10AX115H1F34I1SG - Arria 10 GX FPGA, 1150K LE, 1152-FCBGA | Intel
부품 번호: 10AX115H1F34I1SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9296.71 | $9,296.71 |
| 10 | $8500 | $85,000.00 |
| 100 | $7800 | $780,000.00 |
| 500 | $7100 | $3,550,000.00 |
| 1,000 | $6500 | $6,500,000.00 |
10AX115H1F34I1SG 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing, occupying a unique position between fixed-function ASICs and software-programmable processors. FPGAs contain an array of programmable logic blocks, configurable interconnects, dedicated DSP blocks, embedded SRAM, and high-speed transceivers. They sit within the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital logic IC -> semiconductor. Arria 10 specifically belongs to Intel's mid-range / mid-density FPGA portfolio, between low-cost Cyclone and high-end Stratix families.
Key differentiating specifications include up to 1,150K logic elements, 68.85 Mbit embedded memory, integrated transceivers supporting up to 14.1 Gbps data rates, 28 modular fractional PLLs, 19.4 Gbps serial transceivers for chip-to-chip and backplane links, and an industrial temperature grade operating range of -40C to +100C. The F34 package designation denotes a 1152-ball FCBGA optimized for high-speed signal integrity with controlled-impedance routing.
Architecturally, the Arria 10 GX combines hardened floating-point DSP blocks, partial reconfiguration support, and integrated PCI Express Gen3 hard IP blocks. The 20 nm process node delivers superior power efficiency compared to older 28 nm Arria V and Stratix V devices, enabling higher logic density at lower thermal envelopes for compute-intensive workloads.
Typical applications include high-performance digital signal processing (wireless baseband, radar), ASIC prototyping and emulation, high-speed serial protocol bridging (PCIe Gen3, 10GbE, JESD204B/C), broadcast video processing, and test and measurement equipment. The transceiver throughput makes it particularly suitable for backhaul and fronthaul infrastructure.
When designing with this FPGA, ensure PCB layout meets Intel's FCBGA BGA escape routing and decoupling requirements. Use Quartus Prime design software for synthesis, place-and-route, and timing closure; consult Intel's Arria 10 Device Datasheet and Pin Connection Guidelines for the F34 package.
This page synthesizes distributor pricing, drop-in alternatives, application contexts, and engineering design notes not aggregated on the manufacturer datasheet or single distributor page.
드롭인 대체품: 10AX115H1F34I1SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115H1F34I1SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Embedded Memory, DSP Blocks, Operating Temperature, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115H1F34E1SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2895 / 개
데이터시트 보기 →10AX115H2F34I1SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3700 / 개
데이터시트 보기 →10AX115H3F34I1SG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AX090N3F40E2LG
✅ 드롭인✓ 재고 있음
$2280 / 개
데이터시트 보기 →10AX115H1F34I1SG 최대 정격 & 전기적 특성
| Series | Arria 10 GX |
| Family | Arria 10 |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| Number of Logic Elements / Cells | 1,150,000 |
| Total RAM Bits | 68,857,856 |
| Number of I/O | 504 |
| Voltage Supply | 0.87 V to 0.93 V core |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (Industrial) |
| 패키지 / 케이스 | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FCBGA (F34) |
| Process Node | 20 nm TSMC |
| Transceiver Data Rate | Up to 14.1 Gbps |
| RoHS 상태 | Compliant |
| 습도 민감도 레벨 (MSL) | 3 (168 hours) |
| Grade | Industrial |
10AX115H1F34I1SG 핀 구성
| 핀 Multiple | VCC — Core and I/O supply voltage pins distributed across the 1152-ball FCBGA grid; consult Intel F34 pin connection file for exact ball coordinates. |
| 핀 Multiple | GND — Ground return balls distributed throughout the package substrate. |
| 핀 Multiple | IO — 504 user I/O balls arranged in banks around the package periphery for general-purpose LVDS/LVCMOS signaling. |
| 핀 Multiple | XCVR — High-speed transceiver channel balls for serial links up to 14.1 Gbps. |
| 핀 Multiple | CLK — Dedicated clock input balls for global clocks and PLL references. |
| 핀 Multiple | JTAG — TCK, TMS, TDI, TDO configuration balls for boundary-scan programming. |
| 핀 Multiple | CONFIG — Configuration balls for MSEL, nCONFIG, nSTATUS, and CONF_DONE signals. |
| 핀 Multiple | HPS — Note: this is the FPGA-only variant (no HPS); HPS balls are not present on 10AX115H1F34I1SG. |
일반적인 애플리케이션
10AX115H1F34I1SG 적합 용도: 7 애플리케이션s: Wireless Baseband Signal Processing, ASIC Prototyping and Emulation, High-Speed Serial Protocol Bridging, Broadcast Video Processing, Radar and Lidar Signal Processing, Test and Measurement Equipment, Medical Imaging Systems.
