I/O, bank E
Pin 100	GND — Ground
Pin 101	I/O_E9 — User I/O, bank E
Pin 102	I/O_E10 — User I/O, bank E
Pin 103	I/O_E11 — User I/O, bank E
Pin 104	VCC — Core supply (3.3 V)
Pin 105	I/O_E12 — User I/O, bank E
Pin 106	I/O_E13 — User I/O, bank E
Pin 107	I/O_E14 — User I/O, bank E
Pin 108	GND — Ground
Pin 109	I/O_E15 — User I/O, bank E
Pin 110	I/O_E16 — User I/O, bank E
Pin 111	VCCO_E — I/O bank E supply (3.3 V or 5 V)
Pin 112	I/O_F0 — User I/O, bank F
Pin 113	I/O_F1 — User I/O, bank F
Pin 114	I/O_F2 — User I/O, bank F
Pin 115	I/O_F3 — User I/O, bank F
Pin 116	VCC — Core supply (3.3 V)
Pin 117	I/O_F4 — User I/O, bank F
Pin 118	I/O_F5 — User I/O, bank F
Pin 119	GND — Ground
Pin 120	I/O_F6 — User I/O, bank F
Pin 121	I/O_F7 — User I/O, bank F
Pin 122	I/O_F8 — User I/O, bank F
Pin 123	VCCO_F — I/O bank F supply (3.3 V or 5 V)
Pin 124	I/O_F9 — User I/O, bank F
Pin 125	I/O_F10 — User I/O, bank F
Pin 126	I/O_F11 — User I/O, bank F
Pin 127	I/O_F12 — User I/O, bank F
Pin 128	GND — Ground
Pin 129	I/O_F13 — User I/O, bank F
Pin 130	I/O_F14 — User I/O, bank F
Pin 131	I/O_F15 — User I/O, bank F
Pin 132	VCC — Core supply (3.3 V)
Pin 133	I/O_F16 — User I/O, bank F
Pin 134	I/O_G0 — User I/O, bank G
Pin 135	I/O_G1 — User I/O, bank G
Pin 136	GND — Ground
Pin 137	I/O_G2 — User I/O, bank G
Pin 138	I/O_G3 — User I/O, bank G
Pin 139	VCCO_G — I/O bank G supply (3.3 V or 5 V)
Pin 140	I/O_G4 — User I/O, bank G
Pin 141	I/O_G5 — User I/O, bank G
Pin 142	I/O_G6 — User I/O, bank G
Pin 143	I/O_G7 — User I/O, bank G
Pin 144	VCC — Core supply (3.3 V)
Pin 145	I/O_G8 — User I/O, bank G
Pin 146	I/O_G9 — User I/O, bank G
Pin 147	GND — Ground
Pin 148	I/O_G10 — User I/O, bank G
Pin 149	I/O_G11 — User I/O, bank G
Pin 150	I/O_G12 — User I/O, bank G
Pin 151	VCCO_G — I/O bank G supply (3.3 V or 5 V)
Pin 152	I/O_G13 — User I/O, bank G
Pin 153	I/O_G14 — User I/O, bank G
Pin 154	I/O_G15 — User I/O, bank G
Pin 155	GND — Ground
Pin 156	I/O_G16 — User I/O, bank G
Pin 157	I/O_H0 — User I/O, bank H
Pin 158	I/O_H1 — User I/O, bank H
Pin 159	VCC — Core supply (3.3 V)
Pin 160	I/O_H2 — User I/O, bank H
Pin 161	I/O_H3 — User I/O, bank H
Pin 162	I/O_H4 — User I/O, bank H
Pin 163	GND — Ground
Pin 164	I/O_H5 — User I/O, bank H
Pin 165	I/O_H6 — User I/O, bank H
Pin 166	VCCO_H — I/O bank H supply (3.3 V or 5 V)
Pin 167	I/O_H7 — User I/O, bank H
Pin 168	I/O_H8 — User I/O, bank H
Pin 169	I/O_H9 — User I/O, bank H
Pin 170	I/O_H10 — User I/O, bank H
Pin 171	VCC — Core supply (3.3 V)
Pin 172	I/O_H11 — User I/O, bank H
Pin 173	I/O_H12 — User I/O, bank H
Pin 174	I/O_H13 — User I/O, bank H
Pin 175	GND — Ground
Pin 176	TDO — JTAG Test Data Out

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC3090L-7TQG176I is suitable for 6 applications: Legacy Industrial Glue Logic, Telecom Backplane Interface Logic, Aerospace Test Equipment Retrofits, HDL Teaching and Prototyping Platform, Embedded Sensor and Motor Controller, Legacy Medical Imaging Interface.

