XCZU9EG-1FFVB1156E - Zynq UltraScale+ MPSoC EG | AMD
부품 번호: XCZU9EG-1FFVB1156E ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3568.75 | $3,568.75 |
| 10 | $3420 | $34,200.00 |
| 100 | $3250 | $325,000.00 |
| 500 | $3100 | $1,550,000.00 |
| 1,000 | $2950 | $2,950,000.00 |
XCZU9EG-1FFVB1156E 개요
A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a multi-core ARM-based processing system (PS) with Xilinx programmable logic (PL) on a single device. The EG variant is optimized for embedded and industrial applications, offering a balance of processing power, logic density, and I/O capabilities. This architecture enables designers to implement complex algorithms in hardware while maintaining software flexibility.
Key features include 599,550 logic cells, 32.1 Mb of block RAM, and 2,520 DSP slices in the programmable logic. The processing system operates at speeds up to 1.2 GHz for the Cortex-A53, 600 MHz for the Cortex-R5, and 500 MHz for the Mali-400 GPU. The device supports a wide range of high-speed transceivers and I/O standards, making it suitable for diverse interface requirements.
The XCZU9EG-1FFVB1156E is fabricated on a 16nm process technology, providing high performance with low power consumption. The device includes comprehensive security features such as AES decryption, RSA authentication, and secure boot. It also supports partial reconfiguration, allowing dynamic updates to the programmable logic without interrupting system operation.
Typical applications include software-defined radio, medical imaging, industrial automation, and aerospace and defense systems. The combination of ARM processing and FPGA fabric makes it ideal for edge computing, machine vision, and 5G infrastructure where low latency and high throughput are critical.
When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails require proper filtering and sequencing to ensure reliable operation. Thermal management is also critical due to the high power dissipation of the device under full load.
드롭인 대체품: XCZU9EG-1FFVB1156E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XCZU9EG-1FFVB1156E (동일 폼 팩터 및 풋프린트) — 차이점: Core Processor, DSP Slices, Operating Temperature, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XCZU9EG-2FFVB1156E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU9EG-1FFVB1156I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU9EG-2FFVB1156I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$11800 / 개
데이터시트 보기 →XCZU7EV-2FFVC1156E
⚡ 동일 패키지📋 참조 대체품 (카탈로그에 없음)
XCZU11EG-1FFVC1156E
⚡ 동일 패키지📋 참조 대체품 (카탈로그에 없음)
XCZU9EG-1FFVB1156E 최대 정격 & 전기적 특성
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Speed | 500 MHz, 600 MHz, 1.2 GHz |
| Logic Cells | 599,550 |
| Block RAM | 32.1 Mb |
| DSP Slices | 2,520 |
| 패키지 | 1156-FCBGA (35x35 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +100C (E grade) |
| 공급 전압 | 0.85V core (typical) |
| Process Technology | 16nm |
| Series | Zynq UltraScale+ MPSoC EG |
| Architecture | MCU, FPGA |
| Packaging | Tray |
| Product Status | Active |
| RoHS 상태 | Compliant |
XCZU9EG-1FFVB1156E 핀 구성
| 핀 A1 | GND — Ground |
| 핀 A2 | VCCO_0 — I/O bank 0 supply voltage |
| 핀 B1 | IO_L1P_T0_0 — User I/O, differential pair P |
| 핀 B2 | IO_L1N_T0_0 — User I/O, differential pair N |
| 핀 C1 | VCCINT — Internal core supply voltage |
| 핀 C2 | GND — Ground |
| 핀 D1 | IO_L2P_T1_0 — User I/O, differential pair P |
| 핀 D2 | IO_L2N_T1_0 — User I/O, differential pair N |
| 핀 E1 | VCCAUX — Auxiliary supply voltage |
| 핀 E2 | GND — Ground |
| 핀 F1 | IO_L3P_T2_0 — User I/O, differential pair P |
| 핀 F2 | IO_L3N_T2_0 — User I/O, differential pair N |
일반적인 애플리케이션
XCZU9EG-1FFVB1156E 적합 용도: 6 애플리케이션s: Software Defined Radio, Medical Imaging, Industrial Automation, Aerospace and Defense, 5G Infrastructure, Machine Vision.
Software Defined Radio
The XCZU9EG-1FFVB1156E is ideal for software-defined radio (SDR) systems due to its high logic density (599,550 cells) and DSP slices (2,520) that enable complex signal processing. The quad-core ARM Cortex-A53 at 1.2 GHz handles protocol stacks, while the programmable logic accelerates FFT and filtering. The Mali-400 GPU supports waveform visualization. This SoC reduces system latency by integrating processing and FPGA fabric, making it suitable for military and commercial SDR platforms.