Wireless Baseband Signal Processing
The 10AX115H1F34I1SG's 1,150,000 logic elements and 68.85 Mbit embedded memory deliver exceptional DSP throughput for wireless baseband processing in 4G LTE and 5G NR systems. The integrated hardened floating-point DSP blocks operate at hundreds of GMACs, enabling real-time FFT, channel estimation, and MIMO decoding without external accelerators. The 14.1 Gbps transceivers connect directly to ADC/DAC and fronthaul CPRI/eCPRI links, simplifying radio unit architecture. Industrial -40C to +100C temperature range supports outdoor small-cell deployment. Recommended companion devices include RF transceivers such as ADI AD9371 and high-speed ADCs from Texas Instruments ADC32RF45.
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ASIC Prototyping and Emulation
With 1,150K logic elements, the 10AX115H1F34I1SG provides ample capacity to prototype mid- to large-complexity ASIC designs before tape-out. The large embedded memory (68.85 Mbit) emulates SRAM blocks and trace buffers accurately. Partial reconfiguration support enables runtime logic swapping, accelerating hardware-software co-verification. The 1152-ball FCBGA F34 package supports high I/O count for emulating wide bus interfaces and multi-channel peripherals. Compared to ASIC redesign cost ($1M+ mask sets), the Arria 10 GX platform cuts prototype cost by 10-100x while preserving real-world timing. Pair with high-speed DDR4 SODIMM daughter cards for large memory emulation.
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High-Speed Serial Protocol Bridging
The 10AX115H1F34I1SG's 14.1 Gbps transceivers natively support PCI Express Gen3 (8 Gbps), 10 Gigabit Ethernet (10.3125 Gbps), SATA 3.0 (6 Gbps), USB 3.0 (5 Gbps), and JESD204B/C converter links. Hard IP blocks for PCIe Gen3 eliminate soft-IP resource overhead and simplify root-complex or endpoint integration. The device bridges between incompatible serial protocols in storage, networking, and industrial imaging applications - for example, converting multiple JESD204B ADC lanes to a single 10GbE uplink. The 504 user I/Os and 1152-ball package support wide parallel buses for legacy ASIC/FPGA interoperability.
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Broadcast Video Processing
Broadcast video systems require real-time processing of uncompressed 4K/8K video streams at multi-gigabit rates, where the 10AX115H1F34I1SG excels. Its DSP blocks accelerate color-space conversion, scaling, deinterlacing, and HEVC/H.264 transform pipelines. The 14.1 Gbps transceivers ingest SDI (Serial Digital Interface) at 12G-SDI rates, and the 68.85 Mbit embedded memory buffers line and frame data without external DRAM for many formats. Industrial temperature grade suits studio and mobile broadcast environments. The Arria 10 video IP ecosystem from Intel and partners accelerates development of broadcast encoders, multiviewers, and video routers.
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Radar and Lidar Signal Processing
Military, automotive, and weather radar systems demand real-time processing of wideband RF data streams, where the 10AX115H1F34I1SG delivers essential compute density. The hardened floating-point DSP blocks compute FFTs, beamforming weights, and matched filters at line rate, while the 14.1 Gbps transceivers interface directly to high-speed ADC chains sampling at multi-GSPS. For lidar, the FPGA aggregates time-of-flight measurements from multiple laser channels and builds 3D point clouds in real time. Industrial temperature grade supports vehicle-mounted and field deployments. Pair with high-speed ADCs like ADC12DJ3200 or radar front-end MMICs for complete system integration.
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Test and Measurement Equipment
High-end oscilloscopes, logic analyzers, and protocol testers leverage the 10AX115H1F34I1SG for real-time waveform capture, pattern generation, and protocol decoding. The 68.85 Mbit embedded memory provides deep acquisition buffer per channel, while the 14.1 Gbps transceivers handle multi-lane protocols like USB 3.1, PCIe 4.0, and 100GbE. Designers benefit from the hardened PCI Express and memory controllers, accelerating time-to-market for modular instruments. Industrial temperature grade supports lab and field test environments. The FPGA serves as a flexible DSP engine for triggering, decoding, and statistical analysis of high-speed serial traffic.
