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10AX090U3F45I2SG

10AX090U3F45I2SG - Arria 10 GX FPGA 900K LE | Intel | 1932-BGA

The Intel (formerly Altera) 10AX090U3F45I2SG is a high-density Arria 10 GX field-programmable gate array (FPGA) built on 20nm process technology, integrating approximately 900,000 logic elements, 59,234,304 bits of embedded memory, and 480 user I/O pins in a 1932-ball FCBGA (F45) package with industrial temperature grading. Key features include 28.05 Gbps transceivers, 3,733 18x19 multipliers (variable-precision DSP blocks), 1,518 LVDS-capable user I/O, integrated hard memory controllers, and partial reconfiguration support. The device targets mid- to high-performance transceiver-based designs where high logic density, abundant DSP, and high-speed serial connectivity must coexist in a single FPGA. A field-programmable gate array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as DSP slices, block RAM, PLLs, and high-speed transceivers. FPGAs sit within the broader category of programmable logic devices (PLDs) and, in modern system hierarchies, are often co-classified with processors as parallel computing fabrics. Arria 10 specifically targets transceiver-rich applications in the wireless, broadcast, and high-performance computing segments. The 10AX090U3F45I2SG utilizes TSMC's 20nm process with a hard-core PCIe Gen2/Gen3 controller, multi-protocol memory interface support (DDR3, DDR4, QDR II+, RLDRAM 3), and 28.05 Gbps backplane-capable transceivers. The F45 package designation indicates a 45mm body FCBGA optimized for high-pin-count line cards. Typical applications include 4K video processing and broadcast equipment, 100G/400G Ethernet line cards, wireless baseband processing, military radar prototyping, and test and measurement ASIC prototyping. The industrial temperature grade (-40C to +100C) supports deployment in non-extreme environments including outdoor telecom and industrial imaging. When designing with this device, ensure that Quartus Prime software targeting the 20nm node is used, verify transceiver reference clock architecture against the relevant Arria 10 Transceiver PHY User Guide, and confirm power delivery supports up to approximately 40W peak dissipation with proper heatsinking. This page synthesizes distributor pricing, drop-in same-package speed-grade and logic-density variants, and practical design considerations drawn from Intel/Altera documentation not aggregated on standard distributor listings.

USD $7,450.00 재고 있음

10AX090U4F45E3LG

10AX090U4F45E3LG - 900K Logic Elements Arria 10 FPGA | Intel

Intel 10AX090U4F45E3LG is an Arria 10 GX field-programmable gate array (FPGA) with 900,000 logic elements, 480 user I/O, and 59,234,304 bits of embedded memory, supplied in a 1932-ball FCBGA package. It belongs to Intel's high-density programmable-logic portfolio, combining configurable logic, embedded memory, digital-signal-processing resources, and high-speed I/O in one device. The large logic capacity supports complex datapaths, communications infrastructure, industrial imaging, and protocol processing while retaining the flexibility of FPGA-based development. An FPGA is a semiconductor device containing configurable logic blocks, programmable interconnects, embedded memories, and I/O resources that can be configured after manufacturing. In the system hierarchy, an FPGA sits between a general-purpose processor and fixed-function application-specific integrated circuits: it provides more parallel processing capability and hardware-timer predictability than software execution, while offering more design flexibility than a custom ASIC. The Arria 10 GX family is designed for bandwidth-intensive and compute-oriented digital systems. The key verified resource figures are 900,000 logic elements, 480 I/O, and 59,234,304 memory bits. A 1932-ball FCBGA package provides the interconnect and thermal/mechanical interface required by this high-pin-count device. The part is listed by distributors as an FPGA IC with ball-grid-array terminals and a square BGA package designation. These characteristics make the device suitable for designs that need substantial configurable logic and many external interfaces. The configurable architecture allows designers to implement parallel pipelines, packet-processing engines, control logic, and interface bridging without waiting for a custom mask set. Embedded memory can support buffering, lookup tables, FIFOs, and local data storage close to the logic. The device should be evaluated with the complete manufacturer device documentation because the verified search data does not expose operating voltage, transceiver count, transceiver speed, DSP count, temperature grade, package dimensions, or speed grade details. Typical applications include communications and networking equipment, industrial automation, high-performance test and measurement, video and image processing, and accelerator or protocol-processing systems. Its 480 I/O count is particularly relevant when a design must connect to many memory devices, converters, backplanes, or high-speed interfaces. The 900,000-logic-element capacity supports partitioning complex functions across parallel hardware blocks. PCB design must use the exact 1932-ball land pattern, manufacturer pin map, and recommended stack-up from the Altera/Intel device documentation. Power integrity, simultaneous-switching-noise control, decoupling, thermal analysis, and high-speed routing are critical. Designers should also confirm configuration memory, clocking, transceiver support, and software-tool compatibility before release. This product data synthesizes the exact distributor and manufacturer search values, while clearly identifying unavailable electrical and mechanical details with data-needed markers. It also avoids treating generic cross-reference search pages as proof of a pin-compatible replacement.

USD $7,147.87 재고 있음

10AX090U4F45I3LG

10AX090U4F45I3LG - Arria 10 GX FPGA 900K LE | Intel

The Intel (formerly Altera) 10AX090U4F45I3LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) built on 20 nm process technology, featuring 900,000 logic elements, 59,234,304 bits of embedded memory, and a 1932-ball FCBGA package operating at 0.9 V core. The device targets mid-to-high performance programmable logic designs requiring integrated transceivers and a hardened floating-point DSP block fabric. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and embedded hardened IP such as block RAM, DSP slices, high-speed transceivers, and external memory controllers. Modern FPGAs sit at the top of the programmable-logic hierarchy (FPGA -> programmable logic -> digital IC -> semiconductor) and are used as glue logic, accelerators, and full SoC replacements where ASIC NRE cost is unjustified. The Arria 10 GX family specifically targets 10 Gbps backplane, 25 Gbps backplane-ready, video processing, and DSP-intensive applications with hard PCIe Gen3 and 100G Ethernet IP. Key features of the 10AX090U4F45I3LG include 480 user I/O pins, 20 nm TSMC process, industrial temperature grade (-40C to +100C), industrial speed grade, and 28 Gbps-capable transceivers (per Arria 10 GX family capability). The -I3 speed/power bin denotes a mid-power balance suitable for fan-cooled line cards and modular embedded systems. The 1932-ball FCBGA (F45 package code) uses a 45 mm body with fine-pitch BGA balls to deliver the 480 user I/O bandwidth while providing mechanical rigidity for high-layer-count PCB stackups. The architecture pairs a programmable logic fabric with hard memory controllers, hard PCIe Gen3 x8 IP, hard 10/25/100G Ethernet MACs, and hardened floating-point DSP blocks. This heterogeneous integration removes soft-IP area overhead and lets the FPGA sustain multi-gigasample DSP throughput while keeping core voltage at 0.9 V for power-efficient operation in dense line-card designs. The Arria 10 family is widely deployed in 4K/8K video broadcast, medical imaging, and defense signal-processing platforms. Typical applications include 4K/8K video broadcast and processing, 100G Ethernet line cards, software-defined radio (SDR) baseband, radar signal processing, ASIC prototyping, and high-performance DSP co-processing. The 20 nm process node gives a good power/performance trade-off for thermally constrained chassis compared with 28 nm predecessors. When designing with this FPGA, plan PCB stackup with the BGA escape pattern, allocate sufficient decoupling, and verify Quartus Prime software version compatibility for the -I3 device variant. Thermal management is critical at 0.9 V core due to static plus dynamic power; a heat spreader or heatsink with adequate airflow is recommended for sustained operation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping procurement and engineering teams make informed sourcing and design decisions.

