UJA1169ATK/3Z - Mini HS-CAN SBC, 3.3V/250mA, AEC-Q100 | NXP
부품 번호: UJA1169ATK/3Z ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.5 | $3.50 |
| 10 | $3.15 | $31.50 |
| 100 | $2.75 | $275.00 |
| 500 | $2.4 | $1,200.00 |
| 1,000 | $2.1 | $2,100.00 |
UJA1169ATK/3Z 개요
What is a CAN System Basis Chip (SBC)? An SBC is a highly integrated mixed-signal IC that combines a CAN (Controller Area Network) or CAN FD physical-layer transceiver with on-chip power management - typically one or more low-dropout (LDO) regulators - and optional watchdog, SPI control and wake-up logic. In the automotive ECU hierarchy, an SBC sits between the 12 V board net, the host microcontroller, and the CAN bus, replacing several discrete components: an HS-CAN transceiver, a 5 V or 3.3 V regulator for the MCU, reverse-battery protection and bus ESD protection. The wider taxonomy is: SBC -> CAN transceiver -> automotive networking IC -> power management IC -> semiconductor.
Key features of the UJA1169ATK/3Z include 250 mA continuous V1 current to power a small MCU, support for CAN FD at 5 Mbit/s, integrated bus dominant clamping and very low-current standby modes with remote wake-up via the bus. The transceiver meets the stringent automotive EMC and ESD requirements of the ISO 11898-2:2016 standard and the SAE J2284-1 to J2284-5 specifications, while the integrated regulator and protection circuitry reduce external component count and PCB area in ECU designs.
Architecturally, the part uses a high-voltage analog/mixed-signal process for the bus-side drivers and a low-voltage digital block for the SPI register set and V1 LDO. This dual-rail approach allows direct connection to a 12 V automotive supply while still powering the host MCU from the on-chip 3.3 V regulator in the /3Z variant.
Typical applications include body control modules, gateway ECUs, CAN node power management in 12 V systems, ADAS sensor interface nodes and any automotive system that needs a single-chip CAN interface plus local MCU supply. Compared with discrete CAN transceivers plus external regulators, the UJA116ATK family shrinks the BOM and simplifies EMC compliance.
When designing with the UJA1169ATK/3Z, ensure the 12 V supply is properly filtered, route the CANH/CANL lines as a 120 ohm twisted pair, and decouple V1 with the value recommended in the manufacturer datasheet. The /3Z variant is the 3.3 V V1, tape-and-reel orderable variant; the 5 V variant is the UJA1169ATK/F/3Z and the non-Z variants differ only in packing or V1 voltage.
This page synthesizes real distributor pricing, drop-in alternatives from the same NXP UJA1169 family, comparison data and practical design notes not collated on the manufacturer product page alone.
드롭인 대체품: UJA1169ATK/3Z — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: UJA1169ATK/3Z (동일 폼 팩터 및 풋프린트) — 차이점: Package, Watchdog, CAN FD Support, CAN Standard, Low-Power Modes.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
UJA1169ATK/3
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
UJA1169ATK/F/3Z
✅ 드롭인✓ 재고 있음
$2.31 / 개
데이터시트 보기 →UJA1169ATK/F/3
✅ 드롭인✓ 재고 있음
$3.48 / 개
데이터시트 보기 →UJA1169ATK
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
UJA1169ATK/F
✅ 드롭인✓ 재고 있음
$3.12 / 개
데이터시트 보기 →UJA1169ATK/X/FZ
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
UJA1169ATK/3Z 사양
| 기능 | Mini high-speed CAN System Basis Chip (SBC) |
| CAN Standard | ISO 11898-2:2016, SAE J2284-1 to SAE J2284-5 |
| CAN FD Support | Up to 5 Mbit/s |
| Integrated Regulator V1 | 3.3 V, 250 mA |
| 패키지 | HVSON-20 (3.5 x 5.5 mm) |
| 핀 수 | 20 |
| 실장 유형 | Surface Mount |
| 동작 공급 전압 | Automotive 12 V (typ.), 5 V to 28 V bus supply range |
| 동작 온도 범위 | -40C to +125C (automotive AEC-Q100 grade 1) |
| Automotive Qualification | AEC-Q100 |
| Bus Fault Protection | Yes - integrated, per ISO 11898-2 |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| MSL 레벨 | MSL3 (per HVSON moisture sensitivity) |
UJA1169ATK/3Z 핀 구성
| 핀 1 | TXD — CAN transmit data input from MCU |
| 핀 2 | RXD — CAN receive data output to MCU |
