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TXB0304RSVR - 4-Bit Bidirectional Level Translator 100Mbps | TI
TXB0304RSVR

TXB0304RSVR - 4-Bit Bidirectional Level Translator 100Mbps | TI

The Texas Instruments TXB0304RSVR is a 4-bit bidirectional voltage-level translator with automatic direction sensing, designed for mixed-voltage systems. It operates with two separate power-supply rails, VCCA and VCCB, each configurable from 0.9V to 3.6V, and supports data rates up to 100 Mbps in a 16-pin UQFN (RSV) package measuring 2.6mm x 1.8mm, ideal for space-constrained designs. A voltage-level translator is a crucial component in modern electronics, allowing communication between ICs operating at different voltage levels. For example, a 1.8V microcontroller can interface with a 3.3V sensor or memory device without risking damage or logic errors. The TXB0304 belongs to the TXB family of auto-direction-sensing translators, part of TI's broader level-shifting portfolio that includes unidirectional and bidirectional solutions for various interface standards. Key features include a fully symmetric supply range (0.9V to 3.6V on both VCCA and VCCB), automatic direction sensing that detects data flow without external direction control, and a high data rate of 100 Mbps. The device also provides an isolation function: if either VCC input is at GND, all outputs are placed in a high-impedance state, preventing backflow current and protecting the system. Technically, the TXB0304 uses a one-shot circuit to accelerate rising edges, ensuring fast signal propagation even with capacitive loads. The architecture includes a pass-gate transistor with a pull-up resistor on each I/O pin, providing robust translation. The device is specified from -40C to +85C, is RoHS compliant and lead-free. Typical applications include SPI, I2C, UART, and GPIO interfacing between microcontrollers, sensors, memory, and peripherals at different voltage levels, particularly in IoT devices, portable electronics, and industrial control systems. Design tip: ensure both VCCA and VCCB are powered and place decoupling capacitors close to the power pins. Note that push-pull drivers are preferred; open-drain buses require external pull-ups sized carefully.

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TXB0604 - 4-Bit Auto-Bidirectional Level Translator 345Mbps | TI
TXB0604

TXB0604 - 4-Bit Auto-Bidirectional Level Translator 345Mbps | TI

The Texas Instruments TXB0604 is a 4-bit non-inverting auto-bidirectional voltage level translator that uses two separate configurable power-supply rails: the A port tracks VCCA (0.9V to 2V) and the B port tracks VCCB (1.65V to 3.6V), with the constraint VCCA <= VCCB. It supports data rates exceeding 345Mbps with a 15pF load and over 190Mbps with a 100pF load, and is supplied in a 14-pin TSSOP (PWR) package with a 12-pin X2QFN (1.6x1.6mm) option (RWBR). A voltage level translator is an integrated circuit that allows digital signals to cross between different voltage domains, ensuring valid logic levels and signal integrity in mixed-voltage systems. Within the interface hierarchy, level shifters sit between logic devices and buses, and auto-bidirectional translators eliminate the direction-control pin by automatically sensing data flow. Key features include TI's patented architecture achieving high data throughput for memory-intensive interfaces like Quad-SPI between a Baseboard Management Controller (BMC) and Flash devices, without signal-integrity losses from excessive output parasitic capacitance. The device also provides partial power-down protection (Ioff), Vcc disconnect, Vcc isolation, and integrated pull-up resistors on the A and B ports. Wettable-flank packages enhance solder-joint inspection for automotive-quality assembly. Technically, the TXB0604 functions as both a voltage translator and a line redriver: a one-shot edge accelerator sharpens rising edges, reducing propagation delay, while boosted drive strength enables signal boosting over long-cable transmission. Compared to the legacy TXB0104 (100Mbps), the TXB0604 delivers over 3x the data rate with stronger capacitive load driving. Typical applications include Quad-SPI and Octal-SPI buses between BMCs and Flash memory, eSPI interfaces, and mixed-voltage processor-to-peripheral links in servers, networking equipment, and industrial systems. Design tip: always ensure VCCA <= VCCB, place decoupling capacitors close to both supply pins, and avoid floating unused inputs in partial power-down states. Pricing below is as of 2026-08-30.

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TXE8124-Q1 - 24-Bit Automotive SPI I/O Expander | TI
TXE8124-Q1

TXE8124-Q1 - 24-Bit Automotive SPI I/O Expander | TI

The Texas Instruments TXE8124-Q1 is an automotive-grade 24-bit SPI bus I/O expander with interrupt output, reset input, and I/O configuration registers, operating from a 1.65V to 5.5V VCC supply and available in a VQFN-32 (RHB) package. An SPI I/O expander is a type of interface IC within the broader semiconductor hierarchy (interface IC -> I/O expander -> logic/integration device) that adds general-purpose parallel input/output pins to a microcontroller or processor using the four-wire Serial Peripheral Interface protocol. It belongs to the same product family as GPIO extenders and port expanders, and is the SPI counterpart to I2C expanders such as the PCX857x family, offering higher speed and deterministic timing. Key features include 24 configurable GPIO channels with individual I/O configuration registers, a dedicated interrupt output (INT) that flags input state changes to the host controller, and a reset input (RST) for rapid recovery of the register map to a known default state. The device supports both standard point-to-point SPI communication and daisy-chaining of multiple devices, allowing several expanders to share a single SPI chip-select in dense I/O designs. Performance scales with supply voltage: according to the Texas Instruments datasheet, the TXE8124-Q1 supports a 10MHz SPI clock when VCC is 3.3V to 5.5V and 5MHz when VCC is 1.65V to 5.5V. This voltage-flexible operation allows direct interfacing with 1.8V, 2.5V, 3.3V, and 5V logic domains without level translation in many systems. Typical applications include automotive body control modules, gateway ECUs, and infotainment boards that need additional GPIO for switches, push-buttons, sensors, LEDs, fans, and relay drivers when the host processor has exhausted its native GPIO. Daisy-chaining suits seat-control modules and door zones where dozens of switches must share one SPI port. When designing with this device, plan daisy-chain timing budgets around the 10MHz maximum clock and account for the added shift-register latency per cascaded device; also verify the interrupt output is polled or serviced before the register state can change again. This page synthesizes verified distributor and manufacturer data with drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet, giving engineers a single citable reference.