USD $7,450.00 재고 있음

10AX090U4F45I3SG

10AX090U4F45I3SG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel

The Intel (formerly Altera) 10AX090U4F45I3SG is a high-density Arria 10 GX Field Programmable Gate Array built on a 20nm process, integrating 900,000 logic elements, 59,234,304 bits of embedded memory, and 480 user I/O pins in a 1932-ball FCBGA (F45) package. The 'U4' designator marks the device with the highest performance and logic-density tier of the Arria 10 GX family, while 'F45' designates the 45x45 mm FCBGA package and 'I3' indicates the industrial temperature grade (-40C to +100C). An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and embedded memory. FPGAs sit within the broader taxonomy of programmable logic devices, alongside CPLDs and structured ASICs, and are widely used for high-throughput data processing, hardware acceleration, and protocol bridging. The Arria 10 GX family specifically targets mid-range applications that require high transceiver bandwidth, signal processing capability, and on-chip memory without the power envelope of Stratix-class devices. Key features of the 10AX090U4F45I3SG include up to 48 transceivers supporting data rates from 1 Gbps to 14.1 Gbps, hardened floating-point DSP blocks, variable-precision DSP architecture, and high-bandwidth memory interfaces such as DDR4, DDR3, and QDR-IV support through the hardened memory controllers. The device also includes embedded HardCopy blocks for partial reconfiguration and supports the PCI Express Gen3 hard IP block. Architecturally, the Arria 10 GX fabric is built on TSMC's 20nm process with a high-performance core fabric at 0.9V operation. Compared with prior-generation Arria V and Stratix V devices, the Arria 10 GX delivers up to 4x higher system-level performance at half the power by combining a tightly integrated Hard Processor System option with hardened floating-point arithmetic in DSP blocks, eliminating many of the FPGA fabric inefficiencies of older architectures. Typical applications include 4K video broadcast and professional AV signal processing, 100G/400G Ethernet line-card packet processing, military radar and electronic warfare baseband, test and measurement instrumentation, and ASIC prototyping. The high transceiver count and DSP density make the device particularly suited to applications requiring dense parallel DSP computation alongside multi-gigabit serial I/O. When designing with this device, plan PCB layout for the 1932-ball FCBGA package early - the 1 mm ball pitch demands controlled-impedance routing, microvia stack-ups, and a minimum 8-layer PCB stack-up with continuous ground and power planes beneath the device. Thermal management must account for the industrial temperature envelope, and the transceiver reference clocks require dedicated jitter-cleaner PLLs per Arria 10 GX design guidelines. This page synthesizes distributor inventory across six channels, same-brand alternative ordering codes, and PCB-layout design notes that are not consolidated in the manufacturer datasheet, providing a one-stop BOM and selection reference for engineering teams evaluating the 10AX090U4F45I3SG.

USD $3,490.00 재고 있음

10AX115H1F34E1SG

10AX115H1F34E1SG - Arria 10 GX 1.15M LEs FPGA | Intel | 1152-FCBGA

The Intel 10AX115H1F34E1SG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 504 user I/Os in a 1152-ball Flip-Chip BGA (FCBGA) package. The device is built on Intel's 20nm process and targets mid- to high-performance transceiver-based applications with up to 24.0 Gbps transceiver data rates. The 10AX115H1F34E1SG ordering code decodes as: 10AX = Arria 10 GX family, 115 = 1,150K LEs, H = high-transceiver variant, 1 = 17 Gbps/24 Gbps transceiver speed grade, F34 = 1152-pin FCBGA, E1 = enhanced speed grade 1, SG = lead-free RoHS-compliant package. An FPGA (Field Programmable Gate Array) is a programmable logic device that engineers can configure post-manufacturing to implement custom digital logic functions, parallel processing pipelines, and high-speed serial interfaces. FPGAs sit hierarchically below ASICs in design flexibility and above microcontrollers in raw logic density. The Arria 10 family is a mid-range, transceiver-rich family positioned between the lower-cost Cyclone series and the high-performance Stratix series, making it well-suited for applications requiring 10-25 Gbps serial links, DSP-intensive signal processing, and PCIe Gen3 system integration. Key features of the 10AX115H1F34E1SG include 1,150,000 logic elements, 68.86 Mbits embedded memory, integrated transceivers supporting up to 17 Gbps (speed grade 1) with 24 Gbps capability in higher speed grades, hardened PCIe Gen3 x8 IP blocks, and 504 user I/Os distributed across 12 I/O banks. The device also integrates variable-precision DSP blocks, hard memory controllers, and an SoC subsystem option in related Arria 10 SX variants. The F34 package (1152-ball FCBGA) provides high signal density and supports high-performance signaling for memory and serial interfaces. Typical applications include high-speed data acquisition, test and measurement equipment, medical imaging systems, military/aerospace signal processing, broadcast video processing, 10/25/40/100G Ethernet aggregation, and PCIe Gen3-based accelerators. The high logic count and transceiver bandwidth make this device especially appropriate for multi-channel waveform generation, radar processing, and high-speed protocol bridging. Designers should pay close attention to the F34 PCB footprint, transceiver reference clocking topology, and decoupling strategy. Power estimation using Intel's Early Power Estimator (EPE) is strongly recommended before PCB commitment, as a fully populated 10AX115 device can exceed 25W under typical workloads. Thermal management requires a 6-8 layer PCB with internal copper planes for heat spreading.

USD $2,895.00 재고 있음

10AX115H1F34I1SG

10AX115H1F34I1SG - Arria 10 GX FPGA, 1150K LE, 1152-FCBGA | Intel

The Intel (formerly Altera) 10AX115H1F34I1SG is an Arria 10 GX Field-Programmable Gate Array (FPGA) delivering up to 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 504 user I/O pins in a 1152-ball Flip-Chip BGA (FCBGA) package. The device is built on TSMC's 20 nm process and targets mid- to high-density mid-range applications requiring high transceiver throughput and DSP compute density. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing, occupying a unique position between fixed-function ASICs and software-programmable processors. FPGAs contain an array of programmable logic blocks, configurable interconnects, dedicated DSP blocks, embedded SRAM, and high-speed transceivers. They sit within the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital logic IC -> semiconductor. Arria 10 specifically belongs to Intel's mid-range / mid-density FPGA portfolio, between low-cost Cyclone and high-end Stratix families. Key differentiating specifications include up to 1,150K logic elements, 68.85 Mbit embedded memory, integrated transceivers supporting up to 14.1 Gbps data rates, 28 modular fractional PLLs, 19.4 Gbps serial transceivers for chip-to-chip and backplane links, and an industrial temperature grade operating range of -40C to +100C. The F34 package designation denotes a 1152-ball FCBGA optimized for high-speed signal integrity with controlled-impedance routing. Architecturally, the Arria 10 GX combines hardened floating-point DSP blocks, partial reconfiguration support, and integrated PCI Express Gen3 hard IP blocks. The 20 nm process node delivers superior power efficiency compared to older 28 nm Arria V and Stratix V devices, enabling higher logic density at lower thermal envelopes for compute-intensive workloads. Typical applications include high-performance digital signal processing (wireless baseband, radar), ASIC prototyping and emulation, high-speed serial protocol bridging (PCIe Gen3, 10GbE, JESD204B/C), broadcast video processing, and test and measurement equipment. The transceiver throughput makes it particularly suitable for backhaul and fronthaul infrastructure. When designing with this FPGA, ensure PCB layout meets Intel's FCBGA BGA escape routing and decoupling requirements. Use Quartus Prime design software for synthesis, place-and-route, and timing closure; consult Intel's Arria 10 Device Datasheet and Pin Connection Guidelines for the F34 package. This page synthesizes distributor pricing, drop-in alternatives, application contexts, and engineering design notes not aggregated on the manufacturer datasheet or single distributor page.

