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EP2A25F1020C8ES - APEX II 24K LE FPGA 1020-BBGA | Intel
EP2A25F1020C8ES

EP2A25F1020C8ES - APEX II 24K LE FPGA 1020-BBGA | Intel

The Intel (formerly Altera) EP2A25F1020C8ES is a high-density APEX II Field-Programmable Gate Array (FPGA) delivering 24,320 logic elements and 2,750,000 system gates in a 1020-ball FineLine BGA package with 735 user I/O pins. Operating from a 1.5V core supply with multi-voltage I/O support, this commercial-grade device targets high-performance logic integration, on-chip bus implementation, and DSP-style datapath design. The part is rated for commercial temperature operation (0 C to +85 C) and is offered in speed grade 8 with the ES (Engineering Sample) designation. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream. APEX II specifically combines look-up table (LUT)-based logic with embedded memory blocks and a MultiCore architecture that supports both fine-grained combinatorial logic and coarse-grained datapaths. Within the broader taxonomy, the EP2A25 sits at FPGA & CPLD -> programmable logic -> logic IC -> integrated circuit, occupying the high-density tier of the APEX II family and bridging the gap between discrete gate arrays and ASICs in pre-production and prototyping designs. The EP2A25F1020C8ES features 622,592 bits of embedded RAM, embedded LVDS support on selected I/O banks, dedicated clock-management circuitry, and a high-speed interconnect fabric that supports up to 735 user I/O. The 1020-ball FineLine BGA package uses a 1.27 mm ball pitch with controlled-impedance escape routing, making it suitable for multi-layer PCBs with buried vias. Compared to ASICs, this FPGA offers design-time flexibility at the cost of higher per-unit pricing and higher dynamic power consumption. Typical applications for the EP2A25 include telecommunications line cards, custom bus-bridging glue logic, video processing pipelines, prototyping of ASIC designs, and high-density DSP co-processing. The large user-I/O count makes it particularly attractive for system-level integration where multiple parallel interfaces, memory controllers, and arithmetic blocks must coexist on a single device. The Engineering Sample (ES) suffix indicates an early-revision part intended for design validation rather than volume production deployment. When designing with this part, ensure that PCB layout supports the 1020-ball BGA escape pattern with appropriate microvia technology and that the configuration PROM is selected to match the device bitstream size. Power-supply sequencing must follow the APEX II multi-rail requirement (VCCINT before VCCIO) to prevent in-rush current damage to the I/O cells.

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EP2A25F672C7 - APEX II FPGA, 25K LE, 492 I/O, 672-BGA | Altera
EP2A25F672C7

EP2A25F672C7 - APEX II FPGA, 25K LE, 492 I/O, 672-BGA | Altera

The Intel (formerly Altera) EP2A25F672C7 is a member of the APEX II family of Field-Programmable Gate Arrays (FPGAs), featuring 25,000 logic elements housed in a 672-ball FineLine BGA (FCBGA) package. Manufactured on a 0.15-micrometer all-layer copper process supporting up to eight metal layers, the device targets high-bandwidth applications with integrated 1-Gbps True-LVDS, LVPECL, PCML, and HyperTransport interface support. The 'C7' speed grade indicates a commercial temperature range (0C to +85C) with a -7 speed bin. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose internal logic blocks, interconnects, and I/O cells are reconfigured after manufacture via a configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy (above CPLDs and PALs) and are widely used to implement parallel datapaths, custom interfaces, and prototype ASIC designs where time-to-market or low-volume economics preclude a custom silicon run. APEX II specifically occupies the high-density, high-I/O-count tier of the Altera portfolio, bridging the gap to early HardCopy structured ASICs. The EP2A25F672C7 integrates 492 user I/O pins, embedded system blocks (ESBs) for memory and arithmetic functions, and high-speed LVDS channels capable of 1 Gbps operation per pair. The device supports a maximum of 1,650,000 system gates and offers up to 422,976 RAM bits, making it well suited for data-path-intensive designs such as custom bus bridges, video processing pipelines, and telecommunications infrastructure. Typical applications include high-speed serial interface bridging, custom ASIC prototyping, parallel DSP architectures, and telecom line-card glue logic. The FineLine BGA package enables dense PCB layouts while supporting the LVDS signaling required for 1-Gbps chip-to-chip links. When migrating designs from APEX II to newer Cyclone or Stratix families, designers should review pinout compatibility and Quartus tool support, as the APEX II is supported by legacy Altera development software rather than current Quartus Prime releases.

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EP2A25F672C7N - APEX II FPGA, 900K Gates, 672-BGA | Intel / Altera
EP2A25F672C7N

EP2A25F672C7N - APEX II FPGA, 900K Gates, 672-BGA | Intel / Altera

The Intel (formerly Altera) EP2A25F672C7N is a member of the APEX II programmable logic device family, delivering approximately 900,000 system gates and 24,320 logic elements in a 672-ball FineLine BGA (FC-FBGA) package. The part is fabricated on a 0.15 µm all-layer copper process supporting up to eight metal layers, and it integrates high-speed serial interfaces capable of 1 Gbps operation including True-LVDS, LVPECL, PCML, and HyperTransport signaling. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be rewired after manufacturing to implement arbitrary digital circuits. APEX II FPGAs sit within Intel's programmable logic hierarchy as high-density, MultiCore architecture devices combining logic, embedded memory, and high-speed I/O, used for ASIC prototyping, glue logic, signal processing, and high-bandwidth interface bridging in networking, telecom, and computing systems. Key features of the EP2A25F672C7N include 24,320 logic elements, 492 user I/Os, 1.69 ns propagation delay through the LUT, and support for multiple I/O standards including LVDS, LVPECL, PCML, and HyperTransport. The device operates from a 1.5 V core supply and is offered in the commercial 0 °C to 85 °C temperature grade, indicated by the 'C7' speed-grade and 'N' non-lead-free finish-free designators in the part number. Architecturally, APEX II devices embed a MultiCore structure that pairs Look-Up Table (LUT) based logic with embedded system blocks (ESBs) acting as dual-port RAM or ROM. Up to four PLLs provide clock synthesis, while dedicated high-speed circuitry delivers up to 1 Gbps serial performance. The 672-ball FC-FBGA package uses a 27 × 27 mm body with 1 mm pitch to expose the device's 492 user I/Os alongside dedicated configuration, clock, and power pins. Typical applications include high-speed communications infrastructure, ASIC prototyping, network processor co-processing, image processing pipelines, and DSP front-end pre/post-processing. The combination of high logic density and multi-gigabit serial I/O makes the EP2A25F672C7N well suited for line-card designs requiring both DSP and SERDES functionality on a single programmable device. When designing with this part, plan PCB layout for the 1 mm-pitch BGA using microvia or via-in-pad technology, and provide at least four PCB layers with continuous power planes for the 1.5 V VCCINT rail. Decoupling must combine bulk, mid-frequency, and high-frequency capacitors placed as close as possible to the package balls to suppress simultaneous switching noise across the 492 I/Os. This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design considerations that complement the official APEX II family datasheet DS-APEXII-3.0.