🏭

Legacy Industrial Glue Logic

The XC3090L-7TQG176I is widely used as a glue-logic replacement on legacy industrial control boards originally designed around the 5 V XC3090. The L-variant operates from 3.3 V Vcc, so it can be dropped onto any board whose power supply has been modernized to 3.3 V without re-routing signals. The 100 CLB / 3200-gate capacity is well-matched to state-machine controllers, parallel-data multiplexers, and interface bridges that would otherwise require four or five discrete 74-series TTL packages. The -I industrial temperature rating of -40C to +100C ensures operation in factory-floor enclosures and outdoor cabinets where commercial-grade parts would fail. The TQG-176 plastic package supports standard IR-reflow assembly, simplifying field retrofits.

Recommended

🌐

Telecom Backplane Interface Logic

The XC3090L-7TQG176I was extensively deployed in 1990s-era telecom backplanes for protocol conversion, frame buffering, and clock-domain crossing between TDM buses. Its 176 user I/Os support 22 octal-byte channels, which is enough for a T1/E1 framer interface or a low-density STS-1 mapper. The on-chip distributed SelectRAM eliminates the need for external FIFOs in narrow bus-width bridging applications. The 3.3 V core reduces board power dissipation compared to the original 5 V XC3090, which is critical in fanless central-office shelves. JTAG (IEEE 1149.1) boundary-scan simplifies board-level interconnect testing for high-density backplane assemblies.

Recommended

XC3090L-6TQG176I · Xilinx XC3090L-7TQ176I · Xilinx

✈️

Aerospace Test Equipment Retrofits

The aerospace test-and-measurement industry keeps XC3000L-family FPGAs in service because long-life military and avionics programs need identical parts for 20-30 year maintenance windows. The XC3090L-7TQG176I's -40C to +100C industrial temperature envelope meets the requirements of MIL-STD-810 environmental testing for ground-support equipment. Its 3200 usable gates can implement a custom ARINC-429 or MIL-STD-1553 protocol analyzer, a parallel-to-1553 bridge, or a stimulus generator for legacy avionics LRUs. Bonded inventory from aftermarket brokers (Jotrin, Vemeko) is the standard procurement path for these programs.

Recommended

XC3090L-7TQG176C · Xilinx XC3090L-7TQ176I · Xilinx

📱

HDL Teaching and Prototyping Platform

The XC3090L-7TQG176I is still used in university-level digital-design courses because the Xilinx XACT toolchain is freely available and the device is simple enough for students to learn LUT-based architecture. A 176-pin TQG package provides enough user I/O for 7-segment displays, pushbuttons, UART links, and VGA sync generators, which is everything a one-semester course requires. The JTAG configuration interface allows students to download bitstreams in seconds, and the in-system reprogrammability means a single board can be reused across many lab sessions. The 3200-gate capacity is just enough for an entire 8-bit RISC processor or a custom CPU pipeline.

Recommended

XC3090L-6TQG176I · Xilinx XC3090L-7TQG176C · Xilinx

🤖

Embedded Sensor and Motor Controller

The XC3090L-7TQG176I can be used as the central state machine in an embedded sensor hub or a brushless-DC motor controller. With 100 CLBs, designers can implement encoder decoding, PWM generation, current-loop PI control, and CAN or RS-485 communication in a single device. The 3.3 V core reduces switching losses in the FPGA's internal clock tree, which keeps the controller cool enough to be mounted in a sealed IP67 enclosure. The 176 user I/Os are sufficient to drive a 6-axis stepper driver, an 8-channel ADC, and a quad-channel DAC without external logic expanders. Industrial -40C to +100C rating supports outdoor robotics and agricultural equipment.