USD $6,500.00 재고 있음

10AX115H2F34E1SG

10AX115H2F34E1SG - Arria 10 GX FPGA 1.15M LE, 1152-FCBGA | Intel

The Intel (formerly Altera) 10AX115H2F34E1SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) built on TSMC's 20 nm process, integrating approximately 1,150,000 logic elements (LEs), 504 user I/O pins, and up to 68,857,856 bits of embedded memory in a 1152-ball flip-chip BGA (FCBGA) package. It targets mid-to-high-end digital signal processing, high-speed serial connectivity, and PCIe Gen3 system designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, interconnect, and I/O can be configured by the customer after manufacture using a hardware description language (HDL) or IP library. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors, balancing hardware parallelism with design flexibility. The Arria 10 family sits within Intel's mid-range FPGA portfolio between Cyclone (low-cost) and Stratix (high-performance). Key features include up to 1,150,000 logic elements, integrated transceivers supporting data rates up to 17.4 Gbps, embedded hard IP for PCIe Gen3 x8, dual-core ARM Cortex-A9 hard processor subsystem (HPS) in the SoC variants, 28.05 Mb on-chip RAM, 1,518 fixed-point multipliers (18x19), and 16 fractional PLLs. The 0.9 V core voltage and 20 nm technology deliver a power-efficient fabric compared with the prior-generation 28 nm Arria V family. Architecturally the device combines a sea-of-gates logic fabric with column-based embedded SRAM blocks, DSP slices with 18x19 multipliers, hardened transceivers, and a high-speed serial interface supporting backplanes and chip-to-chip links. Configuration is via SRAM cells, so the bitstream must be loaded from external flash or host processor at power-up. Typical applications include high-speed data acquisition, video broadcasting equipment, 10G/40G Ethernet bridges, software-defined radio, radar signal processing, medical imaging, and PCIe accelerator cards. The wide transceiver count makes it especially attractive for protocols like CPRI, JESD204B, and 10 GbE aggregation. When designing with this FPGA, ensure PCB layout supports the flip-chip BGA's high-speed signal integrity requirements and that thermal solutions account for junction temperatures under full utilization. The Quartus Prime design toolchain supports synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, same-package alternatives, and design considerations not found on the manufacturer product page, helping procurement and design engineers evaluate the 10AX115H2F34E1SG against functionally similar Arria 10 variants.

USD $3,300.00 재고 있음

10AX115H2F34E2LG

10AX115H2F34E2LG - Arria 10 GX FPGA 1.15M LE 1152-FCBGA | Intel / Altera

The Intel / Altera 10AX115H2F34E2LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 504 user I/Os in a 1152-ball Flip-Chip Ball Grid Array (FCBGA) package. Fabricated on a 20 nm process, it operates from a 0.9 V core supply and integrates hardened 14.1 Gbps transceivers plus variable-precision DSP blocks. The device belongs to the Arria 10 family, a mid-range / mid-power lineup designed for high-bandwidth signal processing, PCIe Gen3 x8, and 100G Ethernet bridging applications. An FPGA is a programmable logic device that lets engineers implement custom digital circuits by configuring an array of logic elements, embedded memory blocks, DSP slices, and high-speed serial transceivers. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers (which execute software) and ASICs (which commit a fixed function to silicon). Arria 10 specifically targets mid-bandwidth applications where Stratix 10 performance is over-spec and Cyclone cost is too low; this places it in the high-performance mid-range category alongside Xilinx Kintex and Microchip PolarFire SoCs. Key features include up to 28.05 Gbps transceivers with hardened PCIe Gen3 and 100G Ethernet MAC, variable-precision DSP supporting IEEE 754 single-precision floating point, hard memory controllers for DDR4 up to 2666 Mbps, and an SoC subsystem option on related part numbers. The 1152-ball FCBGA provides a low-inductance flip-chip interconnect ideal for high-speed serial channels and high-density parallel I/O, with thermal performance suitable for industrial temperature grades. Architecturally, the Arria 10 GX family uses a monolithic 20 nm fabric with adaptive logic modules (ALMs), 20 Kbit M20K memory blocks, and signal-conditioning circuitry that supports both chip-to-chip and backplane interfaces at data rates up to 28.05 Gbps. The combination of embedded hard IP (PCIe Gen3, 100G Ethernet MAC, DDR4 controllers) and rich fabric resources makes it well suited for high-throughput data-path acceleration, signal intelligence, and high-performance imaging. Typical applications include high-speed data acquisition systems, 100G Ethernet network interface cards, FPGA-based protocol bridges, radar and electronic warfare preprocessing, 4K/8K video broadcast processing, and ASIC prototyping. Designers often pair the Arria 10 with external DDR4 SODIMMs and high-speed ADCs/DACs to build complete signal-processing platforms. When designing with this part, pay close attention to PCB stack-up: the FCBGA requires a high-density interconnect (HDI) build-up with microvias and matched-length routing for the transceiver channels. Reference Intel's pin connection guidelines and the Arria 10 GX Transceiver PHY User Guide for channel-loss budgeting; insufficient PCB stack-up planning is the most common cause of link-up failures in production. This page synthesizes distributor pricing, parametric comparisons with same-family variants, drop-in alternatives, and PCB-level design notes not found in the manufacturer datasheet alone, helping procurement and engineering teams make faster, better-informed decisions.

USD $5,950.00 재고 있음

10AX115H2F34E2SG

10AX115H2F34E2SG - Arria 10 GX FPGA 1150K LE 504 I/O | Intel

The Intel 10AX115H2F34E2SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) integrating 1,150,000 logic elements and 68,857,600 bits of embedded memory in a 1152-ball flip-chip BGA package. It provides 504 user I/O pins, 24 transceiver channels supporting up to 14.1 Gbps backplane data rates, and hardened floating-point DSP blocks for signal-processing workloads. The -E2 speed/temperature grade targets industrial applications with a 0 C to 100 C junction range and -2 transceiver speed. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor containing programmable logic blocks, routing fabric, and dedicated hardware resources such as DSP slices, transceivers, and block memory. Modern FPGAs sit within the broader semiconductor hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. The Arria 10 family is engineered for mid-range applications that require transceivers, DSP, and ARM hard processor system integration, balancing Stratix-class performance against Cyclone-class power efficiency. Key features include 24 high-speed transceivers up to 14.1 Gbps, embedded Multi-Gigabit Transceivers (EMGCs), hardened IEEE 754 single/double-precision floating-point DSP blocks, 2,150 18x19 multipliers, up to 24 fractional PLLs, and partial reconfiguration support. The device supports DDR4 external memory interfaces up to 1,600 Mbps and includes a Hard Processor System (HPS) with dual-core ARM Cortex-A9 MPCore. These resources enable efficient implementation of high-throughput data pipelines and protocol bridges. Typical applications include 100G/400G optical transport networking, wireless LTE/5G baseband processing, military radar and electronic-warfare DSP, broadcast video processing, and PCI Express Gen3 endpoint/root-port designs. The combination of transceivers, DSP blocks, and HPS makes the Arria 10 GX well-suited for heterogeneous compute and protocol aggregation platforms. When designing with the 10AX115H2F34E2SG, ensure the PCB land pattern matches the 1152-ball FCBGA footprint and that thermal vias under the package provide adequate heat extraction. The -E2 industrial grade requires derating for transceivers above 100 C junction. Quartus Prime provides the reference design flow, IP library, and pinout files.

USD $5,500.00 재고 있음

10AX115H2F34I1SG

10AX115H2F34I1SG - Arria 10 GX FPGA, 1.15M LE, 1152-FBGA | Intel / Altera

The Intel (formerly Altera) 10AX115H2F34I1SG is a high-density Arria 10 GX field-programmable gate array (FPGA) fabricated on TSMC's 20 nm process, integrating approximately 1,150,000 logic elements and 68,857,856 bits of embedded memory in a 1152-ball FCBGA (F34) package. The part is a member of the Arria 10 GX family, the industry's first mid-range FPGA with hardened floating-point digital-signal-processing (DSP) blocks and up to 96 transceivers capable of 17.4 Gbps operation, targeting 25G/40G/100G optical and backplane links, ASIC prototyping, and high-throughput signal processing. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via a programmable interconnect fabric, supplemented by hardened IP such as DSP blocks, BRAM, transceivers, PLLs, and external-memory controllers. FPGAs occupy the layer above general-purpose microcontrollers and DSPs in the computational hierarchy - between fixed-function ASICs and software-programmable CPUs - because they can be hardware-reconfigured after manufacture while still providing ASIC-class throughput on parallel workloads. The Arria 10 family in particular introduced a heterogeneous 20 nm SoC-like architecture combining a quad-core 64-bit ARM Cortex-A53 hard processor subsystem (HPS) with 20 nm FPGA fabric, hardened floating-point DSP, and partial reconfiguration support. Key features of the 10AX115H2F34I1SG include 504 user I/O pins, transceiver rates up to 17.4 Gbps for 25G/40G/100G applications, integrated PCIe hard IP blocks, 10-Gbps Ethernet MACs, hardened floating-point DSP blocks supporting IEEE-754 single- and double-precision, and SmartVID core voltage support from 0.85 V to 0.95 V for dynamic power reduction. The device supports DDR4, DDR3, QDR II+, and RLDRAM III external-memory interfaces up to 933 MHz, and includes the Configuration via Protocol (CvP) feature that allows the FPGA fabric to be programmed over PCIe. The 'H2' suffix indicates a logic-density/transceiver configuration tier; the 'F34' package code designates the 1152-ball FCBGA with 35 mm x 35 mm body; 'I' indicates the industrial temperature grade (-40 C to +100 C ambient operating range); '1' is the device speed grade; and 'SG' denotes lead-free / RoHS-compliant packaging. Designers typically pair this device with 10 Gbps optics, DDR4 SODIMMs or RDIMMs, and external clocking such as the Intel / SiTime 8V19N492 differential MEMS oscillator for the reference clock. Typical applications include 100G optical transport line cards, 25G Ethernet NICs, high-frequency-trading (HFT) accelerator cards, ASIC prototyping platforms, military radar baseband processing, and 4K / 8K video broadcast encoders. For 100G optical transport, the transceiver channel count and 17.4 Gbps line rate enable a single chip to drive a CFP2/CFP4 module directly without an external mux/demux ASIC. For ASIC prototyping, the 1.15M logic elements give a 1:1 mapping budget for ASICs up to ~25-30 M gates with careful partitioning. The SmartVID feature typically yields 30-50% lower core power than static-voltage 28 nm predecessors at the same performance. When designing with this part, allocate a continuous inner-row copper plane for the 0.95 V SmartVID core rail with low-impedance decoupling; the transceiver channels require a clean 1.0-1.2 V analog rail (VCCH, VCCR) with separate filtering to avoid coupling noise from the digital core. Reference Intel application note AN 698 (configuration), AN 711 (transceiver board design), and AN 736 (power distribution) for board-level implementation guidance. This page synthesizes distributor pricing across DigiKey, Mouser, and authorized partners, drop-in alternative options within the Arria 10 family, and practical design considerations that are not aggregated on any single distributor page.

