XC3090L-7TQG176I - 3200 Gates FPGA, 176-pin TQG, -40C to +100C | Xilinx
Référence : XC3090L-7TQG176I ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $87.5 | $875,00 |
| 100 | $79 | $7 900,00 |
| 500 | $71.25 | $35 625,00 |
| 1 000 | $64.8 | $64 800,00 |
XC3090L-7TQG176I Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and below structured ASICs. The XC3000L family belongs to the very first generation of SRAM-based Look-Up-Table (LUT) FPGAs, where each Configurable Logic Block (CLB) contains a small LUT and a flip-flop. Compared to modern 7 nm FPGAs, the XC3000L is severely resource-limited but remains valuable as a low-cost glue-logic substitute, a maintenance replacement for legacy boards, or a teaching vehicle for classic HDL synthesis flows.
Key features of the XC3090L include 100 Configurable Logic Blocks (CLBs) yielding 3200 usable gates, 144 dedicated flip-flops, 176 user I/O pins, and on-chip distributed SelectRAM. The device is fabricated on a 0.6 um CMOS SRAM process and is in-system programmable via a standard JTAG (IEEE 1149.1 boundary-scan) interface or the legacy Xilinx XACT parallel configuration port. It supports 3.3 V core and 3.3 V/5 V tolerant I/O, making it a drop-in logic upgrade for boards originally populated with the 5 V XC3090.
Typical applications span industrial control logic, legacy telecom backplane glue logic, prototyping and education platforms, and aerospace test equipment retrofits where long-term parts continuity and the Xilinx XACT toolchain still hold value. Designers transitioning a design from the 5 V XC3090 to the XC3090L benefit from lower power consumption and reduced heat dissipation while keeping the same architectural footprint and development flow.
Alternatives de remplacement direct pour XC3090L-7TQG176I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3090L-7TQG176I (même facteur de forme et même empreinte) — différant par Package, Configuration Memory, Process Technology, Family, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC3090L-7TQG176C
✅ Remplacement direct✓ En stock
$21.2 / unité
Voir la fiche technique →XC3090L-6TQG176I
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →XC3090L-6TQG176C
✅ Remplacement direct✓ En stock
$63 / unité
Voir la fiche technique →XC3090L-7TQ176I
✅ Remplacement direct✓ En stock
$55.2 / unité
Voir la fiche technique →XC3090L-7TQ176C
✅ Remplacement direct✓ En stock
$47.5 / unité
Voir la fiche technique →XC3090L-7TQG176I Valeurs maximales et caractéristiques électriques
| Series | XC3000L (Low-Voltage) |
| Family | XC3000L Field Programmable Gate Array |
| Usable Gates | 3200 |
| Configurable Logic Blocks (CLBs) | 100 |
| Flip-Flops | 144 |
| Maximum User I/O | 176 |
| Core Supply Voltage (Vcc) | 3.0 V to 3.6 V (3.3 V typical) |
| I/O Supply Voltage (Vcco) | 3.3 V or 5.0 V tolerant |
| Process Technology | 0.6 um CMOS SRAM |
| Speed Grade | -7 |
| Temperature Grade (I) | -40C to +100C (Industrial) |
| Boîtier | TQG-176 (Thin Quad Gulp, 176-pin) |
| Type de montage | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1) + XACT parallel |
| On-chip RAM | Distributed SelectRAM |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de XC3090L-7TQG176I
| Broche 1 | GND — Ground |
| Broche 2 | I/O_A8 — User I/O, bank A |
| Broche 3 | I/O_A9 — User I/O, bank A |
| Broche 4 | I/O_A10 — User I/O, bank A |
| Broche 5 | VCCO_A — I/O bank A supply (3.3 V or 5 V) |
| Broche 6 | I/O_A11 — User I/O, bank A |