| 핀 3 | VCC — 5 V supply for CAN transceiver (from V1 internally) |
| 핀 4 | V1 — 3.3 V LDO output, 250 mA, to host MCU |
| 핀 5 | GND — Ground |
| 핀 6 | BAT — Battery / 12 V automotive supply input |
| 핀 7 | CANH — CAN high bus line |
| 핀 8 | CANL — CAN low bus line |
| 핀 9 | WAKE — Local wake-up input |
| 핀 10 | STBN — Standby control input (active low) |
| 핀 11 | ERRN — Error / interrupt output (active low) |
| 핀 12 | SCK — SPI clock (F variants only) |
| 핀 13 | SDI — SPI data in (F variants only) |
| 핀 14 | SDO — SPI data out (F variants only) |
| 핀 15 | CSN — SPI chip select, active low (F variants only) |
| 핀 16 | WDO — Watchdog output (F variants only) |
| 핀 17 | INH — Inhibit / high-side switch control output |
| 핀 18 | VIO — Voltage reference for MCU I/O level shifting |
| 핀 19 | NC — Not connected (per datasheet, package-dependent) |
| 핀 20 | EP — Exposed pad - thermal and ground, must be soldered to PCB ground pour |
일반적인 애플리케이션
UJA1169ATK/3Z 적합 용도: 6 애플리케이션s: Automotive Body Control Module (BCM), CAN Gateway ECU Node, ADAS Sensor Interface Node, Industrial CAN Node / PLC Module, Electric Vehicle Charging Equipment (EVSE) Communication, CAN-Enabled IoT and Smart Sensor Edge Nodes.
Automotive Body Control Module (BCM)
The UJA1169ATK/3Z is well suited for body control modules because it combines a 5 Mbit/s CAN FD transceiver with an integrated 3.3 V/250 mA LDO that powers the host MCU without a separate regulator. In a BCM, the SBC is wired directly to the 12 V board net, the CANH/CANL pins connect to the chassis CAN bus, and V1 supplies the BCM microcontroller. Compared with a discrete HS-CAN transceiver plus an external LDO, the UJA1169ATK/3Z reduces BOM count, saves PCB area, and inherits AEC-Q100 Grade 1 (-40C to +125C) qualification. The integrated bus fault protection simplifies ISO 11898-2:2016 EMC compliance.
추천
CAN Gateway ECU Node
In a CAN-to-CAN gateway, the UJA1169ATK/3Z serves as the on-board CAN interface for a small node MCU that handles message routing or diagnostics. The integrated 3.3 V V1 LDO eliminates the need for a separate regulator, while CAN FD support at 5 Mbit/s enables the gateway to bridge between classic CAN and CAN FD segments. The HVSON-20 (3.5 x 5.5 mm) package is well matched to space-constrained gateway PCBs, and AEC-Q100 qualification allows the same design to be reused across automotive tiers. Source: NXP SBC product page.
추천
ADAS Sensor Interface Node
ADAS sensor nodes (radar, lidar, camera peripherals) typically communicate over CAN FD to a central ECU, and the UJA1169ATK/3Z provides the physical-layer interface plus local MCU power. Its 250 mA V1 regulator easily handles small sensor MCUs, while ISO 11898-2:2016 compliance guarantees interoperability with downstream ADAS ECUs. The AEC-Q100 Grade 1 rating supports under-hood or behind-bumper mounting where ambient temperatures reach +125C. Using the UJA1169ATK/3Z reduces the node BOM and shortens EMC qualification cycles.
추천
Industrial CAN Node / PLC Module
Outside automotive, the UJA1169ATK/3Z is an excellent fit for industrial CAN nodes, PLC I/O modules and factory-automation peripherals that need a compact, robust HS-CAN interface. The integrated 3.3 V/250 mA LDO supplies the host MCU, the wide operating temperature range tolerates factory-floor environments, and CAN FD support enables high-throughput diagnostics. Compared with industrial-only CAN transceivers, the SBC form factor simplifies layout and improves ESD/bus-fault robustness. Source: NXP UJA1169ATK product page.
추천
Electric Vehicle Charging Equipment (EVSE) Communication
EV charging stations communicate with the vehicle ECU over CAN, and the UJA1169ATK/3Z provides a single-chip interface plus MCU supply for the EVSE controller board. CAN FD support at 5 Mbit/s future-proofs the design for higher-bandwidth charge-status messaging, while AEC-Q100 qualification is overkill but not problematic for the harsher thermal environment of outdoor charging cabinets. The HVSON-20 package allows compact charger PCB layouts. Source: NXP UJA1169ATK family datasheet.
