XCZU6CG-1FFVC900E
XCZU6CG-1FFVC900E - Zynq UltraScale+ MPSoC CG, Dual A53/R5, 900-FCBGA | AMD
The AMD (formerly Xilinx) XCZU6CG-1FFVC900E is a heterogeneous Zynq UltraScale+ MPSoC CG device integrating a dual-core ARM Cortex-A53 application processor (up to 1.2 GHz) with a dual-core ARM Cortex-R5 real-time processor (up to 500 MHz), CoreSight debug, and approximately 469K+ programmable logic cells, all housed in a 900-ball FCBGA (31x31 mm) package. The CG subfamily is the cost-optimized dual-core variant without the integrated H.264/H.265 video codec, which AMD explicitly targets at industrial motor control and sensor-fusion workloads. The -1 speed grade and E (0C to +100C) extended temperature grade make this part well suited for industrial and edge deployments where power-constrained enclosures and harsh environments are common.
A heterogeneous MPSoC (Multiprocessor System-on-Chip) is a class of integrated device that tightly couples deterministic real-time microcontrollers, application-class CPUs, graphics/video engines, and hardware-programmable FPGA fabric on a single die. The Zynq UltraScale+ family sits at the top of AMD's SoC taxonomy: heterogeneous MPSoC > Zynq UltraScale+ > Zynq-7000 > earlier Zynq devices, and competes directly with Microchip PolarFire SoC, NXP Layerscape, and TI Jacinto in the embedded edge AI and industrial control segment.
Key features include dual ARM Cortex-A53 cores with NEON/SIMD and ARMv8-A 64-bit support, dual ARM Cortex-R5 cores with lock-step capability, ARM Mali-400MP2 GPU, integrated memory controller supporting DDR4/LPDDR4 with ECC, high-speed transceivers (GTH/GTX), common-use peripherals such as USB 2.0, Gigabit Ethernet, CAN, SPI, I2C, UART, and 256-bit AES/RSA hardware root of trust for secure boot. The 900-FCBGA package exposes approximately 256 user I/O pins grouped into high-range, high-performance, and high-density banks.
The programmable logic portion contains roughly 469K system logic cells plus DSP slices, block RAM, and UltraRAM, all accessible through the ARM PS-PL AXI interconnect. Designers can implement custom peripherals, hardware accelerators, and vision pipelines in the PL fabric, while the hardened PS handles real-time and application tasks. The Vivado and Vitis toolchains from AMD provide C/C++, RTL, and high-level synthesis flows.
Typical applications include industrial motor drives, robotics, sensor fusion gateways, machine-vision controllers, 5G edge radio units, automotive ADAS prototyping, and medical imaging. The CG subfamily is optimal when video encode/decode is not needed but deterministic real-time control, Linux application processing, and FPGA acceleration are all required.
When designing with this device, allocate PCB power-delivery for the multi-rail requirement (typically 0.85 V VCCINT, 1.8 V VCCAUX, 0.9 V DDR4 VTT, plus 3.3 V I/O). Proper decoupling, ground plane stitching under the BGA, and length-matched DDR4 address/command traces are critical; AMD UG583 and UG1075 are the primary hardware-design references.
This page synthesizes distributor pricing, validated drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
USD $4,100.00
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