USD $3,700.00 재고 있음

10AX115H2F34I2LG

10AX115H2F34I2LG - Arria 10 GX FPGA, 1.15M Logic Elements | Intel

The Intel (formerly Altera) 10AX115H2F34I2LG is a high-density Arria 10 GX field-programmable gate array (FPGA) built on TSMC's 20 nm process, delivering 1,150,000 logic elements and 68,857,560 bits of embedded memory in a 1152-ball flip-chip BGA (FCBGA) package. The Arria 10 GX family integrates up to 96 transceivers capable of 14.4 Gbps data rates, hard floating-point DSP blocks, and a hardened memory controller subsystem, making the 10AX115H2F34I2LG suitable for high-throughput signal processing and protocol bridging designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O can be programmed after manufacturing to implement arbitrary digital functions. The Arria 10 family sits between Cyclone (low-power/low-cost) and Stratix (highest-performance) in Intel's FPGA portfolio, targeting mid- to high-end applications that need transceiver bandwidth and DSP throughput without the absolute top-end cost of Stratix 10. Within the broader taxonomy, the 10AX115H2F34I2LG is part of the Arria 10 GX sub-family (transceivers enabled), distinct from Arria 10 GT (higher transceiver rate) and Arria 10 SX (HPS + FPGA SoC integration). Key features include 504 maximum user I/O pins, a 1.5 GHz core fabric, support for DDR4/QDR-IV external memory interfaces, and an industrial temperature grade (-40C to +100C ambient). The device also integrates 24 backplane-capable transceivers up to 14.4 Gbps, hardware PCI Express Gen3 hard IP blocks, and partial reconfiguration support for in-field updates. With 1152 package balls and a flip-chip BGA construction, the package provides high I/O density and excellent electrical performance for high-speed serial links. The 10AX115H2F34I2LG's combination of logic capacity, transceiver count, and hard IP makes it well suited to applications such as 4K video processing, software-defined radio (SDR), radar signal processing, and high-speed serial protocol bridges (PCIe Gen3, 10GbE, 40GbE, JESD204B/C, CPRI). Compared with smaller Arria 10 variants like the 10AS066H2F34I2SG, the 10AX115H2F34I2LG offers nearly 1.7x the logic elements and roughly 1.5x the embedded memory for designs that need additional fabric headroom. Typical applications include broadcast studio video processing, medical imaging front-ends, defense signal intelligence, and high-end test & measurement. When migrating designs from earlier Arria V or Stratix V devices, Quartus Prime provides device-aware migration scripts that re-target pin assignments to the 10AX115H2F34I2LG footprint. Designers should carefully review the device's power estimation early in the design cycle using Intel's Early Power Estimator (EPE) tool, since a fully loaded 1.15M-LE design with multiple 14.4 Gbps transceivers can exceed 30 W. Proper PCB stack-up, decoupling strategy, and thermal management are mandatory. Quartus Prime Pro Edition supports the 10AX115H2F34I2LG with full synthesis, place-and-route, and timing analysis. This page synthesizes distributor pricing, parametric alternatives, and practical design considerations drawn from the Intel Arria 10 datasheet and major distributor listings (as of 2026-09-05), not found in any single source.

USD $4,995.00 재고 있음

10AX115H2F34I2SG

10AX115H2F34I2SG - Arria 10 GX 1.15M Logic Elements FPGA | Altera | Intel

The Intel (formerly Altera) 10AX115H2F34I2SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) fabricated on a 20 nm process, integrating 1,150,000 logic elements and approximately 68.86 Mbit of embedded memory, housed in a 1152-ball FC-FBGA (F34) package at 0.9 V core operation. The device belongs to the Arria 10 GX transceiver family, targeting mid-range high-bandwidth applications requiring integrated 14.1 Gbps transceivers, a hardened floating-point digital signal processing (DSP) fabric, and a coherent system-on-chip (SoC) subsystem. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture comprises an array of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, Block RAM (BRAM), clock management tiles (PLLs), and - on transceiver variants - multi-gigibit transceivers (MGTs) and high-speed serial interface hard IP. Within the broader taxonomy, FPGAs sit inside the Programmable Logic category of Integrated Circuits, alongside CPLDs and SPLDs; the Arria 10 family is positioned between Intel Cyclone (low-power/cost) and Intel Stratix (high-performance) lines. The Arria 10 GX variant specifically adds transceiver channels for protocols such as PCIe Gen3, 10GbE, CPRI, and Serial RapidIO. Key differentiating specifications for the Arria 10 GX 115 include 1,150,000 logic elements, 68.86 Mbit embedded memory, integrated 14.1 Gbps transceivers, a hardened IEEE 754-compliant single-precision floating-point DSP block (up to ~1.5 TFLOPs), and SmartVID dynamic voltage scaling between 0.85 V and 0.9 V. The H2 speed grade balances timing margin against power; the I2 temperature grade supports industrial ambient operation (-40C to +100C Tj) suitable for base-station, broadcast, and ruggedized embedded deployments. The F34 package is the 1152-ball FCBGA used for the 115 density tier. Architecturally, the device combines an ARM Cortex-A9 MPCore hard processor system option (in SoC variants) with a tightly coupled coherent interconnect, dual PCIe Gen3 hard IP blocks with on-die termination, and 24 transceiver channels. The 20 nm Tri-Gate process delivers 60% lower power than the prior 28 nm Arria V generation at equivalent performance, with SmartVID allowing each die to operate at its lowest viable Vcc while maintaining performance guarantees. Typical applications for the Arria 10 GX 115 include 4K/UHD video processing and broadcast contribution encoders, wireless baseband (LTE-A/5G NR small-cell digital front-end), military and avionics signal processing, test and measurement instrumentation, high-performance computing accelerators, and PCIe Gen3 add-in cards. The combination of integrated transceivers and hardened floating-point DSP removes the need for an external PHY or software-emulated floating point, simplifying board layout and lowering bill-of-materials cost. When designing with this device, ensure that PCB substrate meets the loss budget for 14.1 Gbps serial channels (typically >6 GHz Nyquist), power delivery nets support the SmartVID dynamic range, and the JTAG/Active Serial configuration path is accessible for in-system reprogramming. Quartus Prime is the required development toolchain. Designers should also budget thermal headroom for SmartVID peak current transients during dynamic reconfiguration. This page synthesizes Arria 10 family datasheet parameters, drop-in 1152-ball FCBGA alternatives, industrial-grade operating conditions, and practical Quartus Prime design notes not consolidated in the manufacturer datasheet.