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EP2A25F672C8 - APEX II FPGA 492 I/O 672-FBGA | Intel / Altera
EP2A25F672C8

EP2A25F672C8 - APEX II FPGA 492 I/O 672-FBGA | Intel / Altera

The Altera (now Intel) EP2A25F672C8 is a member of the APEX II family of Field-Programmable Gate Arrays (FPGAs) delivering 25,000 logic elements in a 672-ball FineLine BGA package. It provides 492 user I/Os, 2,432 macrocells, and is fabricated on a 0.15 microm all-layer copper process with up to eight metal layers, giving it high density and predictable timing closure for complex digital designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacture, via a hardware description language and a configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and simple PLDs, and below fixed-function ASICs. APEX II specifically combines Look-Up Table (LUT)-based logic, Embedded System Blocks (ESBs) for memory and product-term functions, and True-LVDS/PLL clock management, making it suitable for high-throughput data-path and bus-interface designs. Key features of the EP2A25F672C8 include 25,000 typical gates, 40,960 maximum system gates, 1.69 ns propagation delay, 1 Gbps LVDS-capable I/O performance, 4 PLLs, dual-port RAM, and embedded content-addressable memory (CAM) blocks. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI-X, GTL+, SSTL-2/3, HSTL, LVDS, and LVPECL through 16 I/O banks, allowing mixed-voltage interfacing to DDR SDRAM, ZBT SRAM, and QDR SRAM without external translators. The architectural strength of APEX II lies in its MultiCore architecture: each Logic Array Block (LAB) contains 10 Logic Elements (LEs), and adjacent LABs share ESBs that can be configured as FIFO, dual-port RAM, ROM, CAM, or standard product-term logic. Four PLLs with up to 16 outputs each provide low-jitter clock synthesis for high-speed serializer/deserializer and DDR memory interfaces. Typical applications include telecom line-card glue logic, high-speed serial backplane bridging, DDR/QDR memory controllers, digital signal processing front-ends, and industrial ASIC prototyping where time-to-market outweighs unit cost. Designers should note the -C8 speed grade (8 is the speed bin, slower than -C7 but faster than -C9) and confirm Quartus II version compatibility, as APEX II is a legacy device family supported by older Altera tool releases only.

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EP2A25F672C8N - APEX II 900K Gates 333MHz FPGA | Altera/Intel
EP2A25F672C8N

EP2A25F672C8N - APEX II 900K Gates 333MHz FPGA | Altera/Intel

The Altera (now Intel) EP2A25F672C8N is a high-density programmable logic device from the APEX II family, manufactured on a 0.15-micrometer all-layer copper-metal process with up to eight metal layers and offering up to 1 Gbps I/O performance. The device delivers approximately 900,000 system gates, 24,320 logic elements (cells), and 333 MHz internal operation while housed in a 672-ball FineLine BGA package (FC-FBGA) at 1.0 mm pitch and a 27 x 27 mm body. The 'C8' speed grade and 'N' lead-free suffix indicate the commercial 0 to 85 degrees C operating range. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing configurable logic blocks (CLBs), embedded memory, I/O elements, and routing resources that the designer programs after manufacture using a hardware description language (HDL) or schematic entry. FPGAs occupy the middle ground between fixed-function ASICs and discrete glue logic, providing high integration, parallel processing, and rapid design iteration. The APEX II family in particular belongs to Altera's high-end, pre-Cyclone/Stratix era of multi-gigabit serial-interface capable PLDs, suitable for high-speed telecommunications, video, and DSP backplane designs. Key features of the EP2A25F672C8N include 492 user I/Os for high pin-count designs, embedded system blocks (ESBs) for memory and CAM implementation, multi-gigabit transceivers (up to 1 Gbps per channel) for high-speed serial I/O, LVDS and HSTL I/O support, and a 1.5 V core supply with on-chip PLL clock management. The PLLs deliver low-jitter clock multiplication and skew control for multi-channel synchronous designs. Architecturally, the APEX II device combines a hierarchical routing fabric with embedded array blocks (EABs) that double as RAM, ROM, or content-addressable memory (CAM). The 0.15-micrometer copper process enables higher logic density and lower power than the 0.18-micrometer process used in the original APEX family, while the dedicated high-speed serial interfaces make the part attractive for 1 Gbps backplanes, optical transport, and parallel DSP pipelines. Typical applications include 1 Gbps networking line cards, optical transport and SONET/SDH framer ICs, multi-channel DSP coprocessors for wireless base stations, broadcast video processing engines, and high-speed test and measurement instrumentation. Designers choose the EP2A25F672C8N when they need a mature, second-sourced Altera architecture with abundant logic capacity and multi-gigabit I/O. When designing with this part, engineers should verify Quartus II tool support for the APEX II device family and confirm long-term supply continuity, because APEX II has been classified as a mature device by Intel. For new designs, current-generation Cyclone or Stratix devices are typically recommended. Ensure PCB layout follows FineLine BGA escape rules with microvia or via-in-pad technology to fan out the 672-ball array.

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EP2A25F672C9 - APEX II FPGA 25K LE 492 I/O 672-FBGA | Altera
EP2A25F672C9

EP2A25F672C9 - APEX II FPGA 25K LE 492 I/O 672-FBGA | Altera

The Altera EP2A25F672C9 is a member of the APEX II family of field-programmable gate arrays (FPGAs) housed in a 672-pin FineLine BGA (FCBGA) package measuring 27 mm × 27 mm with a 1.0 mm ball pitch. According to the manufacturer datasheet, the device integrates approximately 25,000 logic elements (LEs), 2,432 macro cells, and 492 user I/O pins, making it suitable for high-density logic, DSP, and memory-intensive designs. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect. APEX II devices belong to the broader hierarchy: programmable logic device (PLD) → FPGA → embedded programmable logic → high-density programmable logic IC. They are manufactured on a 0.15 µm all-layer copper process supporting up to eight metal layers and are designed for systems that require parallel processing, deterministic timing, and on-chip memory integration. Key features of the EP2A25F672C9 include embedded system blocks (ESBs) for dual-port RAM, ROM, and FIFO functions, fast interconnect with MultiCore interconnect routing, dedicated carry and cascade chains for arithmetic, and 1 Gbps LVDS-capable I/O support per the APEX II architecture. The device supports in-system programmability through Altera's passive serial (PS), passive parallel synchronous (PPS), and JTAG interfaces. It also offers multi-voltage I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) for interfacing with legacy and modern logic families. The APEX II architecture combines Look-Up Table (LUT)-based logic with embedded memory and a high-speed interconnect fabric. The 0.15 µm copper process reduces interconnect resistance, enabling higher toggle rates and lower dynamic power per logic operation compared to the previous-generation APEX 20K family. The 672-ball FineLine BGA package supports high pin count with controlled impedance for high-speed signal integrity. Typical applications of the EP2A25F672C9 include telecommunications baseband processing, network switching fabrics, high-speed data acquisition front ends, digital signal processing (DSP) co-processors, and ASIC prototyping. With 492 user I/Os, it can interface with multi-channel parallel ADC/DAC arrays, PCI bus bridges, and memory subsystems in embedded computing platforms. Designers should note that the APEX II family has been classified as a mature/legacy product line, with new designs generally directed to Altera/Intel Stratix or Cyclone families. The 672-ball FCBGA also requires careful PCB stack-up, controlled-impedance routing, and reflow profile management to ensure reliable assembly. Lead-time for this legacy part should be confirmed before committing to volume production.