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TXE8148DGGR - 48-Bit SPI I/O Expander 10MHz | Texas Instruments
TXE8148DGGR

TXE8148DGGR - 48-Bit SPI I/O Expander 10MHz | Texas Instruments

The Texas Instruments TXE8148DGGR is a 48-bit SPI bus I/O expander with interrupt output, reset input, and I/O configurable registers, delivering 48 general-purpose I/Os across six 8-bit ports with 10 MHz SPI operation from a 1.65 V to 5.5 V supply in a 56-pin TSSOP package. An I/O expander is a peripheral interface IC that increases the number of input/output pins available to a host microcontroller or processor without changing the host silicon. In the digital system hierarchy it sits between the host bus master (SPI in this case) and the GPIO load, functioning as a bridge in the broader family of interface ICs. I/O expanders such as the TXE8148 offload pin-count-constrained MCUs, allowing one SPI bus to control dozens of additional digital signals with only four host wires plus chip select. Key features include per-I/O programmable open-drain or push-pull outputs, programmable pullup and pulldown resistors, bus-hold latchable inputs, maskable interrupts with an interrupt status register, and a fail-safe operating mode. The device also supports daisy-chaining of multiple TXE8148 units on a single SPI bus, and documentation is available to aid functional safety system design. Technically, the TXE8148 maintains a 10 MHz SPI bus frequency across the entire 1.65 V to 5.5 V VCC range, which is significant for mixed-voltage designs where many expanders derate speed at low supply. The six-port, eight-I/O-per-port register map gives engineers byte-aligned access to all 48 channels, and the reset input provides deterministic recovery of all registers to a known default state after a fault or watchdog event. Typical applications include industrial control panels that need many switch inputs and relay outputs, functionally safe systems requiring documented failure modes, and server or networking backplanes where a processor must monitor dozens of card-present, fault, and status signals. Design consideration: plan your interrupt strategy early - the maskable interrupt and status register let the host poll a single register instead of 48 GPIOs, but interrupt masks must be configured after every reset since registers return to defaults. This page synthesizes distributor pricing, availability, and practical design guidance not found in the manufacturer datasheet alone.

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TXG1010 - 1-Bit ±10V Ground-Level Translator | Texas Instruments
TXG1010

TXG1010 - 1-Bit ±10V Ground-Level Translator | Texas Instruments

The Texas Instruments TXG1010DSER is a 1-bit, fixed-direction, non-galvanic voltage and ground-level translator supporting logic-level shifting between 1.71V and 5.5V and ground-level shifting of up to ±10V, housed in a small 8-pin SOT-23 (DSE) surface-mount package. A level translator (also called a level shifter or voltage translator) is a logic IC that enables communication between digital circuits operating at different supply voltages, for example a 1.8V microcontroller driving a 5V peripheral. Within the signal-chain hierarchy, the TXG1010 belongs to the voltage-level-translation family of interface ICs. What distinguishes the TXG1010 family from traditional level translators is its ability to shift signals not only between different logic levels but also across different ground domains, solving the challenge of voltage translation between subsystems whose grounds differ by up to ±10V. Key features include a wide 1.71V to 5.5V logic-level translation range, ±10V ground-level shifting capability, a fixed-direction architecture that removes the need for a direction-control pin, and a single-channel (1-bit) topology that minimizes board area. The non-galvanic approach means there is no isolation barrier; the device tolerates ground potential differences rather than providing reinforced isolation, which is an important distinction from digital isolators. Technically, the device translates a logic input referenced to one ground domain into an output referenced to a second ground domain, while simultaneously performing standard low-voltage logic up- or down-translation. The fixed-direction design simplifies control logic and reduces pin count, making it suitable for one-way status, enable, and control signals. Typical applications include ground-offset compensation between a controller and a motor driver, level shifting in automotive and industrial subsystems where ground lift occurs under load, and interfacing between negative-rail or high-side circuitry and a low-voltage MCU. When designing with the TXG1010, remember that it is non-galvanic: sustained ground differences must remain within the ±10V rating, and it should not be used where safety isolation is required. Refer to the manufacturer datasheet for the exact truth table and supply sequencing requirements. This page synthesizes verified distributor and manufacturer data, practical design notes, and selection guidance not found in the datasheet alone. Pricing and stock figures are as of 2026-10-19.

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TXG1021-Q1 - ±10V 2-bit Ground-Level Translator | TI
TXG1021-Q1

TXG1021-Q1 - ±10V 2-bit Ground-Level Translator | TI

The Texas Instruments TXG1021-Q1 is an automotive-qualified 2-bit, fixed-direction, non-galvanic ground-level translator supporting DC ground shifts up to ±10V and logic-level shifting between 1.71V and 5.5V, with propagation delay under 5ns and data rates above 250Mbps in an 8-pin SOIC package. A ground-level translator is a specialized voltage translator that solves a problem conventional level shifters cannot: signals referenced to grounds that sit at different DC potentials. In a classic automotive or industrial system, heavy load currents lifted through shared harness returns create millivolt-to-volt offsets between a sensor ground and a controller ground. Standard level shifters interpret those offsets as logic errors, while a non-galvanic ground-level translator tolerates the DC offset directly on its inputs while still reproducing clean logic edges at the destination domain. Key features include AEC-Q100 qualification for automotive deployments, DC shift tolerance up to ±10V, AC noise rejection of 20VPP up to 45MHz, and common-mode transient immunity (CMTI) of 1kV/us. Channel-to-channel skew is below 0.20ns and propagation delay stays under 5ns, so the device does not become a timing bottleneck even in fast digital links. Quiescent power consumption is low at approximately 0.8mA per the manufacturer datasheet. Architecturally, the TXG102x family uses a non-galvanic coupling approach rather than isolation barriers, giving it near-zero added latency compared with digital isolators while still rejecting ground potential differences. This makes it attractive for bridging control grounds in battery-managed, motor-driven, or switched-load environments where return paths are far from ideal. Typical applications include automotive body-control and gateway modules, motor inverter gate-drive signaling across shifted grounds, industrial PLC I/O with grounded sensor offsets, and battery-management communication lines where cell-stacking creates ground potential differences. Design consideration: verify that expected DC ground offset stays within the ±10V rating under all load and fault conditions, and follow the datasheet layout guidance for the ground-shifted domain. This page adds value beyond the manufacturer datasheet by synthesizing drop-in alternatives, comparison tables, and practical design notes in one place.

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TXG4021-Q1 - ±40V 2-bit Ground-Level Translator | TI
TXG4021-Q1

TXG4021-Q1 - ±40V 2-bit Ground-Level Translator | TI

The Texas Instruments TXG4021-Q1 is an automotive-grade, 2-bit, fixed-direction, non-galvanic ground-level translator supporting logic-level shifting between 1.71V and 5.5V and ground-level shifting up to ±40V, delivered in an 8-pin SOIC (D) package with a maximum data rate of 264 Mbps. A ground-level translator is a specialized type of voltage level shifter within the broader logic IC family. While standard level translators only shift logic thresholds between supply domains (for example 3.3V to 5V), a ground-level translator also bridges systems whose ground references differ by tens of volts - a common condition in automotive and industrial environments where load currents in shared returns lift local ground potentials. The TXG402x-Q1 family solves this without galvanic isolation, offering a lower-cost, smaller-footprint alternative to digital isolators where only ground-offset tolerance is needed. Key features include the ±40V ground-shift tolerance, the 1.71V to 5.5V logic-level range on both sides, a fixed (unidirectional) direction configuration with two channels in a 1/1 arrangement, and a 264 Mbps maximum data rate. The -Q1 variant is qualified for automotive applications per TI's automotive qualification flow, supporting AEC-oriented design flows. Architecturally, the device is non-galvanic: input and output stages share a common substrate reference topology that tolerates large ground differentials while translating logic swings, unlike optocoupler or transformer-based isolators. This yields lower propagation delay and lower cost than isolation approaches, with the trade-off that the ground offset is tolerated rather than fully isolated. Typical applications include automotive body electronics and lighting modules, motor-drive gate-drive interfaces where ground lift occurs, and industrial PLC I/O cards bridging a 1.71V-5.5V controller domain to a high-side domain with a shifted ground. Design consideration: because the part is unidirectional, confirm signal direction is fixed in your topology; it cannot be used for bidirectional buses such as I2C without external direction handling. This page synthesizes verified distributor data, drop-in alternatives, and practical design guidance beyond the manufacturer datasheet.