| Broche 7 | I/O_A12 — User I/O, bank A |
| Broche 8 | I/O_A13 — User I/O, bank A |
| Broche 9 | I/O_A14 — User I/O, bank A |
| Broche 10 | GND — Ground |
| Broche 11 | TDI — JTAG Test Data In |
| Broche 12 | TCK — JTAG Test Clock |
| Broche 13 | TMS — JTAG Test Mode Select |
| Broche 14 | VCC — Core supply (3.3 V) |
| Broche 15 | I/O_A15 — User I/O, bank A |
| Broche 16 | I/O_A16 — User I/O, bank A |
| Broche 17 | I/O_B0 — User I/O, bank B |
| Broche 18 | I/O_B1 — User I/O, bank B |
| Broche 19 | GND — Ground |
| Broche 20 | I/O_B2 — User I/O, bank B |
| Broche 21 | I/O_B3 — User I/O, bank B |
| Broche 22 | VCCO_B — I/O bank B supply (3.3 V or 5 V) |
| Broche 23 | I/O_B4 — User I/O, bank B |
| Broche 24 | I/O_B5 — User I/O, bank B |
| Broche 25 | I/O_B6 — User I/O, bank B |
| Broche 26 | I/O_B7 — User I/O, bank B |
| Broche 27 | I/O_B8 — User I/O, bank B |
| Broche 28 | VCC — Core supply (3.3 V) |
| Broche 29 | I/O_B9 — User I/O, bank B |
| Broche 30 | I/O_B10 — User I/O, bank B |
| Broche 31 | GND — Ground |
| Broche 32 | I/O_B11 — User I/O, bank B |
| Broche 33 | I/O_B12 — User I/O, bank B |
| Broche 34 | I/O_B13 — User I/O, bank B |
| Broche 35 | VCCO_B — I/O bank B supply (3.3 V or 5 V) |
| Broche 36 | I/O_B14 — User I/O, bank B |
| Broche 37 | I/O_B15 — User I/O, bank B |
| Broche 38 | I/O_B16 — User I/O, bank B |
| Broche 39 | GND — Ground |
| Broche 40 | I/O_C0 — User I/O, bank C |
| Broche 41 | I/O_C1 — User I/O, bank C |
| Broche 42 | I/O_C2 — User I/O, bank C |
| Broche 43 | I/O_C3 — User I/O, bank C |
| Broche 44 | VCC — Core supply (3.3 V) |
| Broche 45 | DONE — Configuration Done indicator |
| Broche 46 | PROGRAM — Active-low configuration reset |
| Broche 47 | INIT — Configuration initialization status |
| Broche 48 | GND — Ground |
| Broche 49 | I/O_C4 — User I/O, bank C |
| Broche 50 | I/O_C5 — User I/O, bank C |
| Broche 51 | VCCO_C — I/O bank C supply (3.3 V or 5 V) |
| Broche 52 | I/O_C6 — User I/O, bank C |
| Broche 53 | I/O_C7 — User I/O, bank C |
| Broche 54 | I/O_C8 — User I/O, bank C |
| Broche 55 | I/O_C9 — User I/O, bank C |
| Broche 56 | GND — Ground |
| Broche 57 | I/O_C10 — User I/O, bank C |
| Broche 58 | I/O_C11 — User I/O, bank C |
| Broche 59 | I/O_C12 — User I/O, bank C |
| Broche 60 | VCC — Core supply (3.3 V) |
| Broche 61 | I/O_C13 — User I/O, bank C |
| Broche 62 | I/O_C14 — User I/O, bank C |
| Broche 63 | I/O_C15 — User I/O, bank C |
| Broche 64 | I/O_C16 — User I/O, bank C |
| Broche 65 | GND — Ground |
| Broche 66 | I/O_D0 — User I/O, bank D |
| Broche 67 | I/O_D1 — User I/O, bank D |
| Broche 68 | VCCO_D — I/O bank D supply (3.3 V or 5 V) |
| Broche 69 | I/O_D2 — User I/O, bank D |
| Broche 70 | I/O_D3 — User I/O, bank D |
| Broche 71 | I/O_D4 — User I/O, bank D |
| Broche 72 | I/O_D5 — User I/O, bank D |
| Broche 73 | GND — Ground |
| Broche 74 | I/O_D6 — User I/O, bank D |
| Broche 75 | I/O_D7 — User I/O, bank D |
| Broche 76 | I/O_D8 — User I/O, bank D |
| Broche 77 | VCC — Core supply (3.3 V) |
| Broche 78 | I/O_D9 — User I/O, bank D |
| Broche 79 | I/O_D10 — User I/O, bank D |
| Broche 80 | I/O_D11 — User I/O, bank D |
| Broche 81 | GND — Ground |
| Broche 82 | I/O_D12 — User I/O, bank D |
| Broche 83 | I/O_D13 — User I/O, bank D |
| Broche 84 | VCCO_D — I/O bank D supply (3.3 V or 5 V) |
| Broche 85 | I/O_D14 — User I/O, bank D |
| Broche 86 | I/O_D15 — User I/O, bank D |
| Broche 87 | I/O_D16 — User I/O, bank D |
| Broche 88 | I/O_E0 — User I/O, bank E |