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EP2A25F672C9ES - APEX II FPGA 900K Gates 236MHz | Intel
EP2A25F672C9ES

EP2A25F672C9ES - APEX II FPGA 900K Gates 236MHz | Intel

The Intel EP2A25F672C9ES is a high-density APEX II family Field-Programmable Gate Array (FPGA) delivering up to 900,000 system gates and 24,320 logic elements (LEs), operating at up to 236 MHz internal frequency and fabricated on a 0.15 µm all-layer copper-metal process with up to eight metal layers. The device integrates 492 user I/Os and is housed in a 672-pin FineLine Ball-Grid Array (FC-FBGA) measuring 27 mm x 27 mm with a 1.0 mm pitch, and is supplied from a 1.5 V core rail. It is offered in the commercial 0 °C to 85 °C temperature grade with a -9 speed grade and Enhanced (ES) configuration support. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - itself a category of integrated circuits - that combines an array of configurable logic blocks, programmable interconnect, and dedicated I/O cells on a single semiconductor die. Within the broader semiconductor taxonomy, FPGAs sit under digital ICs -> programmable logic -> FPGAs, where they are differentiated from CPLDs by their register-rich, fine-grained architecture and ability to implement complex arithmetic, memory, and high-speed serial interfaces. The APEX II family was Intel's (formerly Altera's) high-density, multi-core architecture targeting parallel data-path and multi-gigabit serial I/O designs. Key features of the EP2A25F672C9ES include 24,320 logic elements, embedded system blocks (ESBs) for on-chip RAM and CAM, support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, dedicated clock-management circuitry with up to four phase-locked loops (PLLs), and propagation delay of approximately 1.69 ns per logic element. The 672-pin FC-FBGA package enables high I/O count (492 user I/Os) on a compact fine-pitch land pattern, while the 1.5 V core reduces dynamic power compared with the prior 2.5 V APEX family. Architecturally, the APEX II device combines a fine-grained Logic Array Block (LAB) fabric with row/column-based ESBs and a high-bandwidth MultiTrack interconnect. This enables designers to integrate PCI, LVDS, SDRAM controllers, and multi-gigabit transceivers in a single chip. The 1.5 V core, combined with 0.15 µm process geometry, gives the EP2A25F672C9ES an attractive speed/power envelope for telecom line-card, base-station pre-processing, and high-speed instrumentation front-ends. Typical applications include telecommunications line-card interface logic, high-speed data-acquisition front-ends, military signal-processing subsystems, medical imaging pre-processors, and industrial automation controllers. The 492 user I/Os are well matched to designs that aggregate many parallel buses, such as legacy parallel RapidIO or custom ASIC replacement projects. When designing with the EP2A25F672C9ES, designers must use the Quartus II design suite (or MAX+PLUS II for legacy projects) and pay close attention to power-rail sequencing on the 1.5 V core - inrush current can exceed several amps during configuration. Bypass capacitors must be placed within 5 mm of every power pin pair, and the FC-FBGA land pattern requires laser-via or microvia PCB fabrication for reliable assembly. This page synthesizes distributor pricing, drop-in same-brand and cross-brand alternatives, and practical design notes that extend beyond the manufacturer datasheet. Where the underlying data set is incomplete, [DATA_NEEDED] markers flag parameters requiring datasheet verification.

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EP2A25F672C9N - 900K Gates APEX II FPGA, 672-BGA | Intel (Altera)
EP2A25F672C9N

EP2A25F672C9N - 900K Gates APEX II FPGA, 672-BGA | Intel (Altera)

The Intel (formerly Altera) EP2A25F672C9N is a high-density APEX II family FPGA implementing approximately 900,000 system gates with 24,320 logic elements, fabricated on a 0.15-µm all-layer copper-metal process supporting up to eight metal interconnect layers. The device operates from a 1.425 V to 1.575 V supply (1.5 V nominal) and is offered in a 672-ball FineLine BGA package measuring 27.0 × 27.0 mm with a 1.00 mm ball pitch, marketed in the Altera ordering scheme as the F672 package code. Per the manufacturer datasheet, the silicon supports True-LVDS, LVPECL, pseudo current mode logic (PCML), and HyperTransport signaling, plus 1-Gbps I/O capability, making it suitable for high-speed parallel interfaces, telecom backplanes, and embedded processing pipelines. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture. FPGAs belong to the broader Programmable Logic Device (PLD) family, sitting hierarchically between fixed-function ASICs (which are mask-programmed and non-reusable) and software-programmable microcontrollers. The APEX II architecture combines embedded memory blocks, embedded multiplier blocks, and LUT-based logic, allowing it to map datapath, control, and interconnect functions into a single device. Modern successors such as Stratix, Cyclone, and Agilex inherit the architectural innovations introduced by APEX II, including true-LVDS support and high-speed I/O. Key features include 492 user I/O pins, an internal core operating at up to 236 MHz per the part decoder, and support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport). The device contains embedded ESBs (Enhanced System Blocks) for fast on-chip RAM, and dedicated phase-locked loops (PLLs) for clock synthesis and skew management. Configuration can be performed via serial or parallel PROM, JTAG, or the Altera passive parallel scheme using the enhanced configuration interface. The 0.15-µm eight-layer copper interconnect process is engineered to maximize signal integrity and reduce die-level resistance for high-performance routing, while embedded multiplier blocks accelerate DSP operations such as FIR filters and FFT engines. The PLD provides abundant routing resources for high-utilization designs, with the 25-series being the densest member of the APEX II family. Typical applications include high-speed data acquisition, telecom baseband processing, network switching fabrics, industrial imaging pipelines, and ASIC prototyping for ASIC emulation. The combination of LVDS support, large logic capacity, and embedded multipliers makes the EP2A25 particularly suitable for DSP-intensive designs. When designing with EP2A25F672C9N, use the Quartus II design software (version 5.1 or later) for synthesis, place-and-route, and timing closure. Ensure adequate decoupling on the 1.5 V core supply and provide proper LVDS termination networks. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP2A25F672ES - APEX II 25K Logic Elements FPGA | Altera | 672-BGA
EP2A25F672ES

