XC7A200T-1FB484I - 215K-Cell Artix-7 FPGA | AMD | Industrial
MPN： XC7A200T-1FB484I ✓ 啟用中XC7A200T-1FB484I 概覽
An FPGA is a programmable semiconductor in the broader hierarchy of programmable logic devices, logic integrated circuits, and digital semiconductors. Artix-7 devices combine configurable logic, block RAM, programmable input/output, and dedicated clocking resources on one device. This combination allows designers to implement parallel digital logic, interface adaptation, signal processing, and embedded control functions without relying on a fixed application-specific circuit.
The XC7A200T-1FB484I provides 215,360 logic cells, 134,553,60 as presented by the distributor record, 485,360 register bits, and an operating core voltage identified as 1 V. The industrial ordering suffix selects extended-temperature suitability, while the speed-grade 1 suffix indicates the device performance class within the Artix-7 family. Its 484-ball fine-pitch package supports high-density connections while requiring careful PCB layout, thermal analysis, and assembly control.
The Artix-7 architecture is suitable for designs that require more parallelism than a microcontroller or discrete logic implementation can provide. Its fabric can host parallel data paths, control state machines, protocol bridges, and fixed-pipeline processing blocks. Dedicated memory resources support buffering and data alignment, while programmable I/O can accommodate multiple interface standards within the electrical limits of the selected banks and package pins.
Typical applications include industrial automation, camera and imaging control, communications infrastructure, test and measurement systems, instrumentation, and embedded signal-processing equipment. The device is also appropriate for prototype platforms where programmable logic allows interfaces, timing, and control algorithms to be revised without changing the PCB.
The primary design consideration is the fine-pitch BGA land pattern. A qualified PCB stack-up, escape-routing strategy, power-distribution network, and assembly process are necessary for reliable manufacture. Designers should also confirm the exact pinout, supported I/O standards, configuration method, and power requirements in AMD package documentation before releasing the hardware.
This product record combines the verified device identity, package information, family-level architecture, and engineering guidance with commercial forms for quotation, availability, and lifecycle review. It also provides focused selection criteria for distinguishing speed-grade, temperature-grade, and package variants before design commitment.
直接替換替代品，適用於 XC7A200T-1FB484I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7A200T-1FB484I （相同外形與佔位） — 差異在於 Package, Speed Grade, Mounting Type, Device Type, Temperature Grade.
XC7A200T-1FBG484C
✅ 直接替換📋 參考替代品（不在目錄中）
XC7A200T-1FBG484E
✅ 直接替換📋 參考替代品（不在目錄中）
XC7A200T-2FBG484I
✅ 直接替換 ⚠️ 規格未經驗證✗ 缺貨
$89.15 / 單位
查看資料表 →XC7A200T-1SBG484I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC7A200T-1SB484I
✅ 直接替換聯絡詢價
查看資料表 →XC7A200T-1FB484I 最大額定值與電氣特性
| Device Type | Artix-7 Field Programmable Gate Array (FPGA) |
| Programmable Logic Cells | 215,360 cells |
| System Logic Cells | 285,000 cells |
| Register Bits | 485,360 bits |
| Process Technology | 28 nm |
| Core Voltage | 1 V |
| Speed Grade | Grade 1 |
| Temperature Grade | Industrial, -40 C to +100 C |
| 封裝 | 484-BBGA, lidless FCBGA |
| Package Designation | FB484 |
| Package Dimensions | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| Ball Count | 484 balls |
| 安裝類型 | Surface Mount |
| Product Family | Artix-7 |
| Programmable Logic Type | FPGA |
XC7A200T-1FB484I 23 x 23 mm 腳位配置指南
XC7A200T-1FB484I（23 x 23 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC7A200T-1FB484I.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC7A200T-1FB484I 適用於 6 應用s: Industrial Automation and Control, Camera and Imaging Control, Communications Infrastructure, Test and Measurement Instrumentation, Industrial Sensor Aggregation, Embedded Signal Processing.
Industrial Automation and Control
The XC7A200T-1FB484I fits industrial control systems that need multiple parallel channels, deterministic sequencing, and adaptable I/O behavior. Its 215,360 programmable logic cells and 485,360 register bits can implement motion-control state machines, machine interlocks, protocol conversion, and sensor conditioning logic in one programmable device. The industrial-temperature grade is appropriate for equipment operating beyond a room-temperature commercial environment. Place the FPGA beside the controlled power and sensor interfaces, then allocate separate clocking and power regions to avoid coupling noisy switching stages into timing-critical logic.
推薦
Camera and Imaging Control
The XC7A200T-1FB484I is suitable for camera modules that require parallel capture control, frame synchronization, exposure control, and data-path routing. Its large programmable fabric allows multiple independent image-processing stages to execute concurrently, while the 1 V core operation suits high-performance logic systems. The designer should use the official FB484 pinout to map clocks, data lanes, control signals, and configuration pins, and should keep high-speed data routes short and impedance controlled to preserve signal integrity from sensor to processor.
