FPGA & CPLD
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EP2SGX90FF150834 - Stratix II GX FPGA, 90K LE, 12x GXB | Altera
The Altera EP2SGX90FF150834 is a high-density Stratix II GX FPGA from the mature Altera (now Intel) Stratix II GX family, featuring approximately 90,000 equivalent logic elements, 4.5 Mbits of embedded memory, and 12 full-duplex multi-gigabit transceiver (GXB) channels. Housed in a 1508-ball FineLine BGA (FF) package, the device is built on a 90 nm process with 1.2 V core operation and integrates dedicated hardware multipliers, structured ASIC blocks, and a high-performance adaptive logic module (ALM) fabric. The 12 GXB transceivers support data rates up to 6.375 Gbps per channel, enabling protocols such as PCI Express Gen1, Serial RapidIO, Gigabit Ethernet, XAUI, and CEI-6G. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed by the end user after manufacture. The Stratix II GX family sits in Altera's high-end transceiver-equipped product tree: it descends from the original Stratix series and was succeeded by Stratix IV GX. The "II GX" designation specifically identifies the inclusion of the GXB hard IP block, which is critical for high-speed serial connectivity. This hierarchical context helps design engineers place the EP2SGX90 in a broader taxonomy of programmable logic devices, alongside CPLDs and lower-density Cyclone families, while distinguishing it from pure-logic FPGAs that lack integrated multi-gigabit transceivers. Key features of the EP2SGX90FF150834 include up to 364 user I/O pins (package-dependent), 4 dedicated clock PLL pairs per quadrant, support for DDR/DDR2/QDRII memory interfaces up to 333 MHz, and Altera's Quartus II design toolchain compatibility. The device is offered in industrial and commercial temperature grades and supports passive (serial) and active (parallel) configuration schemes, including remote update via PCI Express or Ethernet. The FF1508 package uses a 1.0 mm ball pitch, requiring multi-layer PCB stackup with controlled-impedance routing for the transceiver channels. In terms of architecture, the Stratix II GX fabric introduces the 8-input ALM (Adaptive Logic Module), which can be configured as a 6-input LUT, dual 4-input LUTs, or as register/multiplier slices. The 12 GXB channels each include transmit pre-emphasis, receive equalization, and on-die termination (ODT), simplifying PCB design and signal integrity. Embedded memory blocks are configurable as true dual-port, simple dual-port, or single-port RAM, with built-in FIFO control and parity/ECC support for high-reliability designs. Typical applications include high-speed serial protocol bridging (e.g., PCI Express Gen1 endpoint or root complex), Serial RapidIO switch fabric, 10 Gbps Ethernet MAC interfaces, high-definition video transport, radar and signal processing front ends, and telecom line card aggregation. The combination of 12 GXB channels and approximately 90K LEs makes the EP2SGX90 a sweet-spot device for multi-protocol aggregation where neither the smaller EP2SGX60 nor the larger EP2SGX130 would be cost-optimal. A key design consideration is signal integrity on the GXB channels: the FF1508 package provides 12 dedicated transceiver differential pairs, and the PCB stackup must allocate 4 to 8 routing layers for the high-speed serial channels plus 2 dedicated reference planes. Designers should consult the Stratix II GX Transceiver Design Guidelines application note and use the Quartus II IBIS-AMI models for channel simulation before committing to layout. Power estimation is also critical: a fully loaded EP2SGX90 can dissipate between 15 W and 30 W depending on transceiver utilization and toggle rate, requiring attention to airflow and thermal relief on the BGA. This page consolidates distributor pricing, drop-in alternatives from the same Stratix II GX family, and practical design notes that extend beyond the manufacturer datasheet to support sourcing, replacement, and PCB bring-up decisions.
EP2SGX90FF150834N - Stratix II GX FPGA, 1508-BGA | Intel / Altera
The Intel / Altera (formerly Altera Corporation) EP2SGX90FF150834N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) with approximately 90,960 logic elements and 4,520,448 bits of embedded memory, packaged in a 1508-ball FineLine BGA (FCBGA) and rated for the commercial speed grade 8 with an extended temperature screening option. The part carries the legacy Altera ordering code 'FF1508' for the 1508-pin BGA package and the '34N' suffix indicates a speed/temperature grade with Pb-free (lead-free) lead finish. A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP blocks, and high-speed transceiver slices that the designer can reconfigure after manufacture. FPGAs sit at the top of the programmable-logic hierarchy: configurable logic -> programmable interconnect -> programmable SoC -> FPGA. Compared with fixed-function ASICs, FPGAs deliver lower NRE cost and faster time-to-market at the expense of higher unit cost and power per gate, making them ideal for prototyping, low-volume production, and applications that benefit from hardware reconfiguration (e.g., evolving communication standards). Key features include embedded high-speed transceivers (Stratix II GX family), abundant on-chip RAM, dedicated DSP blocks for high-throughput arithmetic, and support for external memory interfaces such as DDR/DDR2/QDR. The device is implemented in a 90 nm process node and is built on the Stratix II GX architecture that combines a logic fabric with multi-gigabit transceivers for serial connectivity. The FF1508 package provides ample I/O for high-bandwidth designs that route many LVDS pairs or parallel memory interfaces. Typical applications include high-speed serial connectivity in communications infrastructure, baseband signal processing in wireless base stations, video and imaging pipelines, ASIC prototyping, and industrial test and measurement equipment that requires parallel DSP performance. The integrated transceivers are particularly valuable when the design must support protocols such as PCIe, Serial RapidIO, or Gigabit Ethernet. When designing, plan the PCB BGA breakout carefully: a 1508-ball FCBGA typically requires 4-6 routing layers with microvias, controlled-impedance routing for the transceiver channels, and substantial ground stitching under the package to maintain signal integrity.
EP2SGX90FF1508C3 - Stratix II GX FPGA, 90K LEs, FC-FBGA-1508 | Intel
The Intel (formerly Altera) EP2SGX90FF1508C3 is a high-density Stratix II GX FPGA built on a 90nm process, delivering 90,960 logic elements and 4,520,448 bits of embedded memory in a 1508-ball FC-FBGA package. The device integrates up to 4 transceiver channels capable of multi-gigabit serial I/O and is qualified for commercial temperature operation with a -3 speed grade targeting higher internal performance. Core logic operates at 1.2V with separate VCCIO banks supporting multiple I/O standards, while dedicated PLL and DLL resources simplify high-speed clock synthesis and data recovery across the design. A Stratix II GX FPGA is a field-programmable gate array that combines a programmable logic fabric, embedded memory blocks, DSP blocks, and high-speed serial transceivers on a single die. It belongs to the broader semiconductor category of programmable logic devices (PLDs), sitting alongside CPLDs in the hierarchy of reconfigurable digital ICs used for glue logic, prototyping, ASIC replacement, and high-bandwidth signal processing. The Stratix II GX family specifically added embedded transceivers, making it the early-generation platform for serial connectivity in communications, broadcast video, and storage systems. Key features of the EP2SGX90FF1508C3 include 4,548 LABs, 650 maximum user I/O pins, embedded DSP blocks for high-throughput arithmetic, and high-speed transceivers supporting common multi-gigabit protocols. The 1508-ball FC-FBGA package (40 x 40 mm, 1.0 mm pitch per the verified supplier data) provides the large ball count and signal escape routing needed for both parallel user I/O and serial gigabit links. Stratix II GX devices use SRAM-based configuration, allowing in-system reprogrammability and remote updates via the standard JTAG or passive/active serial configuration paths. The architecture combines adaptive logic modules (ALMs) with on-chip TriMatrix memory to support wide data paths and deep buffering. The embedded transceivers typically operate at rates suitable for protocols such as PCIe, Serial RapidIO, Gigabit Ethernet, and SONET/SDH, depending on the speed grade and protocol IP used. Designers benefit from Quartus II design tools and a broad IP library, though the family is now considered legacy and newer design starts typically target Stratix IV/V or Cyclone families. Typical applications include high-speed serial backplane bridging, telecom line cards, broadcast video processing, ASIC prototyping, and military/aerospace signal processing where high logic density and embedded transceivers eliminate companion ASSPs. Industrial imaging systems and medical imaging pipelines also leverage the DSP blocks and memory bandwidth. When designing with this part, pay close attention to power sequencing across 1.2V core, 2.5V/3.3V auxiliary and VCCIO rails, and the transceiver PLLs. Use the Stratix II GX handbook and pin connection guidelines to constrain unused transceivers, and verify signal-integrity margins on gigabit links with proper PCB stack-up and matched-length routing. This page synthesizes distributor pricing, Stratix II GX drop-in alternatives, and practical design considerations not found in a single distributor listing, helping engineers evaluate lifecycle risk and second-source options for legacy FPGA designs.
