XC6SLX9-N3FT256I - 9K Logic FPGA, 186 I/O | AMD
部品番号: XC6SLX9-N3FT256I ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
XC6SLX9-N3FT256I 概要
A Spartan-6 FPGA is a programmable-logic semiconductor used to implement parallel data paths, control logic, state machines, interfaces, and signal processing. It belongs to the FPGA and CPLD hierarchy, combines configurable logic with programmable I/O, and is programmed through a configuration chain or memory interface. This makes the device suitable for embedded control, communications, instrumentation, industrial automation, and test equipment.
The part identifier identifies an XC6SLX9 device in the N3 speed and FT256 package variant. The verified listing reports 186 I/O, 9,152 logic elements, and 589,824 RAM bits. The package is identified as 256-LBGA, while one cross-reference result describes it as a 256-FTBGA surface-mount package measuring 17 mm by 17 mm. Pin-level placement and all 256 ball assignments require the official package pinout data before board layout is approved.
The -N3 portion is associated with the device’s specified speed and temperature grade in the manufacturer ordering information, but the supplied web data does not provide a complete timing table, operating-temperature range, power table, or lifecycle statement. Those parameters should be taken from the relevant Spartan-6 device datasheet and package files rather than inferred from the distributor listings. The cross-reference data identifies the same XC6SLX9-N3FT256I part in a 256-FTBGA package with 1.14 V to 1.26 V supply voltage and a -40°C to 100°C operating junction-temperature description.
Typical design use includes industrial control systems, communication interfaces, data acquisition, test-and-measurement equipment, and embedded instrumentation. Configuration storage, clocking, bank voltage, I/O standards, and decoupling must be planned together because incorrect bank voltage or signal-integrity assumptions can prevent reliable operation. For replacements, the exact package, pinout, speed grade, temperature grade, memory resources, and configuration compatibility are decisive.
This page consolidates verified distributor listings, package information, cross-reference results, and engineering guidance. It does not invent missing electrical, timing, lifecycle, or pinout values; unavailable specifications remain marked for validation against AMD documentation.
ドロップイン代替品: XC6SLX9-N3FT256I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC6SLX9-N3FT256I （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Speed Grade, Mounting Type, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
XC6SLX9-2FT256I
✅ ドロップイン✓ 在庫あり
$23.1 / 個
データシートを見る →XC6SLX9-2FTG256I
✅ ドロップイン✓ 在庫あり
$21.75 / 個
データシートを見る →XC6SLX9-2FTG256C
✅ ドロップイン✓ 在庫あり
$27.85 / 個
データシートを見る →XC6SLX9-3FT256I
✅ ドロップイン✓ 在庫あり
$50.64 / 個
データシートを見る →XC6SLX9-N3FTG256I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX9-N3FTG256C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX9-N3FT256I 最大定格＆電気的特性
| Device Type | Spartan-6 LX Field Programmable Gate Array (FPGA) |
| Logic Elements | 9,152 |
| I/O Count | 186 |
| RAM Bits | 589,824 |
| パッケージ | 256-LBGA |
| Package Description | 256-FTBGA surface-mount package, 17 mm x 17 mm |
| Supply Voltage Range | 1.14 V to 1.26 V |
| 動作接合温度 | -40°C to 100°C |
| Speed Designation | N3 |
| 実装タイプ | Surface Mount |
| Programmable Logic Type | FPGA |
| ピン数 | 256 balls |
| Manufacturer | AMD |
XC6SLX9-N3FT256I 256-ftbga surface-mount package, 17 mm x 17 mm ピン配置ガイド
XC6SLX9-N3FT256I (256-ftbga surface-mount package, 17 mm x 17 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC6SLX9-N3FT256I.
詳細は データシート をご参照ください。
主な用途
XC6SLX9-N3FT256I の用途: 6 件s: Industrial Control Logic, Communications Interface Consolidation, Data-Acquisition and Test Equipment, Programmable Signal Conditioning, Embedded Instrumentation and Measurement, FPGA-Based Education and Prototype Platforms.
Industrial Control Logic
The AMD XC6SLX9-N3FT256I fits industrial control systems that combine parallel logic, sensor conditioning interfaces, and supervisory state machines. Its verified 9,152 logic elements and 589,824 RAM bits provide enough configurable resources for sequencing, timing, event logging, and communication-control functions in a compact Spartan-6 LX design. The 186-I/O count is useful when a controller must connect directly to sensors, actuators, relays, and field-bus transceivers. Place the FPGA near the signal-conditioning section and route high-speed or noisy edges through controlled PCB layers. The supplied data identifies a 1.14 V to 1.26 V supply range, but production designs must confirm core power sequencing, I/O-bank voltages, decoupling, and thermal margins from the AMD datasheet.
おすすめ
Communications Interface Consolidation
The XC6SLX9-N3FT256I is appropriate for consolidating low- and medium-speed communications interfaces in embedded industrial equipment. The 186 I/O and 9,152 logic elements can support UART, SPI, parallel bus, protocol conversion, packet framing, and test-point logic without relying on a large processor for every interface. Its block RAM can be used for buffering and protocol state, while the FPGA fabric can implement deterministic timing and fault handling. The 256-BGA package requires careful ball escape routing and a verified package stack-up before layout release. Confirm supported I/O standards, bank voltage limits, clock topology, and input/output timing from the official AMD documentation; those values are not supplied in the retrieved snippets.