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TXG4042-Q1 - Automotive ±40V 4-bit Ground-Level Translator | TI
TXG4042-Q1

TXG4042-Q1 - Automotive ±40V 4-bit Ground-Level Translator | TI

The Texas Instruments TXG4042-Q1 is an automotive-grade, ±40V, 4-bit fixed-direction ground-tolerant voltage level translator in a 2/2 push-pull configuration, housed in a 16-pin SSOP package. It supports DC ground shifts up to ±40V, AC noise rejection up to 130 VPP at 1 MHz, and a common-mode transient immunity (CMTI) of 1 kV/μs. The device delivers a maximum propagation delay of 8.5 ns, channel-to-channel skew of 2 ns, and supports data rates up to 100 Mbps. Low power consumption is 0.7 mA per channel at 1 Mbps with a 1.8 V supply, making it efficient for always-on automotive networks. The TXG4042-Q1 is specifically designed to interface low-voltage MCUs with high-voltage domains in systems where the grounds are not co-located, such as in EV traction inverters, motor drives, and industrial PLC I/O modules. A ground-level translator (also called a ground-level shifter) is a specialized class of voltage level translator that operates correctly even when the local ground reference of the input side differs substantially from the local ground reference of the output side. Unlike generic level shifters that only translate voltage thresholds, ground-level translators reject large common-mode DC offsets (typically ±25V to ±50V) between the two sides. This category of IC sits within the broader hierarchy of voltage translators -> interface ICs -> signal conditioning -> integrated circuits. They are essential in safety, motor-control, and renewable-energy systems where isolated high-side circuitry must communicate with low-voltage digital controllers over short, non-isolated links. Key features include robust ±40V DC ground-shift tolerance, high AC noise rejection of 130 VPP at 1 MHz, excellent 1 kV/μs CMTI for fast switching transients, push-pull output drivers with edge acceleration for clean edges at high data rates, and a wide 1.71 V to 5.5 V supply range on the low-voltage side. The fixed 2/2 direction (2 inputs / 2 outputs in one direction, 2 in the other) simplifies firmware and eliminates direction-control pins, reducing BOM cost and PCB area. AEC-Q100 qualification makes the TXG4042-Q1 suitable for automotive temperature grade 1 (-40 °C to +125 °C) operation. Architecturally, the TXG4042-Q1 uses TI's capacitorless, two-channel ground-shift topology with internal high-voltage blocking transistors on each channel. The high-voltage side tolerates continuous DC offsets via integrated clamping and ESD structures, while the input/output structures on the low-voltage side are optimized for sub-5 V CMOS logic levels. The device requires no external bootstrap capacitors, inductors, or programming resistors, simplifying PCB layout and reducing BOM count compared to digital isolator-based alternatives. Typical applications include EV traction inverter gate-driver communication, automotive HVAC and body controllers interfacing with high-side sensors, industrial PLC mixed-voltage I/O links, solar inverter string-monitoring interfaces, and battery-management system (BMS) communications across isolated high-voltage domains. It is also well-suited for medical imaging systems, white-goods motor drives, and any application requiring safe digital communication across non-isolated grounds with significant DC offset. When designing with the TXG4042-Q1, ensure the high-voltage side stays within ±40 V relative to the local ground. Place the VCC bypass capacitor as close as possible to the supply pin to maintain noise margins, and avoid long high-side traces to minimize parasitic coupling. For multi-channel applications, observe the 2 ns channel-to-channel skew budget to preserve signal alignment at the receiver. This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes that extend beyond the manufacturer datasheet, giving engineers actionable sourcing and design guidance in one place.

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TXG4122 - ±40V Bidirectional I2C Ground-Level Translator | TI
TXG4122

TXG4122 - ±40V Bidirectional I2C Ground-Level Translator | TI

The Texas Instruments TXG4122 is a dual (2-bit) bidirectional, non-galvanic voltage and ground-level translator designed specifically for I2C buses, housed in an 8-pin SOIC (D) package. It tolerates ground potential differences of up to ±40V, supports two separately configurable power-supply rails, and passes I2C signals at data rates up to 2 Mbps. A ground-level translator is a type of logic-level shifter within the broader family of signal interface and level-translation ICs. Unlike conventional voltage translators that shift logic thresholds between two supply domains, a ground-level translator tolerates a DC offset difference between the ground references of two subsystems while passing digital signals intact. This matters in systems where a shared I2C bus spans domains whose grounds sit at different potentials, such as battery-stacked architectures, grounded-inverter motor drives, shunt-referenced sensing, and isolated industrial networks where full galvanic isolation is not required but ground bounce or stacking offsets of tens of volts exist. Key features of the TXG4122 include the ±40V common-mode ground-offset tolerance, true bidirectional I2C signaling without direction-control pins, dual channels in a compact 8-SOIC footprint, and an operating temperature range of -40C to +125C for industrial and automotive-adjacent environments. The non-galvanic topology passes signals resistively/capacitively rather than through a digital isolator barrier, avoiding the propagation delay, quiescent power, and cost of optocoupler or digital-isolator approaches while still blocking the ground offset. Architecturally, the device supports two separate configurable power-supply rails, so the low-voltage controller side and the offset high-voltage side can each run at their own logic levels. Bidirectional open-drain I2C signaling (SDA and SCL) is preserved through the translator, keeping multi-master and clock-stretching behavior intact, which is essential for Standards-Mode (100 kHz) through Fast-Mode (up to the 2 Mbps supported rate) operation. Typical applications include I2C communication across stacked battery modules in energy-storage and e-mobility systems, communication equipment and industrial control where grounds are offset, and interfacing to sense elements riding on a high-voltage rail. Distributor listings note demonstrated use in industrial control, automotive electronics, and communication equipment. Design-wise, verify that the common-mode offset stays within the ±40V window under all fault and transient conditions, and keep pull-up resistor values appropriate for the 2 Mbps data rate so rise times remain within the I2C specification. This page synthesizes distributor listings, TI product data, and practical engineering guidance not found in a single source, offering an engineer-oriented view of the TXG4122.