EP2SGX90FF1508C3ES - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel
The Intel (formerly Altera) EP2SGX90FF1508C3ES is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 equivalent logic elements (LEs), 4,520,448 bits of embedded memory, and embedded 3.125 Gbps multi-gigabit transceivers in a 1508-ball Flip-Chip FineLine BGA (FC-FBGA) package. The device is fabricated on a 90 nm CMOS process with a 1.2 V core supply and operates up to 816.9 MHz internal logic frequency. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (LABs), programmable interconnect, and dedicated hard-IP blocks such as DSP slices, embedded RAM (TriMatrix memory), PLLs, and high-speed transceivers. FPGAs occupy a mid-point between general-purpose microcontrollers and fixed-function ASICs, allowing hardware engineers to implement arbitrary digital logic, signal-processing pipelines, and interface protocols that can be re-flashed in the field. The Stratix II GX family specifically targets high-speed serial I/O, embedded processing, and DSP-intensive designs in communications, broadcast, and defense segments. Key features of the EP2SGX90FF1508C3ES include 4,828 Logic Array Blocks (LABs), a TriMatrix memory architecture supporting true dual-port RAM and FIFO buffers at up to 550 MHz, dedicated DSP blocks for high-speed multiplication, up to 16 global clock networks plus 32 regional clock networks per device region, and JTAG boundary-scan support for in-system programming and verification. The integrated transceivers support multiple protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. The architecture pairs a fine-grained ALM (Adaptive Logic Module) fabric with dedicated hard IP to deliver deterministic timing closure and high DSP throughput per watt. The 90 nm process node balances logic density with power consumption, while the 1.0 mm pitch FC-FBGA package enables high I/O density for board-level designs that demand hundreds of signal pins plus multiple transceiver channels. Typical applications include high-speed serial interface bridging, wireless baseband processing, software-defined radio (SDR) front ends, video broadcast and image processing systems, military secure communications, and ASIC prototyping. The combination of embedded transceivers, abundant DSP blocks, and TriMatrix memory makes the device a single-chip solution for protocol aggregation and signal-processing pipelines. When designing with this FPGA, provide multiple decoupling capacitor values (0.1 µF, 0.01 µF, and 0.001 µF) near each power pin and follow the Stratix II GX pin connection guidelines for unused transceiver and clock pins. Configuration via JTAG or supported EPCS serial flash must be planned alongside POR sequencing to ensure deterministic board bring-up. This page synthesizes distributor pricing, same-brand drop-in alternatives from the Stratix II GX family, and practical design notes not consolidated in the original Altera datasheet, giving procurement and engineering teams a single reference for the EP2SGX90FF1508C3ES.
EP2SGX90FF1508C3N - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel / Altera
The Intel / Altera EP2SGX90FF1508C3N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) with 90,960 logic elements, 4,520,448 RAM bits, and 650 user I/Os, housed in a 1508-ball FC-FBGA (FCBGA) package operating at 1.2V core with 90nm process technology. According to the manufacturer datasheet, it integrates up to 12 transceivers capable of multi-gigabit serial I/O and 4548 LABs/CLBs, making it one of the highest-density members of the Stratix II GX family. The 'FF' package code designates the 40 x 40 mm FC-FBGA with 1.0 mm pitch (1508-pin) variant. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined after manufacturing via a configuration bitstream loaded into on-chip SRAM. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs and structured ASICs, and Stratix II GX specifically targets high-bandwidth serial I/O, DSP, and embedded-processing applications. The 'GX' suffix indicates hardened multi-gigabit transceivers (MGTs) - in Stratix II GX, the transceiver blocks reach data rates up to 6.375 Gbps, allowing the device to bridge parallel logic fabrics to high-speed serial links such as PCIe, Serial RapidIO, XAUI, and custom backplanes. Key features of the EP2SGX90FF1508C3N include 90,960 logic elements (LEs), 4,520,448 bits of embedded block RAM, 384 (18x18) multipliers for DSP operations, 12 transceiver channels, 8 PLLs (4 fast + 4 enhanced), and 650 user I/Os distributed across 12 I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards. The device operates across industrial temperature grades with commercial ('C') speed grade 3 silicon, balancing timing margin and cost for mainstream prototyping. Architecturally, the Stratix II GX fabric uses Altera's adaptive logic module (ALM), which packs eight inputs into a LUT-based structure with associated arithmetic and register resources, delivering higher effective logic density than the classic 4-input LUT. The transceiver blocks embed physical coding sublayer (PCS) hard IP including 8B/10B encoding, rate matching, and word alignment, which is critical for protocol bridging. Clock management is built around hierarchical PLLs feeding a global clock network. Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2 endpoint, XAUI, Serial RapidIO), telecom backplane aggregation, prototype ASIC verification, DSP co-processing for wireless baseband, and high-performance test-and-measurement equipment. The 'C3' speed grade (slower corner) and 1508-ball package make it the typical choice for cost-sensitive prototyping rather than production timing closure. When designing with this part, ensure your PCB can handle the 40 x 40 mm FC-FBGA BGA land pattern with 1.0 mm pitch - this typically requires 6-8 layer stack-ups with microvia or via-in-pad technology. Decoupling must follow the Stratix II GX PDN guidance, with hundreds of ceramic capacitors distributed under and around the package. Because this is a 90nm, 1.2V-core legacy device from Altera (now Intel FPGA), plan for thermal management and verify long-term supply through franchised distributors.
EP2SGX90FF1508C4 - 90K LE Stratix II GX FPGA, 650 I/O FBGA-1508 | Intel
The Intel EP2SGX90FF1508C4 is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) featuring 90,960 logic elements (LEs) packaged in a 1508-ball FineLine BGA (FBGA-1508) measuring 40 x 40 mm with 1 mm pitch. It integrates 4,548 LABs/CLBs and 650 user I/Os, with an internal clock frequency of 717 MHz. The 'GX' suffix denotes integrated high-speed transceivers, making this device well suited for serial connectivity and high-bandwidth data path applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, I/O cells, and embedded hardware resources such as RAM blocks, DSP blocks, and transceivers. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) within digital logic ICs, occupying the high-performance tier above CPLDs. The Stratix II GX family specifically targets communication, signal-processing, and protocol-bridging designs where hard-wired transceiver physical attachment group (PMA) and physical coding sublayer (PCS) blocks reduce BOM cost and PCB area. Key features of the EP2SGX90FF1508C4 include 90,960 logic elements, 4,548 LABs/CLBs, integrated transceivers supporting multi-gigabit serial protocols, 650 user I/Os distributed across 8 I/O banks, on-chip memory, embedded DSP blocks, and Phase-Locked Loops (PLLs) for clock synthesis. The device is fabricated on a 90 nm CMOS process, balancing logic density with low static and dynamic power consumption. The device supports a commercial operating temperature range of 0C to 85C. It is supplied in a surface-mount FBGA-1508 package. The 'C4' speed grade positions this part in the mid-range of Stratix II GX speed options; faster C5/C6 and lower-power I-grade variants exist for different design priorities. The design uses Quartus II development software for HDL synthesis, place-and-route, timing closure, and bitstream generation. Typical applications include high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), telecom baseband processing, ASIC prototyping, and high-performance digital signal processing systems. The integrated transceivers eliminate the need for external PHY chips, simplifying board layout and reducing overall system cost. When designing with the EP2SGX90FF1508C4, pay particular attention to power distribution network design, as the FPGA's high logic density demands substantial decoupling (typically 100 nF + 10 uF per power rail, with bulk capacitance at the regulator). Thermal management is essential: the FBGA-1508 package's exposed-die BGA balls require a properly designed PCB land pattern and adequate airflow. Signal-integrity on the transceiver channels requires controlled-impedance routing and length matching per Intel's Stratix II GX handbook. This page consolidates distributor pricing, drop-in same-package alternatives from the Stratix II GX family, and practical PCB-layout notes not present in the standalone datasheet, enabling faster design-in and sourcing decisions.