USD $3,640.00 재고 있음

10AX115H3F34E2LG

10AX115H3F34E2LG - Arria 10 GX FPGA, 1.15M LE, 1152-FCBGA | Intel

The Intel 10AX115H3F34E2LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) built on TSMC's 20nm process, integrating approximately 1,150,000 logic elements, 68,857,856 embedded memory bits, and 504 general-purpose I/Os in a 1152-ball FCBGA (F34) package. The device targets mid- to high-bandwidth applications requiring integrated transceivers, hard memory controllers, and PCI Express Gen3 hard IP blocks. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behaviour can be reconfigured after manufacture by loading a user-defined bitstream. FPGAs occupy the middle ground between fixed-function ASICs and software-driven processors: they offer hardware-timed parallelism and protocol acceleration, and they belong to the broader family of programmable logic devices (PLDs). The Arria 10 family sits in Intel's mid-range line, below Stratix 10 but above Cyclone 10, balancing transceiver performance, logic density, and power efficiency for communications, broadcast, and compute-acceleration workloads. Key features of the 10AX115H3F34E2LG include up to 1,150,000 logic elements (LEs), 67.7 Mbits of embedded SRAM, integrated transceivers supporting data rates up to 17.4 Gbps (per the Arria 10 device datasheet), hard PCI Express Gen3 x8 controllers, hard memory controllers for DDR4/DDR3/QDR-IV, and 504 user I/Os distributed across 12 I/O banks. The 'E2' speed grade targets commercial-grade timing closure, while the F34 package designation defines a 1152-ball flip-chip BGA with 1.0 mm ball pitch, optimised for high-speed serial channel escape. The architecture combines a core fabric of adaptive logic modules (ALMs), embedded DSP blocks, embedded M20K memory blocks, and a variable-precision DSP engine. Per the Intel Arria 10 device datasheet, hard IP blocks implement PCIe Gen3, 10/25/100G Ethernet MACs, and high-speed serial interfaces, offloading these functions from soft logic and improving timing closure. The 20nm process enables higher logic density at lower core power compared with the prior 28nm Arria V generation. Typical applications include 4K/8K video broadcast and contribution encoders, radar and electronic-warfare signal processing in defense systems, 100G line-card data-path processing, 4G/5G baseband preprocessing, medical imaging accelerators (CT, MRI, ultrasound beamforming), and high-performance computing test and measurement platforms. The integrated 17.4 Gbps transceivers are commonly paired with CFP2/CFP4 optical modules or direct-attached copper cable assemblies. When designing with the 10AX115H3F34E2LG, allocate sufficient PCB layers (minimum 12, recommended 16+) for transceiver channel breakout, simulate channel loss with the Intel Quartus Prime Signal Integrity Toolkit, and respect the F34 ballmap recommended decoupling strategy. The 'E2' speed grade trades maximum Fmax for lower static power and is acceptable for most commercial deployment profiles. This page synthesises distributor pricing, parametric data, and cross-references to same-package Arria 10 family variants that are not consolidated on a single manufacturer datasheet table, providing drop-in alternatives and design notes useful during sourcing decisions.

USD $6,550.00 재고 있음

10AX115H3F34I2LG

10AX115H3F34I2LG - Arria 10 GX 1.15M LEs FPGA | Intel FPGA

The Intel FPGA 10AX115H3F34I2LG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) housed in a 1152-ball FCBGA package, fabricated on TSMC's 20nm process. The device integrates 1,150,000 logic elements, 68,857,856 bits of embedded memory, 504 user I/O pins, and up to 24 high-speed transceivers, making it suitable for mid- to high-throughput digital signal processing, video bridging, and high-bandwidth backplane applications. What is an FPGA? A Field Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, surrounded by hardened I/O and DSP resources. Unlike an ASIC (Application-Specific Integrated Circuit), an FPGA can be reconfigured after manufacture, enabling hardware iteration without mask costs. The Arria 10 family sits in Intel's mid-range portfolio, balancing cost, performance per watt, and transceiver density between Cyclone (low-end) and Stratix (high-end). It belongs to the broader class of programmable logic devices (PLDs), alongside CPLDs (Complex Programmable Logic Devices) and modern SoC FPGAs that integrate a hard processor system. Key features include 24 high-speed transceivers supporting data rates up to 17.4 Gbps, hard floating-point DSP blocks delivering up to 1.5 TFLOP/s of DSP performance, embedded hard memory controllers for DDR4/3 and LPDDR3, and a high-performance FPGA fabric with adaptive logic modules (ALMs). The device also integrates dedicated PCI Express Gen3 hard IP blocks, hardened memory controllers, and a hardened 10/40/100G Ethernet MAC block, all operating from a 0.9V core supply. The H3 speed grade provides -3 to 3 (slowest to fastest) transceiver and fabric performance. The Arria 10 architecture uses a homogeneous fabric with variable-precision DSP blocks supporting both fixed and floating-point operations, plus hard PCI Express Gen3 x8 IP cores. The 14.2 Gbps / 17.4 Gbps transceivers support protocols including PCIe Gen3, 10G/40G Ethernet, CPRI, and Interlaken. This combination of hard IP blocks dramatically reduces soft-logic resource consumption while improving power efficiency. Typical applications include high-end video processing and broadcast equipment, radar and electronic warfare systems, medical imaging backplanes, 4K/8K video encoding/decoding pipelines, and high-speed serial protocol bridging. The wide transceiver aggregate bandwidth also suits test and measurement backplanes and 100G Ethernet aggregation nodes. When designing with this device, ensure the PCB meets the FCBGA 1152-ball land pattern with high-density escape routing and matched-length impedance control for transceivers. The 0.9V core and multiple auxiliary rails require a well-sequenced power delivery network with adequate decoupling. Thermal management is critical: at full transceiver utilization, expect junction-to-ambient thermal resistance in the low single-digit C/W range, demanding a heatsink plus airflow. This page synthesizes distributor pricing, drop-in Arria 10 family alternatives, transceiver/DSP/PCIe comparison data, and practical FCBGA layout notes not found in the manufacturer datasheet alone.

USD $6,800.00 재고 있음

10AX115H3F34I2SG

10AX115H3F34I2SG - Arria 10 GX FPGA 1.15M LE | Intel

The Intel (formerly Altera) 10AX115H3F34I2SG is a high-density Arria 10 GX Field Programmable Gate Array delivering 1,150,000 logic elements in a 1152-pin FCBGA package with 28nm Tri-Gate process technology. It operates from a 0.87V to 0.93V core supply, supports industrial temperature range (-40C to 100C TJ), and integrates 28.05 Mbits of embedded memory along with 504 user I/O pins for high-bandwidth connectivity. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that implements custom digital logic through a configurable array of logic elements, embedded memory blocks, DSP blocks, and high-speed transceivers. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), which themselves belong to the integrated circuit family used for digital signal processing, hardware acceleration, and prototyping. The Arria 10 GX family specifically targets mid-range applications requiring transceivers up to 14.1 Gbps alongside hardened memory controllers and PCI Express Gen3 IP. Key features of the 10AX115H3F34I2SG include 1,150,000 logic elements, 68,857,856 bits (approximately 8.4 MB) of embedded memory, 504 maximum user I/O, transceiver support, hard memory controllers, and DSP blocks for high-performance arithmetic. The FCBGA-1152 package exposes differential pairs and high-speed serial links that enable protocols such as PCI Express Gen3, 10 Gigabit Ethernet, and JESD204B. Hardware hardening of floating-point multipliers and memory interfaces reduces soft logic utilization and improves system-level throughput. The architecture combines a 20nm-equivalent process node with hardened variable-precision DSP blocks, partial reconfiguration support, and security features such as bitstream encryption. The Arria 10 GX family introduces hardened floating-point operators and embedded Multi-Port Memory structures, allowing deterministic latency and deterministic throughput for signal-processing pipelines that benefit from simultaneous data-plane and control-plane execution on a single die. Typical applications include high-speed data acquisition systems, wireline telecom backhaul, broadcast video processing, medical imaging accelerators, military radar front-ends, ASIC prototyping, and FPGA-based hardware acceleration in HPC and datacenter fabrics. The 504 I/O count and transceiver density also suit test-and-measurement instrumentation, software-defined radio platforms, and industrial machine vision requiring low-latency parallel processing. When designing with this device, plan PCB layout for the FCBGA-1152 footprint, which requires high-density via arrays and controlled-impedance routing for transceiver channels. Use the Intel Quartus Prime design suite for synthesis, place-and-route, and timing closure; the device supports partial reconfiguration and remote system update via on-chip configuration logic. This page synthesizes distributor pricing, drop-in alternative inventory, and practical design notes not found in the manufacturer datasheet, enabling faster sourcing decisions.

