XC3090L-7TQG176I - 3200 Gates FPGA, 176-pin TQG, -40C to +100C | Xilinx
N.º da peça: XC3090L-7TQG176I ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $87.5 | $875,00 |
| 100 | $79 | $7.900,00 |
| 500 | $71.25 | $35.625,00 |
| 1.000 | $64.8 | $64.800,00 |
XC3090L-7TQG176I Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and below structured ASICs. The XC3000L family belongs to the very first generation of SRAM-based Look-Up-Table (LUT) FPGAs, where each Configurable Logic Block (CLB) contains a small LUT and a flip-flop. Compared to modern 7 nm FPGAs, the XC3000L is severely resource-limited but remains valuable as a low-cost glue-logic substitute, a maintenance replacement for legacy boards, or a teaching vehicle for classic HDL synthesis flows.
Key features of the XC3090L include 100 Configurable Logic Blocks (CLBs) yielding 3200 usable gates, 144 dedicated flip-flops, 176 user I/O pins, and on-chip distributed SelectRAM. The device is fabricated on a 0.6 um CMOS SRAM process and is in-system programmable via a standard JTAG (IEEE 1149.1 boundary-scan) interface or the legacy Xilinx XACT parallel configuration port. It supports 3.3 V core and 3.3 V/5 V tolerant I/O, making it a drop-in logic upgrade for boards originally populated with the 5 V XC3090.
Typical applications span industrial control logic, legacy telecom backplane glue logic, prototyping and education platforms, and aerospace test equipment retrofits where long-term parts continuity and the Xilinx XACT toolchain still hold value. Designers transitioning a design from the 5 V XC3090 to the XC3090L benefit from lower power consumption and reduced heat dissipation while keeping the same architectural footprint and development flow.
Alternativas drop-in para XC3090L-7TQG176I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC3090L-7TQG176I (mesmo formato e footprint) — diferindo em Package, Configuration Memory, Process Technology, Family, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC3090L-7TQG176C
✅ Drop-In✓ Em estoque
$21.2 / unidade
Ver ficha técnica →XC3090L-6TQG176I
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →XC3090L-6TQG176C
✅ Drop-In✓ Em estoque
$63 / unidade
Ver ficha técnica →XC3090L-7TQ176I
✅ Drop-In✓ Em estoque
$55.2 / unidade
Ver ficha técnica →XC3090L-7TQ176C
✅ Drop-In✓ Em estoque
$47.5 / unidade
Ver ficha técnica →XC3090L-7TQG176I Classificações máximas e características elétricas
| Series | XC3000L (Low-Voltage) |
| Family | XC3000L Field Programmable Gate Array |
| Usable Gates | 3200 |
| Configurable Logic Blocks (CLBs) | 100 |
| Flip-Flops | 144 |
| Maximum User I/O | 176 |
| Core Supply Voltage (Vcc) | 3.0 V to 3.6 V (3.3 V typical) |
| I/O Supply Voltage (Vcco) | 3.3 V or 5.0 V tolerant |
| Process Technology | 0.6 um CMOS SRAM |
| Speed Grade | -7 |
| Temperature Grade (I) | -40C to +100C (Industrial) |
| Encapsulamento | TQG-176 (Thin Quad Gulp, 176-pin) |
| Tipo de montagem | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1) + XACT parallel |
| On-chip RAM | Distributed SelectRAM |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do XC3090L-7TQG176I
| Pino 1 | GND — Ground |
| Pino 2 | I/O_A8 — User I/O, bank A |
| Pino 3 | I/O_A9 — User I/O, bank A |
| Pino 4 | I/O_A10 — User I/O, bank A |
| Pino 5 | VCCO_A — I/O bank A supply (3.3 V or 5 V) |
| Pino 6 | I/O_A11 — User I/O, bank A |