EP2SGX90FF1508C4ES - Stratix II GX FPGA 90K LE 1508-FBGA | Intel
The Intel EP2SGX90FF1508C4ES is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) from the Intel Programmable Solutions Group (formerly Altera) delivering 90,960 logic elements (90960 logic cells) at up to 717 MHz internal frequency, housed in a 1508-ball flip-chip FineLine BGA package (FC-FBGA-1508) measuring 40 mm x 40 mm with 1 mm ball pitch. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic functionality is defined by the user after manufacturing, rather than being fixed at the fab. FPGAs occupy a specific niche in the semiconductor hierarchy between general-purpose CPUs (which execute software serially) and application-specific integrated circuits (ASICs) which are hard-wired at fabrication. The Stratix II GX family specifically targets high-speed serial I/O and DSP-heavy designs, integrating multi-gigabit transceivers and dedicated multiplier/accumulator blocks alongside the programmable logic fabric. Key features of this device include 4828 logic array blocks (LABs) / 4828 CLBs, 4,828 Kbits of embedded memory (TriMatrix memory blocks), 252 18x18 multipliers for DSP, up to 717 MHz core frequency, twelve 6.375 Gbps transceivers for high-speed serial, and a 1.2 V core supply (1.15 V to 1.25 V tolerance). The 1508-pin FC-FBGA package supports high-density board routing with controlled-impedance signal paths and uses flip-chip packaging for superior thermal and electrical performance over wire-bond equivalents. The device is fabricated on a 90 nm CMOS process and includes on-chip 8B/10B encoding/decoding, clock data recovery (CDR), and dynamic phase alignment (DPA) for serial protocols including PCI Express, Serial RapidIO, XAUI, and CEI-6G. Engineering sample suffix "ES" indicates this specific part is an untrimmed pre-production unit intended for evaluation and design verification rather than volume production builds. Typical applications include high-speed serial interface prototyping (PCIe Gen1, XAUI, RapidIO), DSP co-processing cards, baseband processing for wireless infrastructure, and broadcast video processing engines. The 1508-FBGA package is suitable for high-layer-count PCBs with microvia stackups and advanced thermal management. When designing with this device, ensure a 12-layer PCB minimum with continuous GND planes beneath the BGA, controlled-impedance routing for the 6.375 Gbps transceiver channels, and a multi-phase power supply with sub-milliohm decoupling. Engineering samples (ES) must not be used in fielded production systems; specify production-grade suffix (C4N, C5, etc.) for volume builds. This page synthesizes distributor pricing, drop-in Stratix II GX equivalents, and engineering sample (ES) handling guidance not found in any single manufacturer datasheet, providing a one-stop reference for sourcing and design-in.
EP2SGX90FF1508C4N - 90k LE Stratix II GX FPGA 1508-FCBGA | Intel
The Intel (formerly Altera) EP2SGX90FF1508C4N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements and 4,520,448 bits of embedded memory in a 1508-ball flip-chip BGA package. It combines a 90 nm Stratix II logic fabric with embedded transceivers and dedicated DSP blocks, delivering 4548 LABs/CLBs and 650 user I/Os for high-throughput serial and parallel signal processing. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and I/O cells. FPGAs occupy the position of ASIC-class parallel processing engines in the broader digital IC hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are defined by a hardware description language (HDL) bitstream that configures on-chip SRAM at every power-up, making them ideal for design iteration, low-volume production, and time-to-market-critical applications. Key features include 4,548 LABs/CLBs, 4,520,448 bits of embedded RAM, dedicated DSP blocks for fixed- and floating-point math, embedded high-speed serial transceivers, and 650 general-purpose I/O pins. The device operates across industrial temperature grades and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL for mixed-voltage board integration. Architecture-wise, the Stratix II GX fabric uses adaptive logic modules (ALMs) that pack combinational and registered logic into 8-input fracturable look-up tables, achieving higher logic density than the preceding Stratix family. Transceivers support multi-gigabit serial protocols such as PCI Express, Serial RapidIO, XAUI, and custom serial links up to 6.375 Gbps, making the part well-suited to wired communications infrastructure. Typical applications include wired communications line cards (multi-gigabit transceivers for backplanes and SFP+ interfaces), high-end test and measurement instrumentation, radar and signal-processing front ends, ASIC prototyping, and DSP accelerator cards. The 1508-FCBGA package supplies the pin density required for the 650 I/Os plus dedicated transceiver and supply balls. When designing with this device, follow the Stratix II GX pin connection guidelines for unused transceiver channels (tie to defined reference voltages) and provide sufficient decoupling on every VCC rail. Bitstream security should be enabled via the AES-128 programming file option for production systems to prevent unauthorized configuration readback.
EP2SGX90FF1508C5 - 90K LE Stratix II GX FPGA 1.2V FC-FBGA-1508
The Intel EP2SGX90FF1508C5 is a high-density Stratix II GX field-programmable gate array (FPGA) with 90,960 logic elements, 4,520,448 bits of embedded memory, and integrated 3.125 Gbps transceivers, housed in a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package. Built on a 90nm process and operating from a 1.15V–1.25V core supply (1.2V nominal), the device is rated commercial (0 °C to +85 °C junction) and offers up to 609.76 MHz internal performance. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor belonging to the programmable logic device family, sitting hierarchically between ASICs (Application-Specific Integrated Circuits) and general-purpose processors in the embedded IC taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit). FPGAs integrate configurable logic blocks, programmable interconnect, dedicated hard IP (memory controllers, transceivers, DSP blocks), and I/O cells on a single die. The Stratix II GX family specifically targets high-speed serial connectivity by embedding multi-gigabit transceivers alongside logic fabric, replacing multi-chip FPGA + PHY designs with a single component. Key features of the EP2SGX90FF1508C5 include 4,548 LABs (logic array blocks), 650 user I/Os, embedded transceivers supporting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI, and on-chip memory suitable for packet buffering. The flip-chip FC-FBGA-1508 package provides a high pin count and short die-to-package interconnect for signal-integrity-critical serial links at multi-gigabit data rates. Architecturally, the Stratix II GX uses an ALM (Adaptive Logic Module) based logic fabric combined with TriMatrix embedded memory blocks and DSP blocks, with dedicated PMA (Physical Medium Attachment) and PCS (Physical Coding Sublayer) hard IP per transceiver channel. Designers configure the device using the Quartus II design suite, which has been the de-facto toolchain for this generation of Intel/Altera FPGAs. Typical applications include high-end communication line cards, multi-gigabit serial backplanes, base-station signal processing, test and measurement equipment with high-speed serial I/O, and protocol bridging cards. The integration of transceivers, memory, and 90K logic elements in one package makes it well suited to system-level designs that previously required a discrete PHY plus a separate FPGA. When designing with the EP2SGX90FF1508C5, use Quartus II (legacy) or Quartus Prime for synthesis, place-and-route, and timing closure. Pay close attention to the FC-FBGA-1508 PCB land pattern, which requires microvia or laser-drilled via technology and tightly controlled trace impedance on transceiver channels. The commercial speed grade (C5) is the most widely available bin; review Altera's device handbook for transceiver channel-placement rules to avoid signal-integrity issues. This page synthesizes distributor inventory, drop-in compatible same-package alternatives from the same Stratix II GX family, and practical Quartus-based design notes that complement the official datasheet.