推薦
Communications Infrastructure
The XC7A200T-1FB484I can serve in communications equipment requiring parallel packet processing, buffering, aggregation, and interface adaptation. The 215,360 logic cells allow designers to implement multiple data paths concurrently, while dedicated programmable I/O supports board-level communication interfaces when their voltage and timing requirements are met. For line-card or baseband designs, isolate high-speed transceiver lanes from sensitive control logic, maintain continuous reference-clock distribution, and verify every high-speed I/O standard against the device's supported bank configurations.
推薦
Test and Measurement Instrumentation
The XC7A200T-1FB484I is well suited to programmable test and measurement front ends that require configurable timing, acquisition pipelines, trigger logic, and protocol support. Its logic fabric can combine multiple counters, digital pattern generators, decision trees, and acquisition control blocks without relying exclusively on a microcontroller. The designer should partition critical timing paths from analog-adjacent circuitry, use clock-capable pins for high-fidelity clock distribution, and validate jitter, I/O standards, and acquisition bandwidth before committing to the device configuration.
推薦
Industrial Sensor Aggregation
The XC7A200T-1FB484I can aggregate and process data from multiple industrial sensors when the design requires configurable digital filtering, event correlation, and timestamp handling. Its 215,360 logic cells support parallel sensor channels, while the 485,360 register bits provide state and buffering resources for deterministic pipelines. Use the industrial-temperature ordering grade only after checking the complete enclosure temperature profile, and isolate field-side inputs from sensitive logic. Configuration storage, watchdogs, and startup sequencing should be included so the system remains recoverable after power interruptions.
推薦
Embedded Signal Processing
The XC7A200T-1FB484I supports fixed-pipeline and parallel signal-processing implementations that benefit from deterministic hardware execution. The programmable fabric can implement filters, correlation, interpolation, data formatting, and control functions while the 485,360 register bits support intermediate data paths. For analog or mixed-signal systems, the FPGA should be paired with suitable converters and clocking circuitry, with attention to conversion latency, data alignment, and clock-domain crossings. Validate throughput and timing using realistic traffic rather than isolated block performance.
推薦
推薦產品摘要
工程參考資料，適用於 XC7A200T-1FB484I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7A200T-1FBG484C | XC7A200T-1FBG484E | XC7A200T-2FBG484I | XC7A200T-1SBG484I | XC7A200T-1SB484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-BBGA, lidless FCBGA | 484-BBGA, lidless FCBGA | 484-BBGA, lidless FCBGA | 484-BBGA, lidless FCBGA | 484-BBGA, lidless FCBGA | 484-BBGA, lidless FCBGA |
| FPGA Family | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 |
| Programmable Logic Cells | 215,360 cells | 215,360 cells | 215,360 cells | 215,360 cells | 215,360 cells | 215,360 cells |
| Speed Grade | Grade 1 | Grade 1 | Grade 1 | Grade 2 | Grade 1 | Grade 1 |
| Temperature Grade | Industrial, -40 C to +100 C | Commercial, 0 C to +85 C | Extended temperature grade | Industrial, -40 C to +100 C | Industrial, -40 C to +100 C | Industrial, -40 C to +100 C |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
| Core Voltage | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
主要差異化特點
- Industrial temperature coverage (對比XC7A200T-1FBG484C)
- Identical Artix-7 logic capacity (對比XC7A200T-2FBG484I)
- Fine-pitch high-density integration (對比XC7A200T-1SB484I)
設計說明
Treat the 484-ball, 1.0 mm-pitch FCBGA as a demanding fine-pitch assembly. Base the PCB stack-up on the package mechanical drawing, route escape layers consistently, and maintain the required ball-pad geometry and solder-mask definition. Confirm the assembly house's capability for the selected board size, copper weight, via strategy, and X-ray inspection requirements before schematic and layout sign-off.
Separate core, I/O, and auxiliary supply routing according to the AMD power-distribution guidance, then use the device's recommended decoupling network close to the relevant balls. Estimated power depends on design utilization, I/O activity, clocking, and voltage; calculate junction temperature from the actual board and enclosure rather than using logic-cell count alone. Provide current headroom for startup, configuration, and worst-case I/O states.
Assign clocks and high-speed interfaces only to pins approved for their signaling requirements in the official FB484 pinout. Keep configuration pins, dedicated grounds, and user I/O assignments consistent across schematic, constraints, and PCB files. Use a repeatable ball-map verification step to catch translated or mirrored BGA errors, and compare the final netlist against the AMD package pinout file before fabrication.
Plan thermal performance around the lidless FCBGA package, exposed thermal balls, copper layers, vias, airflow, and the maximum expected ambient temperature. Estimated: with total device dissipation represented as P and effective board-to-ambient resistance represented as Theta_EA, junction rise is approximately P multiplied by Theta_EA; replace these variables with values from the actual PCB and enclosure design before making a thermal decision.
合規資訊
The FB484 package is described as a lidless FCBGA, but no explicit RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive qualification statement is present. The industrial-temperature suffix does not by itself establish AEC-Q100 qualification.