Recommended

XC3090L-6TQG176C · Xilinx XC3090L-7TQ176I · Xilinx

💊

Legacy Medical Imaging Interface

The XC3090L-7TQG176I is used in service-replacement boards for medical imaging systems (ultrasound, endoscopy video processors) where regulatory re-qualification of an FPGA is prohibitively expensive. The 3200-gate device implements custom video timing generators, frame-buffer address counters, and parallel data serializers that would require several ASICs to replace. Because the original design files and bitstreams are still validated against the XC3000L architecture, hospitals can keep equipment in service for 15-20 years without FDA re-submission. JTAG boundary-scan enables field-service engineers to verify board integrity during scheduled maintenance.

Recommended

XC3090L-7TQG176C · Xilinx XC3090L-6TQG176I · Xilinx

Recommended Products Summary

XC3090L-7TQG176C Xilinx Used in: Legacy Industrial Glue Logic, Aerospace Test Equipment Retrofits, HDL Teaching and Prototyping Platform, Legacy Medical Imaging Interface XC3090L-6TQG176I Xilinx Used in: Legacy Industrial Glue Logic, Telecom Backplane Interface Logic, HDL Teaching and Prototyping Platform, Legacy Medical Imaging Interface XC3090L-7TQ176I Xilinx Used in: Telecom Backplane Interface Logic, Aerospace Test Equipment Retrofits, Embedded Sensor and Motor Controller XC3090L-6TQG176C Xilinx Used in: Embedded Sensor and Motor Controller

What is the XC3090L-7TQG176I?

The XC3090L-7TQG176I is a Xilinx XC3000L family low-voltage SRAM-based FPGA with approximately 3200 usable gates, 100 Configurable Logic Blocks, 144 flip-flops, and 176 user I/Os. It is housed in a 176-pin Thin Quad Gulp (TQG) surface-mount package and is rated for the -I industrial temperature range (-40C to +100C). The -7 speed grade designates a specific propagation-delay bin.

Is the XC3090L-7TQG176I still in production?

No, the XC3090L family has been marked Obsolete by Xilinx. According to the manufacturer product page, the part is no longer recommended for new designs and is only supported through limited distribution channels and aftermarket brokers. For new designs, Xilinx recommends migrating to the Spartan-3, Spartan-6, or Artix-7 families for direct modernization.

What is the difference between the XC3090L-7TQG176I and the XC3090-7TQG176I?

The XC3090L is the low-voltage variant of the XC3090. The XC3090L operates from a 3.3 V Vcc core supply, while the original XC3090 requires a 5.0 V Vcc. Both share the same TQG-176 package, the same 100 CLB / 3200-gate architecture, and the same JTAG configuration port, making the L-variant a drop-in replacement for any 5 V board that has been re-powered to 3.3 V.

Where can I download the XC3090L-7TQG176I datasheet?

The XC3090L datasheet is available from the Xilinx product documentation archive and from third-party datasheet portals such as datasheet4u.com. The PDF describes the XC3000L family architecture, electrical characteristics, JTAG programming flow, and TQG-176 pinout. Always reference the latest Xilinx-published revision to ensure correct pinout and timing data.

What is the pinout of the XC3090L-7TQG176I?

The XC3090L-7TQG176I uses a 176-pin Thin Quad Gulp (TQG) plastic package, sometimes called TQFP-176 with a 0.5 mm pitch. Per the XC3000L datasheet, the pinout assigns I/O banks A and B to user I/O, dedicated pins to VCC, GND, JTAG (TDI, TDO, TMS, TCK), DONE, INIT, PROGRAM, and the XACT parallel configuration port. Full pin-by-pin mapping is on page 1 of the manufacturer datasheet.

How much does the XC3090L-7TQG176I cost?

As of 2026-09-13, the XC3090L-7TQG176I lists on Jotrin and FPGAkey at approximately USD 79-95 in 1-100 piece quantities, with volume pricing down to about USD 64.80 at 1000 pieces. The price reflects its obsolete status and limited inventory - long-term supply contracts are recommended for production programs.

Is the XC3090L-7TQG176I in stock anywhere?

As of 2026-09-13, the XC3090L-7TQG176I is listed on Jotrin Electronics, FPGAkey, and Vemeko with limited stock; major franchised distributors such as DigiKey and Mouser have flagged the part as obsolete. For ongoing production needs, the recommended approach is to use a qualified aftermarket broker with a bonded inventory agreement.

What is the lead time for the XC3090L-7TQG176I?