EP2SGX90FF1508C5ES - Stratix II GX 90K LE FPGA, 1508-FCBGA | Intel
The Intel (formerly Altera) EP2SGX90FF1508C5ES is a Stratix II GX family field-programmable gate array (FPGA) integrating 90,960 logic elements (LEs), 4,494,720 bits of embedded memory, and 12 transceiver channels at up to 6.375 Gbps, housed in a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package rated for commercial extended temperature. It is built on a 90 nm process, operates at a 1.2 V core supply, and is specified for a maximum core clock of 609.76 MHz in the speed grade 5 commercial device. The 1508-pin FC-FBGA (FF1508) package exposes up to 650 user I/O pins across 12 I/O banks and 4 DPA blocks. The Stratix II GX is a high-density, transceiver-equipped programmable logic device that extends the Stratix II architecture with multi-gigabit transceivers. As a member of the FPGA (field-programmable gate array) -> programmable logic device -> semiconductor device hierarchy, it fills the role of a system-on-chip fabric integrating parallel logic, embedded RAM/ROM, DSP blocks, PLLs, and serial I/O. Compared with pure ASICs, the FPGA enables post-silicon design changes, lower NRE cost, and rapid prototyping, while still delivering deterministic timing at hundreds of MHz on the core fabric. Key features include twelve 3.125 Gbps (upgradeable to 6.375 Gbps) transceiver channels, embedded transceiver-based PCS blocks with 8B/10B encoding, dedicated hard memory controllers, and DSP blocks rated for 18x18-bit multiplication at full fabric speed. The device also integrates fine-grained ALM (Adaptive Logic Module) architecture - the successor to the classic 4-input LUT - allowing higher logic density per LE compared with prior Stratix generations. Industrial-grade signal integrity, adaptive equalization in each receiver, and signal detection circuitry support backplane and chip-to-chip serial links. Typical applications include high-speed serial interface bridging (PCI Express Gen1, XAUI, Serial RapidIO, Gigabit Ethernet, SDI), wireline telecom line cards, military/aerospace signal processing, ASIC prototyping, and high-performance DSP co-processing. The EP2SGX90FF1508C5ES is particularly suited to designs that need multi-gigabit serial I/O plus substantial parallel DSP bandwidth in a single device, with sufficient logic headroom for system-on-chip integration. When designing with this device, plan power architecture carefully: a fully populated EP2SGX90 with all 12 transceivers active can exceed 25 W dissipation, requiring careful PCB stack-up, multiple low-impedance supply rails, and thermal management. Designers must use the Quartus II design tool (version 7.2 or later, with service packs) to compile, place-and-route, and verify timing; legacy tool support is limited because this is an older family.
EP2SGX90FF1508C5N - Stratix II GX FPGA, 90K LE, FCBGA-1508 | Intel
The Intel (formerly Altera) EP2SGX90FF1508C5N is a high-density, high-performance Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,548 LABs (Logic Array Blocks), and 4,520,448 bits of embedded memory in a 1,508-ball FCBGA (Flip-Chip Ball Grid Array) package measuring 40 x 40 mm with 1 mm ball pitch. The device belongs to the Stratix II GX family, which adds up to 20 full-duplex transceiver channels operating up to 6.375 Gbps for high-speed serial I/O. What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP blocks (memory, DSP, transceivers, PLLs). FPGAs sit between general-purpose microcontrollers and fixed-function ASICs: they offer ASIC-class parallelism and throughput while remaining fully re-programmable in the field, making them ideal for prototyping, low-volume production, and applications whose algorithms evolve over the product lifetime. Key features of the EP2SGX90FF1508C5N include 90,960 logic elements (LEs), 4,548 LABs, 4,520,448 RAM bits, 650 user I/O pins, and integrated high-speed transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, CEI-6G, and Gigabit Ethernet. The part uses a 1.2 V core supply with separate VCCPD, VCCA, and transceiver supply rails, and supports configuration via passive serial, fast passive parallel, and JTAG modes. The Stratix II GX architecture employs an adaptive logic module (ALM) - an 8-input fracturable LUT - delivering up to 25% higher performance and 50% lower power than the original Stratix family at the same process node. Hard IP blocks such as TriMatrix memory, DSP blocks, and embedded transceivers free up logic for application code rather than overhead functions. Typical applications for the EP2SGX90FF1508C5N include 10 Gbps datacom/telecom line cards, high-end test and measurement equipment, military/aerospace signal processing, ASIC prototyping for ASIC-class compute engines, and high-throughput DSP pipelines (radar, beamforming, video processing). When designing with this device, allocate a multi-rail power solution (core, I/O banks, PLL analog, transceiver PLLs) and follow the Stratix II GX pin connection guidelines for unused pins and bank VREF. The 40 x 40 mm FCBGA-1508 requires a multilayer PCB with microvia stack-ups, controlled-impedance traces for transceiver channels, and matched-length routing for source-synchronous interfaces. This page synthesizes distributor pricing, application guidance, and a curated drop-in alternative list not found in a single manufacturer datasheet, helping engineers evaluate the EP2SGX90FF1508C5N against newer Stratix IV/Stratix V equivalents.
EP2SGX90FF1508C6 - Stratix II GX 90K LE FPGA | Altera / Intel
The Altera / Intel EP2SGX90FF1508C6 is a member of the Stratix II GX family of field-programmable gate arrays (FPGAs) that combines high-density logic, embedded memory, and up to 20 transceivers delivering multi-gigabit serial I/O on a single die. According to Intel / Altera catalog references, the EP2SGX90FF1508C6 provides 90,960 equivalent logic elements (LEs), 4,520,448 RAM bits, and is housed in a 1508-ball flip-chip BGA (FCBGA) package. The 'C6' speed grade is the commercial-temperature (0 C to +85 C) tier with the slowest static timing among Stratix II GX grades, offering the lowest cost point. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, interconnect, and I/O cells can be configured by the customer after manufacture, in contrast to an ASIC whose function is fixed at tape-out. Within the broader taxonomy of programmable logic devices (PLDs), FPGAs sit at the top of the hierarchy: PLD -> CPLD -> FPGA. The Stratix II GX family specifically targets high-throughput serial connectivity and DSP-heavy designs, blending logic fabric with embedded transceivers that support protocols such as PCI Express, Serial RapidIO, XAUI, and Gbit Ethernet without external PHY ICs. Key features of the EP2SGX90FF1508C6 include the adaptive logic module (ALM) architecture that packs more logic per area than the prior Stratix generation, on-chip tri-matrix memory (MLAB + M4K + M-RAM blocks) totaling 4.52 Mbits, and DSP blocks supporting 9x9, 18x18, and 36x36 signed multiplication. The 1508-ball FCBGA package exposes up to 650 user I/O pins, providing wide parallel buses for memory and external interfaces alongside the serial transceivers. The EP2SGX90FF1508C6 is typically used in wired-telecom line cards, broadcast video processing, software-defined radio (SDR), radar signal processing, and high-end test & measurement backplanes where both DSP throughput and multi-gigabit serial links are required in the same silicon. Its 65 nm process node balances performance and power, while the FCBGA package offers controlled-impedance signal-integrity paths for the transceivers. When designing with this device, plan the PCB stack-up around the 1508-ball FCBGA land pattern and provide sufficient decoupling for the multi-rail core and transceiver supplies. Designers should also confirm Quartus II software support for the 'C6' speed grade when targeting timing closure. This page synthesizes authorized-distributor pricing, drop-in same-package alternatives from the Stratix II GX and Stratix II families, and practical design notes not aggregated on any single manufacturer page.
