XC7A200T-1FB484I - 215K-Cell Artix-7 FPGA | AMD | Industrial
部品番号: XC7A200T-1FB484I ✓ 生産中XC7A200T-1FB484I 概要
An FPGA is a programmable semiconductor in the broader hierarchy of programmable logic devices, logic integrated circuits, and digital semiconductors. Artix-7 devices combine configurable logic, block RAM, programmable input/output, and dedicated clocking resources on one device. This combination allows designers to implement parallel digital logic, interface adaptation, signal processing, and embedded control functions without relying on a fixed application-specific circuit.
The XC7A200T-1FB484I provides 215,360 logic cells, 134,553,60 as presented by the distributor record, 485,360 register bits, and an operating core voltage identified as 1 V. The industrial ordering suffix selects extended-temperature suitability, while the speed-grade 1 suffix indicates the device performance class within the Artix-7 family. Its 484-ball fine-pitch package supports high-density connections while requiring careful PCB layout, thermal analysis, and assembly control.
The Artix-7 architecture is suitable for designs that require more parallelism than a microcontroller or discrete logic implementation can provide. Its fabric can host parallel data paths, control state machines, protocol bridges, and fixed-pipeline processing blocks. Dedicated memory resources support buffering and data alignment, while programmable I/O can accommodate multiple interface standards within the electrical limits of the selected banks and package pins.
Typical applications include industrial automation, camera and imaging control, communications infrastructure, test and measurement systems, instrumentation, and embedded signal-processing equipment. The device is also appropriate for prototype platforms where programmable logic allows interfaces, timing, and control algorithms to be revised without changing the PCB.
The primary design consideration is the fine-pitch BGA land pattern. A qualified PCB stack-up, escape-routing strategy, power-distribution network, and assembly process are necessary for reliable manufacture. Designers should also confirm the exact pinout, supported I/O standards, configuration method, and power requirements in AMD package documentation before releasing the hardware.
This product record combines the verified device identity, package information, family-level architecture, and engineering guidance with commercial forms for quotation, availability, and lifecycle review. It also provides focused selection criteria for distinguishing speed-grade, temperature-grade, and package variants before design commitment.
ドロップイン代替品: XC7A200T-1FB484I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC7A200T-1FB484I （同一形状・フットプリント） — 相違点: Package, Speed Grade, Mounting Type, Device Type, Temperature Grade.
XC7A200T-1FBG484C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7A200T-1FBG484E
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7A200T-2FBG484I
✅ ドロップイン ⚠️ 仕様未検証✗ 在庫切れ
$89.15 / 個
データシートを見る →XC7A200T-1SBG484I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7A200T-1SB484I
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC7A200T-1FB484I 最大定格＆電気的特性
| Device Type | Artix-7 Field Programmable Gate Array (FPGA) |
| Programmable Logic Cells | 215,360 cells |
| System Logic Cells | 285,000 cells |
| Register Bits | 485,360 bits |
| Process Technology | 28 nm |
| Core Voltage | 1 V |
| Speed Grade | Grade 1 |
| Temperature Grade | Industrial, -40 C to +100 C |
| パッケージ | 484-BBGA, lidless FCBGA |
| Package Designation | FB484 |
| Package Dimensions | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| Ball Count | 484 balls |
| 実装タイプ | Surface Mount |
| Product Family | Artix-7 |
| Programmable Logic Type | FPGA |
XC7A200T-1FB484I 23 x 23 mm ピン配置ガイド
XC7A200T-1FB484I (23 x 23 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC7A200T-1FB484I.
詳細は データシート をご参照ください。
主な用途
XC7A200T-1FB484I の用途: 6 件s: Industrial Automation and Control, Camera and Imaging Control, Communications Infrastructure, Test and Measurement Instrumentation, Industrial Sensor Aggregation, Embedded Signal Processing.
Industrial Automation and Control
The XC7A200T-1FB484I fits industrial control systems that need multiple parallel channels, deterministic sequencing, and adaptable I/O behavior. Its 215,360 programmable logic cells and 485,360 register bits can implement motion-control state machines, machine interlocks, protocol conversion, and sensor conditioning logic in one programmable device. The industrial-temperature grade is appropriate for equipment operating beyond a room-temperature commercial environment. Place the FPGA beside the controlled power and sensor interfaces, then allocate separate clocking and power regions to avoid coupling noisy switching stages into timing-critical logic.
おすすめ
Camera and Imaging Control
The XC7A200T-1FB484I is suitable for camera modules that require parallel capture control, frame synchronization, exposure control, and data-path routing. Its large programmable fabric allows multiple independent image-processing stages to execute concurrently, while the 1 V core operation suits high-performance logic systems. The designer should use the official FB484 pinout to map clocks, data lanes, control signals, and configuration pins, and should keep high-speed data routes short and impedance controlled to preserve signal integrity from sensor to processor.