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TXH0137D-Q1 - 7-Bit 30V Level Translator | Texas Instruments
TXH0137D-Q1

TXH0137D-Q1 - 7-Bit 30V Level Translator | Texas Instruments

The Texas Instruments TXH0137D-Q1 is an automotive-qualified 7-bit, single-supply, fixed-direction voltage-level translator with inverted open-drain outputs, housed in a 14-pin TSSOP (PW) package rated from -40C to +125C. A voltage-level translator is a type of logic IC that converts digital signals from one voltage domain to another, sitting within the broader hierarchy of logic ICs, interface ICs, and semiconductors. Level translators are essential whenever chips operating at different supply rails - for example a 3.3V microcontroller and a 12V industrial sensor - must exchange signals safely. Fixed-direction translators like this one assign a permanent direction to each channel, avoiding the overhead and ambiguity of direction-control pins. Key features include 7 translation channels in a single package, open-drain outputs that support voltages up to 30V, and output currents up to 100mA per channel. The inverted output polarity allows the device to double as a level-shifting buffer-inverter, and the open-drain structure lets designers pull outputs to any rail within the 30V rating. As a Q1 device, it carries TI's automotive qualification for -40C to +125C operation. On the technical side, because output currents of up to 100mA per channel are very high for a level translator, the outputs are more susceptible to large overshoot caused by reactive loads. To address this, the TXH0137D-Q1 integrates clamping overshoot-protection diodes on its outputs, improving robustness against inductive and capacitive ringing in automotive wiring environments. Additionally, the open-drain outputs can be tied (paralleling) together to achieve higher aggregate current capability, a flexibility not found in push-pull translators. Typical applications include automotive body electronics and gateways, level-shifting between low-voltage MCUs and high-voltage sensors or actuators, industrial PLC I/O modules, and driving relays, LEDs, or solenoids that require more than the few milliamps a standard logic gate can source. The 30V output rating and 100mA drive make it a direct fit for 12V and 24V automotive rail signaling. A key design consideration: with open-drain outputs, external pull-up resistors are required, and their value sets both the output high level and the rise time. Size pull-ups to balance current consumption against edge speed, and rely on the integrated clamp diodes for overshoot events rather than external TVS in most designs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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TXS0102-Q1 - 2-Bit Auto-Direction Level Translator | TI
TXS0102-Q1

TXS0102-Q1 - 2-Bit Auto-Direction Level Translator | TI

The Texas Instruments TXS0102-Q1 is an automotive-grade, 2-bit bidirectional voltage-level translator for open-drain and push-pull applications, offered in an 8-pin VSSOP (DCU) package. It supports data rates up to 24 Mbps and interfaces logic operating at different voltage levels without a direction-control pin. A voltage-level translator, or level shifter, is a logic IC that connects incompatible logic families or systems operating at different supply voltages, such as a 1.65V microcontroller communicating with a 3.3V or 5V peripheral. Within the signal-chain hierarchy, level translators sit between logic ICs and interface ICs, enabling safe chip-to-chip communication where voltage mismatch would otherwise damage a driver or fail to meet input thresholds. Key features include auto-direction sensing on both channels, A-port supply (VCCA) from 1.2V to 3.6V and B-port supply (VCCB) from 1.65V to 5.5V, an output-enable (OE) input referenced to VCCA that places all I/O in high impedance when low, and internal 10 kOhm pull-up resistors on the I/Os that make the device ideal for open-drain drivers such as I2C buses. The -Q1 suffix denotes AEC-Q100 qualification for automotive applications. Technically, the TXS0102 architecture uses two NMOS pass transistors with 10 kOhm pull-ups per I/O, allowing either port to drive the signal while the opposite side is pulled to its rail. This push-pull capability plus open-drain support distinguishes it from passive FET translators and fixed-direction buffers. Typical applications include I2C and SMBus level translation in automotive body electronics, UART and GPIO bridging in cluster and infotainment modules, and low-speed sensor interface translation between 1.8V MCUs and 3.3V peripherals. Design tip: tie OE to GND through a pull-down resistor to guarantee high impedance during power-up, and for push-pull drivers note that the internal 10 kOhm pull-ups limit edge rates at heavy capacitive loads.

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TXS0102DCUR - 2-Bit Bidirectional Level Shifter | Texas Instruments
TXS0102DCUR

TXS0102DCUR - 2-Bit Bidirectional Level Shifter | Texas Instruments

The Texas Instruments TXS0102DCUR is a 2-bit bidirectional voltage-level translator designed for open-drain and push-pull applications. It enables digital switching compatibility between mixed-voltage systems using two separate configurable power-supply rails: the A ports support 1.65V to 3.6V while tracking VCCA, and the B ports support 2.3V to 5.5V while tracking VCCB. The device comes in an 8-pin VSSOP (DCU) package and operates from -40C to +85C. A voltage-level translator, also called a level shifter, is an integrated circuit that allows communication between components operating at different voltage levels. In mixed-voltage systems combining 3.3V microcontrollers with 5V sensors, or 1.8V logic with 3.3V peripherals, level shifters ensure logic high and low signals are correctly interpreted across voltage domains. The TXS0102 belongs to the bidirectional translator class, which shifts signals in both directions without a direction-control signal, simplifying design and reducing pin count within the broader logic IC and voltage-translation hierarchy. Key features include auto-direction sensing with no direction pin required, maximum data rates of 24 Mbps for push-pull and 2 Mbps for open-drain applications, and support for I2C, SMBus, and UART interfaces. A one-shot accelerator architecture speeds up rising edges even with capacitive loads. The OE pin, when low, places outputs in a high-impedance state for power sequencing and bus isolation. Technically, the TXS0102 uses a pass-gate architecture with integrated pull-up resistors on both A and B ports. When a line is driven low the pass-gate turns on; when released, internal pull-ups raise the line to the respective rail. This enables true bidirectional operation without external control. Typical applications include interfacing microcontrollers with sensors at different voltages, I2C and SMBus bus translation, and UART level shifting between 3.3V and 5V systems in consumer electronics, industrial control, and automotive infotainment. Design tip: ensure VCCA and VCCB stay within specified ranges, control the OE pin to avoid bus contention, and consider the 24 Mbps limit for high-speed links.

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TXS0104EQPWRQ1 - 4-Bit Auto-Direction Level Translator | TI
TXS0104EQPWRQ1

TXS0104EQPWRQ1 - 4-Bit Auto-Direction Level Translator | TI

The Texas Instruments TXS0104EQPWRQ1 is an automotive-grade, 4-bit bidirectional voltage-level translator supporting 24 Mbps data rates in a 14-pin TSSOP (PW) package, qualified to AEC-Q100 for -40C to +125C operation. A voltage-level translator (also called a level shifter) is a logic IC that interfaces digital signals between circuits operating at different supply voltages, for example bridging a 1.8V microcontroller to a 5V sensor bus. Translators sit within the broader voltage-translation family of logic ICs, alongside direction-controlled transceivers and unidirectional buffers. The TXS0104E-Q1 belongs to TI's auto-direction TXS family, which requires no host-side direction-control pin. Key features include auto-direction sensing that eliminates the DIR pin entirely, mixed open-drain and push-pull operation per channel, a wide VCCA range of 1.65V to 3.6V and VCCB range of 2.3V to 5.5V, and a 4 kbps to 24 Mbps data-rate window. An active-high OE pin places all I/O in high-impedance during power-up, enabling partial power-down sequencing. Architecturally, the TXS family uses a discrete integration approach with on-chip series resistors and one-shot edge accelerators: the resistors form a passive divider/clamp for open-drain buses while one-shots speed up rising edges for push-pull signals. This makes it tolerant of I2C, SMBus, SPI, UART and GPIO mixed-direction traffic but limits DC drive capability (typ. 2 mA sink at 3.3V side), which distinguishes it from the TXB push-pull-only family. Typical applications include I2C level shifting between 3.3V and 5V domains, automotive infotainment and body-control module GPIO expansion, and mixed-voltage UART/SD-card interfaces. AEC-Q100 qualification suits it for under-hood and cabin electronics. Design consideration: do not use the TXS family where channels source continuous DC current above 2-3 mA or where extremely low standby current is required; the always-on one-shot architecture draws current on every edge. This page synthesizes distributor availability, pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet.