EP2A25F672ES - APEX II 25K Logic Elements FPGA | Altera | 672-BGA

The Altera EP2A25F672ES is a member of the APEX II family of Field Programmable Gate Arrays (FPGAs) that integrates up to 900,000 gates and 24,320 logic elements in a 672-ball FineLine BGA package. Manufactured on a 0.15 µm CMOS process, the device supports core voltages of 1.5 V with multi-voltage I/O standards, system clock rates up to 500 MHz, and embedded system blocks that combine look-up tables, product-term logic, and dual-port RAM on a single die. What is an FPGA? An FPGA (Field Programmable Gate Array) is a type of integrated circuit that can be configured by the customer after manufacturing using a hardware description language. FPGAs sit at the top of the programmable logic hierarchy: programmable logic device -> CPLD (complex programmable logic device) -> FPGA -> SoC FPGA. APEX II extends this hierarchy by embedding large blocks of SRAM and product-term logic, making it suitable for high-density system-on-chip prototyping, custom DSP datapaths, and parallel processing front-ends. Key features include 24,320 logic elements, 24 embedded system blocks (ESBs) providing up to 1.4 Mbit of dual-port RAM, four phase-locked loops (PLLs) for clock management, and 24 clock networks supporting low-skew global distribution. The device supports LVTTL, LVCMOS, PCI, LVDS, LVPECL, and HSTL I/O standards via sixteen I/O banks, enabling flexible mixed-voltage interfacing without external level shifters. The APEX II architecture uses a multi-tier interconnect hierarchy (FastTrack, local, row, and column) that delivers predictable timing closure for high-speed designs. Multi-gigabit serial capability is provided via LVDS ports, while embedded dual-port RAM blocks allow true single-cycle access for FIFO and register-file applications. Typical applications include high-throughput digital signal processing, telecommunications line cards, ASIC prototyping, and parallel processor glue logic. Designers also deploy EP2A25F672ES in image processing pipelines, network packet inspection engines, and high-speed serial backplane interfaces where deterministic latency is required. A key design consideration is power integrity: the EP2A25F672ES can draw several amps during configuration and full-speed operation, so a minimum of four 0.1 µF decoupling capacitors must be placed within 5 mm of each power pin pair. The 672-ball FCBGA also requires a 6-layer or higher PCB stack-up to maintain signal integrity above 100 MHz. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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EP2A25F672I-7 - APEX II FPGA 900K Gates 672-BGA | Intel
EP2A25F672I-7

EP2A25F672I-7 - APEX II FPGA 900K Gates 672-BGA | Intel

The Intel (formerly Altera) EP2A25F672I-7 is a member of the APEX II family of Field-Programmable Gate Arrays (FPGAs), delivering approximately 900K gates with 24,320 logic elements in a 672-pin FC-FBGA package. It uses 0.15um process technology, supports core voltages around 1.5V, and is rated for the industrial temperature range. The part is designed for high-performance, logic-intensive applications where programmable flexibility is required. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic blocks and interconnects after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices -> CPLDs -> FPGAs -> semiconductor ICs. Unlike fixed-function ASICs, FPGAs offer hardware re-programmability, making them ideal for prototyping, low-volume production, and applications with evolving standards. APEX II devices specifically combine Look-Up Table (LUT)-based logic with embedded memory blocks and a high-speed interconnect fabric. Key features of the EP2A25F672I-7 include 24,320 logic cells, approximately 900K system gates, embedded system blocks (ESBs) for memory and specialized functions, multi-voltage I/O support, and high-speed LVDS capabilities. The -7 speed grade indicates a particular performance bin within the APEX II family. The FC-FBGA (Flip Chip Fine-pitch Ball Grid Array) package provides high pin density and excellent thermal performance for high-gate-count designs. Technically, the APEX II architecture combines four-input LUTs, embedded memory, and a MultiTrack interconnect structure for predictable timing closure. The device supports IEEE 1149.1 JTAG boundary-scan testing and in-system programmability through configuration schemes including passive serial, active serial, and JTAG-based configuration. The industrial temperature grade (-40C to +85C) makes it suitable for non-automotive rugged environments. Typical applications include telecommunications infrastructure, high-speed data acquisition systems, digital signal processing (DSP), network packet processing, and complex glue logic replacement. The high gate count makes this device particularly suitable for protocol bridging and bus interface implementations in industrial and communications equipment. When designing with this device, ensure proper decoupling with multiple low-ESR capacitors near each power pin, and follow Altera's APEX II hardware reference manual for impedance-controlled routing of high-speed signals. The -7 speed grade provides a specific timing margin; consult the datasheet's speed-grade tables when targeting critical paths. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes that are not readily available in the manufacturer datasheet alone.

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EP2A25F672I-9 - APEX II 25K LUT FPGA, 672-BGA | Intel / Altera
EP2A25F672I-9

EP2A25F672I-9 - APEX II 25K LUT FPGA, 672-BGA | Intel / Altera

The Intel (formerly Altera) EP2A25F672I-9 is a high-density APEX II family Field Programmable Gate Array (FPGA) delivering approximately 25,000 typical logic elements and 1,125 Kbits of embedded system blocks, housed in a 672-pin FineLine BGA (FCBGA) package. Built on a 0.18 µm CMOS process, the APEX II architecture combines look-up table (LUT)-based logic with embedded memory and dedicated high-speed I/O, targeting bus-interface bridging, telecom datapaths, and high-throughput DSP pre/post-processing. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital logic, memory, and I/O functions on a single silicon die after manufacturing. APEX II sits within the programmable logic hierarchy as: FPGA -> programmable logic device (PLD) -> logic IC -> semiconductor. APEX II specifically integrates MultiCore architecture with embedded system blocks (ESBs) for RAM/ROM/CAM and supports LVDS, LVTTL, LVCMOS, and PCI I/O standards, providing a single-chip solution for glue-logic replacement and high-speed bus interfacing. Key features of the EP2A25F672I-9 include up to 25,000 logic elements, 1,125 Kbits of ESB memory, four phase-locked loops (PLLs), high-speed clock networks, and up to 16 high-speed transceiver-like channels via LVDS pairs. The 672-pin FCBGA package provides ample I/O count for parallel buses and memory interfaces, while the industrial temperature grade (-40 °C to +100 °C junction, indicated by the 'I' suffix) and speed grade -9 place it in the mid-density, mid-performance segment of the APEX II family. Typical applications for the EP2A25F672I-9 span telecom backplane bridging, custom bus controllers (PCI to local bus, VME to PCI), high-speed image pre-processing pipelines, and DSP coprocessor interfaces. Designers typically pair it with external SRAM or SDRAM and a small CPLD for configuration supervision, with Quartus II software (legacy, available from the Intel FPGA archive) used for synthesis, place-and-route, and bitstream generation. When designing with this device, allocate sufficient PCB area for the 672-ball BGA fanout and use at least six PCB routing layers with microvia technology. Confirm that the chosen configuration EPROM or JTAG programmer supports the APEX II bitstream format, and respect the 1.5 V/1.8 V core voltage sequencing required by the -9 speed grade datasheet. This page synthesizes distributor availability, same-family alternatives, and practical design notes for engineers evaluating the EP2A25F672I-9 against modern FPGA migration paths or last-time-buy sourcing.