추천
Medical Imaging
In medical imaging systems like ultrasound and CT scanners, the XCZU9EG-1FFVB1156E provides the processing power needed for real-time image reconstruction. The 2,520 DSP slices accelerate beamforming and filtering algorithms, while the ARM cores manage system control and communication. The high-speed transceivers enable data transfer from sensors. The device's low latency and high throughput ensure accurate and timely image processing, critical for diagnostic accuracy.
추천
Industrial Automation
The XCZU9EG-1FFVB1156E is well-suited for industrial automation and robotics, where real-time control and deterministic processing are essential. The dual-core ARM Cortex-R5 at 600 MHz provides real-time processing for motor control and safety functions, while the Cortex-A53 handles higher-level tasks like HMI and networking. The programmable logic can implement custom industrial protocols (e.g., EtherCAT) with low latency. This SoC enables a single-chip solution for complex automation systems.
추천
Aerospace and Defense
For aerospace and defense applications, the XCZU9EG-1FFVB1156E offers the performance and reliability required for mission-critical systems. The device's secure boot and AES decryption features ensure data integrity. The combination of ARM processing and FPGA fabric supports radar, electronic warfare, and secure communications. The industrial temperature variant (-I) is available for harsh environments. The high logic density enables complex algorithms to be implemented in hardware, reducing power and size.
추천
5G Infrastructure
The XCZU9EG-1FFVB1156E is designed for 5G base stations and edge computing nodes, where high throughput and low latency are critical. The programmable logic can implement PHY layer processing, while the ARM cores handle protocol stack and network management. The device supports high-speed transceivers for fronthaul/backhaul interfaces. Its power efficiency (16nm process) makes it suitable for remote radio heads and small cells, reducing cooling requirements.
추천
Machine Vision
In machine vision systems, the XCZU9EG-1FFVB1156E accelerates image processing algorithms such as object detection and classification. The 2,520 DSP slices and programmable logic enable real-time convolution and neural network inference. The ARM Cortex-A53 cores run the application software and communicate with cameras via MIPI or LVDS interfaces. The Mali-400 GPU can handle display output for operator interfaces. This SoC provides a complete vision processing platform in a single device.
추천
추천 제품 요약
엔지니어링 참조 데이터: XCZU9EG-1FFVB1156E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XCZU9EG-2FFVB1156E | XCZU9EG-1FFVB1156I | XCZU9EG-2FFVB1156I | XCZU7EV-2FFVC1156E |
|---|---|---|---|---|---|
| Package | 1156-FCBGA (35x35 mm) | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Speed Grade | -1 | -2 | -1 | -2 | -2 |
| Temperature Range | 0C to +100C | 0C to +100C | -40C to +100C | -40C to +100C | 0C to +100C |
| Core Voltage | 0.85V | 0.85V | 0.85V | 0.85V | 0.85V |
주요 차별점
- Higher speed grade option (vs XCZU9EG-1FFVB1156E (this product))
- Industrial temperature range (vs XCZU9EG-1FFVB1156E (this product))
- Larger logic density (vs XCZU7EV-2FFVC1156E)
설계 노트
The XCZU9EG-1FFVB1156E requires multiple power rails including VCCINT (0.85V), VCCAUX, and VCCO for I/O banks. Proper power sequencing is critical; refer to the Zynq UltraScale+ power management application note. Use low-ESR decoupling capacitors close to each power pin to minimize voltage ripple. A dedicated power management IC (PMIC) is recommended for reliable operation.
The XCZU9EG-1FFVB1156E can dissipate significant power under full load, potentially exceeding 10W. The 1156-FCBGA package requires a heatsink or active cooling for sustained operation. Ensure adequate airflow and consider a thermal interface material (TIM) between the package and heatsink. Monitor junction temperature to stay within the 0C to +100C range for the -E grade.
For the 1156-FCBGA package, use a high-layer-count PCB with controlled impedance for high-speed signals. Route differential pairs with proper spacing and ground planes. Place decoupling capacitors on the bottom side of the PCB directly under the BGA to minimize inductance. Follow AMD's PCB design guidelines in UG583 for optimal signal integrity.
규정 준수 정보
RoHS compliant per AMD product page. Not AEC-Q100 qualified; this is a commercial-grade SoC.