USD $3,675.00 재고 있음

10AX115H4F34I3LG

10AX115H4F34I3LG - Arria 10 GX 1.15M Logic Elements FPGA | Intel

The Intel 10AX115H4F34I3LG is a high-end Arria 10 GX Field Programmable Gate Array delivering 1,150,000 logic elements, 68,857,600 bits of embedded memory, and 504 maximum user I/O in a 1152-ball FCBGA package. It is fabricated on a 20 nm process and operates from a 0.9 V core supply, with the 4 denoting the -4 speed grade and H4 denoting the high-performance transceiver variant with 24 transceivers capable of up to 17.4 Gbps. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnects, and dedicated hardened IP such as transceivers, memory blocks, and DSP slices. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose microcontrollers and ASICs, offering hardware-level parallelism with the flexibility of in-system reprogramming. Arria 10 devices specifically target mid-to-high-bandwidth applications requiring integrated transceivers, hardened floating-point DSP, and partial reconfiguration capability, occupying the middle tier between Cyclone/Cyclone V low-cost families and Stratix 10 high-end families. Key features of this device include 24 high-speed transceivers reaching up to 17.4 Gbps for protocols such as PCIe Gen3 x8, 10GbE, CPRI, and Serial RapidIO. The integrated Hard Processor System option and 16.7 Gbps external memory interfaces support DDR4 with ECC. Partial reconfiguration is supported, allowing runtime logic swaps. The 1152-ball FCBGA (F34) package uses flip-chip BGA technology for enhanced thermal and electrical performance at high toggle rates. This FPGA is commonly deployed in 100G optical transport line cards, FPGA-based radio baseband processing (CPRI fronthaul), high-performance computing acceleration cards, broadcast video processing, and test and measurement equipment. The -4 speed grade combined with the H4 high-performance transceiver option makes it particularly suited for designs that need maximum transceiver throughput combined with tight logic timing margins. When designing with the 10AX115H4F34I3LG, plan power sequencing for the 0.9 V core, transceiver PLL supplies, and I/O banks independently. Use the Quartus Prime design suite for synthesis, place-and-route, and timing closure. Thermal management requires careful attention because the 1152-ball FCBGA can dissipate 15-25 W in typical designs and needs a properly designed heat sink and PCB thermal via array. This page synthesizes distributor pricing, drop-in same-package alternatives from the Arria 10 family, and practical design notes not consolidated in the manufacturer datasheet.

USD $5,550.00 재고 있음

10AX115N1F40E1SG

10AX115N1F40E1SG - Arria 10 GX FPGA, 1150K LE, 1517-FCBGA | Intel

The Intel 10AX115N1F40E1SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) delivering 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 600 user I/O pins in a 1517-ball FCBGA package. It belongs to the -E1 (fastest) speed grade in Intel's 20nm Arria 10 family and targets mid- to high-end FPGA-based designs in communications, broadcast, and signal-processing systems. What is an FPGA? A Field-Programmable Gate Array is a class of programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and hardened IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit within the broader semiconductor hierarchy: programmable logic -> logic device -> integrated circuit -> semiconductor. They offer hardware-level parallelism and the ability to reconfigure logic post-deployment, making them ideal for evolving standards, custom data-path acceleration, and time-to-market-critical designs where ASIC NRE costs are prohibitive. Key features include integrated 28.05 Gbps transceivers supporting backplanes and chip-to-chip links, hardware DSP blocks delivering up to 1.5 TFLOPS of fixed/floating-point throughput, hard memory controllers for DDR4 and DDR3, and PCI Express Gen3 x8 hard IP. The device also integrates dual ARM Cortex-A9 MPCore hard processors for system-on-chip designs. The 1517-FCBGA package uses a 1.0mm ball pitch and supports extended-temperature operation. Architecturally, the Arria 10 GX combines a 20nm tri-gate process with hard floating-point multipliers in DSP blocks, eliminating soft-logic multipliers to reduce power and latency. Its Adaptive Logic Module (ALM) packs eight inputs with two combinational outputs and two register outputs, doubling logic density vs. older 6-input LUT architectures. This translates into lower power per DSP operation and more deterministic timing closure. Typical applications include 100G/400G Ethernet line cards, military radar signal processing, medical imaging accelerator boards, professional video broadcast (4K/8K UHD), and high-performance computing (HPC) test infrastructure. The combination of 28G transceivers and PCIe Gen3 makes it well suited for data-acquisition front ends. When designing with this device, plan power delivery for the core (0.9V/0.95V), I/O banks (1.2V-3.3V), and transceiver rails separately, and validate thermal envelopes using the Quartus PowerPlay early power estimator before PCB commitment. Use the F40 package variant when migrating between speed grades within the same footprint. This page synthesizes distributor pricing, drop-in pin-compatible alternatives drawn from the same Arria 10 family, and practical design notes not consolidated in the manufacturer datasheet.

USD $6,995.00 재고 있음

10AX115N1F40I1SG

10AX115N1F40I1SG - Arria 10 GX FPGA 1150K LE | Intel

The Intel (formerly Altera) 10AX115N1F40I1SG is an Arria 10 GX field-programmable gate array (FPGA) built on a 20 nm process, delivering 1,150,000 logic elements, 68,857,856 embedded memory bits, and up to 600 user I/O pins in a 1517-ball FC-FBGA (F40) package. It targets mid- to high-performance transceiver-based designs and is rated for the industrial temperature range. An FPGA (field-programmable gate array) is a reconfigurable logic IC that sits at the top of the programmable logic hierarchy. FPGAs integrate programmable logic blocks, configurable I/O, on-chip memory, DSP blocks, and high-speed transceivers. Within Intel's portfolio, the Arria 10 family is positioned between Cyclone (low-power / cost-optimized) and Stratix (highest performance), with Arria 10 GX adding integrated transceivers and hardening PCIe, memory controllers, and floating-point DSP for bandwidth-intensive applications. Key features of the 10AX115N1F40I1SG include 1,150,000 logic elements, 68.86 Mbits of embedded SRAM, integrated transceivers supporting multi-gigabit serial links, hardened PCI Express Gen3 blocks, variable-precision DSP blocks, and up to 600 user I/Os. Core voltage is 0.9 V, with separate rails for I/O and transceiver supplies. The 1517-ball FC-FBGA package enables high-density routing and excellent thermal performance for industrial designs. The device uses a TSMC 20 nm process with Intel's adaptive logic module (ALM) architecture, embedding hardened IP for memory controllers, PCIe Gen3 x8, and high-speed transceivers up to 14.1 Gbps. This hardware acceleration lowers logic utilization and dynamic power compared with soft implementations, while the GX variant specifically provides the transceiver-rich feature set. Typical applications include wireless baseband processing, broadcast video and studio equipment, medical imaging acceleration, high-speed test and measurement, defense signal processing, and PCIe Gen3 adapter cards. Designers select the 10AX115N1F40I1SG when they need transceiver bandwidth, hardened PCIe, and ample logic density without stepping up to Stratix 10 cost. When designing with this FPGA, ensure the PCB uses a minimum 1.0 mm pitch BGA footprint with microvia stack-up. Power sequencing must follow the Intel Arria 10 Power Management User Guide; POR holds the device in reset until all rails are stable. Decoupling per the reference design is mandatory to meet transceiver jitter specs. This page synthesizes distributor pricing, drop-in alternative options, and practical design notes not found in the manufacturer datasheet alone, giving an engineer a fast procurement and selection reference for the Arria 10 GX 10AX115 family.