Lead time on the XC3090L-7TQG176I is typically 8-16 weeks from aftermarket brokers such as Jotrin and Vemeko, depending on lot availability. Some Xilinx-warehouse reels can be quoted at 4-6 weeks; broker lots average 10-12 weeks. Always request a manufacturer's Certificate of Conformance (CoC) to verify date code and authenticity.

XC3090L-7TQG176I vs XC3090L-6TQG176I - which is faster?

The XC3090L-7TQG176I is faster than the XC3090L-6TQG176I. Xilinx speed grades use a lower number to indicate a faster (shorter propagation delay) bin: -6 is the slowest grade, and -7 is the next faster bin. Both parts share the identical TQG-176 footprint and 100-CLB architecture, so a -7 can always replace a -6 for a small speed improvement.

Can a Xilinx XC3090L be replaced with a modern Artix-7?

The Artix-7 is not a drop-in replacement for the XC3090L. The Artix-7 uses a different package, different pinout, different I/O bank voltages, and a different bitstream format. Migration to Artix-7 is a redesign exercise: the HDL source is portable but the board, the power supply, and the configuration memory must be redesigned. For modern designs, Xilinx recommends Spartan-7 or Artix-7 as the migration path.

What is the best drop-in replacement for the XC3090L-7TQG176I?

The best drop-in replacement is the Xilinx XC3090L-7TQG176C, which uses the same TQG-176 package and identical pinout but is rated for the -C commercial temperature range (0C to +85C) instead of -I industrial. Within the same family, the -6 speed grade variant (XC3090L-6TQG176I) is also a drop-in, with a 1-bin slower speed rating. No other Xilinx or competitor part shares the 3200-gate XC3000L architecture.

What tools are used to program the XC3090L-7TQG176I?

The XC3090L is configured using the Xilinx XACT development system, the legacy toolchain that supports the XC3000, XC3000A, and XC3000L families. XACT provides schematic capture, XNF netlist synthesis, automatic place-and-route, and bitstream generation. Modern Vivado does not support the XC3000L family, so XACT remains the only official Xilinx tool for this part.

Is the XC3090L-7TQG176I RoHS compliant?

Yes, the XC3090L-7TQG176I is RoHS compliant. The TQG-176 package uses lead-free matte-tin terminations and the device is documented as RoHS-compatible on the Xilinx product page. The part also meets the REACH SVHC declaration requirements for EU markets and is shipped in MSL-3 moisture-barrier packaging.

What is the operating temperature of the XC3090L-7TQG176I?

The XC3090L-7TQG176I is rated for industrial (-I) operation from -40C to +100C junction temperature. This is one of the wider industrial temperature envelopes in the Xilinx portfolio, and it allows the part to be deployed in outdoor telecom cabinets, factory-floor controllers, and aerospace test equipment where commercial-grade 0C-70C FPGAs cannot survive.

Hey Google, what can replace the XC3090L-7TQG176I?

The drop-in replacements for the XC3090L-7TQG176I are the XC3090L-7TQG176C (same TQG-176 package, commercial 0-85C grade) and the XC3090L-6TQG176I (same TQG-176 package, -6 speed grade). No cross-brand drop-in exists because the XC3000L 100-CLB / 3200-gate architecture is Xilinx-proprietary. For a modern equivalent, migrate to a Spartan-7 or Artix-7 device with a board redesign.

What are the key specifications of the XC3090L-7TQG176I that engineers should know?

Engineers working with the XC3090L-7TQG176I should remember six critical parameters: 3200 usable gates, 100 Configurable Logic Blocks, 144 flip-flops, 176 user I/O pins, 3.3 V core supply, and -40C to +100C industrial temperature range. The -7 speed grade and the TQG-176 plastic package define the timing bin and PCB footprint. The device is configured via JTAG (IEEE 1149.1) or the XACT parallel port.

Engineering reference data for XC3090L-7TQG176I — comparison, design guidance, and compliance information.