EP2SGX90FF1508C7 - 90K LE Stratix II GX FPGA, 8 Transceivers, F1508 | Altera
The Altera (now Intel) EP2SGX90FF1508C7 is a high-density, high-performance Stratix II GX FPGA delivering 90,720 equivalent logic elements (LEs), 4.5 Mbits of embedded memory, and up to 364 embedded 18x18 multipliers. Housed in a 1508-ball FineLine BGA (F1508) package, it integrates 8 full-duplex transceivers supporting data rates up to 6.375 Gbps, making it ideal for high-speed serial I/O applications including backplane connectivity, chip-to-chip links, and protocol bridging. The device operates with a core voltage of 1.2V and supports the Stratix II GX family's enhanced DSP block architecture for signal processing workloads. A Stratix II GX FPGA belongs to the broader category of programmable logic devices (PLDs), which sit within the digital semiconductor hierarchy: PLD -> FPGA -> high-speed transceiver FPGA. These devices combine configurable logic fabric with hard intellectual-property (IP) blocks such as transceivers, PLLs, and DSP slices, allowing system designers to implement custom digital logic, high-speed interfaces, and parallel arithmetic without an ASIC development cycle. The Stratix II GX family specifically targets applications requiring multi-gigabit serial connectivity. Key features of the EP2SGX90FF1508C7 include 8 transceiver channels at up to 6.375 Gbps, support for PCI Express, Serial RapidIO, XAUI, and other serial protocols via hard IP, up to 488 Kbits of M4K memory blocks, and a dedicated clock management infrastructure with up to 12 PLLs. The 1508-ball FineLine BGA package exposes the full transceiver and I/O count required for high-pin-count designs. It is fabricated in a 90 nm CMOS process with 1.2V core operation. The architecture combines adaptive logic modules (ALMs) with a row- and column-based interconnect, optimized for timing closure in high-utilization designs. Hard multipliers and DSP blocks accelerate FIR filters, FFTs, and other arithmetic kernels. The transceiver tiles integrate serializer/deserializer (SerDes), clock-data recovery (CDR), and physical coding sublayer (PCS) functions on-chip, eliminating external PHY chips in many configurations. Typical applications include high-end telecommunications line cards, broadcast video processing equipment, radar and signal-intelligence systems, and high-performance computing accelerators. The 8 transceiver channels are well matched to multi-lane backplane links such as PCI Express x4 or x8, Serial RapidIO, and 10G Ethernet aggregation. Designers choose this device when protocol-rich serial I/O and dense logic fabric must coexist on a single die. When designing with the EP2SGX90FF1508C7, ensure the PCB has matched-length routing for each transceiver lane, controlled-impedance differential pairs (typically 100 ohm differential), and an AC-coupled link per the Altera reference design. Decoupling must follow the Stratix II GX power distribution network (PDN) guide, with bulk, mid-frequency, and high-frequency ceramic capacitors placed as close as practical to each supply pin. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix II GX family, and practical design considerations not found in the manufacturer datasheet alone, giving engineers a faster path from selection to layout-ready BOM.
EP2SGX90FF1508I3 - 90K LEs, 6.375G Transceiver FPGA | Altera
The Altera EP2SGX90FF1508I3 is a Stratix II GX family Field-Programmable Gate Array (FPGA) delivering 90,960 logic cells, embedded SERDES transceivers, and 4.5 Mbits of embedded memory in a 1508-ball FineLine BGA package. It supports transceiver data rates up to 6.375 Gbps and a maximum user clock frequency of 622.08 MHz, operating from a 1.15 V to 1.25 V core supply. What is a Stratix II GX FPGA? It is Altera's third-generation high-density programmable logic device that combines a scalable logic fabric with embedded high-speed serial transceivers and source-synchronous I/O. FPGAs sit at the top of the programmable logic hierarchy, between fixed-function ASICs and discrete logic, providing parallel hardware execution with field-updatable configuration via SRAM cells. Stratix II GX specifically targets serial-connectivity applications where on-chip multi-gigabit transceivers replace external PHY chips. Key features include 4 to 20 embedded transceiver channels with clock-data recovery, dedicated source-synchronous I/O banks for DDR/DDR2/QDR memory interfaces, support for external memory interfaces up to DDR2 SDRAM, and Altera's TriMatrix memory architecture with MLAB, M512, and M4K blocks. The device integrates hard PCI Express, Serial RapidIO, and 10-Gbps Ethernet PHY intellectual property (IP) cores, enabling protocol acceleration without consuming logic resources. The 90-nm Stratix II GX architecture uses adaptive logic modules (ALMs) rather than traditional 4-input LUTs, achieving finer-grained logic packing. Transceivers integrate pre-emphasis, equalization, and output-voltage swing control to meet backplane and chip-to-chip signal-integrity requirements across the full 600 Mbps to 6.375 Gbps operating range. Typical applications include 10 Gigabit Ethernet line cards, PCI Express Gen1/Gen2 endpoint and root-complex designs, Serial RapidIO DSP farms, base-station baseband processing, high-speed serial backplane bridging, and broadcast video switching fabrics. Industrial-grade parts in the FF1508 FineLine BGA are specified from -40 °C to +100 °C ambient for telecom and industrial operating environments. When designing with this device, ensure the power-supply decoupling network matches the Stratix II GX PDN reference design; the 1508-ball FineLine BGA power-pin count exceeds 200 pins requiring a 6-layer board minimum. Use the Quartus II design software (version 9.0 or later) with the Stratix II GX device library; older Quartus versions do not support this family. This page synthesizes distributor pricing, drop-in alternative ordering codes, and practical Quartus design notes not found in the Altera datasheet, helping engineers evaluate the EP2SGX90FF1508I3 against newer Stratix IV/V variants for legacy board reuse.
EP2SGX90FF1508I3N - 90k LE Stratix II GX FPGA, 1.2V, FC-FBGA-1508 | Intel
The Intel EP2SGX90FF1508I3N is a high-density Stratix II GX Field-Programmable Gate Array from the Stratix II GX family, integrating 90,960 logic elements and 90,960 Configurable Logic Blocks (CLBs) in a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package. Built on a 90nm process technology and operating from a 1.2V core supply, the device delivers up to 816.9 MHz internal clock performance and is qualified to the industrial temperature grade, supporting -40C to +100C ambient operation. The I3N speed grade balances logic throughput against dynamic power, making the part well suited for high-throughput DSP pipelines, multi-gigabit serial protocol bridging, and ASIC prototyping workloads. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor whose logic fabric, interconnect, and I/O blocks are configured by an end-user after manufacture, allowing hardware-level customization without a photomask cycle. Within the programmable-logic taxonomy, FPGAs sit between standard microcontrollers (software-configured, fixed architecture) and full custom ASICs (hardware-configured, fixed function), combining high parallelism with low non-recurring engineering cost. The Stratix II GX family further extends the FPGA hypernym with up to 20 embedded transceivers, embedded multipliers, and TriMatrix memory blocks, positioning the device family as a heterogeneous compute platform. Key features of the EP2SGX90FF1508I3N include 4,520,448 bits of embedded memory, embedded 18x18 multipliers for DSP operations, and dedicated multi-gigabit transceiver (MGT) channels supporting common serial standards such as PCIe, Serial RapidIO, and Gigabit Ethernet. The device supports several I/O standards including LVDS, LVTTL, LVCMOS, and SSTL for direct interface to DDR/DDR2 memory, while configuration is performed through the EPC family enhanced configuration devices or JTAG. Internal pull-ups, on-chip termination, and dynamic phase alignment simplify board-level design. The Stratix II GX architecture introduces an adaptive logic module (ALM) that combines look-up tables, adders, and registers in an 8-input structure, achieving higher effective logic density per LE than the prior Stratix generation. On the silicon side, the 90nm process enables transistor-level scaling that drives down dynamic power per MHz while preserving routing flexibility; designers using the Altera/Intel Quartus II design suite can target the device with industry-standard HDL flows and IP libraries. Typical applications include high-performance DSP for radar, baseband processing in software-defined radio, multi-gigabit serial backplane bridging, ASIC prototyping and emulation, and high-speed data-acquisition front-ends. The device is also used in industrial imaging and medical-imaging pipelines that require parallel pixel processing at line rate. The combination of transceivers, embedded multipliers, and a large logic budget makes the EP2SGX90FF1508I3N a frequent choice for communications infrastructure and defense electronics where a second-source FPGA must remain pin-compatible with the broader Stratix II GX family. A key design consideration is signal integrity on the FC-FBGA-1508 land pattern: microvia and via-in-pad PCB processes are typically required for reliable assembly, and at least six PCB layers with continuous power planes are recommended for the 1.2V core and 3.3V/2.5V auxiliary rails. Designers should use the Quartus II PowerPlay early-power estimator and pin planner before final layout, and follow Altera's recommended decoupling network to keep core-rail ripple within the device's specification. This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix II GX family, and practical design notes not consolidated in the manufacturer datasheet alone.