USD $3,450.00 재고 있음

10AX115N1F45E1SG

10AX115N1F45E1SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA

The Intel (Altera) 10AX115N1F45E1SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) with 1,150,000 logic elements, fabricated on a 20 nm process and packaged in a 1932-ball Flip-Chip BGA (FCBGA). It belongs to the Arria 10 GX transceiver family, integrating up to 1,150K logic elements, 67.7 Mbits of embedded memory (M20K), and 768 user I/O pins optimized for high-throughput data-plane and DSP-heavy designs. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic, routing, and I/O behaviour can be defined after manufacture using a hardware description language (HDL). FPGAs sit in the semiconductor hierarchy alongside ASICs, ASSPs, microcontrollers, and CPLDs, but unlike CPLDs they target data-parallel workloads such as digital signal processing, packet processing, and high-speed serial I/O. The Arria 10 family specifically targets mid-range applications that need high transceiver bandwidth without the power envelope of a Stratix-class device. Key features of the 10AX115N1F45E1SG include integrated transceivers supporting backplane and chip-to-chip serial links, hard memory controllers for DDR3/DDR4, hard PCIe Gen2/Gen3 IP blocks, variable-precision DSP blocks with hardened IEEE 754 single-precision floating point, and a 0.9 V core supply. The -1 speed grade and E1 industrial operating temperature grade (-40C to +100C) make it suitable for demanding embedded systems. Architecturally, the device uses a 20 nm TSMC process, a core fabric of adaptive logic modules (ALMs), and dedicated hardware blocks that offload common functions such as memory interfacing, PCIe, and DSP from soft logic. This is why Arria 10 GX achieves substantially higher effective throughput per watt than older 28 nm or 40 nm FPGA generations. Typical applications include high-performance DSP (radar, beamforming, test and measurement), 100G/40G packet processing and switching, video broadcast infrastructure, medical imaging accelerators, and defense signal intelligence platforms. The wide transceiver bandwidth also makes it a popular choice for high-speed data acquisition and protocol bridging. When designing with this part, pay close attention to PCB layout: the 1932-ball FCBGA requires high-density escape routing, microvia stacks, and controlled-impedance differential pairs for the transceivers. Power delivery must support simultaneous load steps on 0.9 V core rails - use a multi-phase controller with sufficient bulk decoupling. This page synthesizes distributor pricing, drop-in same-footprint alternatives from the Arria 10 family, and practical design notes not assembled in the manufacturer datasheet alone.

USD $6,866.23 재고 있음

10AX115N1F45I1SG

10AX115N1F45I1SG - Arria 10 GX FPGA 1150K LE FCBGA-1932 | Intel

The Intel (formerly Altera) 10AX115N1F45I1SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) delivering up to 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 768 maximum user I/Os, housed in a 1932-ball Fine-Pitch Ball Grid Array (FCBGA) package. Built on TSMC's 20nm process, the device integrates up to 1,518 hardened DSP blocks and up to 24 embedded transceivers supporting data rates up to 17.4 Gbps, making it suitable for high-throughput signal processing, high-speed serial interconnect, and mid-range ASIC prototyping. The 'I' suffix denotes the industrial temperature grade (-40C to +100C), and the '1SG' ordering code indicates transceiver speed grade 1 with the standard power option. An FPGA is a reprogrammable integrated circuit that lets designers implement arbitrary digital logic using configurable logic blocks (CLBs), routing resources, and hardened IP. Modern FPGAs such as the Arria 10 GX also integrate high-speed transceivers, external memory controllers (EMIFs), DSP blocks, and PCIe hard IP, placing them in the hierarchy: programmable logic -> FPGA -> programmable logic device (PLD) -> digital integrated circuit -> semiconductor. The Arria 10 family targets mid-range applications that require a balance of logic density, transceiver bandwidth, and power efficiency. Key features include 17.4 Gbps transceivers with hardened PCS/PMA, hardware PCIe Gen3 x8 IP blocks, variable-precision DSP with hardened IEEE 754 single-precision floating-point support, and SmartVID core voltage scaling for dynamic power reduction. The 1932-ball FCBGA package is one of the largest Intel offers for this family, providing the maximum user I/O count of 768 and the densest pin escape for high-bandwidth memory and transceiver interfaces. Configuration is supported through JTAG, AS, PS, and FPP modes. Typical applications for the 10AX115N1F45I1SG include 100G/40G/10G optical transport line cards, 4K/8K video broadcast and image processing pipelines, 5G fronthaul/baseband prototyping, radar and electronic-warfare DSP front-ends, high-speed test and measurement instrumentation, and ASIC prototyping where 1.15M logic elements and 17.4 Gbps transceivers are required. When designing with this device, plan PCB layer stackup for the FCBGA-1932 escape (typically 16+ layers with stacked vias), provide matched-length routing for transceiver channels, and verify the Quartus Prime power estimator early in the cycle. Thermal dissipation at full transceiver utilization can exceed 25W; the FCBGA package requires a properly designed thermal management solution including heatsink and airflow. This page synthesizes distributor availability, same-package Arria 10 drop-in alternatives, and practical design notes that are not consolidated in the official Intel datasheet alone.

USD $5,120.00 재고 있음

10AX115N2F40E1SG

10AX115N2F40E1SG - Arria 10 GX 1.15M LE FPGA 1517-FCBGA | Intel

The Intel (formerly Altera) 10AX115N2F40E1SG is a high-density Arria 10 GX field-programmable gate array (FPGA) built on a 20 nm process, integrating 1,150,000 logic elements, 68,857,600 bits of embedded memory, and 600 high-speed user I/Os in a 1517-ball FCBGA (F40) package. It belongs to the Arria 10 GX family targeting mid-range, transceiver-rich applications such as 10G/25G/40G Ethernet, video broadcast, and DSP acceleration. The 'N2' speed grade and 'E1' temperature grade specify a commercial -40C to +100C operating envelope. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can re-program after manufacture to implement custom digital circuits. FPGAs sit between fixed-function ASICs and software-driven processors in the design hierarchy: ASIC -> FPGA -> DSP -> MPU/MCU. Unlike ASICs, FPGAs ship with no application logic - the user loads a configuration bitstream to define functionality, making them ideal for prototyping, low-volume production, and workloads needing hardware-level parallelism. Key features of the 10AX115N2F40E1SG include 24 high-speed transceivers supporting data rates up to 17.4 Gbps (chip-to-chip), hard PCI Express Gen3 IP blocks, dedicated DSP blocks with variable-precision arithmetic support, and up to 3.9 TFLOPs of single-precision floating-point performance per device. The 0.9 V core voltage, 20 nm process, and hardened memory/DSP blocks deliver an industry-leading performance-per-watt envelope for transceiver-rich designs. Architecturally, the Arria 10 GX family uses Intel's adaptive logic module (ALM) structure with 8-input fracturable look-up tables, distributed MLAB memory, M20K block RAM, and embedded hard IP for PCIe Gen3 and 10/40G Ethernet MACs. The 1517-ball FCBGA package measures 40 mm x 40 mm with 1.0 mm ball pitch, and integrates a high-performance transceiver tile array across the device perimeter. Typical applications include 10G/40G Ethernet networking line cards, broadcast video processing (4K/8K UHD), radar signal processing in defense systems, ASIC prototyping, and high-performance computing (HPC) acceleration cards. The combination of hardened PCIe Gen3 and multi-rate transceivers reduces external component count and BOM cost in communications infrastructure. When designing with this device, ensure the PCB layout supports the 1.0 mm ball-pitch FCBGA with matched-length impedance-controlled transceiver lanes, and provide adequate thermal dissipation through the exposed-die package. Use Intel Quartus Prime for synthesis, place-and-route, and timing closure - the device is supported in Quartus Prime Standard Edition.

