XCZU47DR-2FFVE1156I - RFSoC, 930K Logic Cells | AMD
料号： XCZU47DR-2FFVE1156I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $25042.8 | $25,042.80 |
| 10 | $24500 | $245,000.00 |
| 100 | $23800 | $2,380,000.00 |
| 500 | $23000 | $11,500,000.00 |
| 1,000 | $22500 | $22,500,000.00 |
XCZU47DR-2FFVE1156I 概述
A Zynq UltraScale+ RFSoC is a class of adaptive SoC that monolithically integrates data converters (ADCs and DACs) alongside the programmable logic and processing system, eliminating the need for separate converter chips in radio systems. This integration reduces board space, power, and latency, making it ideal for applications like 5G base stations, radar, and test equipment.
Key features include the ARM Cortex-A53 application processor running at up to 1.333 GHz, the ARM Cortex-R5 real-time processor at up to 533 MHz, and the 930K+ logic cells for custom hardware acceleration. The device also supports high-speed transceivers and DDR4 memory interfaces, enabling high-throughput data movement. The -2 speed grade indicates a high-performance variant, and the I suffix denotes an industrial temperature grade (-40C to +100C).
The RFSoC architecture combines the flexibility of FPGA fabric with the performance of dedicated converters, allowing designers to implement complex DSP chains in hardware while maintaining software programmability. The integrated converters support direct RF sampling, reducing analog front-end complexity. The device is supported by AMD's Vivado design suite and Vitis unified software platform.
Typical applications include 5G NR base stations, phased array radar, software-defined radio, and medical imaging systems. The high logic cell count and processing power make it suitable for beamforming, channel estimation, and real-time signal analysis. The industrial temperature grade ensures reliable operation in harsh environments.
When designing with this device, careful attention must be paid to power supply sequencing and decoupling, as the RFSoC has multiple power rails with specific requirements. The package pinout files from AMD (UG1075) should be consulted for accurate pin assignments.
直接替换替代料： XCZU47DR-2FFVE1156I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XCZU47DR-2FFVE1156I （相同外形与封装尺寸） ——差异在于 Temperature Grade.
快速对比工具——选择替代料号进行并排对比：
XCZU47DR-L2FFVE1156I
✅ 直接替换📋 参考替代料（不在目录中）
XCZU48DR-2FFVE1156I
✅ 直接替换📋 参考替代料（不在目录中）
XCZU46DR-2FFVE1156I
✅ 直接替换📋 参考替代料（不在目录中）
XCZU42DR-L1FFVE1156I
✅ 直接替换📋 参考替代料（不在目录中）
XCZU47DR-2FFVE1156I 最大额定值与电气特性
| Processor Core | Quad ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processor | Dual ARM Cortex-R5 with CoreSight |
| Logic Cells | 930K+ |
| A53 Max Frequency | 1.333 GHz |
| R5 Max Frequency | 533 MHz |
| 封装 | 1156-FCBGA (35x35 mm) |
| Speed Grade | -2 |
| Temperature Grade | Industrial (I) |
| RFSoC Data Converters | Integrated (RF-ADC/RF-DAC) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Series | Zynq UltraScale+ RFSoC |
| 工作温度 | -40C to +100C |
| 引脚数 | 1156 |
| FPGA Fabric | UltraScale+ architecture |
XCZU47DR-2FFVE1156I 引脚配置
| 引脚 A1 | GND — Ground |
| 引脚 A2 | VCCINT — Internal core voltage |
| 引脚 B1 | VCCAUX — Auxiliary voltage |
| 引脚 C1 | VCCO_0 — I/O bank 0 voltage |
| 引脚 D1 | MIO[0] — Multiplexed I/O |
| 引脚 E1 | PS_CLK — Processing system clock |
| 引脚 F1 | PS_POR_B — Power-on reset |
| 引脚 G1 | PS_SRST_B — System reset |
| 引脚 H1 | DDR4_A[0] — DDR4 address |
| 引脚 J1 | DDR4_DQ[0] — DDR4 data |
| 引脚 K1 | GTY_REFCLK — Transceiver reference clock |
| 引脚 L1 | GTY_TX[0] — Transceiver transmit |
典型应用
XCZU47DR-2FFVE1156I 适用于 6 应用s: 5G NR Base Stations, Phased Array Radar, Software-Defined Radio, Medical Imaging Systems, Test and Measurement Equipment, Aerospace and Defense.
5G NR Base Stations
The XCZU47DR-2FFVE1156I is ideal for 5G NR base stations due to its integrated RF data converters and high logic cell count. The RFSoC enables direct RF sampling, reducing the need for separate ADC/DAC chips and simplifying the analog front-end. The 930K+ logic cells can implement beamforming algorithms, channel estimation, and signal processing in hardware, while the ARM cores handle protocol stack and control plane tasks. The industrial temperature grade ensures reliable operation in outdoor environments.