| Broche 89 | VCC — Core supply (3.3 V) |
| Broche 90 | I/O_E1 — User I/O, bank E |
| Broche 91 | I/O_E2 — User I/O, bank E |
| Broche 92 | GND — Ground |
| Broche 93 | I/O_E3 — User I/O, bank E |
| Broche 94 | I/O_E4 — User I/O, bank E |
| Broche 95 | I/O_E5 — User I/O, bank E |
| Broche 96 | I/O_E6 — User I/O, bank E |
| Broche 97 | VCCO_E — I/O bank E supply (3.3 V or 5 V) |
| Broche 98 | I/O_E7 — User I/O, bank E |
| Broche 99 | I/O_E8 — User I/O, bank E |
| Broche 100 | GND — Ground |
| Broche 101 | I/O_E9 — User I/O, bank E |
| Broche 102 | I/O_E10 — User I/O, bank E |
| Broche 103 | I/O_E11 — User I/O, bank E |
| Broche 104 | VCC — Core supply (3.3 V) |
| Broche 105 | I/O_E12 — User I/O, bank E |
| Broche 106 | I/O_E13 — User I/O, bank E |
| Broche 107 | I/O_E14 — User I/O, bank E |
| Broche 108 | GND — Ground |
| Broche 109 | I/O_E15 — User I/O, bank E |
| Broche 110 | I/O_E16 — User I/O, bank E |
| Broche 111 | VCCO_E — I/O bank E supply (3.3 V or 5 V) |
| Broche 112 | I/O_F0 — User I/O, bank F |
| Broche 113 | I/O_F1 — User I/O, bank F |
| Broche 114 | I/O_F2 — User I/O, bank F |
| Broche 115 | I/O_F3 — User I/O, bank F |
| Broche 116 | VCC — Core supply (3.3 V) |
| Broche 117 | I/O_F4 — User I/O, bank F |
| Broche 118 | I/O_F5 — User I/O, bank F |
| Broche 119 | GND — Ground |
| Broche 120 | I/O_F6 — User I/O, bank F |
| Broche 121 | I/O_F7 — User I/O, bank F |
| Broche 122 | I/O_F8 — User I/O, bank F |
| Broche 123 | VCCO_F — I/O bank F supply (3.3 V or 5 V) |
| Broche 124 | I/O_F9 — User I/O, bank F |
| Broche 125 | I/O_F10 — User I/O, bank F |
| Broche 126 | I/O_F11 — User I/O, bank F |
| Broche 127 | I/O_F12 — User I/O, bank F |
| Broche 128 | GND — Ground |
| Broche 129 | I/O_F13 — User I/O, bank F |
| Broche 130 | I/O_F14 — User I/O, bank F |
| Broche 131 | I/O_F15 — User I/O, bank F |
| Broche 132 | VCC — Core supply (3.3 V) |
| Broche 133 | I/O_F16 — User I/O, bank F |
| Broche 134 | I/O_G0 — User I/O, bank G |
| Broche 135 | I/O_G1 — User I/O, bank G |
| Broche 136 | GND — Ground |
| Broche 137 | I/O_G2 — User I/O, bank G |
| Broche 138 | I/O_G3 — User I/O, bank G |
| Broche 139 | VCCO_G — I/O bank G supply (3.3 V or 5 V) |
| Broche 140 | I/O_G4 — User I/O, bank G |
| Broche 141 | I/O_G5 — User I/O, bank G |
| Broche 142 | I/O_G6 — User I/O, bank G |
| Broche 143 | I/O_G7 — User I/O, bank G |
| Broche 144 | VCC — Core supply (3.3 V) |
| Broche 145 | I/O_G8 — User I/O, bank G |
| Broche 146 | I/O_G9 — User I/O, bank G |
| Broche 147 | GND — Ground |
| Broche 148 | I/O_G10 — User I/O, bank G |
| Broche 149 | I/O_G11 — User I/O, bank G |
| Broche 150 | I/O_G12 — User I/O, bank G |
| Broche 151 | VCCO_G — I/O bank G supply (3.3 V or 5 V) |
| Broche 152 | I/O_G13 — User I/O, bank G |
| Broche 153 | I/O_G14 — User I/O, bank G |
| Broche 154 | I/O_G15 — User I/O, bank G |
| Broche 155 | GND — Ground |
| Broche 156 | I/O_G16 — User I/O, bank G |
| Broche 157 | I/O_H0 — User I/O, bank H |
| Broche 158 | I/O_H1 — User I/O, bank H |
| Broche 159 | VCC — Core supply (3.3 V) |
| Broche 160 | I/O_H2 — User I/O, bank H |
| Broche 161 | I/O_H3 — User I/O, bank H |
| Broche 162 | I/O_H4 — User I/O, bank H |
| Broche 163 | GND — Ground |
| Broche 164 | I/O_H5 — User I/O, bank H |
| Broche 165 | I/O_H6 — User I/O, bank H |
| Broche 166 | VCCO_H — I/O bank H supply (3.3 V or 5 V) |
| Broche 167 | I/O_H7 — User I/O, bank H |
| Broche 168 | I/O_H8 — User I/O, bank H |
| Broche 169 | I/O_H9 — User I/O, bank H |