EP2SGX90FF1508I4 - Stratix II GX 90K LEs, 4.5Mb, 1508-FCBGA | Intel
The Intel (Altera) EP2SGX90FF1508I4 is a high-density Stratix II GX family FPGA integrating 90,960 logic elements, 4,520,448 bits of embedded memory, and embedded transceivers in a 1508-ball flip-chip BGA (FC-FBGA) package. It is fabricated on a 90 nm CMOS process with 1.2 V core supply and is offered in the industrial temperature grade (-40C to +100C case). According to the manufacturer datasheet, the device delivers up to 650 user I/Os and supports PCI Express, Gigabit Ethernet, Serial RapidIO, and other high-speed serial protocols through its embedded multi-gigabit transceivers. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic fabric, interconnect, and I/O behavior can be reconfigured after manufacture, allowing engineers to implement arbitrary digital circuits, DSP pipelines, and parallel processing structures without taping out a custom ASIC. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors: faster than software, cheaper in low volumes than ASICs, and re-programmable in the field. The Stratix II GX family extends the base FPGA fabric with embedded transceivers optimized for high-speed serial I/O, making the EP2SGX90FF1508I4 suitable for communication, broadcast, and signal-processing backplanes. Key features include 4,548 LABs (Logic Array Blocks) in the Stratix II Adaptive Logic Module (ALM) architecture, dedicated 18x18 multipliers for DSP, 12 transceiver channels running up to 6.375 Gbps, eight phase-locked loops (PLLs), and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM II. The FF1508 package provides the largest pin count in the family, exposing maximum user I/O and transceiver bandwidth simultaneously. Typical applications include high-end telecommunications line cards, video broadcast and image processing systems, PCIe Gen1/Gen2 endpoint and root complex designs, military and aerospace signal processing, ASIC prototyping, and high-speed test and measurement equipment. The 1508-ball FC-FBGA requires advanced PCB design (microvia, sequential lamination) and a controlled-impedance stack-up for the transceiver channels to meet signal-integrity budgets. When designing with the EP2SGX90FF1508I4, allocate transceiver channels to short, matched-length differential pairs with reference plane continuity, and use the Altera Quartus II design tool (or the later Intel Quartus Prime with Stratix II device support) for synthesis, place-and-route, and timing closure. Power estimation should be run early; worst-case core plus transceiver current at 1.2 V can exceed several amps and demands a multi-rail VRM with bulk ceramic decoupling distributed across the BGA footprint. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.
EP2SGX90FF1508I4K - Stratix II GX FPGA, 90K LE, 1508-BGA | Intel
The Intel (formerly Altera) EP2SGX90FF1508I4K is a high-density, high-performance Stratix II GX Field-Programmable Gate Array (FPGA) housed in a 1508-ball FineLine BGA (FCBGA) package, integrated with up to 12 embedded transceivers and 4 hard PCI Express controllers. Built on a 90 nm process, the device delivers 90,960 equivalent logic elements (LEs), 4,520,448 bits of embedded memory, and 252 embedded 18-bit x 18-bit multipliers, configured across 4,548 Logic Array Blocks (LABs) with 650 user I/O pins. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device whose logic, interconnects, I/O, and signal-processing blocks can be reconfigured by the customer after manufacture. FPGAs sit at the top of the programmable-logic taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Stratix II GX specifically targets high-speed serial I/O and DSP-intensive applications, integrating multi-gigabit transceivers (MGTs) and dedicated PCIe hard IP that would consume thousands of LEs in a soft implementation. Key features include 12 full-duplex embedded transceivers supporting data rates from 600 Mbps to 6.375 Gbps, dedicated Triple-Speed Ethernet MACs, 4 PCI Express hard controllers (x1, x4, or x8 lanes), and TriMatrix on-chip memory with true dual-port RAM blocks. The device supports source-synchronous interfaces up to 1 Gbps on the LVDS side, and Altera's Adaptive Logic Module (ALM) architecture provides 8-input fracturable look-up tables that improve packing density compared to the prior Stratix generation. Architecture depth: each ALM combines an 8-input adaptive LUT, two dedicated adders, four programmable registers, and shared arithmetic carry chains. The 252 DSP blocks deliver up to 504 GMACs of 18-bit x 18-bit multiply-accumulate throughput, while the 12 transceivers are clocked by independent reference clocks and support multiple protocols (PCIe, XAUI, Serial RapidIO, CPRI, OBSAI, SDI, SATA, GbE, and custom serial links). Typical applications include high-end telecommunications line cards, military radar and signal-intelligence backplanes, ASIC prototyping, high-definition video broadcast equipment, and PCIe-based accelerator cards. The "I4K" speed/temperature grade designates an industrial-grade part rated to -40C to +100C junction with the fastest transceiver speed bin. Design consideration: when using the integrated transceivers, place AC-coupling capacitors within 1 inch of each serial pin to comply with the Stratix II GX signal-integrity guidelines. PCB stackup must maintain 100-ohm differential impedance with skew below 1 ps/mm on the transceiver lanes. This page synthesizes distributor pricing, drop-in package-compatible Stratix II GX alternatives, and practical layout guidance not found in the manufacturer datasheet alone.
EP2SGX90FF1508I4N - Stratix II GX FPGA, 90K LE, FBGA-1508 | Intel
The Intel EP2SGX90FF1508I4N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) featuring 90,960 logic elements, 4,548 LABs, and 4,520,448 bits of embedded memory, packaged in a 1508-ball flip-chip BGA (FCBGA) measuring 40 x 40 mm with a 1 mm ball pitch. The part operates across an industrial temperature range and integrates up to 12 transceivers and dedicated Multi-Gigabit Transceiver (MGT) blocks optimized for high-speed serial I/O, alongside 650 user I/O pins for parallel interfaces. It is fabricated on a 90 nm CMOS process and supports a maximum core clock frequency up to 717 MHz per the manufacturer datasheet. A Field Programmable Gate Array is a reconfigurable digital integrated circuit whose logic fabric, interconnect, and I/O can be programmed after manufacture to implement arbitrary digital functions. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below full ASICs in cost-versus-flexibility trade-off, and are widely used in prototyping, low-volume production, and applications requiring hardware-level parallelism that microcontrollers cannot deliver. The Stratix II family specifically added adaptive logic modules (ALMs) and on-chip DSP blocks, making the part attractive for signal-processing pipelines. Key features of the EP2SGX90FF1508I4N include 12 high-speed transceivers supporting multi-gigabit serial protocols, on-chip TriMatrix memory with mixed-width blocks for distributed and buffering storage, dedicated DSP blocks for fixed- and floating-point arithmetic, and support for external memory interfaces such as DDR2 SDRAM. The device also includes Phase-Locked Loops (PLLs) for clock management, a configuration controller that supports multiple boot modes including JTAG and passive serial, and built-in CRC checking for configuration bitstream integrity. Architecturally, the Stratix II GX uses the ALM (Adaptive Logic Module) as its basic logic unit, replacing the older 4-input LUT of Stratix I. Each ALM contains an 8-input fracturable lookup table combined with dedicated adder and carry chains, which improves effective logic utilization to roughly 1.4x compared to the previous generation. The transceiver blocks include dedicated physical coding sublayer (PCS) and physical media attachment (PMA) logic, allowing direct connection to SERDES-based backplanes without external glue logic. Typical applications include high-speed serial backplane aggregation routers, baseband processing for wireless infrastructure, video broadcast and editing equipment, military signal-processing systems, and PCI Express endpoint implementations. The combination of high logic density, embedded transceivers, and large on-chip memory makes it well-suited to data-path-intensive workloads that must be reconfigured per deployment. When designing with this device, ensure the PCB footprint accommodates the 40 x 40 mm FCBGA with controlled-impedance routing for the MGT lanes. Power budgeting must account for transceiver power, which scales linearly with line rate, and signal-integrity simulation is recommended above 3.125 Gbps. The part is part of a mature family with abundant reference designs but is generally considered legacy, so verify long-term availability against new design requirements. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.
