10AX090U4F45I3SG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel
부품 번호: 10AX090U4F45I3SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4050 | $40,500.00 |
| 100 | $3820 | $382,000.00 |
| 500 | $3650 | $1,825,000.00 |
| 1,000 | $3490 | $3,490,000.00 |
10AX090U4F45I3SG 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and embedded memory. FPGAs sit within the broader taxonomy of programmable logic devices, alongside CPLDs and structured ASICs, and are widely used for high-throughput data processing, hardware acceleration, and protocol bridging. The Arria 10 GX family specifically targets mid-range applications that require high transceiver bandwidth, signal processing capability, and on-chip memory without the power envelope of Stratix-class devices.
Key features of the 10AX090U4F45I3SG include up to 48 transceivers supporting data rates from 1 Gbps to 14.1 Gbps, hardened floating-point DSP blocks, variable-precision DSP architecture, and high-bandwidth memory interfaces such as DDR4, DDR3, and QDR-IV support through the hardened memory controllers. The device also includes embedded HardCopy blocks for partial reconfiguration and supports the PCI Express Gen3 hard IP block.
Architecturally, the Arria 10 GX fabric is built on TSMC's 20nm process with a high-performance core fabric at 0.9V operation. Compared with prior-generation Arria V and Stratix V devices, the Arria 10 GX delivers up to 4x higher system-level performance at half the power by combining a tightly integrated Hard Processor System option with hardened floating-point arithmetic in DSP blocks, eliminating many of the FPGA fabric inefficiencies of older architectures.
Typical applications include 4K video broadcast and professional AV signal processing, 100G/400G Ethernet line-card packet processing, military radar and electronic warfare baseband, test and measurement instrumentation, and ASIC prototyping. The high transceiver count and DSP density make the device particularly suited to applications requiring dense parallel DSP computation alongside multi-gigabit serial I/O.
When designing with this device, plan PCB layout for the 1932-ball FCBGA package early - the 1 mm ball pitch demands controlled-impedance routing, microvia stack-ups, and a minimum 8-layer PCB stack-up with continuous ground and power planes beneath the device. Thermal management must account for the industrial temperature envelope, and the transceiver reference clocks require dedicated jitter-cleaner PLLs per Arria 10 GX design guidelines.
This page synthesizes distributor inventory across six channels, same-brand alternative ordering codes, and PCB-layout design notes that are not consolidated in the manufacturer datasheet, providing a one-stop BOM and selection reference for engineering teams evaluating the 10AX090U4F45I3SG.
드롭인 대체품: 10AX090U4F45I3SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX090U4F45I3SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Mounting Type, Speed Grade, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX090U4F45I3LG
✅ 드롭인✓ 재고 있음
$7450 / 개
데이터시트 보기 →10AX090U4F45E3LG
✅ 드롭인✓ 재고 있음
$7147.8719 / 개
데이터시트 보기 →10AX090U3F45I2SG
✅ 드롭인✓ 재고 있음
$7450 / 개
데이터시트 보기 →10AX090S4F45I3SG
✅ 드롭인✓ 재고 있음
$4520 / 개
데이터시트 보기 →10AX090N4F45I3LG
✅ 드롭인✓ 재고 있음
$5202.97 / 개
데이터시트 보기 →10AX090U4F45I3SG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (Bits) | 59,234,304 |
| Transceivers | Up to 48 channels |
| Transceiver Data Rate (max) | 14.1 Gbps |
| Maximum User I/O | 480 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| 패키지 | 1932-BBGA FCBGA (F45) 45x45 mm, 1 mm pitch |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
10AX090U4F45I3SG 1932-bbga fcbga (f45) 45x45 mm, 1 mm pitch 핀 구성 가이드
10AX090U4F45I3SG(1932-bbga fcbga (f45) 45x45 mm, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX090U4F45I3SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX090U4F45I3SG 적합 용도: 6 애플리케이션s: 4K Video Broadcast and Professional AV, 100G/400G Ethernet Line-Card Packet Processing, Military Radar and Electronic Warfare Baseband, Test and Measurement Instrumentation, ASIC Prototyping and Emulation, High-Performance Industrial Imaging and Machine Vision.