| Pino 7 | I/O_A12 — User I/O, bank A |
| Pino 8 | I/O_A13 — User I/O, bank A |
| Pino 9 | I/O_A14 — User I/O, bank A |
| Pino 10 | GND — Ground |
| Pino 11 | TDI — JTAG Test Data In |
| Pino 12 | TCK — JTAG Test Clock |
| Pino 13 | TMS — JTAG Test Mode Select |
| Pino 14 | VCC — Core supply (3.3 V) |
| Pino 15 | I/O_A15 — User I/O, bank A |
| Pino 16 | I/O_A16 — User I/O, bank A |
| Pino 17 | I/O_B0 — User I/O, bank B |
| Pino 18 | I/O_B1 — User I/O, bank B |
| Pino 19 | GND — Ground |
| Pino 20 | I/O_B2 — User I/O, bank B |
| Pino 21 | I/O_B3 — User I/O, bank B |
| Pino 22 | VCCO_B — I/O bank B supply (3.3 V or 5 V) |
| Pino 23 | I/O_B4 — User I/O, bank B |
| Pino 24 | I/O_B5 — User I/O, bank B |
| Pino 25 | I/O_B6 — User I/O, bank B |
| Pino 26 | I/O_B7 — User I/O, bank B |
| Pino 27 | I/O_B8 — User I/O, bank B |
| Pino 28 | VCC — Core supply (3.3 V) |
| Pino 29 | I/O_B9 — User I/O, bank B |
| Pino 30 | I/O_B10 — User I/O, bank B |
| Pino 31 | GND — Ground |
| Pino 32 | I/O_B11 — User I/O, bank B |
| Pino 33 | I/O_B12 — User I/O, bank B |
| Pino 34 | I/O_B13 — User I/O, bank B |
| Pino 35 | VCCO_B — I/O bank B supply (3.3 V or 5 V) |
| Pino 36 | I/O_B14 — User I/O, bank B |
| Pino 37 | I/O_B15 — User I/O, bank B |
| Pino 38 | I/O_B16 — User I/O, bank B |
| Pino 39 | GND — Ground |
| Pino 40 | I/O_C0 — User I/O, bank C |
| Pino 41 | I/O_C1 — User I/O, bank C |
| Pino 42 | I/O_C2 — User I/O, bank C |
| Pino 43 | I/O_C3 — User I/O, bank C |
| Pino 44 | VCC — Core supply (3.3 V) |
| Pino 45 | DONE — Configuration Done indicator |
| Pino 46 | PROGRAM — Active-low configuration reset |
| Pino 47 | INIT — Configuration initialization status |
| Pino 48 | GND — Ground |
| Pino 49 | I/O_C4 — User I/O, bank C |
| Pino 50 | I/O_C5 — User I/O, bank C |
| Pino 51 | VCCO_C — I/O bank C supply (3.3 V or 5 V) |
| Pino 52 | I/O_C6 — User I/O, bank C |
| Pino 53 | I/O_C7 — User I/O, bank C |
| Pino 54 | I/O_C8 — User I/O, bank C |
| Pino 55 | I/O_C9 — User I/O, bank C |
| Pino 56 | GND — Ground |
| Pino 57 | I/O_C10 — User I/O, bank C |
| Pino 58 | I/O_C11 — User I/O, bank C |
| Pino 59 | I/O_C12 — User I/O, bank C |
| Pino 60 | VCC — Core supply (3.3 V) |
| Pino 61 | I/O_C13 — User I/O, bank C |
| Pino 62 | I/O_C14 — User I/O, bank C |
| Pino 63 | I/O_C15 — User I/O, bank C |
| Pino 64 | I/O_C16 — User I/O, bank C |
| Pino 65 | GND — Ground |
| Pino 66 | I/O_D0 — User I/O, bank D |
| Pino 67 | I/O_D1 — User I/O, bank D |
| Pino 68 | VCCO_D — I/O bank D supply (3.3 V or 5 V) |
| Pino 69 | I/O_D2 — User I/O, bank D |
| Pino 70 | I/O_D3 — User I/O, bank D |
| Pino 71 | I/O_D4 — User I/O, bank D |
| Pino 72 | I/O_D5 — User I/O, bank D |
| Pino 73 | GND — Ground |
| Pino 74 | I/O_D6 — User I/O, bank D |
| Pino 75 | I/O_D7 — User I/O, bank D |
| Pino 76 | I/O_D8 — User I/O, bank D |
| Pino 77 | VCC — Core supply (3.3 V) |
| Pino 78 | I/O_D9 — User I/O, bank D |
| Pino 79 | I/O_D10 — User I/O, bank D |
| Pino 80 | I/O_D11 — User I/O, bank D |
| Pino 81 | GND — Ground |
| Pino 82 | I/O_D12 — User I/O, bank D |
| Pino 83 | I/O_D13 — User I/O, bank D |
| Pino 84 | VCCO_D — I/O bank D supply (3.3 V or 5 V) |
| Pino 85 | I/O_D14 — User I/O, bank D |
| Pino 86 | I/O_D15 — User I/O, bank D |
| Pino 87 | I/O_D16 — User I/O, bank D |
| Pino 88 | I/O_E0 — User I/O, bank E |
| Pino 89 | VCC — Core supply (3.3 V) |