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EP2A25F672I6 - APEX II 25K LUT FPGA 672-BGA | Intel (Altera)
EP2A25F672I6

EP2A25F672I6 - APEX II 25K LUT FPGA 672-BGA | Intel (Altera)

The Intel (formerly Altera) EP2A25F672I6 is a member of the APEX II family of FPGAs, integrating approximately 25,000 logic elements in a 672-pin FineLine BGA package. The device is fabricated in a 0.18 µm CMOS SRAM-based process and is configured via an industry-standard configuration device for SRAM-based LUT architectures. Operating from a 1.5 V core supply with separate I/O banks, the EP2A25F672I6 targets high-density logic, on-chip memory, and parallel DSP workloads. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines configurable logic blocks (LUTs), embedded memory, DSP blocks, and programmable interconnect into a single semiconductor die. Within the broader taxonomy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) inside the programmable logic family, which itself belongs to the digital integrated circuit / semiconductor category. APEX II extends this hierarchy by combining LUT-based logic with dedicated MultiCore multipliers and embedded system blocks, bridging the gap between traditional FPGA glue logic and early platform-level integration. Key features of the EP2A25F672I6 include approximately 25,000 typical gates (manufacturer-published logic element metric), embedded MultiCore multipliers for DSP acceleration, embedded system blocks (ESBs) for on-chip dual-port RAM and CAM, JTAG (IEEE 1149.1) boundary-scan support, and dedicated clock management circuitry. The device is offered in the industrial temperature grade (suffix "I") and a speed grade of 6, denoted by the trailing "6" in the part number. The APEX II architecture combines fine-grained LUTs with coarse-grained embedded memory, allowing a single device to implement wide datapaths, FIFO buffers, and DSP pipelines without external memories. MultiCore multipliers deliver dedicated hardware multiplication, freeing general-purpose logic from arithmetic bottlenecks. This combination makes APEX II particularly suited to mixed datapath-and-control designs where engineers want to keep everything inside one programmable fabric. Typical applications include telecom line-card glue logic, parallel DSP pipelines for video and imaging, industrial control and instrumentation front-ends, and high-density bus-interface consolidation. The 672-ball FineLine BGA package supports up to 16 user I/O banks with single-ended and differential signalling options per device documentation. When designing with this part, note that SRAM-based FPGAs require a configuration device (EPC or compatible) at every power-up. The industrial temperature grade ("I6") supports -40 °C to +100 °C ambient operation, but the device is an older generation now considered NRND (Not Recommended for New Designs) by Intel/Altera. Engineers evaluating this part for new projects should review the latest Intel product change notifications. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the APEX II family, and practical design notes not consolidated in the manufacturer datasheet.

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EP2A25F672I7 - APEX II FPGA 900K Gates 672-FBGA | Intel
EP2A25F672I7

EP2A25F672I7 - APEX II FPGA 900K Gates 672-FBGA | Intel

The Intel EP2A25F672I7 is a high-density FPGA from the APEX II family, integrating 900,000 gates and 24,320 logic elements in a 672-pin FC-FBGA package. It is fabricated on a 0.15 µm CMOS process, operates from a 1.5 V core supply, and supports up to 500 MHz internal performance, making it suitable for high-throughput parallel processing and DSP-intensive applications. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor in the broader hierarchy of logic devices: programmable logic -> programmable logic device (PLD) -> FPGA -> CMOS integrated circuit -> semiconductor. Unlike a fixed-function ASIC, an FPGA can be reconfigured in the field to implement custom digital logic, DSP blocks, and memory structures. The APEX II family was Altera's (now Intel) high-end flagship in the early 2000s, positioned before the Stratix and Cyclone families and aimed at data-path-heavy designs requiring embedded memory and multipliers. Key features include 24,320 logic elements, embedded system blocks (ESBs) for RAM/ROM, support for LVDS, LVTTL, and PCI I/O standards, and a multi-gigabit embedded transceiver option via companion chipsets. The device supports in-system programmability through JTAG, and its high pin count (672 FC-FBGA) provides abundant I/O bandwidth for parallel buses, memory interfaces, and high-speed serial links. The APEX II architecture combines look-up table (LUT)-based logic with structured embedded memory and dedicated routing, balancing flexibility with deterministic timing closure. The 0.15 µm process delivers low core voltage operation (1.5 V) and moderate static power consumption relative to larger-node FPGAs of its generation. Typical applications include telecommunications line cards, ASIC prototyping, high-speed data acquisition, image processing front-ends, and legacy industrial control systems. The 672-ball FC-FBGA package enables dense board layouts required in telecom backplane designs. When designing with this device, verify availability through authorized distributors, as the APEX II family has been classified as legacy/obsolete for many years. Designers should plan migration paths to Stratix or Cyclone families for new designs. This page synthesizes distributor availability, parametric specifications, and drop-in alternative cross-references for the EP2A25F672I7, providing practical sourcing context not consolidated on the original Altera datasheet.

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EP2A25F672I7N - APEX II 900K Gates FPGA | Intel / Altera
EP2A25F672I7N

EP2A25F672I7N - APEX II 900K Gates FPGA | Intel / Altera

The Intel (formerly Altera) EP2A25F672I7N is a high-density programmable logic device from the APEX II family, integrating 900,000 gates and 24,320 logic elements (cells) on a 0.15 µm CMOS process operating at a 1.5 V core supply with a maximum internal frequency of 500 MHz, packaged in a 672-ball Fine-pitch Chip-scale Ball Grid Array (FC-FBGA). An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks, embedded memory blocks, and programmable routing that the designer programs after manufacture. APEX II sits within Intel/Altera's programmable logic hierarchy as a high-density, multi-vendor-standard logic family: FPGA -> programmable logic -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The architecture combines look-up tables (LUTs), product-term logic, embedded system blocks (ESBs) for memory and FIFO, and high-speed I/O elements that support multiple single-ended and differential I/O standards. Key features of the EP2A25F672I7N include 24,320 logic elements, embedded memory for distributed and block RAM, dedicated high-speed I/O supporting LVDS and other differential signaling, four phase-locked loops (PLLs) for clock management, and a 672-ball FC-FBGA package that maximizes I/O count while minimizing board area. The device supports in-system programming through the IEEE 1149.1 JTAG interface and configuration via the passive serial, fast passive parallel, and other Altera configuration schemes. Architecturally, APEX II combines a MultiCore architecture with embedded system blocks for memory and arithmetic, supporting complex system-on-chip designs including on-chip microprocessors, custom DSP datapaths, and high-bandwidth bus interfaces. The 0.15 µm process provides a balance between density and static power consumption, while the 1.5 V core voltage reduces dynamic power dissipation relative to older 2.5 V families. Typical applications include telecommunications line cards, high-speed serial protocol bridging, ASIC prototyping, image processing pipelines, and industrial automation controllers. The combination of high logic capacity, embedded memory, and high-speed I/O makes the EP2A25F672I7N well suited for designs that previously required multiple smaller FPGAs or a custom ASIC. When designing with this part, plan power distribution carefully: a 672-ball BGA requires a multi-layer PCB with dedicated power and ground planes, and the 1.5 V core supply typically needs a separate regulator such as a low-dropout (LDO) or DC-DC converter. Use Altera Quartus II design software for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, same-brand APEX II variants, and practical design notes not found in the manufacturer datasheet alone.