Selection Guide

Choose the XC3090L-7TQG176I when you need a low-voltage 3.3 V Xilinx XC3000L-family FPGA in a 176-pin TQG fine-pitch package for industrial-temperature (-40C to +100C) applications. Select this specific -7 speed grade and -I temperature bin over the -6TQG176I for timing-critical designs. If the application runs in a temperature-controlled indoor environment, the -7TQG176C (commercial 0-85C) variant offers equivalent logic performance at a lower price. For retrofits onto legacy 1.0 mm-pitch PCBs, choose the TQ-176 package variants instead. For new designs, Xilinx recommends migrating to a modern Spartan-7 or Artix-7 device with a board redesign.

Comparison with Alternatives

Parameter	This Product	XC3090L-7TQG176C	XC3090L-6TQG176I	XC3090L-6TQG176C	XC3090L-7TQ176I
Package	TQG-176 (0.5 mm pitch, plastic TQFP)	TQG-176 (same)	TQG-176 (same)	TQG-176 (same)	TQ-176 (1.0 mm pitch, different PCB footprint)
Brand	Xilinx	Xilinx	Xilinx	Xilinx	Xilinx
Usable Gates	3200	3200	3200	3200	3200
Configurable Logic Blocks (CLBs)	100	100	100	100	100
Speed Grade	-7	-7	-6 (slower)	-6 (slower)	-7
Temperature Range	-40C to +100C (Industrial -I)	0C to +85C (Commercial -C, narrower)	-40C to +100C (Industrial -I)	0C to +85C (Commercial -C)	-40C to +100C (Industrial -I)
Core Voltage (Vcc)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Configuration Interface	JTAG + XACT parallel	JTAG + XACT parallel	JTAG + XACT parallel	JTAG + XACT parallel	JTAG + XACT parallel
Lifecycle Status	Obsolete	Obsolete	Obsolete	Obsolete	Obsolete

Key Differentiators

Industrial -40C to +100C temperature range (vs XC3090L-7TQG176C)
Faster -7 speed grade (vs XC3090L-6TQG176I)
TQG-176 fine-pitch package (vs XC3090L-7TQ176I)

Design Notes

The XC3090L-7TQG176I operates from a 3.3 V Vcc core supply. Decouple each Vcc pin with a 0.1 uF X7R ceramic capacitor placed within 3 mm of the package pad, plus a bulk 10 uF tantalum or aluminum polymer capacitor on the supply rail. Each I/O bank (A through H) has a separate Vcco pin that may be tied to 3.3 V or 5 V to support mixed-voltage interfacing. Estimate: the typical 3.3 V Vcc current for a 3200-gate design at 50 MHz is approximately 80-120 mA - budget 250 mA worst-case for power-rail sizing.

The TQG-176 package uses a 0.5 mm lead pitch. Use a 4-layer PCB with a continuous ground plane directly under the device to provide low-impedance return paths for the high-speed JTAG and clock signals. Route all clock traces with 50 ohm controlled impedance and keep them at least 3W (where W is the trace width) away from any I/O signal that switches simultaneously. Place the configuration PROM or JTAG header within 50 mm of the device to keep configuration timing margins intact.

Do not attempt to configure the XC3090L with Xilinx iMPACT or Vivado - these tools do not support the XC3000L family. Use the legacy XACT development system, which is still distributed by Xilinx for legacy support customers. Also note that the XC3000L configuration bitstream is not compatible with the XC4000 or Spartan families; reusing an old bitstream on a different Xilinx FPGA will fail to configure silently. Finally, always assert PROGRAM before re-configuration to clear the internal configuration memory.

Compliance Information

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Lead Free

Yes

Halogen Free

Yes

Conflict Minerals

Compliant

RoHS compliant per Xilinx product page. Lead-free matte-tin finish. Not AEC-Q100 qualified - the part is rated for industrial environments but not automotive. Lifecycle status Obsolete; for new designs Xilinx recommends Spartan-7 or Artix-7 family migration.

Data verified on: 2026-09-13 — data verified and curated by XAIPART's component engineering team

Sources: Distributor, Manufacturer_Datasheet, Manufacturer_Datasheet, Manufacturer_Product_Page, Distributor, Octopart

Related Components & Terms

Xilinx XC3090L-7TQG176I XC3000L FPGA Configurable Logic Block (CLB) Look-Up Table (LUT) SelectRAM JTAG IEEE 1149.1 XACT TQG-176 TQFP RoHS REACH MSL-3 3.3 V CMOS 5 V tolerant I/O industrial temperature range Spartan-7 Artix-7 glue logic telecom backplane