| Pino 90 | I/O_E1 — User I/O, bank E |
| Pino 91 | I/O_E2 — User I/O, bank E |
| Pino 92 | GND — Ground |
| Pino 93 | I/O_E3 — User I/O, bank E |
| Pino 94 | I/O_E4 — User I/O, bank E |
| Pino 95 | I/O_E5 — User I/O, bank E |
| Pino 96 | I/O_E6 — User I/O, bank E |
| Pino 97 | VCCO_E — I/O bank E supply (3.3 V or 5 V) |
| Pino 98 | I/O_E7 — User I/O, bank E |
| Pino 99 | I/O_E8 — User I/O, bank E |
| Pino 100 | GND — Ground |
| Pino 101 | I/O_E9 — User I/O, bank E |
| Pino 102 | I/O_E10 — User I/O, bank E |
| Pino 103 | I/O_E11 — User I/O, bank E |
| Pino 104 | VCC — Core supply (3.3 V) |
| Pino 105 | I/O_E12 — User I/O, bank E |
| Pino 106 | I/O_E13 — User I/O, bank E |
| Pino 107 | I/O_E14 — User I/O, bank E |
| Pino 108 | GND — Ground |
| Pino 109 | I/O_E15 — User I/O, bank E |
| Pino 110 | I/O_E16 — User I/O, bank E |
| Pino 111 | VCCO_E — I/O bank E supply (3.3 V or 5 V) |
| Pino 112 | I/O_F0 — User I/O, bank F |
| Pino 113 | I/O_F1 — User I/O, bank F |
| Pino 114 | I/O_F2 — User I/O, bank F |
| Pino 115 | I/O_F3 — User I/O, bank F |
| Pino 116 | VCC — Core supply (3.3 V) |
| Pino 117 | I/O_F4 — User I/O, bank F |
| Pino 118 | I/O_F5 — User I/O, bank F |
| Pino 119 | GND — Ground |
| Pino 120 | I/O_F6 — User I/O, bank F |
| Pino 121 | I/O_F7 — User I/O, bank F |
| Pino 122 | I/O_F8 — User I/O, bank F |
| Pino 123 | VCCO_F — I/O bank F supply (3.3 V or 5 V) |
| Pino 124 | I/O_F9 — User I/O, bank F |
| Pino 125 | I/O_F10 — User I/O, bank F |
| Pino 126 | I/O_F11 — User I/O, bank F |
| Pino 127 | I/O_F12 — User I/O, bank F |
| Pino 128 | GND — Ground |
| Pino 129 | I/O_F13 — User I/O, bank F |
| Pino 130 | I/O_F14 — User I/O, bank F |
| Pino 131 | I/O_F15 — User I/O, bank F |
| Pino 132 | VCC — Core supply (3.3 V) |
| Pino 133 | I/O_F16 — User I/O, bank F |
| Pino 134 | I/O_G0 — User I/O, bank G |
| Pino 135 | I/O_G1 — User I/O, bank G |
| Pino 136 | GND — Ground |
| Pino 137 | I/O_G2 — User I/O, bank G |
| Pino 138 | I/O_G3 — User I/O, bank G |
| Pino 139 | VCCO_G — I/O bank G supply (3.3 V or 5 V) |
| Pino 140 | I/O_G4 — User I/O, bank G |
| Pino 141 | I/O_G5 — User I/O, bank G |
| Pino 142 | I/O_G6 — User I/O, bank G |
| Pino 143 | I/O_G7 — User I/O, bank G |
| Pino 144 | VCC — Core supply (3.3 V) |
| Pino 145 | I/O_G8 — User I/O, bank G |
| Pino 146 | I/O_G9 — User I/O, bank G |
| Pino 147 | GND — Ground |
| Pino 148 | I/O_G10 — User I/O, bank G |
| Pino 149 | I/O_G11 — User I/O, bank G |
| Pino 150 | I/O_G12 — User I/O, bank G |
| Pino 151 | VCCO_G — I/O bank G supply (3.3 V or 5 V) |
| Pino 152 | I/O_G13 — User I/O, bank G |
| Pino 153 | I/O_G14 — User I/O, bank G |
| Pino 154 | I/O_G15 — User I/O, bank G |
| Pino 155 | GND — Ground |
| Pino 156 | I/O_G16 — User I/O, bank G |
| Pino 157 | I/O_H0 — User I/O, bank H |
| Pino 158 | I/O_H1 — User I/O, bank H |
| Pino 159 | VCC — Core supply (3.3 V) |
| Pino 160 | I/O_H2 — User I/O, bank H |
| Pino 161 | I/O_H3 — User I/O, bank H |
| Pino 162 | I/O_H4 — User I/O, bank H |
| Pino 163 | GND — Ground |
| Pino 164 | I/O_H5 — User I/O, bank H |
| Pino 165 | I/O_H6 — User I/O, bank H |
| Pino 166 | VCCO_H — I/O bank H supply (3.3 V or 5 V) |
| Pino 167 | I/O_H7 — User I/O, bank H |
| Pino 168 | I/O_H8 — User I/O, bank H |
| Pino 169 | I/O_H9 — User I/O, bank H |
| Pino 170 | I/O_H10 — User I/O, bank H |
| Pino 171 | VCC — Core supply (3.3 V) |