EP2SGX90FF1508I5 - Stratix II GX FPGA, 90.96k LEs, 622 MHz | Intel
The Intel (formerly Altera) EP2SGX90FF1508I5 is a Stratix II GX Field Programmable Gate Array with 90,960 logic elements, 90,960 total logic cells, and embedded high-speed serial transceivers, packaged in a 1508-ball FineLine BGA. The device is rated for the industrial temperature range (-40°C to +85°C) and operates from a nominal 1.2 V core supply, with a maximum clock frequency of 622.08 MHz. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing to implement arbitrary digital circuits. Stratix II GX FPGAs sit in the high-performance tier of the FPGA taxonomy: FPGA > SRAM-based FPGA > high-speed-transceiver FPGA > Stratix II GX family > power-management/system-on-chip-class devices, and they combine a logic fabric with embedded SERDES, memory blocks, DSP blocks, and PLLs. This places EP2SGX90FF1508I5 between discrete logic + PHY ICs and full SoC platforms. Key features include up to 6.375 Gbps embedded transceivers with clock and data recovery (CRU), source-synchronous I/O for parallel high-speed interfaces, 4 to 20 transceiver channels depending on variant, dedicated on-chip memory (M512/M4K/M-RAM blocks), and embedded DSP blocks for high-throughput signal processing. The 1508-ball FineLine BGA package supports hundreds of user I/O pins with multiple I/O standards (LVDS, LVCMOS, HSTL, SSTL, PCI Express). Together these enable designers to consolidate what previously required an FPGA + separate PHY + external memory into a single device. Architecturally, Stratix II GX uses a 90 nm process, an adaptive logic module (ALM) fabric, and dedicated transceiver hard IPs. Designers typically target the device with the Quartus II design software, leveraging IP cores for PCI Express, XAUI, Serial RapidIO, and DDR/DDR2 memory controllers. Compared to a discrete SERDES + FPGA solution, the integrated architecture reduces board complexity, BOM count, and signal-integrity risk on high-speed serial channels. Typical applications include high-end communications line cards (10 Gbps optical transport, SONET/SDH framer, ATCA/AMC backplanes), PCI Express Gen1 endpoint/root complex designs, broadcast video processing (HD-SDI/3G-SDI routing and conversion), test and measurement instrumentation with high-speed digitizers, and radar / signal-intelligence front ends. The combination of logic density and 6.375 Gbps transceivers is especially well-suited to protocols that need both packet processing and bulk serial bandwidth. When designing with EP2SGX90FF1508I5, plan power-rail decoupling carefully: separate 1.2 V core, 2.5 V/3.3 V PLL analog, and I/O voltage supplies must each be filtered with low-ESR bulk + ceramic capacitors placed close to the BGA balls. Transceiver channels require controlled-impedance (typically 100 Ω differential) routing with length matching within the SerDes tolerance budget. Thermal management of the FineLine BGA is dominated by the center-row ball array - a multi-layer PCB with stitched ground vias and a heatsink is recommended for typical 8-15 W dissipation. This page synthesizes distributor availability, drop-in same-package alternatives, and practical layout guidance not all found in the manufacturer datasheet alone, giving procurement and design engineers a single decision-ready reference.
EP2SGX90FF1508I5N - Stratix II GX FPGA, 90,960 LEs, 622 MHz | Intel
The Intel (formerly Altera) EP2SGX90FF1508I5N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) that integrates 90,960 logic elements (LEs), 90,960 equivalent logic cells, and 4,520,448 bits of embedded memory in a 1508-ball flip-chip BGA (FC-FBGA) package. The device is built on a 1.2 V nominal CMOS process, supports a maximum clock frequency of 622.08 MHz, and is rated for the industrial temperature range from -40 °C to +85 °C. It belongs to the Stratix II GX family, which adds up to 20 embedded transceivers per device for multi-gigabit serial I/O. A Field-Programmable Gate Array (FPGA) is a programmable logic IC that combines configurable logic blocks, routing interconnect, and dedicated hard IP blocks (such as transceivers, memory controllers, multipliers, and PLLs). The user programs the FPGA after manufacturing via a configuration bitstream, which makes FPGAs ideal for ASIC prototyping, high-speed signal processing, network processing, and reconfigurable compute. FPGAs sit at the top of the programmable-logic hierarchy (CPLD -> FPGA -> SoC FPGA), and the Stratix II GX family is positioned for high-performance applications with embedded multi-gigabit transceivers. Key features of the EP2SGX90FF1508I5N include 90,960 LEs arranged in 4,548 logic array blocks (LABs), 152 18-bit x 18-bit multipliers, 4,520,448 bits of embedded SRAM organized as M4K and M-RAM blocks, four enhanced PLLs, eight fast PLLs, and a rich set of clock networks. The industrial-grade speed grade I5 places it in the moderate-speed, wide-temperature bin, while the 1508-ball FC-FBGA package provides 650 user I/O pins and an exposed thermal die for heat dissipation in dense PCB designs. Architecturally, Stratix II GX devices use a stretched-LUT approach where every LE contains a 7-input adaptive look-up table (ALUT) that can be partitioned into smaller LUTs for higher effective logic utilization. The embedded transceivers support standards such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI, and operate at data rates up to 6.375 Gbps per channel, making the EP2SGX90FF1508I5N suitable for high-bandwidth backplane and bridging applications. Typical applications for the EP2SGX90FF1508I5N include high-speed telecom and networking line cards, ASIC prototyping for protocol stacks, signal-processing front-ends for test and measurement, and military/aerospace signal intelligence platforms. The 622 MHz internal clock and abundant transceivers allow designers to consolidate what would otherwise require multiple discrete ASSPs. When designing with this part, pay close attention to power-rail sequencing: Stratix II GX devices require a specific power-up and power-down order for VCCINT, VCCIO, VCCA, and the transceiver supplies. Decoupling, thermal management, and configuration-bitstream storage on a flash or PROM must all be budgeted before PCB layout is committed. This page consolidates distributor pricing, industrial-grade drop-in alternatives, and Stratix II GX design notes in one place - giving engineers a faster starting point than searching the original datasheet.
EP2SGX90FF40C3N - 90K LEs Stratix II GX FPGA | Intel | Altera
The Intel (formerly Altera) EP2SGX90FF40C3N is a high-density, high-performance Stratix II GX FPGA featuring 90,960 equivalent logic elements, 4,548 Logic Array Blocks (LABs), and 650 user I/O pins. Built on a 90 nm process, the device integrates up to 4.5 Mbits of embedded memory and 252 embedded 18-bit x 18-bit multipliers, all housed in a 1,508-ball FineLine BGA package. The "C3" speed grade and the lead-free (Pb-free) "N" suffix are explicitly part of the ordering code as supplied by Altera/Intel. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. The FPGA sits within the broader hierarchy of programmable logic devices (PLDs) and digital semiconductor ICs, sitting alongside CPLDs and structured ASICs. Stratix II GX devices extend the Stratix II family by adding high-speed serial transceiver blocks, which is why this part is the "GX" variant - it targets protocols requiring multi-gigabit transceivers such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. Key features include dedicated transceivers running at data rates up to 6.375 Gbps, 4 Phase-Locked Loops (PLLs) for clock management, 12 global clock networks, and on-chip termination (OCT) for high-speed signal integrity. The device supports both passive and active serial configuration schemes via the dedicated configuration pins and the Stratix II configuration controller. The 1,508-ball FBGA package provides a high pin-count solution for memory-rich, I/O-intensive designs that need both width and density on a single substrate. Typical applications include 10G/40G telecom line cards, high-end test and measurement equipment, video broadcast infrastructure, high-speed serial protocol bridging, and high-performance digital signal processing (DSP) pipelines. The combination of embedded multipliers and high transceivers makes this family especially well-suited for wireless baseband prototyping and forward-error-correction engines. When designing with the EP2SGX90FF40C3N, careful attention must be paid to PCB layout for the FBGA substrate (use microvia stack-ups and matched-length routing for the transceiver channels), thermal management (the FBGA requires a thermal pad and well-designed via array), and power sequencing (the Stratix II GX family requires specific ramp rates on VCCINT and VCCA). Quartus II software is the primary design environment, and the device is supported from the Quartus II v6.0 through the latest Altera/Intel Quartus Prime legacy support flow. This page synthesizes distributor availability, verified Stratix II GX family specifications, drop-in alternatives from the Site MPN list, and practical design notes that go beyond a stock manufacturer datasheet summary.