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EP2A25F672I8 - APEX II FPGA, 900K Gates, 492 I/O, 672-BGA | Altera
EP2A25F672I8

EP2A25F672I8 - APEX II FPGA, 900K Gates, 492 I/O, 672-BGA | Altera

The Altera EP2A25F672I8 is a high-density APEX II Field Programmable Gate Array (FPGA) IC delivering 900K equivalent gates, 24,320 logic elements (cells), 622,592 bits of embedded RAM, and 492 user I/Os in a 672-ball FineLine BGA (FC-FBGA) package, 27 mm × 27 mm with 1 mm ball pitch. It is fabricated on a 0.15 µm all-layer copper-metal CMOS process (up to eight metal layers) and operates from a 1.5 V core supply. The part is graded for the industrial temperature range (–40 °C to +85 °C, indicated by the 'I' speed/temperature grade letter and '8' speed grade suffix per Altera's APEX II ordering scheme), making it suitable for harsh-environment embedded computing. The device supports I/O voltages up to 3.3 V and includes 4 phase-locked loops (PLUs) for clock management, embedded multiplier blocks, and high-speed True-LVDS support enabling 1 Gbps I/O bandwidth for high-speed serial-style interfaces. With propagation delay around 1.69 ns and APEX II's MultiCore architecture integrating LUT-based logic and embedded memory, the EP2A25F672I8 was a flagship high-density programmable logic device of the late-1990s/early-2000s era, designed for telecom bridging, ASIC prototyping, and complex DSP glue logic. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs) interconnected by a programmable routing matrix. Within the broader taxonomy, FPGAs sit alongside CPLDs and ASICs in the programmable logic family, and underneath the larger category of digital logic ICs. APEX II sits at the high-density end of this hierarchy: it combines look-up-table based logic, embedded SRAM, embedded multipliers, and PLLs in a single fabric, allowing designers to implement microprocessors, custom DSP datapaths, and high-bandwidth bus interfaces on one die. The EP2A25F672I8's 622 Kb of embedded memory and dedicated carry chains make it well suited to data-path designs that previously required a discrete ASIC. Key features include 24,320 logic elements, 622,592 bits of RAM (~76 Kbytes), 492 user I/Os (the largest I/O count in the APEX II family), four enhanced PLLs, dedicated LVDS I/O support with data rates up to 1 Gbps, support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL, GTL+, PCI), and JTAG-based IEEE 1149.1 boundary-scan programming. The 672-ball FineLine BGA package provides controlled-impedance signal paths and ample power/ground balls for noise isolation. Typical applications include high-speed telecommunications bridging, ATM/packet processing, ASIC prototyping, PCI/PCI-X interface logic, custom DSP datapaths, video/imaging pipelines, and military/aerospace signal processing where industrial temperature grading is mandatory. The 672-BGA package requires multi-layer PCB design with via-in-pad or dog-bone fan-out, controlled-impedance traces, and adequate thermal vias under the central ground/power balls. Designers should plan for a 1.5 V core supply with bulk decoupling on every power ball pair, and follow Altera's AN 117 application note for APEX II PCB layout. The 'I8' industrial speed grade indicates AC performance that is slower than the 'C9' commercial 0 °C–85 °C speed grade; this trade-off is acceptable when operating temperature, not absolute clock frequency, is the primary constraint.

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EP2A25F672I8N - APEX II FPGA 900K Gates 672-BGA | Intel / Altera
EP2A25F672I8N

EP2A25F672I8N - APEX II FPGA 900K Gates 672-BGA | Intel / Altera

The Intel (formerly Altera) EP2A25F672I8N is a member of the APEX II programmable logic device family, delivering 900,000 gates of system-level integration in a 672-ball FineLine BGA package. It contains 24,320 logic elements, 622,592 bits of embedded memory, and 492 user I/O pins, and is manufactured on a 0.15 µm all-layer copper-metal process that supports up to eight metal layers and 1 Gbps True-LVDS signalling alongside LVPECL, PCML, and HyperTransport I/O standards. An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic elements (LEs), embedded memory blocks, and programmable interconnect. FPGAs sit within the broader semiconductor taxonomy as programmable logic -> programmable ICs -> integrated circuits, and they are widely used for ASIC prototyping, custom DSP pipelines, glue logic, and high-speed parallel interfaces where fixed-function ASSPs are unavailable or uneconomical. The APEX II family specifically targets high-density, multi-standard I/O designs by combining PLLs, True-LVDS capable I/O, and substantial on-chip memory on a single die. Key features of the EP2A25F672I8N include 333 MHz internal operation, 1.69 ns propagation delay, 1.5 V core supply, 27 x 27 mm FineLine BGA with 1 mm pitch, and an industrial operating range of 0 °C to 85 °C. Each device is configured via Altera's Quartus II design software, which supports both VHDL and Verilog HDL entry, along with MegaWizard Plug-In Manager IP blocks for common functions such as memory controllers, FIFO buffers, and high-speed transceivers. Typical applications include high-speed telecommunications backplanes, parallel DSP arrays, custom ASIC prototyping, and industrial control systems requiring multi-standard I/O. The combination of True-LVDS and HyperTransport support makes the EP2A25F672I8N well suited for bridging parallel bus standards in storage area networks and for prototyping proprietary interconnect fabrics. When designing with this device, careful attention must be paid to the 1.5 V core supply decoupling (multiple low-ESR ceramic capacitors near each VCCINT ball) and to simultaneous-switching output (SSO) analysis for the 492 user I/Os. Because the part is mature and in its end-of-life window, designers should verify long-term availability with their distributor before committing to a new design-in.

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EP2A25F672I9 - APEX II 900K Gates FPGA | Intel (Altera) | FC-FBGA-672
EP2A25F672I9

EP2A25F672I9 - APEX II 900K Gates FPGA | Intel (Altera) | FC-FBGA-672

The Intel (formerly Altera) EP2A25F672I9 is a member of the APEX II family of FPGAs, fabricated on a 0.15 µm process and delivering up to 900,000 system gates with 24,320 logic elements (LEs) housed in a 672-pin flip-chip fine-pitch BGA (FC-FBGA) package. It supports a core voltage of 1.5 V and operates at up to 236 MHz, with an industrial temperature grade (-40 °C to +100 °C, suffix I) and the speed grade 9 (fastest in the APEX II family). An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure in-circuit to implement custom digital circuits. Within the broader semiconductor taxonomy, FPGAs belong to the programmable logic family, which sits between fixed-function ASICs and software-defined microcontrollers; APEX II specifically targets high-density, multi-million-system-gate designs. Key specifications of the EP2A25F672I9 include 24,320 logic cells, 900K ASIC-equivalent gates, embedded system blocks (ESBs) for dual-port RAM and ROM, up to 422,400 RAM bits, and four phase-locked loops (PLLs) for clock management. The device also features high-speed LVDS I/O support, dedicated multiplier circuitry, and a multi-voltage I/O standard set including LVCMOS, LVTTL, SSTL, and HSTL. Its 672-pin FC-FBGA package provides the high I/O count and signal-integrity characteristics required by telecommunications and high-performance data-path designs. Architecturally, the EPEX II device uses a MultiCore architecture combining fine-grain logic elements with embedded memory and a high-bandwidth interconnect fabric. The 0.15 µm metal-layer process supports the high gate count while keeping die area manageable; flip-chip BGA packaging reduces lead inductance and enables the high toggle rates needed at 236 MHz. APEX II introduced the first embedded system blocks for RAM/ROM in an Altera high-density family, replacing earlier distributed-RAM schemes and simplifying synchronous memory inference. Typical applications for the EP2A25F672I9 include telecommunications backplane interfacing, custom DSP pipelines, high-speed data-acquisition front-ends, networking ASIC prototyping, and industrial motion-control subsystems. Its high gate count and embedded RAM also make it useful for system-on-chip (SoC) prototyping and bridge-chip designs that precede ASIC tape-out. When designing with this FPGA, pay close attention to power-rail sequencing (1.5 V core and a separate VCCIO bank supply), thermal management through adequate PCB copper area, and signal-integrity on LVDS pairs. Plan configuration mode (e.g., passive serial, JTAG) and decoupling before layout finalization. This page consolidates distributor pricing, design considerations, and verified pin-compatible alternatives that complement the Intel/Altera APEX II datasheet. It is intended to accelerate component selection and BOM risk assessment for engineering teams evaluating legacy FPGAs.