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TXS0108EPWR - 8-Bit Bidirectional Level Shifter 60Mbps | TI
TXS0108EPWR

TXS0108EPWR - 8-Bit Bidirectional Level Shifter 60Mbps | TI

The Texas Instruments TXS0108EPWR is an 8-bit bidirectional voltage-level translator for open-drain and push-pull applications, housed in a 20-pin TSSOP (PW) package. It operates from two independently supplied rails, VCCA (1.2V to 3.6V on the A port) and VCCB (1.65V to 5.5V on the B port), with data rates up to 60 Mbps for push-pull signals and 2 Mbps for open-drain signals. A voltage-level translator, also called a level shifter, is an integrated circuit that enables digital communication between systems operating at different voltage domains. Within the logic-translation hierarchy, bidirectional auto-direction translators such as the TXS0108E sit alongside direction-controlled families like the SN74LVC8T245 and TXB0108, providing mixed-voltage interfacing for microcontrollers, peripherals, and buses. Key features include automatic direction sensing, which eliminates a direction-control pin, and a VCC isolation feature: if either supply rail is at GND, all I/Os enter high impedance, preventing back-powering during partial power-down. Quiescent current is low at 620 uA, and the one-shot accelerator architecture speeds low-to-high transitions for high-speed push-pull operation. The device is specified from -40C to +85C, is RoHS compliant, and carries MSL 1 (260C unlimited floor life). Architecturally, the TXS0108E combines a pull-up based open-drain translation path with edge-accelerating one-shots, making it equally suitable for I2C-style open-drain buses and push-pull SPI/UART links. This auto-direction design trades output drive strength for bidirectionality, so it excels on lightly loaded point-to-point links rather than heavily bused systems. Typical applications include interfacing 1.8V or 3.3V microcontrollers with 5V sensors, SD/MMC memory-card interfaces, UART/SPI/I2C bus translation, and mixed-voltage communication in consumer, industrial, and IoT systems. Design tip: for open-drain use, external pull-up resistors are required on both sides; keep them sized per datasheet recommendations to avoid rise-time degradation at target data rates. Pricing as of 2026-08-29.

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TXS0108EQPWRQ1 - 8-Bit Auto-Direction Level Shifter | TI
TXS0108EQPWRQ1

TXS0108EQPWRQ1 - 8-Bit Auto-Direction Level Shifter | TI

The Texas Instruments TXS0108EQPWRQ1 is an automotive-grade, 8-bit bidirectional voltage level translator in a 20-pin TSSOP (PW) package, qualified per AEC-Q100 temperature grade 1 (-40C to +125C). It requires no direction-control signal because its auto-direction sensing architecture detects data flow on each channel independently, supporting both push-pull and open-drain applications. A voltage level translator (also called a logic level shifter or voltage translation IC) is an interface component in the broader logic and interface IC family that safely bridges digital devices operating at different supply domains, for example a 1.8V microcontroller talking to a 5V sensor. Level shifters protect low-voltage I/O from overvoltage while preserving logic thresholds, edge rates, and signal integrity across the voltage boundary. Key specifications include a wide VCCA range of 1.2V to 3.6V and VCCB range of 1.65V to 5.5V, enabling translation between almost any two common logic rails. Push-pull data rates reach 110 Mbps while open-drain operation supports 2 Mbps with integrated 10 kOhm pull-up resistors. The device also offers an OE pin for 3-state operation during power sequencing and classified HBM ESD level 2 and CDM level C6 robustness per TI data. Architecturally, the TXS0108E uses one-shot edge-rate accelerators on each channel to improve rise times, combined with a 4 kOhm series pass-gate element; this open-drain-friendly structure means it is not recommended for applications needing high drive strength such as direct LED loads. Typical applications include automotive infotainment and body-control module I/O translation, sensor and CAN-adjacent digital interfacing, and portable electronics bridging 1.8V/2.5V/3.3V memory or peripheral buses to 5V domains. All prices cited in this page are as of 2026-08-29. Design tip: because of the internal pull-ups, avoid this family for signals requiring low-capacitance backplane conditions; for heavy push-pull loads choose the TXB0108 instead.

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TXS0108ERGYR - 8-Bit Bidirectional Level Shifter | Texas Instruments
TXS0108ERGYR

TXS0108ERGYR - 8-Bit Bidirectional Level Shifter | Texas Instruments

The Texas Instruments TXS0108ERGYR is an 8-bit bidirectional voltage-level translator designed for open-drain and push-pull applications. It operates with a VCCA range of 1.4V to 3.6V and a VCCB range of 1.65V to 5.5V (with VCCA <= VCCB), supporting maximum data rates of 110Mbps for push-pull signals and 1.2Mbps for open-drain buses. The device comes in a 20-pin VQFN (RGY) package measuring 3.5x4.5mm with an operating temperature range of -40C to +85C. A voltage-level translator, also called a level shifter, is a logic IC that enables communication between devices operating at different supply voltages, such as a 1.8V microcontroller interfacing with a 5V peripheral. Level translators sit within the broader logic IC family and are essential in any mixed-voltage embedded system. The TXS0108E requires no direction-control signal because its auto-direction sensing architecture detects data flow automatically, reducing MCU pin usage and firmware complexity. Key features include VCC isolation, which places all outputs in high-impedance if either supply is at GND; no power-supply sequencing requirement, since either VCCA or VCCB can ramp first; and a one-shot edge-rate accelerator that boosts rise times to achieve the 110Mbps push-pull data rate. The transistor-based pass-gate architecture supports both open-drain buses such as I2C and push-pull interfaces such as SPI and UART without configuration. Typical applications include I2C, SPI, and UART level shifting between low-voltage MCUs (1.8V/2.5V/3.3V) and 5V peripherals, SD card and SIM card interfaces, and general-purpose GPIO translation in industrial and consumer systems. As of 2026-08-30, pricing starts at approximately $0.60-$0.90 at 1-piece quantity from authorized distributors. Design tip: always keep VCCA <= VCCB, place 0.1uF and 10uF decoupling capacitors close to both supply pins, and use external pull-up resistors on both sides for open-drain operation.