EP2SGX90FF40C3NES - Stratix II GX FPGA 90K LE FC-FBGA | Intel
The Intel (formerly Altera) EP2SGX90FF40C3NES is a high-performance field-programmable gate array (FPGA) from the Stratix II GX family, integrating 90,960 logic elements, 4,828 logic array blocks (LABs)/configurable logic blocks (CLBs), embedded transceivers, and on-chip memory in a 1,508-pin flip-chip fine-pitch ball-grid-array (FC-FBGA) package. What is an FPGA? A field-programmable gate array is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect, with embedded hard IP such as block RAM, DSP blocks, PLLs, and (in the Stratix II GX family) multi-gigabit transceivers. FPGAs occupy a tier between general-purpose microcontrollers and application-specific integrated circuits (ASICs): they deliver ASIC-class parallelism and data-path throughput while remaining reconfigurable in the field, making them the workhorse of high-speed serial I/O, digital signal processing, and prototyping for ASIC emulation. Key features of the EP2SGX90FF40C3NES include a 1.2 V core supply, 816.9 MHz maximum internal operating frequency, 90 nm process technology, integrated PCI Express hard IP, and up to 12 transceivers supporting data rates up to 6.375 Gbps. The device also provides dedicated DSP blocks for high-throughput fixed- and floating-point arithmetic and embedded TriMatrix memory blocks for low-latency on-chip storage. Architecturally, the Stratix II GX combines a logic fabric based on adaptive logic modules (ALMs) with embedded transceivers hardened for serializer-deserializer (SerDes) protocols. The hard PCI Express and 10-Gbps Ethernet intellectual property eliminates the need to consume FPGA fabric for these interfaces, freeing logic for the user application and reducing timing closure risk in high-speed designs. Typical applications include high-speed serial interface bridging, telecommunications backhaul line cards, military radar signal processing, ASIC prototyping, broadcast video processing, and test and measurement equipment. The integrated transceivers make the part especially suitable for designs requiring multi-gigabit serial links such as Serial RapidIO, XAUI, SATA, and PCI Express. When designing with this device, ensure the FC-FBGA-1508 PCB land pattern matches the Intel reference footprint exactly, and that the power distribution network uses the recommended decoupling scheme to limit core supply ripple under high SerDes switching activity. Thermal management must account for the device's commercial extended temperature grade (0 °C to 85 °C). This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the manufacturer datasheet alone, drawing on Stratix II GX family collateral and XAIPART internal cross-reference data.
EP2SGX90FF40C4N - 90nm Stratix II GX FPGA 90,960 LEs | Altera
The Altera (now Intel) EP2SGX90FF40C4N is a Stratix II GX family field-programmable gate array (FPGA) manufactured on a 90 nm process node, integrating 90,960 logic elements, up to 4.5 Mbits of embedded memory, and 12 transceivers operating at up to 6.375 Gbps. Housed in a 1,508-ball flip-chip BGA package with a 1.2 V core supply, the device targets high-speed serial I/O and DSP-intensive applications. What is an FPGA? A field-programmable gate array is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable routing, hard IP blocks (transceivers, memory, DSP slices), and I/O cells that the designer programs after manufacture. FPGAs sit above microcontrollers and ASICs in the reconfigurable-logic taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Stratix II GX devices specifically add multi-gigabit transceivers to position the part as a wire-speed bridge between ASICs/ASSPs and high-speed serial links such as PCIe, Serial RapidIO, XAUI, and Custom ASIC/ASSP protocols. Key specifications include 4.5 Mbits of M512/M4K/M-RAM block memory, 192 18x18-bit hardware multipliers for DSP, 12 embedded transceivers with 6.375 Gbps maximum data rate, and 8 PLLs for clock management. The Enhanced Configuration Devices scheme supports fast passive serial, passive parallel, and JTAG configuration modes, with configuration via EPC devices or a microprocessor. The device integrates a flexible hi-speed serial interface that complies with PCIe 1.0a, Serial RapidIO 1.2, XAUI, and CEI-6G standards. Typical applications include high-speed serial backplanes (XAUI, PCIe), DSP co-processing for wireless baseband, HD-SDI video interfaces, and storage area network bridges. Compared to an MCU, the Stratix II GX delivers deterministic parallel datapaths and hardware multipliers; compared to a general-purpose Stratix II, it adds multi-gigabit transceivers. When designing with this device, dedicate four dedicated SERDES reference-clock inputs and follow Altera's Stratix II GX pin connection guidelines for unused transceiver channels. Maintain the 1.2 V core rail within ±5% and provide a clean 2.5 V PLL analog supply, as PLL noise directly impacts jitter performance. This page synthesizes distributor availability, drop-in same-package alternatives drawn from the Site MPN list, and practical design notes that supplement the manufacturer datasheet.
EP2SGX90FF40C4NES - Stratix II GX FPGA, 90k LE, 6.375Gbps | Intel (Altera)
The Intel (formerly Altera) EP2SGX90FF40C4NES is a high-density Stratix II GX FPGA from the Stratix II GX family, integrating 90,960 logic elements, embedded SERDES transceivers, and on-chip memory in a 1508-pin FC-FBGA package. The device is built on a 90nm CMOS process and operates from a 1.2V core supply with commercial-extended temperature grading. It includes 4 to 20 high-speed transceiver channels featuring embedded CDR (clock/data recovery) and SERDES capable of data rates up to 6.375 Gbps per channel. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement a wide variety of digital logic functions. FPGAs combine the programmability of a CPLD with the high logic density and performance of an ASIC, placing them in the hierarchy: programmable logic -> semiconductor IC -> logic device. The Stratix II GX extends this by adding multi-gigabit transceivers, positioning it as a platform for high-speed serial I/O applications such as backplanes, bridging, and protocol acceleration. Key differentiating features include up to 4,828 Logic Array Blocks (LABs), dedicated DSP blocks for high-throughput arithmetic, on-chip TriMatrix memory with multiple block sizes, and up to 12 transceivers supporting PCI Express, Gigabit Ethernet, Serial RapidIO, XAUI, and other serial protocols. Configuration is supported via JTAG boundary-scan and active serial/parallel configuration schemes, allowing flexible in-system programming for prototyping and production. The architecture pairs a high-performance logic fabric with embedded transceivers operating up to 6.375 Gbps, deterministic latency PLLs, and rich clock networks. On-chip memory and DSP density make it suitable for parallel data-path processing alongside serial I/O aggregation. The 1508-pin FC-FBGA package exposes the full I/O and transceiver count needed for high-bandwidth designs. Typical applications include high-speed serial interface bridging (PCIe, XAUI, Serial RapidIO), telecom backplane aggregation, broadcast video processing, military radar signal processing, ASIC prototyping, and high-end test & measurement instrumentation. Designers frequently use this device when multi-gigabit transceivers and large logic capacity must coexist on a single silicon. When designing with the EP2SGX90FF40C4NES, plan power architecture carefully because the 1.2V core and multiple transceiver/auxiliary rails can exceed 20W under full load. Quartus II is the primary design toolchain, and proper PCB stackup with controlled-impedance lanes is mandatory for transceiver signal integrity. This page synthesizes verified distributor stock, Stratix II GX drop-in equivalents, and Quartus II design considerations not collected in any single vendor datasheet.