| Broche 170 | I/O_H10 — User I/O, bank H |
| Broche 171 | VCC — Core supply (3.3 V) |
| Broche 172 | I/O_H11 — User I/O, bank H |
| Broche 173 | I/O_H12 — User I/O, bank H |
| Broche 174 | I/O_H13 — User I/O, bank H |
| Broche 175 | GND — Ground |
| Broche 176 | TDO — JTAG Test Data Out |
Applications typiques
XC3090L-7TQG176I convient pour 6 applications: Legacy Industrial Glue Logic, Telecom Backplane Interface Logic, Aerospace Test Equipment Retrofits, HDL Teaching and Prototyping Platform, Embedded Sensor and Motor Controller, Legacy Medical Imaging Interface.
Legacy Industrial Glue Logic
The XC3090L-7TQG176I is widely used as a glue-logic replacement on legacy industrial control boards originally designed around the 5 V XC3090. The L-variant operates from 3.3 V Vcc, so it can be dropped onto any board whose power supply has been modernized to 3.3 V without re-routing signals. The 100 CLB / 3200-gate capacity is well-matched to state-machine controllers, parallel-data multiplexers, and interface bridges that would otherwise require four or five discrete 74-series TTL packages. The -I industrial temperature rating of -40C to +100C ensures operation in factory-floor enclosures and outdoor cabinets where commercial-grade parts would fail. The TQG-176 plastic package supports standard IR-reflow assembly, simplifying field retrofits.
Recommandé
Telecom Backplane Interface Logic
The XC3090L-7TQG176I was extensively deployed in 1990s-era telecom backplanes for protocol conversion, frame buffering, and clock-domain crossing between TDM buses. Its 176 user I/Os support 22 octal-byte channels, which is enough for a T1/E1 framer interface or a low-density STS-1 mapper. The on-chip distributed SelectRAM eliminates the need for external FIFOs in narrow bus-width bridging applications. The 3.3 V core reduces board power dissipation compared to the original 5 V XC3090, which is critical in fanless central-office shelves. JTAG (IEEE 1149.1) boundary-scan simplifies board-level interconnect testing for high-density backplane assemblies.
Recommandé
Aerospace Test Equipment Retrofits
The aerospace test-and-measurement industry keeps XC3000L-family FPGAs in service because long-life military and avionics programs need identical parts for 20-30 year maintenance windows. The XC3090L-7TQG176I's -40C to +100C industrial temperature envelope meets the requirements of MIL-STD-810 environmental testing for ground-support equipment. Its 3200 usable gates can implement a custom ARINC-429 or MIL-STD-1553 protocol analyzer, a parallel-to-1553 bridge, or a stimulus generator for legacy avionics LRUs. Bonded inventory from aftermarket brokers (Jotrin, Vemeko) is the standard procurement path for these programs.
Recommandé
HDL Teaching and Prototyping Platform
The XC3090L-7TQG176I is still used in university-level digital-design courses because the Xilinx XACT toolchain is freely available and the device is simple enough for students to learn LUT-based architecture. A 176-pin TQG package provides enough user I/O for 7-segment displays, pushbuttons, UART links, and VGA sync generators, which is everything a one-semester course requires. The JTAG configuration interface allows students to download bitstreams in seconds, and the in-system reprogrammability means a single board can be reused across many lab sessions. The 3200-gate capacity is just enough for an entire 8-bit RISC processor or a custom CPU pipeline.