推荐
Phased Array Radar
The XCZU47DR-2FFVE1156I is well-suited for phased array radar systems, where its integrated RF data converters and high-speed processing capabilities enable real-time beamforming and target detection. The FPGA fabric can handle massive parallel processing of array data, while the ARM cores manage system control and communication. The 1.333 GHz A53 processor provides ample compute for signal processing algorithms, and the 930K+ logic cells allow for custom DSP chains. The device's high bandwidth and low latency make it ideal for defense and aerospace applications.
推荐
Software-Defined Radio
The XCZU47DR-2FFVE1156I is a powerful platform for software-defined radio (SDR), offering the flexibility of FPGA fabric and the performance of integrated data converters. The RFSoC can directly sample RF signals, eliminating the need for multiple analog stages. The 930K+ logic cells enable implementation of complex modulation/demodulation schemes, while the ARM cores run the software stack. The device supports a wide range of frequencies and bandwidths, making it suitable for military communications, spectrum monitoring, and amateur radio applications.
推荐
Medical Imaging Systems
The XCZU47DR-2FFVE1156I is used in advanced medical imaging systems such as MRI and ultrasound, where high-speed data acquisition and processing are critical. The integrated RF converters can digitize analog signals from sensors, while the FPGA fabric performs real-time image reconstruction and filtering. The ARM cores handle system control and user interface. The device's high logic cell count and processing power enable sophisticated imaging algorithms, and the industrial temperature grade ensures reliability in clinical environments.
推荐
Test and Measurement Equipment
The XCZU47DR-2FFVE1156I is ideal for test and measurement equipment such as oscilloscopes, spectrum analyzers, and signal generators. The integrated RF data converters enable high-speed signal acquisition and generation, while the FPGA fabric provides real-time signal processing and triggering. The ARM cores run the user interface and control software. The device's high bandwidth and low latency make it suitable for capturing and analyzing fast transient signals, and the 930K+ logic cells allow for custom measurement algorithms.
推荐
Aerospace and Defense
The XCZU47DR-2FFVE1156I is designed for aerospace and defense applications, including electronic warfare, satellite communications, and radar systems. The device's integrated RF converters and high logic cell count enable advanced signal processing in harsh environments. The industrial temperature grade (-40C to +100C) ensures operation in extreme conditions. The ARM cores provide a robust processing platform for control and communication, while the FPGA fabric handles real-time signal processing. The device's high reliability and performance make it a preferred choice for mission-critical systems.
推荐
推荐产品汇总
工程参考数据： XCZU47DR-2FFVE1156I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XCZU47DR-L2FFVE1156I | XCZU48DR-2FFVE1156I | XCZU46DR-2FFVE1156I | XCZU47DR-2FFVG1517I |
|---|---|---|---|---|---|
| Package | 1156-FCBGA (35x35 mm) | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1517-FCBGA - different |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 930K+ | 930K+ | Higher (e.g., 1.1M) | Lower (e.g., 700K) | 930K+ |
| Speed Grade | -2 | -L2 (lower) | -2 | -2 | -2 |
| Temperature Grade | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) |
| A53 Max Frequency | 1.333 GHz | Lower (e.g., 1.2 GHz) | 1.333 GHz | 1.333 GHz | 1.333 GHz |
| R5 Max Frequency | 533 MHz | Lower (e.g., 500 MHz) | 533 MHz | 533 MHz | 533 MHz |
| Pin Compatibility | Reference | Pin-compatible | Pin-compatible | Pin-compatible | Not pin-compatible |
关键差异点
- Integrated RF data converters （对比 XCZU47DR-2FFVG1517I)
- Higher logic cell count （对比 XCZU46DR-2FFVE1156I)
- Industrial temperature grade （对比 XCZU47DR-L2FFVE1156E)
设计说明
The XCZU47DR-2FFVE1156I has multiple power rails (VCCINT, VCCAUX, VCCO, etc.) with specific voltage and sequencing requirements. Refer to the AMD Zynq UltraScale+ power management documentation to ensure proper power-up and power-down sequencing. Use a dedicated power management IC to handle the sequencing and monitoring.
The 1156-FCBGA package can dissipate significant heat, especially with high logic utilization and transceiver activity. Ensure adequate thermal management, such as a heatsink and airflow, to keep the junction temperature within the industrial range (-40C to +100C). Use thermal vias and a solid ground plane to improve heat dissipation.
For high-speed transceivers and DDR4 interfaces, follow the PCB layout guidelines in the AMD UG1075 and related application notes. Maintain controlled impedance for differential pairs, minimize trace lengths, and use proper decoupling capacitors near the power pins. The package pinout files from AMD should be used for accurate pin assignments.
合规信息
RoHS compliant per distributor listings. AEC-Q100 not applicable for this FPGA/SoC.