10AX115H2F34E1SG - Arria 10 GX FPGA 1.15M LE, 1152-FCBGA | Intel
부품 번호: 10AX115H2F34E1SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4100 | $41,000.00 |
| 100 | $3850 | $385,000.00 |
| 500 | $3600 | $1,800,000.00 |
| 1,000 | $3300 | $3,300,000.00 |
10AX115H2F34E1SG 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, interconnect, and I/O can be configured by the customer after manufacture using a hardware description language (HDL) or IP library. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors, balancing hardware parallelism with design flexibility. The Arria 10 family sits within Intel's mid-range FPGA portfolio between Cyclone (low-cost) and Stratix (high-performance).
Key features include up to 1,150,000 logic elements, integrated transceivers supporting data rates up to 17.4 Gbps, embedded hard IP for PCIe Gen3 x8, dual-core ARM Cortex-A9 hard processor subsystem (HPS) in the SoC variants, 28.05 Mb on-chip RAM, 1,518 fixed-point multipliers (18x19), and 16 fractional PLLs. The 0.9 V core voltage and 20 nm technology deliver a power-efficient fabric compared with the prior-generation 28 nm Arria V family.
Architecturally the device combines a sea-of-gates logic fabric with column-based embedded SRAM blocks, DSP slices with 18x19 multipliers, hardened transceivers, and a high-speed serial interface supporting backplanes and chip-to-chip links. Configuration is via SRAM cells, so the bitstream must be loaded from external flash or host processor at power-up.
Typical applications include high-speed data acquisition, video broadcasting equipment, 10G/40G Ethernet bridges, software-defined radio, radar signal processing, medical imaging, and PCIe accelerator cards. The wide transceiver count makes it especially attractive for protocols like CPRI, JESD204B, and 10 GbE aggregation.
When designing with this FPGA, ensure PCB layout supports the flip-chip BGA's high-speed signal integrity requirements and that thermal solutions account for junction temperatures under full utilization. The Quartus Prime design toolchain supports synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, same-package alternatives, and design considerations not found on the manufacturer product page, helping procurement and design engineers evaluate the 10AX115H2F34E1SG against functionally similar Arria 10 variants.
드롭인 대체품: 10AX115H2F34E1SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115H2F34E1SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, PCIe Hard IP, Process Technology, DSP Blocks, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115H1F34I1SG
✅ 드롭인✓ 재고 있음
$6500 / 개
데이터시트 보기 →10AX115H1F34E1SG
✅ 드롭인✓ 재고 있음
$2895 / 개
데이터시트 보기 →10AX115H2F34E1SG 최대 정격 & 전기적 특성
| Series | Arria 10 GX |
| Family | Intel Arria 10 |
| Logic Elements (LEs) | 1,150,000 |
| Embedded Memory (Bits) | 68,857,856 |
| Number of I/O | 504 |
| 패키지 | 1152-BBGA, FCBGA (F34) |
| 실장 유형 | Surface Mount |
| Core Voltage | 0.9 V |
| Process Technology | 20 nm |
| 동작 온도 | -40C to +100C (E1 grade, industrial) |
| Transceivers | Up to 24 channels, 17.4 Gbps (per Arria 10 GX family) |
| PCIe Hard IP | PCIe Gen3 x8 (per family datasheet) |
| Configuration Type | SRAM-based, requires external boot flash |
| RoHS 상태 | Compliant |
10AX115H2F34E1SG 1152-bbga, fcbga (f34) 핀 구성 가이드
10AX115H2F34E1SG(1152-bbga, fcbga (f34) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX115H2F34E1SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX115H2F34E1SG 적합 용도: 7 애플리케이션s: High-Speed Data Acquisition Systems, 10G/40G Ethernet Aggregation, Software-Defined Radio Platforms, Video Broadcast and Processing, PCIe Accelerator Cards, Industrial Test and Measurement, Aerospace and Defense Signal Processing.
High-Speed Data Acquisition Systems
The 10AX115H2F34E1SG fits multi-channel 10 Gsps data acquisition because its 1,150,000 logic elements and embedded 18x19 multipliers (1,518 DSP slices per Arria 10 datasheet) support real-time FIR filtering on parallel ADC lanes. The 504 user I/O and 17.4 Gbps transceivers aggregate JESD204B/C links from modern high-speed ADCs without bottlenecking the FPGA fabric. Compared with a DSP+FPGA two-chip solution, integrating the entire signal chain in one Arria 10 GX reduces BOM cost, simplifies PCB layout, and lowers latency in beamforming and radar processing pipelines.
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10G/40G Ethernet Aggregation
The 10AX115H2F34E1SG is well suited to 10G and 40G Ethernet aggregation switches and NICs because its hard 10-Gbps transceivers implement multiple SFP+ ports directly, and the PCIe Gen3 x8 hard IP block links the card to a host CPU at line rate. The 504 I/O support external PHY expansion, while the 68 Mb of embedded memory enables cut-through forwarding tables with sub-microsecond latency. Engineers migrating from discrete PHY + TCAM architectures consolidate the entire L2/L3 plane in one device, reducing board area and power by 30-40 percent.
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Software-Defined Radio Platforms
The 10AX115H2F34E1SG excels in software-defined radio (SDR) baseband processing thanks to its high DSP slice count, 28 Mb embedded RAM, and CPRI/OBSAI-compliant transceivers. The fabric runs multi-carrier LTE and 5G NR PHY layers while the integrated PCIe hard IP connects to host servers for upper-layer stack processing. The 1152-FCBGA package provides the signal integrity required for RF sampling ADCs, and the E1 industrial temperature rating suits outdoor small-cell and military radio deployments.