おすすめ
Communications Infrastructure
The XC7A200T-1FB484I can serve in communications equipment requiring parallel packet processing, buffering, aggregation, and interface adaptation. The 215,360 logic cells allow designers to implement multiple data paths concurrently, while dedicated programmable I/O supports board-level communication interfaces when their voltage and timing requirements are met. For line-card or baseband designs, isolate high-speed transceiver lanes from sensitive control logic, maintain continuous reference-clock distribution, and verify every high-speed I/O standard against the device's supported bank configurations.
おすすめ
Test and Measurement Instrumentation
The XC7A200T-1FB484I is well suited to programmable test and measurement front ends that require configurable timing, acquisition pipelines, trigger logic, and protocol support. Its logic fabric can combine multiple counters, digital pattern generators, decision trees, and acquisition control blocks without relying exclusively on a microcontroller. The designer should partition critical timing paths from analog-adjacent circuitry, use clock-capable pins for high-fidelity clock distribution, and validate jitter, I/O standards, and acquisition bandwidth before committing to the device configuration.
おすすめ
Industrial Sensor Aggregation
The XC7A200T-1FB484I can aggregate and process data from multiple industrial sensors when the design requires configurable digital filtering, event correlation, and timestamp handling. Its 215,360 logic cells support parallel sensor channels, while the 485,360 register bits provide state and buffering resources for deterministic pipelines. Use the industrial-temperature ordering grade only after checking the complete enclosure temperature profile, and isolate field-side inputs from sensitive logic. Configuration storage, watchdogs, and startup sequencing should be included so the system remains recoverable after power interruptions.
おすすめ
Embedded Signal Processing
The XC7A200T-1FB484I supports fixed-pipeline and parallel signal-processing implementations that benefit from deterministic hardware execution. The programmable fabric can implement filters, correlation, interpolation, data formatting, and control functions while the 485,360 register bits support intermediate data paths. For analog or mixed-signal systems, the FPGA should be paired with suitable converters and clocking circuitry, with attention to conversion latency, data alignment, and clock-domain crossings. Validate throughput and timing using realistic traffic rather than isolated block performance.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC7A200T-1FB484I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC7A200T-1FBG484C | XC7A200T-1FBG484E | XC7A200T-2FBG484I | XC7A200T-1SBG484I | XC7A200T-1SB484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-BBGA, lidless FCBGA | 484-BBGA, lidless FCBGA | 484-BBGA, lidless FCBGA | 484-BBGA, lidless FCBGA | 484-BBGA, lidless FCBGA | 484-BBGA, lidless FCBGA |
| FPGA Family | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 |
| Programmable Logic Cells | 215,360 cells | 215,360 cells | 215,360 cells | 215,360 cells | 215,360 cells | 215,360 cells |
| Speed Grade | Grade 1 | Grade 1 | Grade 1 | Grade 2 | Grade 1 | Grade 1 |
| Temperature Grade | Industrial, -40 C to +100 C | Commercial, 0 C to +85 C | Extended temperature grade | Industrial, -40 C to +100 C | Industrial, -40 C to +100 C | Industrial, -40 C to +100 C |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
| Core Voltage | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
主な差別化要因
- Industrial temperature coverage （vs XC7A200T-1FBG484C)
- Identical Artix-7 logic capacity （vs XC7A200T-2FBG484I)
- Fine-pitch high-density integration （vs XC7A200T-1SB484I)
設計ノート
Treat the 484-ball, 1.0 mm-pitch FCBGA as a demanding fine-pitch assembly. Base the PCB stack-up on the package mechanical drawing, route escape layers consistently, and maintain the required ball-pad geometry and solder-mask definition. Confirm the assembly house's capability for the selected board size, copper weight, via strategy, and X-ray inspection requirements before schematic and layout sign-off.
Separate core, I/O, and auxiliary supply routing according to the AMD power-distribution guidance, then use the device's recommended decoupling network close to the relevant balls. Estimated power depends on design utilization, I/O activity, clocking, and voltage; calculate junction temperature from the actual board and enclosure rather than using logic-cell count alone. Provide current headroom for startup, configuration, and worst-case I/O states.
Assign clocks and high-speed interfaces only to pins approved for their signaling requirements in the official FB484 pinout. Keep configuration pins, dedicated grounds, and user I/O assignments consistent across schematic, constraints, and PCB files. Use a repeatable ball-map verification step to catch translated or mirrored BGA errors, and compare the final netlist against the AMD package pinout file before fabrication.
Plan thermal performance around the lidless FCBGA package, exposed thermal balls, copper layers, vias, airflow, and the maximum expected ambient temperature. Estimated: with total device dissipation represented as P and effective board-to-ambient resistance represented as Theta_EA, junction rise is approximately P multiplied by Theta_EA; replace these variables with values from the actual PCB and enclosure design before making a thermal decision.
コンプライアンス情報
The FB484 package is described as a lidless FCBGA, but no explicit RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive qualification statement is present. The industrial-temperature suffix does not by itself establish AEC-Q100 qualification.