おすすめ
Data-Acquisition and Test Equipment
The AMD XC6SLX9-N3FT256I can serve as the control and capture fabric in data-acquisition or test equipment, where parallel ADC and DAC interfaces need deterministic timing. Its verified 186 I/O supports multiple digital channels, while 9,152 logic elements and 589,824 RAM bits can implement counters, trigger logic, capture buffers, calibration tables, and communication backends. Use the FPGA alongside high-speed or precision converters and ensure the package ball assignments support the intended pinout. The supplied cross-reference data gives a 1.14 V to 1.26 V supply range and a -40°C to 100°C operating junction-temperature description, but converter interface voltage, acquisition timing, and clock-jitter requirements must be validated independently.
おすすめ
Programmable Signal Conditioning
The XC6SLX9-N3FT256I is useful for programmable signal-conditioning front ends where sensor signals require switching, gain selection, filtering, offset correction, or timing alignment. The FPGA can implement digital filters and control sequences while its 186 I/O provide connections to multiplexers, amplifiers, converters, and calibration storage. Its 589,824 RAM bits allow sample buffers and coefficient storage, although implementation feasibility depends on the desired architecture and timing closure. Keep analog and digital return currents separated, use a defined grounding strategy, and place decoupling near the package power balls. The supplied data does not state supported I/O standards or performance grades, so engineers must verify those details from the official package and device documentation before committing the design.
おすすめ
Embedded Instrumentation and Measurement
The AMD XC6SLX9-N3FT256I fits compact instrumentation products that need programmable measurement sequencing, calibration, and a flexible digital interface. Its Spartan-6 LX architecture can host counters, digital state machines, memory buffers, trigger logic, and protocol conversion while the 256-BGA package supports a high pin-count board layout. A practical system can pair the FPGA with precision converters, amplifiers, and a communications controller while preserving deterministic timing in the fabric. Validate the complete power tree and I/O-bank plan against the AMD documentation, especially because the retrieved data only confirms a 1.14 V to 1.26 V supply range and does not provide complete timing, power, or I/O tables.
おすすめ
FPGA-Based Education and Prototype Platforms
The XC6SLX9-N3FT256I is suitable for FPGA education, prototype platforms, and embedded-systems experiments because it provides 9,152 logic elements, 186 I/O, and 589,824 RAM bits in a programmable package. Students can implement counters, processors, memory controllers, serial links, and mixed-signal control examples while using the same device family for laboratory projects. The 256-BGA footprint is demanding for a first prototype, so use an established board or a verified carrier rather than improvising the land pattern. Confirm pin assignments and configuration requirements from AMD’s package files, and treat the distributor’s 186-I/O listing as a verified resource statement rather than permission to assign every ball without checking bank and power constraints.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC6SLX9-N3FT256I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC6SLX9-2FT256I | XC6SLX9-2FTG256I | XC6SLX9-2FTG256C | XC6SLX9-3FT256I |
|---|---|---|---|---|---|
| Device Family | Spartan-6 LX FPGA | Spartan-6 LX FPGA | Spartan-6 LX FPGA | Spartan-6 LX FPGA | Spartan-6 LX FPGA |
| Package | 256-LBGA / 256-FTBGA family | 256-FTBGA family - same package class | 256-FTBGA - same package class | 256-FTBGA - same package class | 256-LBGA - same package class |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Speed Designation | N3 | 2 | 2 | 2 | 3 |
主な差別化要因
- Target resource profile （vs XC6SLX9-3FT256I)
- Commercial availability signal （vs XC6SLX9-N3FTG256I)
- Exact orderable configuration （vs XC6SLX9-2FTG256C)
設計ノート
Do not create a 256-BGA land pattern from the distributor package label alone. Download the exact AMD package pinout file for XC6SLX9-N3FT256I, confirm whether the package is designated 256-LBGA or 256-FTBGA, and check ball assignments, power balls, configuration pins, and exposed-pad requirements. The supplied data does not enumerate all 256 pins, so a released PCB design must be checked against the manufacturer package file and the selected stack-up.
The verified cross-reference data reports a 1.14 V to 1.26 V supply range, but that value alone is not a complete power specification. Validate core voltage tolerance, I/O-bank voltage ranges, configuration supply behavior, power-up ordering, and decoupling values in the AMD datasheet. Place bulk and high-frequency decoupling close to the relevant package balls, and provide clean return paths to minimize simultaneous-switching noise.
Route high-speed clocks, configuration signals, and sensitive interfaces with controlled impedance and short return paths. Separate clock and data routing from noisy power-regulator and switching-node areas, maintain the package escape geometry recommended for the 256-BGA footprint, and use ground-plane continuity across layer transitions. Verify every pin-to-pin migration candidate against the exact package pinout before treating it as a drop-in replacement.
Do not assume that related Spartan-6 LX orderable part numbers are interchangeable merely because their names look similar. The retrieved cross-reference results identify XC6SLX9-2FT256I, XC6SLX9-2FTG256I, XC6SLX9-3FT256I, and XC6SLX9-N3FTG256I as comparison candidates, but the supplied data does not verify speed timing, temperature grade, package suffix, or full pin compatibility. Obtain manufacturer documentation and run a formal migration review before substitution.
コンプライアンス情報
Compliance data is not present in the supplied verified web results. No RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status should be inferred from the FPGA category or distributor listing.