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EP2A25F672I9N - APEX II 900K Gates FPGA, 672-FBGA | Intel
EP2A25F672I9N

EP2A25F672I9N - APEX II 900K Gates FPGA, 672-FBGA | Intel

The Intel EP2A25F672I9N is a high-density APEX II family FPGA (Field-Programmable Gate Array) from the APEX II series, delivering approximately 900,000 system gates and 24,320 logic elements, fabricated on a 0.15 µm CMOS process. It is housed in a 672-pin FC-FBGA (Fine-pitch Chip-scale Fine-pitch Ball Grid Array) package and operates from a nominal 1.5 V core supply (1.425 V to 1.525 V), with an internal maximum operating frequency of 236 MHz and a propagation delay of approximately 2.23 ns. According to the Intel (formerly Altera) APEX II device family datasheet, the device integrates embedded system blocks (ESBs) for on-chip RAM and ROM, support for multiple I/O standards including LVTTL, LVCMOS, PCI, and LVDS, and a built-in PLL for clock management. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect, allowing the hardware logic to be redefined after manufacture. Within the broader taxonomy, APEX II devices sit between classic CPLDs (Complex Programmable Logic Devices) and high-end SoC FPGAs: a true gate-array-class programmable logic fabric with embedded memory, multipliers, and I/O, rather than a simple PLA/CPLD glue-logic device. APEX II is the predecessor to the Stratix and Cyclone families, sharing many architectural concepts (Look-Up Tables, embedded memory, fast interconnect) but in an older 0.15 µm process node. Key features of the EP2A25F672I9N include 24,320 logic cells, embedded system blocks totaling hundreds of kbits of RAM, 4 PLLs for clock synthesis and deskew, multi-voltage I/O support with hot-socketing capability, and in-system programmability via JTAG. The device is well-suited to high-throughput parallel data-path designs, including DSP filtering, video processing, and communications protocol bridging. Typical applications include telecommunications line-card glue logic, video and image processing pipelines, custom DSP accelerators, ASIC prototyping, and high-speed serial protocol bridges. The 672-pin FC-FBGA package provides ample I/O for wide parallel buses and multiple high-speed interfaces. Designers should note that APEX II is a legacy family no longer in active production; design support is via the legacy Quartus II design tool. Power estimation must include both static and dynamic components, and the 1.5 V core requires tight decoupling close to each supply pin pair. This page synthesizes distributor availability, drop-in alternatives, and practical design notes not found in a single source elsewhere.

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EP2A25F6T218 - APEX II FPGA, 25K LE, BGA-218 | Altera
EP2A25F6T218

EP2A25F6T218 - APEX II FPGA, 25K LE, BGA-218 | Altera

The Altera (now Intel) EP2A25F6T218 is a member of the APEX II programmable logic family, delivering approximately 25,000 logic elements in a 218-ball FineLine BGA package with a -1 speed grade and commercial 0C to 85C operating range. Built on a 0.15 um all-layer copper-metal process with up to eight metal layers, the device supports high-performance serial interfaces including 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport signaling standards. The EP2A25 variant scales below the EP2A40 and is one of the lower-density options in the APEX II lineup. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing configurable logic blocks, programmable interconnects, embedded memory, and dedicated I/O that engineers can program in the field to implement arbitrary digital logic functions. FPGAs sit in the broader hierarchy of programmable logic devices (CPLDs -> FPGAs -> SoC FPGAs) and bridge the gap between fixed-function ASICs and software-defined microcontrollers, offering hardware parallelism with deep I/O flexibility. Key features of the EP2A25F6T218 include embedded system blocks (ESBs) providing dual-port RAM, FIFO, and CAM functions, dedicated high-speed serial interface circuitry, MultiCore hot-socketing support, and joint test action group (JTAG) boundary-scan test compliance. The architected Look-Up Table (LUT)-based logic combined with embedded memory allows implementation of complex state machines, DSP functions, and high-bandwidth data paths in a single device. The APEX II architecture integrates the LUT-based logic fabric with on-chip memory and a high-speed I/O ring designed to interface with industry-standard serializer/deserializer (SerDes) and parallel bus protocols. This makes the EP2A25 suitable for telecom line cards, baseband processing, high-speed instrumentation, and protocol bridging. Typical applications include communications infrastructure, high-speed data acquisition, RAID controllers, and protocol bridging cards. The True-LVDS interface is well suited to backplane interconnects at data rates up to 1 Gbps. When designing with this device, ensure the JTAG chain integrity, supply rail decoupling follows Altera reference designs, and unused pins are configured per the device handbook. The EP2A25F6T218 is now a mature part, and design teams should verify long-term availability before committing to new designs. This page synthesizes distributor pricing, drop-in same-footprint alternatives from the Site MPN catalog, and practical engineering guidance not found in the manufacturer datasheet alone.

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EP2A25F724 - Altera APEX II Enhanced Configuration Device | FPGA
EP2A25F724

EP2A25F724 - Altera APEX II Enhanced Configuration Device | FPGA

The Altera (now Intel) EP2A25F724 is an enhanced configuration device (EPC) designed for high-density SRAM-based FPGAs in the Altera APEX II family, including the EP2A25 and other EP2A-series devices. The EP2A25F724 integrates a configuration controller and flash memory in a single package, providing a single-device, high-speed, advanced configuration solution for very high-density FPGAs and eliminating the need for external boot PROMs. An enhanced configuration device (EPC) is a non-volatile memory IC specialized for storing FPGA configuration bitstreams and presenting them to the target FPGA at power-up via a vendor-specific configuration interface (typically FLEX/APEX passive serial or passive parallel). EPCs sit at the bottom of the boot-memory hierarchy (EPC -> configuration memory -> non-volatile memory -> semiconductor memory) and translate JTAG/serial commands into configuration cycles. By combining flash and controller logic in one die, the EP2A25F724 reduces BOM count, board area, and configuration time relative to discrete flash plus CPLD solutions. Key features of the EP2A25F724 include support for multi-device configuration chains, built-in JTAG support, in-system programmability (ISP) through the IEEE Std. 1149.1 boundary-scan interface, and on-chip oscillator and control logic. The device supports Altera's passive serial, passive parallel asynchronous, and passive parallel synchronous configuration modes, making it compatible with both APEX II and legacy FLEX devices. It is offered in a 724-pin FineLine BGA package suitable for high-density production designs. Architecturally, the EP2A25F724 separates the flash array into configuration controller blocks and user-accessible flash regions, allowing engineers to store configuration data and user code in the same physical device. The configuration controller handles bitstream compression, decompression, and error detection during FPGA load, while the flash array retains data across power cycles without a backup battery. Typical applications include APEX II FPGA boot memory, multi-FPGA configuration in telecom and networking line cards, industrial vision and signal processing platforms, and military/aerospace systems requiring field-upgradable firmware. The 724-ball BGA package also supports high-density designs that may configure multiple FPGAs on the same board. When designing with the EP2A25F724, ensure correct nCONFIG/nSTATUS handshaking with the target FPGA, adequate decoupling near the BGA power balls, and verification of JTAG chain ordering when multiple devices are cascaded. Note that the APEX II family is mature - confirm long-term availability with your distributor or Intel FPGA support for new designs. This page synthesizes verified distributor pricing, package details, and a curated set of pin-compatible Altera EPC drop-in alternatives not found in the manufacturer datasheet alone.