| Pino 172 | I/O_H11 — User I/O, bank H |
| Pino 173 | I/O_H12 — User I/O, bank H |
| Pino 174 | I/O_H13 — User I/O, bank H |
| Pino 175 | GND — Ground |
| Pino 176 | TDO — JTAG Test Data Out |
Aplicações típicas
XC3090L-7TQG176I é adequado para 6 aplicaçãos: Legacy Industrial Glue Logic, Telecom Backplane Interface Logic, Aerospace Test Equipment Retrofits, HDL Teaching and Prototyping Platform, Embedded Sensor and Motor Controller, Legacy Medical Imaging Interface.
Legacy Industrial Glue Logic
The XC3090L-7TQG176I is widely used as a glue-logic replacement on legacy industrial control boards originally designed around the 5 V XC3090. The L-variant operates from 3.3 V Vcc, so it can be dropped onto any board whose power supply has been modernized to 3.3 V without re-routing signals. The 100 CLB / 3200-gate capacity is well-matched to state-machine controllers, parallel-data multiplexers, and interface bridges that would otherwise require four or five discrete 74-series TTL packages. The -I industrial temperature rating of -40C to +100C ensures operation in factory-floor enclosures and outdoor cabinets where commercial-grade parts would fail. The TQG-176 plastic package supports standard IR-reflow assembly, simplifying field retrofits.
Recomendado
Telecom Backplane Interface Logic
The XC3090L-7TQG176I was extensively deployed in 1990s-era telecom backplanes for protocol conversion, frame buffering, and clock-domain crossing between TDM buses. Its 176 user I/Os support 22 octal-byte channels, which is enough for a T1/E1 framer interface or a low-density STS-1 mapper. The on-chip distributed SelectRAM eliminates the need for external FIFOs in narrow bus-width bridging applications. The 3.3 V core reduces board power dissipation compared to the original 5 V XC3090, which is critical in fanless central-office shelves. JTAG (IEEE 1149.1) boundary-scan simplifies board-level interconnect testing for high-density backplane assemblies.
Recomendado
Aerospace Test Equipment Retrofits
The aerospace test-and-measurement industry keeps XC3000L-family FPGAs in service because long-life military and avionics programs need identical parts for 20-30 year maintenance windows. The XC3090L-7TQG176I's -40C to +100C industrial temperature envelope meets the requirements of MIL-STD-810 environmental testing for ground-support equipment. Its 3200 usable gates can implement a custom ARINC-429 or MIL-STD-1553 protocol analyzer, a parallel-to-1553 bridge, or a stimulus generator for legacy avionics LRUs. Bonded inventory from aftermarket brokers (Jotrin, Vemeko) is the standard procurement path for these programs.
Recomendado
HDL Teaching and Prototyping Platform
The XC3090L-7TQG176I is still used in university-level digital-design courses because the Xilinx XACT toolchain is freely available and the device is simple enough for students to learn LUT-based architecture. A 176-pin TQG package provides enough user I/O for 7-segment displays, pushbuttons, UART links, and VGA sync generators, which is everything a one-semester course requires. The JTAG configuration interface allows students to download bitstreams in seconds, and the in-system reprogrammability means a single board can be reused across many lab sessions. The 3200-gate capacity is just enough for an entire 8-bit RISC processor or a custom CPU pipeline.