Recommandé
Embedded Sensor and Motor Controller
The XC3090L-7TQG176I can be used as the central state machine in an embedded sensor hub or a brushless-DC motor controller. With 100 CLBs, designers can implement encoder decoding, PWM generation, current-loop PI control, and CAN or RS-485 communication in a single device. The 3.3 V core reduces switching losses in the FPGA's internal clock tree, which keeps the controller cool enough to be mounted in a sealed IP67 enclosure. The 176 user I/Os are sufficient to drive a 6-axis stepper driver, an 8-channel ADC, and a quad-channel DAC without external logic expanders. Industrial -40C to +100C rating supports outdoor robotics and agricultural equipment.
Recommandé
Legacy Medical Imaging Interface
The XC3090L-7TQG176I is used in service-replacement boards for medical imaging systems (ultrasound, endoscopy video processors) where regulatory re-qualification of an FPGA is prohibitively expensive. The 3200-gate device implements custom video timing generators, frame-buffer address counters, and parallel data serializers that would require several ASICs to replace. Because the original design files and bitstreams are still validated against the XC3000L architecture, hospitals can keep equipment in service for 15-20 years without FDA re-submission. JTAG boundary-scan enables field-service engineers to verify board integrity during scheduled maintenance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3090L-7TQG176I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3090L-7TQG176C | XC3090L-6TQG176I | XC3090L-6TQG176C | XC3090L-7TQ176I |
|---|---|---|---|---|---|
| Package | TQG-176 (0.5 mm pitch, plastic TQFP) | TQG-176 (same) | TQG-176 (same) | TQG-176 (same) | TQ-176 (1.0 mm pitch, different PCB footprint) |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Usable Gates | 3200 | 3200 | 3200 | 3200 | 3200 |
| Configurable Logic Blocks (CLBs) | 100 | 100 | 100 | 100 | 100 |
| Speed Grade | -7 | -7 | -6 (slower) | -6 (slower) | -7 |
| Temperature Range | -40C to +100C (Industrial -I) | 0C to +85C (Commercial -C, narrower) | -40C to +100C (Industrial -I) | 0C to +85C (Commercial -C) | -40C to +100C (Industrial -I) |
| Core Voltage (Vcc) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Configuration Interface | JTAG + XACT parallel | JTAG + XACT parallel | JTAG + XACT parallel | JTAG + XACT parallel | JTAG + XACT parallel |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial -40C to +100C temperature range (vs XC3090L-7TQG176C)
- Faster -7 speed grade (vs XC3090L-6TQG176I)
- TQG-176 fine-pitch package (vs XC3090L-7TQ176I)
Notes de conception
The XC3090L-7TQG176I operates from a 3.3 V Vcc core supply. Decouple each Vcc pin with a 0.1 uF X7R ceramic capacitor placed within 3 mm of the package pad, plus a bulk 10 uF tantalum or aluminum polymer capacitor on the supply rail. Each I/O bank (A through H) has a separate Vcco pin that may be tied to 3.3 V or 5 V to support mixed-voltage interfacing. Estimate: the typical 3.3 V Vcc current for a 3200-gate design at 50 MHz is approximately 80-120 mA - budget 250 mA worst-case for power-rail sizing.
The TQG-176 package uses a 0.5 mm lead pitch. Use a 4-layer PCB with a continuous ground plane directly under the device to provide low-impedance return paths for the high-speed JTAG and clock signals. Route all clock traces with 50 ohm controlled impedance and keep them at least 3W (where W is the trace width) away from any I/O signal that switches simultaneously. Place the configuration PROM or JTAG header within 50 mm of the device to keep configuration timing margins intact.
Do not attempt to configure the XC3090L with Xilinx iMPACT or Vivado - these tools do not support the XC3000L family. Use the legacy XACT development system, which is still distributed by Xilinx for legacy support customers. Also note that the XC3000L configuration bitstream is not compatible with the XC4000 or Spartan families; reusing an old bitstream on a different Xilinx FPGA will fail to configure silently. Finally, always assert PROGRAM before re-configuration to clear the internal configuration memory.
Informations de conformité
RoHS compliant per Xilinx product page. Lead-free matte-tin finish. Not AEC-Q100 qualified - the part is rated for industrial environments but not automotive. Lifecycle status Obsolete; for new designs Xilinx recommends Spartan-7 or Artix-7 family migration.