USD $3,325.00 재고 있음

10AX115N2F40E2LG

10AX115N2F40E2LG - Arria 10 GX FPGA, 1.15M LEs, FCBGA-1517 | Intel

The Intel 10AX115N2F40E2LG is a high-performance Arria 10 GX Field-Programmable Gate Array (FPGA) featuring 1,150,000 logic elements, 68,857,856 bits of embedded memory, and a 20 nm process technology, housed in a 1517-ball FC-BGA package. The part is configured for the commercial operating range, supports up to 600 high-speed user I/O pins, and integrates 28.05 Mbits of on-chip RAM alongside hardened Gen3 PCIe x8 and Gen2 x8 IP blocks. With dedicated DSP blocks, hardened floating-point units, and up to 24 transceivers capable of 17.4 Gbps operation, this FPGA targets mid-to-high-end applications in communications, broadcast, and medical imaging. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines the architecture of a gate array with configurability through SRAM-based configuration memory, allowing hardware designers to implement custom digital logic that can be re-programmed in-system. In the broader semiconductor taxonomy, FPGAs sit between application-specific integrated circuits (ASICs) and general-purpose processors: more flexible than ASICs and far more parallel than CPUs. The Arria 10 GX family specifically targets mid-range applications that require transceivers, DSP performance, and high logic density at lower power than competing families. Key features include 1,150,000 logic elements organized into 42,720 adaptive logic modules (ALMs), 600 maximum user I/O pins, and 28.05 Mbits of embedded memory distributed across M20K and MLAB blocks. The device integrates 24 high-speed transceivers operating up to 17.4 Gbps and supports hardened Gen3 PCIe x8 IP. With hardened floating-point DSP blocks delivering up to 1.5 TFLOPs of single-precision performance, this FPGA is well-suited for high-throughput signal-processing applications. The 10AX115N2F40E2LG is built on TSMC's 20 nm process and uses a 1517-ball flip-chip BGA package measuring 45 x 45 mm. It supports DDR4 external memory interfaces up to 2400 Mbps and offers a SmartVID-controlled core voltage of 0.9 V for reduced static power. Configuration is supported via JTAG, Active Serial, or Fast Passive Parallel interfaces. The -2 speed grade balances performance and power for commercial designs. Operating temperature range is 0C to 100C, with E2 suffix indicating the commercial industrial range. Typical applications include 4K video processing and broadcast equipment, medical imaging (CT, MRI, ultrasound), 100G Ethernet line cards, software-defined radio, radar signal processing, high-performance computing accelerators, and digital signal processing systems requiring floating-point arithmetic. Designers should plan for the 1517-ball FCBGA land pattern, evaluate thermal dissipation at full transceiver and DSP utilization, and use Intel Quartus Prime for place-and-route. The information on this page synthesizes distributor inventory and drop-in guidance beyond the standard datasheet.

USD $1,980.00 재고 있음

10AX115N2F40I1SG

10AX115N2F40I1SG - Arria 10 GX FPGA, 1.15M LE, 1517-BGA | Intel

The Intel 10AX115N2F40I1SG is a high-density Arria 10 GX field-programmable gate array (FPGA) with 1,150,000 logic elements, fabricated on a 20 nm process and housed in a 1517-ball flip-chip BGA (FC-FBGA) package. It integrates up to 68,857,856 bits of embedded memory, 6 fractional PLLs, and hardened PCI Express Gen3 / Gen2 / Gen1 and 10 Gbps Ethernet MAC IP blocks. The device is rated for industrial temperature operation (-40C to +100C) and supports a core voltage of 0.9 V with transceiver rails of 0.95 V and 1.03 V. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and specialized hardened IP such as transceivers, memory controllers, and DSP blocks. Within the broader taxonomy, FPGAs belong to programmable logic devices, which sit between fixed-function ASICs and software-programmable processors in flexibility versus power efficiency. Arria 10 GX specifically targets mid-range applications that require a balance of high transceiver bandwidth, DSP throughput, and low-power 20 nm process technology, occupying the performance-per-watt sweet spot between Cyclone and Stratix families. Key features include up to 24 transceivers at up to 17.4 Gbps, 3,036 DSP blocks for fixed- and floating-point arithmetic, 2 hard memory controllers supporting DDR4, DDR3, QDR IV, and RLDRAM 3, and partial reconfiguration for in-field logic swap. The 1517-ball FC-FBGA package uses lead-free SAC405 solder balls on a 1.0 mm pitch, supporting both standard and high-density board builds. Configuration is supported via JTAG, Active Serial, Active Parallel, and passive serial modes, with bitstream encryption and anti-tamper features built in. Architecture-wise, the Arria 10 GX uses Intel's adaptive logic module (ALM) with 8-input fracturable LUTs, 20 Kbit (M20K) embedded SRAM blocks, and variable-precision DSP blocks that can be configured for 18x19 or 27x27 multiplication. Hardened Gen3 x8 PCIe Gen3 and Gen2 / Gen1 controllers operate at up to 8 Gbps per lane, and the 10 Gbps Ethernet MAC supports 10GBASE-R, 10GBASE-KR, and backplane Ethernet. The transceiver tile integrates PCS, PMA, and clock data recovery, with adaptive equalization for backplane and direct-attach copper channels. Typical applications include wireless infrastructure (5G LTE and LTE-Advanced baseband and fronthaul), broadcast video processing (4K/8K UHD), high-performance data acquisition, military radar signal processing, ASIC prototyping, and PCI Express Gen3 endpoint or root port cards. The combination of high DSP count and 17.4 Gbps transceivers makes this family particularly suited for beamforming and digital predistortion in radio designs. Designers should plan for a multi-rail power supply (0.9 V core, 0.95 V transceiver, 1.03 V transceiver auxiliary, 1.8 V/2.5 V/3.0 V I/O) with a minimum of 6 decoupling capacitor values per rail. The FC-FBGA requires PCB laminate with low-Dk/Df materials (e.g., Megtron 6, FR-4 with high Tg) and microvia stacking for breakout routing; impedance-controlled differential pairs are mandatory for transceiver channels. Thermal design must consider that the FC-FBGA exposes the die through the package top, allowing direct attachment of a heatsink or cold plate for high-power operation. Intel's Quartus Prime design suite is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, same-family Arria 10 alternatives with the same 1517-ball FC-FBGA footprint, and practical design notes not found in the standalone datasheet PDF.

USD $3,720.00 재고 있음

10AX115N2F40I2LG

10AX115N2F40I2LG - Arria 10 GX FPGA 1150K LE | Intel / Altera

The Intel / Altera 10AX115N2F40I2LG is an Arria 10 GX Field-Programmable Gate Array (FPGA) integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 600 user I/O in a 1517-ball FCBGA package. Speed grade 2, industrial temperature range, and 20 nm process technology position this device for mid- to high-density digital signal processing and serial transceiver-based applications. The 10AX115N2F40I2LG delivers transceiver rates up to 14.1 Gbps and hardened floating-point DSP blocks for high-throughput DSP pipelines. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of programmable logic blocks, interconnect, and I/O pads that engineers can configure after manufacturing. FPGAs belong to the broader family of programmable logic devices (PLD) within the semiconductor hierarchy. Unlike fixed-function ASICs, FPGAs enable hardware reconfiguration, parallel processing, and rapid prototyping. The Arria 10 family targets middle-ground price/performance between low-cost Cyclone series and high-performance Stratix series, while the GX sub-family emphasizes serial transceiver capability. Key features of the 10AX115N2F40I2LG include 1,150,000 logic elements (LEs), 68,857,856 embedded memory bits, integrated transceivers supporting protocols such as PCIe Gen3 and 10 GbE, hardened floating-point DSP blocks, and partial reconfiguration capability. The 1517-ball FCBGA package provides high-density interconnect required for the 600 user I/O pins. Industrial temperature grade (-40C to +100C ambient) enables deployment in harsh environment applications. The 20 nm process technology offers favorable power/performance trade-offs versus larger-node FPGAs. The Arria 10 GX architecture combines a core fabric of adaptive logic modules (ALMs) with hard IP blocks for transceivers, memory controllers, and DSP. The hardened floating-point DSP blocks provide deterministic latency and significantly improve GMACS/mm^2 efficiency over soft DSP implementations. Up to 28 transceivers with rates from 1.0 to 14.1 Gbps support protocols such as PCIe Gen3 x8, 10 GbE, CPRI, and Serial RapidIO. Typical applications for the 10AX115N2F40I2LG include high-performance digital signal processing in radar and electronic warfare systems, video broadcast and pro-AV infrastructure, 4K/8K video processing pipelines, 10G/40G network packet processing, and FPGA-based hardware acceleration for test and measurement instruments. Industrial temperature range also enables deployment in factory automation and aerospace platforms requiring environmental hardening. When designing with this FPGA, plan power sequencing carefully for the 0.9V core, 1.8V/2.5V/3.3V auxiliary, and transceiver supply rails; use Altera's PowerPlay early power estimator to size regulators before PCB commitment. Pinout files and signal integrity analysis are mandatory given the 1517-ball flip-chip BGA package. This page synthesizes distributor pricing, drop-in alternatives from the Altera 10AX115 family, and practical design notes not found in the manufacturer datasheet alone.

USD $7,965.99 재고 있음

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