Recomendado
Embedded Sensor and Motor Controller
The XC3090L-7TQG176I can be used as the central state machine in an embedded sensor hub or a brushless-DC motor controller. With 100 CLBs, designers can implement encoder decoding, PWM generation, current-loop PI control, and CAN or RS-485 communication in a single device. The 3.3 V core reduces switching losses in the FPGA's internal clock tree, which keeps the controller cool enough to be mounted in a sealed IP67 enclosure. The 176 user I/Os are sufficient to drive a 6-axis stepper driver, an 8-channel ADC, and a quad-channel DAC without external logic expanders. Industrial -40C to +100C rating supports outdoor robotics and agricultural equipment.
Recomendado
Legacy Medical Imaging Interface
The XC3090L-7TQG176I is used in service-replacement boards for medical imaging systems (ultrasound, endoscopy video processors) where regulatory re-qualification of an FPGA is prohibitively expensive. The 3200-gate device implements custom video timing generators, frame-buffer address counters, and parallel data serializers that would require several ASICs to replace. Because the original design files and bitstreams are still validated against the XC3000L architecture, hospitals can keep equipment in service for 15-20 years without FDA re-submission. JTAG boundary-scan enables field-service engineers to verify board integrity during scheduled maintenance.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC3090L-7TQG176I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC3090L-7TQG176C | XC3090L-6TQG176I | XC3090L-6TQG176C | XC3090L-7TQ176I |
|---|---|---|---|---|---|
| Package | TQG-176 (0.5 mm pitch, plastic TQFP) | TQG-176 (same) | TQG-176 (same) | TQG-176 (same) | TQ-176 (1.0 mm pitch, different PCB footprint) |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Usable Gates | 3200 | 3200 | 3200 | 3200 | 3200 |
| Configurable Logic Blocks (CLBs) | 100 | 100 | 100 | 100 | 100 |
| Speed Grade | -7 | -7 | -6 (slower) | -6 (slower) | -7 |
| Temperature Range | -40C to +100C (Industrial -I) | 0C to +85C (Commercial -C, narrower) | -40C to +100C (Industrial -I) | 0C to +85C (Commercial -C) | -40C to +100C (Industrial -I) |
| Core Voltage (Vcc) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Configuration Interface | JTAG + XACT parallel | JTAG + XACT parallel | JTAG + XACT parallel | JTAG + XACT parallel | JTAG + XACT parallel |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Industrial -40C to +100C temperature range (vs XC3090L-7TQG176C)
- Faster -7 speed grade (vs XC3090L-6TQG176I)
- TQG-176 fine-pitch package (vs XC3090L-7TQ176I)
Notas de projeto
The XC3090L-7TQG176I operates from a 3.3 V Vcc core supply. Decouple each Vcc pin with a 0.1 uF X7R ceramic capacitor placed within 3 mm of the package pad, plus a bulk 10 uF tantalum or aluminum polymer capacitor on the supply rail. Each I/O bank (A through H) has a separate Vcco pin that may be tied to 3.3 V or 5 V to support mixed-voltage interfacing. Estimate: the typical 3.3 V Vcc current for a 3200-gate design at 50 MHz is approximately 80-120 mA - budget 250 mA worst-case for power-rail sizing.
The TQG-176 package uses a 0.5 mm lead pitch. Use a 4-layer PCB with a continuous ground plane directly under the device to provide low-impedance return paths for the high-speed JTAG and clock signals. Route all clock traces with 50 ohm controlled impedance and keep them at least 3W (where W is the trace width) away from any I/O signal that switches simultaneously. Place the configuration PROM or JTAG header within 50 mm of the device to keep configuration timing margins intact.
Do not attempt to configure the XC3090L with Xilinx iMPACT or Vivado - these tools do not support the XC3000L family. Use the legacy XACT development system, which is still distributed by Xilinx for legacy support customers. Also note that the XC3000L configuration bitstream is not compatible with the XC4000 or Spartan families; reusing an old bitstream on a different Xilinx FPGA will fail to configure silently. Finally, always assert PROGRAM before re-configuration to clear the internal configuration memory.
Informações de conformidade
RoHS compliant per Xilinx product page. Lead-free matte-tin finish. Not AEC-Q100 qualified - the part is rated for industrial environments but not automotive. Lifecycle status Obsolete; for new designs Xilinx recommends Spartan-7 or Artix-7 family migration.