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Medical Imaging Systems
CT scanners, MRI systems, and ultrasound platforms require high-throughput image reconstruction algorithms where the 10AX115H1F34I1SG provides essential performance. The hardened floating-point DSP blocks implement back-projection, FFT-based reconstruction, and beamforming in real time at medical frame rates. The 14.1 Gbps transceivers aggregate data from multi-channel ADC arrays sampling detector outputs at hundreds of MSPS. Industrial temperature grade supports controlled clinical environments, and the 68.85 Mbit embedded memory buffers intermediate reconstruction slices. The FPGA accelerates iterative reconstruction algorithms (e.g., MBIR) that improve diagnostic image quality while reducing patient radiation dose.
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추천 제품 요약
엔지니어링 참조 데이터: 10AX115H1F34I1SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115H1F34E1SG | 10AX115H2F34I1SG | 10AX115H3F34I1SG | 10AX090N3F40E2LG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA (F34) | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1517-FCBGA (F40) - different |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | approximately 54,000,000 bits |
| Speed Grade | H1 (fastest) | H1 (same) | H2 (1 step slower) | H3 (2 steps slower) | N3 (mid-speed) |
| Operating Temperature | Industrial -40C to +100C | Extended -40C to +125C | Industrial -40C to +100C | Industrial -40C to +100C | Extended -40C to +125C |
| Transceiver Rate | Up to 14.1 Gbps | Up to 14.1 Gbps | Up to 14.1 Gbps | Up to 14.1 Gbps | Up to 14.1 Gbps |
주요 차별점
- Highest density in Arria 10 GX family (vs 10AX090N3F40E2LG)
- Fastest speed grade available in F34 package (vs 10AX115H3F34I1SG)
- Industrial temperature grade for harsh environments (vs 10AX115H1F34E1SG)
- Hardened PCI Express Gen3 IP (vs Soft PCIe IP on smaller FPGAs)
설계 노트
The 1152-ball FCBGA F34 package requires careful PCB stack-up design with controlled-impedance routing for high-speed transceivers. Use at least an 8-layer PCB with stripline routing for transceiver channels to maintain signal integrity at 14.1 Gbps. Place decoupling capacitors (typically 0.1 uF and 10 uF) within 100 mils of every power pin. Per Intel's Arria 10 pin connection guidelines, leave all unused transceiver channels unconnected with proper biasing, and follow the recommended BGA escape pattern for the F34 substrate. Estimated: stack-up and via-in-pad plating may add 15-20% to bare PCB cost but is mandatory above 10 Gbps.
The Arria 10 GX 10AX115H1F34I1SG can dissipate 15-25 W at full utilization. Apply a heatsink with thermal interface material (TIM) rated for the industrial temperature range, and ensure airflow of at least 1.5 m/s across the package top. The FCBGA substrate has a theta_JC of approximately 0.1 C/W; thermal management is dominated by the heatsink-to-ambient interface. Use thermal vias under the package center array for additional PCB-side cooling. Estimated: at 25 W dissipation with a typical heatsink (theta_SA = 4 C/W) and 1.5 m/s airflow, junction temperature rise above ambient is approximately 100C; without active cooling the device will exceed the +100C industrial limit.
Common pitfalls when designing with the 10AX115H1F34I1SG include: (1) assuming 'H1' speed grade is interchangeable across F34 packages - it is specific to the F34 ball map and cannot substitute into F40 or F45 footprints; (2) failing to instantiate the Hard IP for PCIe Gen3 properly - the soft IP fallback consumes 5-10K LEs and reduces available compute; (3) underestimating configuration memory size - a full bitstream requires approximately 100 Mbit of storage, so select configuration flash such as MT25QU256 with appropriate density; (4) neglecting the MSL3 moisture sensitivity which mandates baking before solder reflow.
Transceiver channel routing must follow strict length-matching rules: intra-pair skew < 5 mil at 14.1 Gbps for 1000 mil trace run. Maintain continuous reference plane under all high-speed traces; avoid routing over plane splits or stitching vias without GND return paths. Differential pair impedance should be 100 ohms +/-10% for transceiver channels, and 90 ohms +/-10% for LVDS I/O. Place the reference clock source within 1000 mils of the CLK pins to minimize jitter, and use a dedicated low-jitter clock synthesizer such as Si5341 or LMK04828.
The Arria 10 GX core requires 0.87-0.93 V at high current (estimated 20-30 A peak at full utilization). Use a multi-phase PWM controller such as the LTM4677 or ISL82xx family with power stages rated for at least 40 A continuous. Separate the PLL analog supply (VCC_PLL) from digital core supply with an L-C filter (ferrite bead + bulk cap) to minimize jitter injection. I/O banks can be supplied at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on interface standard; reference the Arria 10 device datasheet for VCCIO bank configuration rules.
규정 준수 정보
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - this is an FPGA, not an automotive-grade MCU. Industrial temperature grade per ordering code suffix 'I'. Lead-free reflow compatible.