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UCS-NVES1T9K1V - 1.9TB E1.S NVMe Gen4 SSD | Cisco
UCS-NVES1T9K1V

UCS-NVES1T9K1V - 1.9TB E1.S NVMe Gen4 SSD | Cisco

The Cisco UCS-NVES1T9K1V is a 1.90 TB enterprise NVMe solid state drive in an E1.S (15 mm) form factor, built on the Kioxia XD7P high-performance, mid-endurance flash platform with a PCI Express NVMe 4.0 (x1) host interface for Cisco UCS servers. The equivalent commercial SKU is CAI-NVES1T9K1V, listed by distributors as the Cisco 1.9TB E1.S 15mm Kioxia XD7P High Performance Mid Endurance Gen4 1x NVMe drive. An enterprise NVMe SSD is a solid state storage device that connects directly to the PCIe bus using the NVMe protocol, bypassing SATA/SAS controller bottlenecks to achieve lower latency and higher IOPS. Within the storage hierarchy, it sits as block storage below the server OS layer and above the raw NAND media; the E1.S (EDSFF) form factor is the compact successor to M.2 and U.2 drives, optimized for dense 1U/2U rack servers. Cisco qualifies specific drive PIDs for its UCS C-Series rack servers so that firmware, thermal profiles, and drive-slot mapping are fully supported under Cisco TAC. Key characteristics of this drive include its 1.90 TB raw capacity, PCIe 4.0 NVMe x1 electrical interface, E1.S 15 mm mechanical format with an integrated drive carrier for UCS drive slots, and Kioxia XD7P NAND tuned for high performance with mid endurance - a fit for read/write-mixed enterprise workloads rather than extreme write-intensive caching. Cisco lists the supported host platform as the UCS C845A M8 AI Server, an NVIDIA MGX-based accelerated computing system. In deployment, the UCS-NVES1T9K1V typically serves as local high-performance boot or data storage for AI training nodes, database servers, and virtualization hosts where NVMe Gen4 bandwidth reduces data loading time. Cisco validates drive-to-server interoperability through the UCS Hardware Compatibility List (HCL), so mixing unqualified third-party E1.S drives can void hardware support. Design consideration: verify the target UCS server chassis and firmware release support E1.S Gen4 x1 drives via the Cisco UCS HCL before ordering, and note that the drive reaches Cisco end of sale on 2026-12-25, so long-term spares should be procured before that date. This page synthesizes distributor pricing, lifecycle dates, platform compatibility, and procurement guidance for both the UCS-NVES1T9K1V and CAI-NVES1T9K1V SKUs in one place - information typically spread across Cisco, Ingram Micro, CDW, and lifecycle-tracking sources.

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UCS-NVES3T8K1V - Cisco 3.8TB NVMe E1.S SSD | Cisco | UCS Servers
UCS-NVES3T8K1V

UCS-NVES3T8K1V - Cisco 3.8TB NVMe E1.S SSD | Cisco | UCS Servers

The Cisco UCS-NVES3T8K1V is a 3.8TB PCI Express 4.0 (PCIe NVMe 4.0) E1.S (15 mm) internal solid state drive based on the Kioxia XD7P high-performance, medium-endurance SSD series, designed for Cisco UCS C-Series rack servers, including the UCS C845A M8 AI server. The drive connects through a x4 PCIe 4.0 NVMe interface and is qualified by Cisco as a server storage module within the UCS C-Series ecosystem. An NVMe SSD (Non-Volatile Memory Express solid state drive) is a storage device that attaches directly to the PCIe bus rather than through legacy SATA/SAS controller paths. In the storage hierarchy, it sits at the top of the enterprise flash tier: NAND flash -> SSD controller -> NVMe protocol -> PCIe transport -> server platform. By eliminating the SAS/SATA translation layer, NVMe reduces latency and increases queue depth, which is why data center and AI workloads increasingly standardize on NVMe drives such as this one. Key characteristics of the UCS-NVES3T8K1V include its 3.80 TB usable capacity, its compact E1.S 15 mm edge-connector form factor (part of the EDSFF family standardized for dense server platforms), and its PCIe NVMe 4.0 host interface. The underlying Kioxia XD7P silicon is positioned as high performance with medium endurance (drive writes per day rating [DATA_NEEDED: DWPD]), targeting read-intensive and mixed enterprise workloads rather than extreme write-cycle caching tiers. The XD7P platform uses enterprise-grade NAND and a controller tuned for consistent low latency, making the drive suitable as boot, scratch, or high-IOPS data storage. Because it is a Cisco-qualified PID, firmware and thermal behavior are validated against UCS C-Series chassis airflow and power profiles, which third-party drives cannot guarantee. Typical applications include AI/ML training data pipelines on the UCS C845A M8, virtualization and database storage tiers, high-density composable infrastructure, and general rack-server storage expansion where a 3.8TB E1.S NVMe module is required. A key design consideration: this PID is schedule-based for end of sale - Cisco has announced end of sale for UCS-NVES3T8K1V= on 2026-12-25 - so new designs should verify lifecycle status and plan spares accordingly. This page synthesizes distributor pricing, lifecycle information, and drop-in family alternatives not consolidated on the manufacturer datasheet page.

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UDA1341TS/N1 - Stereo Audio CODEC, SSOP-28 | NXP Semiconductors
UDA1341TS/N1

UDA1341TS/N1 - Stereo Audio CODEC, SSOP-28 | NXP Semiconductors

The NXP Semiconductors UDA1341TS/N1 is a single-chip stereo audio CODEC combining a 4-channel Analog-to-Digital Converter and a 2-channel Digital-to-Analog Converter using bitstream conversion techniques, housed in a 28-pin SSOP (SOT341-1) package. It features 20-bit ADC/DAC resolution, integrated Programmable Gain Amplifiers (PGA), digital Automatic Gain Control (AGC), and an L3-interface for microcontroller control of audio processing features including de-emphasis, volume, bass boost, treble, and soft mute. An audio CODEC (Coder-Decoder) is a mixed-signal integrated circuit that converts analog audio signals into digital form for processing or storage, and converts digital audio back into analog for playback. CODECs sit at the boundary between the analog and digital audio domains, and are foundational components in the audio signal chain: microphone input -> analog PGA -> ADC -> digital audio bus -> DAC -> analog output -> speakers/headphones. The UDA1341TS belongs to NXP's economy audio CODEC family, designed for cost-sensitive MiniDisc (MD), home stereo, and portable applications. Key features include 4 analog input channels and 2 analog output channels, support for multiple digital audio data formats (I2S-bus, LSB-justified, MSB-justified), a fully integrated analog front end, on-chip DSP features in playback mode, and partial pin compatibility with the UDA1340M and UDA1344TS for easy PCB upgrades. The device operates over -20C to +85C ambient temperature range typical of consumer audio equipment. The UDA1341TS architecture uses oversampling bitstream (sigma-delta) conversion to achieve 20-bit resolution with high noise immunity and reduced analog filtering requirements. The integrated PGA and AGC simplify external analog circuitry, while the L3-interface allows software control of digital audio features without external DSP hardware. This makes the UDA1341TS suitable for compact, low-cost audio designs. Typical applications include MiniDisc (MD) recorders and players, home stereo receivers and CD recorders, portable digital audio devices, set-top boxes, and automotive head units. The wide input channel count supports multi-source mixing for recording applications. When designing with the UDA1341TS, pay careful attention to power supply decoupling and grounding to avoid digital switching noise coupling into the analog sections, since the CODEC integrates both sensitive analog and high-speed digital functions on the same die. Use separate analog and digital supply pins as recommended in the datasheet, with low-impedance ground returns. This page synthesizes current NXP datasheet specifications, real distributor pricing, drop-in alternative CODECs, and practical analog/digital design guidance not found in the manufacturer datasheet alone.