4K Video Broadcast and Professional AV
The 10AX090U4F45I3SG's 900,000 logic elements and DSP density make it ideal for 4K/UHD video broadcast pipelines that require real-time up/down/cross-conversion, color-space transform, and HDR processing. The 48 transceivers at 14.1 Gbps aggregate >600 Gbps of serial bandwidth, sufficient for SDI 12G and emerging IP-based ST 2110 video-over-Ethernet fabrics in broadcast routers. Compared with a discrete ASIC, the FPGA fabric enables rapid codec-standard adaptation as SMPTE and AIMS evolve; designers typically instantiate hard memory controllers driving DDR4 to act as line buffers and frame stores, and the industrial temperature grade ensures 24/7 rack-mount reliability.
추천
100G/400G Ethernet Line-Card Packet Processing
The Arria 10 GX device's 48 transceivers at 14.1 Gbps, combined with 900K logic elements and embedded 59 Mbit memory, enable line-card designs that aggregate multiple 10G/25G/40G Ethernet links into 100G or 400G uplinks. Hardened PCS and MAC blocks accelerate packet classification, deep buffering, and QoS scheduling in switch fabric applications. The 1932-ball F45 package supports the high pin-count needed for multiple QSFP28 cages plus DDR4 buffer memory; industrial temperature grade suits both centralized-office and outdoor-ruggedized line-card deployments.
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Military Radar and Electronic Warfare Baseband
The 10AX090U4F45I3SG's hardened floating-point DSP blocks deliver massive parallel arithmetic throughput required for phased-array radar beamforming, pulse-Doppler processing, and adaptive electronic-countermeasure algorithms. With 900K logic elements and high M20K memory density, the device supports simultaneous multi-channel waveform generation and channelized receiver processing on a single die. The F45 package and industrial temperature rating meet the ruggedization envelope for ground-vehicle and shipboard EW installations, and the device's built-in partial reconfiguration allows runtime mode switching between radar and jamming profiles.
추천
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol analyzers leverage the 10AX090U4F45I3SG's DSP density and 14.1 Gbps transceivers to perform real-time signal integrity analysis on multi-gigabit serial buses. The 900K logic elements and 59 Mbit embedded memory support deep acquisition memory and complex trigger logic for protocols such as PCIe Gen3, USB 3.1, and 100G Ethernet. The device's PCIe hard IP enables direct host-attach in PXIe and AXIe modular instrument chassis, while the 1932-ball F45 package allows integration of multiple high-speed ADC/DAC front-ends on a single board.
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ASIC Prototyping and Emulation
With 900,000 logic elements and 480 user I/O, the 10AX090U4F45I3SG provides the logic capacity to partition and emulate multi-million-gate ASIC designs in bring-up and validation stages. The high transceiver count enables realistic ASIC-to-ASIC link emulation at production-clock speeds, while the embedded M20K memory accurately models large on-die SRAMs. Multiple Arria 10 GX F45 boards can be co-hosted in a logic-emulation chassis to scale capacity beyond a single FPGA; the 20nm process node ensures timing-accuracy emulating ASICs fabricated at similar process generations.
