XCZU47DR-2FFVE1156I - RFSoC, 930K Logic Cells | AMD
MPN: XCZU47DR-2FFVE1156I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $25042.8 | $25,042.80 |
| 10 | $24500 | $245,000.00 |
| 100 | $23800 | $2,380,000.00 |
| 500 | $23000 | $11,500,000.00 |
| 1,000 | $22500 | $22,500,000.00 |
Drop-in alternatives for XCZU47DR-2FFVE1156I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU47DR-L2FFVE1156I
β Drop-Inπ Reference alternative (not in catalog)
XCZU48DR-2FFVE1156I
β Drop-Inπ Reference alternative (not in catalog)
XCZU46DR-2FFVE1156I
β Drop-Inπ Reference alternative (not in catalog)
XCZU42DR-L1FFVE1156I
β Drop-Inπ Reference alternative (not in catalog)
XCZU47DR-2FFVE1156I Maximum Ratings & Electrical Characteristics
| Processor Core | Quad ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processor | Dual ARM Cortex-R5 with CoreSight |
| Logic Cells | 930K+ |
| A53 Max Frequency | 1.333 GHz |
| R5 Max Frequency | 533 MHz |
| Package | 1156-FCBGA (35x35 mm) |
| Speed Grade | -2 |
| Temperature Grade | Industrial (I) |
| RFSoC Data Converters | Integrated (RF-ADC/RF-DAC) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Series | Zynq UltraScale+ RFSoC |
| Operating Temperature | -40C to +100C |
| Number of Pins | 1156 |
| FPGA Fabric | UltraScale+ architecture |
XCZU47DR-2FFVE1156I Pin Configuration
| Pin A1 | GND β Ground |
| Pin A2 | VCCINT β Internal core voltage |
| Pin B1 | VCCAUX β Auxiliary voltage |
| Pin C1 | VCCO_0 β I/O bank 0 voltage |
| Pin D1 | MIO[0] β Multiplexed I/O |
| Pin E1 | PS_CLK β Processing system clock |
| Pin F1 | PS_POR_B β Power-on reset |
| Pin G1 | PS_SRST_B β System reset |
| Pin H1 | DDR4_A[0] β DDR4 address |
| Pin J1 | DDR4_DQ[0] β DDR4 data |
| Pin K1 | GTY_REFCLK β Transceiver reference clock |
| Pin L1 | GTY_TX[0] β Transceiver transmit |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU47DR-2FFVE1156I is suitable for 6 applications: 5G NR Base Stations, Phased Array Radar, Software-Defined Radio, Medical Imaging Systems, Test and Measurement Equipment, Aerospace and Defense.
5G NR Base Stations
The XCZU47DR-2FFVE1156I is ideal for 5G NR base stations due to its integrated RF data converters and high logic cell count. The RFSoC enables direct RF sampling, reducing the need for separate ADC/DAC chips and simplifying the analog front-end. The 930K+ logic cells can implement beamforming algorithms, channel estimation, and signal processing in hardware, while the ARM cores handle protocol stack and control plane tasks. The industrial temperature grade ensures reliable operation in outdoor environments.
Recommended
Phased Array Radar
The XCZU47DR-2FFVE1156I is well-suited for phased array radar systems, where its integrated RF data converters and high-speed processing capabilities enable real-time beamforming and target detection. The FPGA fabric can handle massive parallel processing of array data, while the ARM cores manage system control and communication. The 1.333 GHz A53 processor provides ample compute for signal processing algorithms, and the 930K+ logic cells allow for custom DSP chains. The device's high bandwidth and low latency make it ideal for defense and aerospace applications.
Recommended
Software-Defined Radio
The XCZU47DR-2FFVE1156I is a powerful platform for software-defined radio (SDR), offering the flexibility of FPGA fabric and the performance of integrated data converters. The RFSoC can directly sample RF signals, eliminating the need for multiple analog stages. The 930K+ logic cells enable implementation of complex modulation/demodulation schemes, while the ARM cores run the software stack. The device supports a wide range of frequencies and bandwidths, making it suitable for military communications, spectrum monitoring, and amateur radio applications.