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UJA1018TK - LIN System Basis Chip w/ LED Drivers | NXP
UJA1018TK

UJA1018TK - LIN System Basis Chip w/ LED Drivers | NXP

The NXP UJA1018TK is a LIN 2.0/2.0A/2.1/2.2/SAE J2602 system basis chip (SBC) with integrated low-drop voltage regulator and LED drivers, housed in a 16-terminal HVSON (3.5x5.5 mm) exposed-pad package. It combines a single LIN-bus transceiver, a 5.0 V/70 mA LDO regulator, and dedicated LED driver outputs that simplify compact mechatronic and automotive body-electronic node designs. A LIN system basis chip is a class of mixed-signal interface IC that integrates a bus transceiver with on-chip power management and support peripherals. By collapsing the transceiver, voltage regulator, and actuator drivers into a single die, an SBC reduces PCB area, lowers quiescent current, and provides a robust EMC/ESD front end for in-vehicle networks governed by the LIN/J2602 family of standards. The UJA1018TK sits within the automotive networking segment alongside CAN and FlexRay transceivers, and is commonly used as a body-control sub-node tying switches, sensors, and LEDs back to a central body control module. Key features of the UJA1018TK include compliance with LIN 2.0/2.1/2.2 and SAE J2602, integrated 5.0 V low-drop regulator capable of delivering up to 70 mA to external loads, programmable LIN-bus slew rate for EMC control, and dedicated LED driver pins capable of sourcing the current required for indicator or status lamps. The device supports node-position identification through a daisy-chained LIN-switch path, allowing cost-effective address assignment in multi-node LIN chains. The architecture combines a high-voltage analog front end tolerant of automotive 12 V transients with a low-power digital LIN protocol state machine. An integrated LIN bus switch enables address assignment without external EEPROM, while thermal shutdown, load-dump protection, and an exposed thermal pad enable AEC-Q100-style automotive operation across the -40C to +150C automotive temperature range. Supply current is typically around 4.5 mA in active mode, supporting always-on body networks. Typical applications include automotive door modules, seat controllers, steering-column switches, sunroof and mirror modules, climate-control panels, and any LIN-attached mechatronic node that also needs to drive LEDs. Its 5 V regulator rail can directly supply a small microcontroller and sensing front-end. When designing with the UJA1018TK, observe the recommended PCB layout for the HVSON exposed pad - a thermal land of at least 100 mm² of 1 oz copper is needed for sustained LED-driver currents. Decouple the regulator output with a 1 µF X7R ceramic placed within 3 mm of the VCC pin, and place the LIN bus termination and ESD protection within 10 mm of the LIN pin to meet IEC 61000-4-2 air-discharge ratings. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical PCB/EMC design notes not found in the manufacturer datasheet.

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UJA1018TK,118 - LIN 2.x SBC with 5V LDO & LED Drivers | NXP
UJA1018TK,118

UJA1018TK,118 - LIN 2.x SBC with 5V LDO & LED Drivers | NXP

NXP UJA1018TK,118 is a LIN 2.0/2.1/2.2 and SAE J2602 compliant system-basis chip (SBC) integrating a LIN transceiver, a 5 V low-dropout (LDO) voltage regulator rated up to 70 mA, and two LED drivers, housed in a 16-pin HVSON (3.5 x 5.5 mm) exposed-pad package. A LIN System Basis Chip (SBC) is a mixed-signal IC that combines the physical-layer transceiver, an internal supply for the local microcontroller, and bus-switching or indicator-driving peripherals in a single die. It sits below the protocol layer (handled by software running on an external MCU) and above the physical LIN bus wire; the SBC therefore belongs to the broader class of in-vehicle networking (IVN) interface ICs in the automotive-power-tree hierarchy: SBC -> transceiver -> interface IC -> automotive semiconductor. Key features include LIN 2.0/2.1/2.2/SAE J2602 compliance, downward compatibility with LIN 1.3, an internal LIN slave termination resistor, Slave Node Position Detection (SNPD) for daisy-chain address assignment, integrated 5 V LDO capable of 70 mA, two programmable LED drivers, and a wide operating temperature range from -40 C to +150 C suited to under-hood automotive modules. The device is built on NXP's automotive-qualified mixed-signal BiCMOS process and uses an internal LIN slave termination that can be switched in/out to detect the node's position on the bus. This eliminates the need for an external termination resistor and simplifies ECU board layout where mechanical relay or electronic module LIN nodes are wired in series. Typical applications include automotive body-control modules, door/window/seat/mirror LIN slave nodes, HVAC control panels, steering-column switches, and ambient interior lighting nodes that require a regulated 5 V rail plus LIN connectivity in a small PCB footprint. When designing with this SBC, observe the maximum LIN bus load and slew-rate limits stated in the datasheet, and use the exposed pad as the primary thermal path - the LDO's 70 mA output and LED-driver current together define the package's power budget. A 100 nF decoupling capacitor placed within a few millimeters of the VCC pin is mandatory for stable LDO operation across the -40 C to +150 C range. This page synthesizes NXP distributor pricing, drop-in HVSON alternatives, and PCB-level design notes that go beyond the manufacturer datasheet's typical-application section.

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UJA1023T - LIN 2.0 I/O Slave, 16-SO, NXP
UJA1023T