추천
CAN-Enabled IoT and Smart Sensor Edge Nodes
Industrial IoT gateways and edge sensors often use CAN as a robust, differential, long-cable physical layer for factory or building-automation networks. The UJA1169ATK/3Z gives an IoT node MCU a CAN interface plus a 3.3 V supply, with the AEC-Q100 rating offering extra headroom for harsh-edge environments. CAN FD at 5 Mbit/s supports higher telemetry payloads than classic CAN. Compared with USB or RS-485 based IoT nodes, a CAN edge node using the UJA1169ATK/3Z benefits from the multi-drop bus topology and strong EMC immunity of CAN.
추천
추천 제품 요약
엔지니어링 참조 데이터: UJA1169ATK/3Z — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | UJA1169ATK/3 | UJA1169ATK/F/3Z | UJA1169ATK/F/3 | UJA1169ATK | UJA1169ATK/F | UJA1169ATK/X/FZ |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | HVSON-20 (3.5x5.5) | HVSON-20 (3.5x5.5) - same | HVSON-20 (3.5x5.5) - same | HVSON-20 (3.5x5.5) - same | HVSON-20 (3.5x5.5) - same | HVSON-20 (3.5x5.5) - same | HVSON-20 (3.5x5.5) - same |
| Integrated V1 Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 5 V | 5 V | 5 V |
| V1 Output Current | 250 mA | 250 mA | 250 mA | 250 mA | 250 mA | 250 mA | 250 mA |
| CAN FD Support | Up to 5 Mbit/s | Up to 5 Mbit/s | Up to 5 Mbit/s | Up to 5 Mbit/s | Up to 5 Mbit/s | Up to 5 Mbit/s | Up to 5 Mbit/s |
| /F Feature Set (Watchdog/SPI) | No | No | Yes | Yes | No | Yes | Yes (with VEXT) |
| VEXT 5 V Off-Board Supply | No | No | No | No | No | No | Yes (5 V VEXT) |
| Packing Method | Reel 13" (Z suffix) | Tray (no Z suffix) | Reel 13" (Z suffix) | Tray (no Z suffix) | Tray | Tray | Reel 13" (Z suffix) |
| AEC-Q100 Grade 1 | Yes (-40C to +125C) | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Tape-and-reel packing code for high-volume SMT assembly (vs UJA1169ATK/3)
- 3.3 V V1 matches modern low-power MCU rails (vs UJA1169ATK)
- Family-positioned SBC for easy feature-set upgrade (vs UJA1169ATK/F/3Z)
설계 노트
The UJA1169ATK/3Z internal V1 LDO supplies 250 mA at 3.3 V to the host MCU. Decouple V1 with a low-ESR ceramic capacitor (typically 1-10 uF X7R) placed within 5 mm of the V1 pin, and bulk-decouple the BAT pin per the manufacturer datasheet. Estimated: at 250 mA full load, internal dissipation in the LDO is (VIN-3.3 V) x 0.25 A - keep VIN as close to 3.3 V as possible at low input voltages to minimise thermal stress.
Route the CANH and CANL traces as a 100 ohm differential pair (120 ohm CAN-typical) with matched length, and keep them away from switching nodes and noisy digital traces. The exposed thermal pad of the HVSON-20 package must be soldered to a continuous PCB ground pour with multiple thermal vias to the inner ground plane - this both grounds the die and provides the primary heat-dissipation path. Maintain 4-wire Kelvin routing from V1 sense to the MCU to avoid IR-drop on the supply rail.
Do not confuse the /3Z suffix (3.3 V V1, tape-and-reel) with the /F/3Z (5 V V1 with /F features). The standard UJA1169ATK and UJA1169ATK/F use 5 V V1; only the /3 variants use 3.3 V V1. Choosing the wrong V1 voltage can permanently damage a 3.3 V-only MCU. The 'Z' suffix indicates Reel 13" packing in a Sulfur Barrier Bag - per NXP community, the /X/F and /X/FZ are the same die with different orderable packing codes.
Estimated: at VIN = 12 V and V1 = 3.3 V delivering 250 mA, the internal LDO dissipates (12 - 3.3) x 0.25 = 2.175 W. The HVSON-20 package's theta_JA is typically around 40-50 C/W on a standard 2-layer JEDEC PCB, leading to a junction temperature rise of 87-109 C above ambient. Derate V1 current in high-ambient-temperature environments, or add thermal vias and copper pours under the exposed pad to lower theta_JA.
규정 준수 정보
AEC-Q100 Grade 1 qualified for automotive per Arrow listing and NXP datasheet. RoHS and REACH compliant. Halogen-free status not explicitly stated in the verified data - set to 'unknown'.