추천
High-Performance Industrial Imaging and Machine Vision
The Arria 10 GX device's parallel DSP throughput and 14.1 Gbps transceivers support multi-camera CoaXPress, 10 GigE Vision, and Camera Link HS aggregation in machine-vision systems for high-speed sortation, semiconductor inspection, and robotics guidance. The 900K logic elements enable real-time image preprocessing, lens-distortion correction, and convolutional feature extraction close to the sensor array. With 480 user I/O plus hard memory controllers, the 10AX090U4F45I3SG can drive DDR4 frame buffers alongside multi-gigabit sensor links, and the industrial temperature rating supports factory-floor deployment.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX090U4F45I3SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX090U4F45I3LG | 10AX090U4F45E3LG | 10AX090U3F45I2SG | 10AX090S4F45I3SG | 10AX090N4F45I3LG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-BBGA FCBGA (F45) 45x45 mm | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (Mbit) | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit |
| Transceiver Channels | Up to 48 | Up to 48 | Up to 48 | Up to 48 | Up to 48 | None (N variant) |
| Transceiver Max Rate | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | ~12.5 Gbps (-1 bin) | ~13.4 Gbps (SEU variant) | N/A |
| User I/O | 480 | 480 | 480 | 480 | 480 | 480 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Enhanced | Industrial | Industrial | Industrial |
| Lead-Free (RoHS) | No (lead-pkg finish) | Yes (LG suffix) | Yes (LG suffix) | No | No | Yes (LG suffix) |
| Special Feature | Standard (U4 highest speed) | Standard lead-free | Enhanced temperature | U3 = lower speed bin | S = SEU-mitigated (rad-hard) | N = no-transceiver |
주요 차별점
- Highest-density Arria 10 GX in the F45 package footprint (vs 10AX090U3F45I2SG)
- Lead-free drop-in available for RoHS-restricted markets (vs 10AX090U4F45I3LG)
- Available with hardened SEU mitigation for military/space (vs 10AX090S4F45I3SG)
- Optional no-transceiver variant in same F45 package (vs 10AX090N4F45I3LG)
설계 노트
The 1932-ball F45 FCBGA package at 1 mm pitch requires an 8-layer or higher PCB stack-up with laser-drilled microvias (typically 0.1 mm finished) for inner-row breakout. Per Intel's Arria 10 GX hardware design guidelines, all transceiver lanes must be length-matched to within 0.127 mm (5 mil) for pairs and 1.27 mm (50 mil) for channel-to-channel, with continuous reference planes on layers 2 and 7 for 100-ohm differential impedance. Skip microvia fan-out and the design will fail PCIe Gen3 and 10G-KR compliance at first silicon.
At full utilization (90% logic, all 48 transceivers active, DDR4 at full rate), the 10AX090U4F45I3SG can dissipate 20-30 W. With the FCBGA's typical theta_JA of ~12 C/W at 1 m/s airflow, junction temperature can climb 240-360 C above ambient under industrial (-40C to +100C) envelopes. Recommended: thermal pad with 1.5-2.5 W/m-K TIM, integrated heat-spreader lid, and 200-400 LFM chassis airflow. Estimated: P=25 W, theta_JA=12 C/W, delta_T = 300 C - sufficient margin only with active cooling.
Common pitfalls when bringing up the 10AX090U4F45I3SG include: (1) missing transceiver reference-clock jitter-cleaner PLLs (per Arria 10 GX design guidelines, each bank requires a dedicated clean PLL); (2) incorrect MSEL configuration pin strapping (MSEL[3:0] must match the intended fast passive or active serial configuration mode); (3) using the wrong Quartus Prime device family variant (select '10AX090' family, NOT '10AS066' or '10CL' - they have different IO standards); and (4) violating the I/O power-on ramp sequence which can latch-up the device.
Power-rail sequencing for the 10AX090U4F45I3SG must follow Intel's recommended order: 0.9V core first, then 1.8V transceiver analog, then 1.2V/1.5V DDR4 interface, then 3.0V/2.5V/1.8V I/O banks per bank voltage. Estimated total supply current at full load: ~25 A on the 0.9V rail, requiring a 30 A capable buck regulator such as the LTC3615 or similar. Use TI's Power Designer or Intel's Early Power Estimator spreadsheet before committing PCB to power-stage component selection.
For 14.1 Gbps transceiver operation, follow Intel's 'Arria 10 GX Transceiver Link Design Guide' for via optimization (back-drilled stubs <0.15 mm), AC-coupling capacitor selection (0402 X7R 100 nF, placed within 5 mm of the RX pin), and receiver CTLE adaptation. The reference clock input path requires a jitter attenuator between the upstream PLL and the FPGA REFCLK pin - using a raw TCXO will fail PCIe Gen3 jitter compliance. Target <500 fs RMS jitter at the device REFCLK input for reliable 10 Gbps link-up.
규정 준수 정보
The 'G' suffix in 10AX090U4F45I3SG denotes lead-pkg terminal finish per Intel Arria 10 ordering nomenclature; for lead-free (RoHS) choose 'LG' suffix variant. RoHS and REACH compliance per the Intel product page; AEC-Q100 not applicable to FPGAs.