UJA1023T - LIN 2.0 I/O Slave, 16-SO, NXP

The NXP UJA1023T is a stand-alone Local Interconnect Network (LIN) 2.0 compliant I/O slave integrated circuit, designed to replace discrete input and output handling components inside automotive electronic control units. The device integrates a LIN 2.0 controller, an integrated LIN transceiver (LIN 2.0 / SAE J2602 compliant, LIN 1.3 compatible), a 30 kΩ slave termination resistor, and eight general-purpose I/O lines, all packaged in a 16-pin Small Outline (SOT109-1 / 16-SO) surface-mount outline. A LIN transceiver IC is a category of in-vehicle networking transceivers that serves as the physical-layer interface between a microcontroller's UART and the single-wire LIN bus. In the broader system hierarchy, a LIN I/O follower sits below full system-basis chips and above discrete LIN bus drivers, providing a compact slave-node solution for distributed body-electronics applications such as door modules, mirror adjusters, and seat controllers. Key functional features of the UJA1023T include LIN 2.0 / SAE J2602 compliance for the physical layer, LIN 1.3 backwards compatibility, an integrated 30 kΩ bus termination resistor that eliminates an external component, eight configurable I/O lines that can act as digital inputs, digital outputs, or analog inputs, and a wide supply voltage range of 6.5 V to 27 V that directly accepts the automotive 12 V battery rail, including cranking transients. The IC operates with a maximum supply current of 1 mA and is qualified for automotive ambient temperatures. Architecturally, the UJA1023T pairs a hardware LIN protocol handler with parallel digital I/O registers, allowing the host microcontroller to service the bus autonomously and read or drive the I/O pins via a simple serial peripheral interface. Because the LIN protocol state machine is embedded, the host MCU only needs to handle application-level data, which reduces firmware complexity. Typical applications include automotive body-electronics slave nodes (door modules, mirror modules, seat controllers, steering-wheel switches, roof modules, and lighting clusters), HVAC flap and blower controls, and generic LIN-bus remote I/O expansion where host MCU pin count is limited but the application requires several additional digital or analog lines. When designing with the UJA1023T, ensure the local Vbat decoupling is sized for the cold-crank profile (down to 6.5 V) and that the LIN bus pin has the recommended reverse-battery and ESD protection network per the datasheet. Pins not used as I/O should be configured to a defined state in firmware to avoid parasitic current paths. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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UJA1023T/2R04/C,51 - LIN 2.0 I/O Slave | NXP Semiconductors
UJA1023T-2R04-C51

UJA1023T/2R04/C,51 - LIN 2.0 I/O Slave | NXP Semiconductors

The NXP Semiconductors UJA1023T/2R04/C,51 is a stand-alone Local Interconnect Network (LIN) I/O follower (slave) that integrates a LIN 2.0 controller, a LIN 2.0/SAE J2602-compliant transceiver, a 30 kOhm LIN-slave termination resistor, and eight configurable I/O ports into a single 16-pin SOIC package supplied from 6.5 V to 27 V. It is designed to replace the discrete components commonly used in electronic control units (ECUs) for digital input capture, digital output driving, and LIN-bus communication. What is a LIN I/O follower? A LIN (Local Interconnect Network) I/O follower is a specialized node device in automotive LIN sub-bus networks. LIN is a low-cost single-wire serial protocol standardized by ISO 17987 (formerly LIN 1.3 / LIN 2.0 / SAE J2602) used for in-vehicle body-electronics communication (window lifters, seat controllers, mirror adjusters, ambient lighting). A LIN I/O follower replaces a small microcontroller + LIN transceiver + I/O expander combination with one IC that listens to LIN commands and drives/reads I/O lines directly, reducing BOM cost and PCB area in low-complexity slave nodes. Key features include LIN 2.0 protocol compliance with LIN 1.3 backward compatibility, SAE J2602 interoperability, integrated 30 kOhm bus termination (no external resistor required), eight software-configurable I/O ports routed via LIN, an SPI-compatible host interface for diagnostics and configuration, and built-in thermal protection. The /2R04 variant designation specifies the I/O mapping and firmware revision; /C,51 indicates the SOIC-16 tape-and-reel packaging and lead-finish code. Architecturally, the UJA1023 combines a LIN protocol handler, a physical-layer transceiver compliant with ISO 9141 / LIN 2.0 / SAE J2602, an internal 30 kOhm pull-up for slave nodes, and a multi-purpose I/O controller. The high integration eliminates the typical external microcontroller in simple LIN slaves, while the SPI host interface allows a higher-level ECU to log or override I/O states during diagnostics. Typical applications include automotive body-electronics modules (window lift, seat control, mirror adjust, ambient lighting, sunroof), HVAC auxiliary controls, door-handle and key-fob reader modules, and LIN-bus sensor actuators. The wide 6.5 V-27 V supply range tolerates automotive load-dump transients up to the absolute maximum ratings stated in the datasheet. Design considerations include adding a reverse-battery protection diode and adequate bulk decoupling on VBat, plus a 100 nF ceramic bypass capacitor close to the supply pin. The internal 30 kOhm termination is enabled in master-less slave configurations; in master or external-terminated nodes, the resistor is typically disabled via configuration. The /2R04 firmware revision must be matched against the OEM's LIN cluster description (LDF/NCF) to ensure correct I/O mapping. This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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UJA1169ATK/3Z - Mini HS-CAN SBC, 3.3V/250mA, AEC-Q100 | NXP
UJA1169ATK/3Z

UJA1169ATK/3Z - Mini HS-CAN SBC, 3.3V/250mA, AEC-Q100 | NXP

The NXP UJA1169ATK/3Z is a mini high-speed CAN System Basis Chip (SBC) in the UJA1169ATK family, integrating an ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant HS-CAN transceiver that supports CAN FD up to 5 Mbit/s together with an on-board 3.3 V (V1) LDO regulator rated at 250 mA for the host microcontroller supply, all housed in a 20-pin HVSON package (3.5 x 5.5 mm). What is a CAN System Basis Chip (SBC)? An SBC is a highly integrated mixed-signal IC that combines a CAN (Controller Area Network) or CAN FD physical-layer transceiver with on-chip power management - typically one or more low-dropout (LDO) regulators - and optional watchdog, SPI control and wake-up logic. In the automotive ECU hierarchy, an SBC sits between the 12 V board net, the host microcontroller, and the CAN bus, replacing several discrete components: an HS-CAN transceiver, a 5 V or 3.3 V regulator for the MCU, reverse-battery protection and bus ESD protection. The wider taxonomy is: SBC -> CAN transceiver -> automotive networking IC -> power management IC -> semiconductor. Key features of the UJA1169ATK/3Z include 250 mA continuous V1 current to power a small MCU, support for CAN FD at 5 Mbit/s, integrated bus dominant clamping and very low-current standby modes with remote wake-up via the bus. The transceiver meets the stringent automotive EMC and ESD requirements of the ISO 11898-2:2016 standard and the SAE J2284-1 to J2284-5 specifications, while the integrated regulator and protection circuitry reduce external component count and PCB area in ECU designs. Architecturally, the part uses a high-voltage analog/mixed-signal process for the bus-side drivers and a low-voltage digital block for the SPI register set and V1 LDO. This dual-rail approach allows direct connection to a 12 V automotive supply while still powering the host MCU from the on-chip 3.3 V regulator in the /3Z variant. Typical applications include body control modules, gateway ECUs, CAN node power management in 12 V systems, ADAS sensor interface nodes and any automotive system that needs a single-chip CAN interface plus local MCU supply. Compared with discrete CAN transceivers plus external regulators, the UJA116ATK family shrinks the BOM and simplifies EMC compliance. When designing with the UJA1169ATK/3Z, ensure the 12 V supply is properly filtered, route the CANH/CANL lines as a 120 ohm twisted pair, and decouple V1 with the value recommended in the manufacturer datasheet. The /3Z variant is the 3.3 V V1, tape-and-reel orderable variant; the 5 V variant is the UJA1169ATK/F/3Z and the non-Z variants differ only in packing or V1 voltage. This page synthesizes real distributor pricing, drop-in alternatives from the same NXP UJA1169 family, comparison data and practical design notes not collated on the manufacturer product page alone.

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