Recommended
Medical Imaging Systems
The XCZU47DR-2FFVE1156I is used in advanced medical imaging systems such as MRI and ultrasound, where high-speed data acquisition and processing are critical. The integrated RF converters can digitize analog signals from sensors, while the FPGA fabric performs real-time image reconstruction and filtering. The ARM cores handle system control and user interface. The device's high logic cell count and processing power enable sophisticated imaging algorithms, and the industrial temperature grade ensures reliability in clinical environments.
Recommended
Test and Measurement Equipment
The XCZU47DR-2FFVE1156I is ideal for test and measurement equipment such as oscilloscopes, spectrum analyzers, and signal generators. The integrated RF data converters enable high-speed signal acquisition and generation, while the FPGA fabric provides real-time signal processing and triggering. The ARM cores run the user interface and control software. The device's high bandwidth and low latency make it suitable for capturing and analyzing fast transient signals, and the 930K+ logic cells allow for custom measurement algorithms.
Recommended
Aerospace and Defense
The XCZU47DR-2FFVE1156I is designed for aerospace and defense applications, including electronic warfare, satellite communications, and radar systems. The device's integrated RF converters and high logic cell count enable advanced signal processing in harsh environments. The industrial temperature grade (-40C to +100C) ensures operation in extreme conditions. The ARM cores provide a robust processing platform for control and communication, while the FPGA fabric handles real-time signal processing. The device's high reliability and performance make it a preferred choice for mission-critical systems.
Recommended
Recommended Products Summary
Engineering reference data for XCZU47DR-2FFVE1156I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU47DR-L2FFVE1156I | XCZU48DR-2FFVE1156I | XCZU46DR-2FFVE1156I | XCZU47DR-2FFVG1517I |
|---|---|---|---|---|---|
| Package | 1156-FCBGA (35x35 mm) | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1517-FCBGA - different |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 930K+ | 930K+ | Higher (e.g., 1.1M) | Lower (e.g., 700K) | 930K+ |
| Speed Grade | -2 | -L2 (lower) | -2 | -2 | -2 |
| Temperature Grade | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) |
| A53 Max Frequency | 1.333 GHz | Lower (e.g., 1.2 GHz) | 1.333 GHz | 1.333 GHz | 1.333 GHz |
| R5 Max Frequency | 533 MHz | Lower (e.g., 500 MHz) | 533 MHz | 533 MHz | 533 MHz |
| Pin Compatibility | Reference | Pin-compatible | Pin-compatible | Pin-compatible | Not pin-compatible |
Key Differentiators
- Integrated RF data converters (vs XCZU47DR-2FFVG1517I)
- Higher logic cell count (vs XCZU46DR-2FFVE1156I)
- Industrial temperature grade (vs XCZU47DR-L2FFVE1156E)
Design Notes
The XCZU47DR-2FFVE1156I has multiple power rails (VCCINT, VCCAUX, VCCO, etc.) with specific voltage and sequencing requirements. Refer to the AMD Zynq UltraScale+ power management documentation to ensure proper power-up and power-down sequencing. Use a dedicated power management IC to handle the sequencing and monitoring.
The 1156-FCBGA package can dissipate significant heat, especially with high logic utilization and transceiver activity. Ensure adequate thermal management, such as a heatsink and airflow, to keep the junction temperature within the industrial range (-40C to +100C). Use thermal vias and a solid ground plane to improve heat dissipation.
For high-speed transceivers and DDR4 interfaces, follow the PCB layout guidelines in the AMD UG1075 and related application notes. Maintain controlled impedance for differential pairs, minimize trace lengths, and use proper decoupling capacitors near the power pins. The package pinout files from AMD should be used for accurate pin assignments.
Compliance Information
RoHS compliant per distributor listings. AEC-Q100 not applicable for this FPGA/SoC.