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Video Broadcast and Processing
The 10AX115H2F34E1SG is ideal for 4K/8K video broadcast routers and processing blades because its 17.4 Gbps transceivers carry uncompressed SDI (SMPTE 2022-6) and SMPTE 2110 IP streams at 12G-SDI rates. The 1.15M-LE fabric runs real-time HEVC/H.265 encoding/decoding IP at low latency, while the 504 I/O handle HDMI 2.0, DisplayPort 1.4, and SDI outputs simultaneously. Compared with ASIC-based broadcast processors, the Arria 10 GX offers codec upgradeability and IP library flexibility for evolving broadcast standards.
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PCIe Accelerator Cards
The 10AX115H2F34E1SG is well matched to PCIe Gen3 x8/x16 accelerator cards for machine learning inference, database acceleration, and computational storage. The hard PCIe Gen3 IP block delivers up to 8 GT/s per lane without consuming fabric resources, leaving the 1.15M-LE logic and 1,518 DSP slices available for customer acceleration kernels. The FCBGA-1152 package supports the high pin count required for DDR4 memory interfaces (up to 72-bit ECC at 2133 MT/s), enabling large working data sets on-card.
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Industrial Test and Measurement
The 10AX115H2F34E1SG fits ATE and industrial test equipment because its DSP slices accelerate FFT-based spectrum analysis and its transceivers digitise multi-GHz signals directly. The E1 industrial temperature rating (-40C to +100C junction) suits factory-floor instrumentation, and the flip-chip BGA's mechanical robustness tolerates shock and vibration in mobile test sets. Compared with DSP-only solutions, the FPGA offloads real-time triggering and pattern generation, freeing the host CPU for higher-level analysis and reporting.
추천
Aerospace and Defense Signal Processing
The 10AX115H2F34E1SG supports radar, electronic warfare, and secure communications because its high logic density and DSP count process wide-bandwidth RF streams in real time, while the 17.4 Gbps transceivers interface with modern military data links. The 1152-FCBGA package is qualified for vibration and thermal cycling per Intel's industrial qualification flow. Engineers building radar receivers and digital RF memory systems use the Arria 10 GX to consolidate IF sampling, pulse compression, and Doppler processing on a single device.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX115H2F34E1SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115H1F34I1SG | 10AX115H1F34E1SG | 10AX115N3F40E2SG | 10AT115N3F40E2SGES | 10AX115R2F40E1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA (F34) | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1517-FCBGA (F40) | 1517-FCBGA (F40) | 1517-FCBGA (F40) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| User I/O Count | 504 | 504 | 504 | 600 | 600 | 342 |
| Family / Variant | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GT | Arria 10 GX |
| Transceiver Speed | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 28.05 Gbps | Up to 17.4 Gbps |
| Speed Grade | H2 (-2) | H1 (-1) | H1 (-1) | N3 (-3) | N3 (-3) | R2 (-2) |
| Temperature Grade | E1 (-40C to +100C) | I1 (-40C to +125C) | E1 (-40C to +100C) | E2 (extended) | E2 (extended) | E1 (-40C to +100C) |
| Unit Price (USD, qty 1) | 4250.00 | 3850.00 | 3450.00 | 4550.00 | 5800.00 | 4650.00 |
주요 차별점
- H2 speed grade in 1152-FCBGA F34 package (vs 10AX115H1F34I1SG)
- 504 I/O in compact 1152-ball package (vs 10AX115R2F40E1SG)
- Industrial E1 temperature grade at competitive price (vs 10AT115N3F40E2SGES)
설계 노트
The 1152-FCBGA package has a 1.0 mm ball pitch and requires a 4-6-4 microvia stack-up for fan-out, per Intel's Arria 10 packaging guidelines. Use ENIG or ENEPIG surface finish to ensure reliable solder joints and minimise pad oxidation during the multi-reflow profile required for high-density BGA assembly.
Under full DSP utilisation (approximately 80% logic toggling at 400 MHz), the 10AX115H2F34E1SG can dissipate 15-20 W. A heatsink with thermal interface material (1.5 W/m-K or higher) plus 6+ thermal vias under the centre die pad is required to keep junction temperature below 100C. Without adequate cooling, the device will throttle or trigger thermal shutdown protection.
17.4 Gbps transceiver channels require matched-length routing with 85-ohm differential impedance and length matching within 5 mil between P and N pairs. Use the Arria 10 transceiver toolkit and Intel's signal integrity centre for pre-layout channel simulation. Avoid right-angle bends and keep via stub length below 8 mil to maintain eye margin.
The Arria 10 device requires at least four independent supply rails (0.9 V core, 1.1 V auxiliary, 1.8 V transceiver, and 2.5 V/3.0 V I/O) with strict sequencing per the Arria 10 datasheet. Use a multi-rail PMIC such as the LTM4677 or TPS6508641 to achieve monotonic ramp-up within 100 ms of power-on.
Configuration flash selection is critical: the Arria 10 GX requires a 1.8 V QSPI or parallel flash for bitstream loading. Using a 3.3 V flash without a level shifter will damage the FPGA's dual-purpose configuration pins. Verify the boot mode (FPP x32, AS x4, or JTAG) is correctly set via MSEL pins before power-up.
규정 준수 정보
RoHS and REACH compliance per Intel Altera material declaration for Arria 10 family. AEC-Q100 not applicable - this is an industrial-grade FPGA, not an automotive-qualified part. Lead-free BGA balls confirmed via product page.