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EP2A40B652C7 - Altera APEX II 40k LE FPGA, BGA-652 | Intel PSG
EP2A40B652C7

EP2A40B652C7 - Altera APEX II 40k LE FPGA, BGA-652 | Intel PSG

The Altera (Intel Programmable Solutions Group) EP2A40B652C7 is a high-density APEX II family Field Programmable Gate Array (FPGA) housed in a 652-ball FineLine BGA package. It delivers up to 40,000 logic elements combined with embedded memory and dedicated high-speed I/O, targeting bandwidth-intensive system-on-chip designs. The device combines LUT-based logic, embedded system blocks (ESBs) for memory and arithmetic, and high-performance I/O elements that support multiple single-ended and differential signaling standards on a single die. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that sits in the broader hierarchy of integrated circuits: FPGA -> programmable logic -> semiconductor. Unlike ASICs, FPGAs are configured after manufacture via SRAM-based or fuse-based interconnect, allowing engineers to implement arbitrary digital logic, glue functions, datapath pipelines, and full processor subsystems in silicon without a fab cycle. APEX II is Altera's pre-Cyclone/Stratix generation architecture, integrating PLLs, LVDS I/O, and content-addressable memory (CAM) blocks for networking and telecom workloads. The EP2A40B652C7 specifically targets designs that need high logic density plus rich I/O at moderate cost versus larger Stratix-class parts. Key differentiating features of the EP2A40B652C7 include 40,000 logic elements (LEs), up to approximately 425 kbits of embedded RAM distributed across embedded system blocks, dedicated high-speed LVDS channels, multiple phase-locked loops (PLLs) for clock management, and configurable I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, LVDS, LVPECL). The device supports a maximum operating frequency in the hundreds of MHz range depending on design and speed grade, with the "C7" suffix denoting the commercial temperature grade and a specific speed bin. Architecturally, APEX II devices use a MultiCore architecture that fuses fine-grained LE logic with coarse-grained ESBs. Each ESB can implement dual-port RAM, ROM, FIFO, CAM, or multiplier functions. The BGA-652 footprint provides 652 balls on a FineLine BGA pitch, enabling dense board-level integration while preserving signal integrity for high-speed parallel buses and serializer/deserializer channels. Typical applications include high-throughput network switches and routers, telecommunications backplane glue logic, ASIC prototyping, PCI/PCI-X bridges, multi-channel DSP datapaths, and military/aerospace signal processing platforms. The combination of high logic density and rich I/O makes the EP2A40B652C7 particularly well-suited to designs that must integrate multiple interface standards on a single board. When designing with this part, engineers should note that APEX II predates the Cyclone and Stratix series, so Quartus II design tools are required for synthesis and place-and-route. Existing APEX II designs are routinely migrated to newer Cyclone III/IV or Stratix II/III/V devices when active lifecycle support and modern transceivers are required, and the BGA-652 footprint complicates such migrations. This page synthesizes distributor pricing, lifecycle status, drop-in alternative MPNs from the APEX II family, and practical design notes not consolidated in the original Altera datasheet, giving engineers a single reference point for sourcing decisions.

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EP2A40B652C8 - APEX 20A40 FPGA 652-BGA | Intel (Altera)
EP2A40B652C8

EP2A40B652C8 - APEX 20A40 FPGA 652-BGA | Intel (Altera)

The Intel (formerly Altera) EP2A40B652C8 is a member of the APEX 20A40 family of high-density FPGAs, housed in a 652-ball FineLine BGA package and specified for the commercial temperature range (0C to +85C). It is built on a 0.18 micrometer CMOS SRAM process and combines look-up table (LUT)-based logic with embedded system blocks (ESBs) that can be configured as either dual-port RAM or content-addressable memory (CAM). The device integrates up to 40,960 logic elements (LEs), up to 425,984 bits of embedded memory, and up to 718 user I/O pins, positioning it for high-bandwidth, high-density programmable logic designs. An FPGA (Field Programmable Gate Array) is a programmable semiconductor device whose logic function is defined by a configuration bitstream loaded into on-chip SRAM after power-up. FPGAs occupy the middle ground between fixed-function ASICs and software-defined processors: they deliver ASIC-class parallelism and deterministic latency for data-path logic while remaining fully re-programmable in the field. The APEX 20A series extended earlier APEX architectures with MultiCore interconnect, embedded CAM, and high-speed LVDS I/O to address networking, telecoms, and DSP-intensive applications where gate counts alone were insufficient. Key features of the EP2A40B652C8 include 40,960 logic elements, 425 Kbits of embedded RAM, 718 maximum user I/O pins, MultiCore interconnect for predictable timing closure, embedded CAM blocks for routing-table and search-engine workloads, LVDS-compatible I/O, and full JTAG boundary-scan with in-system configuration support via the serial configuration (PS) or passive parallel asynchronous (PPA) modes. The part operates from a 1.8V core supply with 3.3V LVTTL/LVCMOS I/O, balancing low power with industry-standard logic interfacing. The APEX 20A architecture pairs four LEs into a logic array block (LAB) with a local interconnect that feeds a row/column MultiCore routing network. Embedded system blocks (ESBs) implement true dual-port RAM with independent read/write clocks and configurable CAM widths, enabling on-chip lookup tables for network processors and content-addressable search without external memory. Configuration is volatile and loaded from a serial ROM or microprocessor on every power-up. Typical applications include high-speed network switches and routers (CAM-based table lookup), telecommunications line cards, DSP datapath co-processors, PCI bridge designs, and high-density glue-logic consolidation. The 652-ball FineLine BGA package supports the largest member of the family at full I/O count while preserving board-level signal integrity for high-frequency parallel buses. When designing with EP2A40B652C8, ensure the 1.8V core and 3.3V I/O rails have adequate decoupling (0.1 uF plus 10 uF bulk per rail) and that JTAG chain integrity is verified before release. The device is in production status; designers should confirm long-term availability with their distributor. This page synthesizes distributor pricing, drop-in same-package variants, and practical design considerations not found in the manufacturer datasheet, with all data current as of 2026-09-08.

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EP2A40B652C9 - APEX II FPGA 1.5M Gates 652-Pin BGA | Intel
EP2A40B652C9

EP2A40B652C9 - APEX II FPGA 1.5M Gates 652-Pin BGA | Intel

The Intel EP2A40B652C9 is a member of the APEX II family of programmable logic devices, offering high-density programmable logic in a 652-pin BGA package. The APEX II family integrates up to 1.5 million system gates with embedded system blocks (ESBs) and a MultiCore architecture that delivers high-performance logic, memory, and I/O in a single device. This part is rated for the industrial temperature range (suffix "C9") and is built on a 0.18 µm CMOS process with a 1.5 V core voltage. An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), interconnect, and I/O cells. APEX II FPGAs extend this concept with embedded system blocks that provide dedicated dual-port RAM, ROM, and CAM (content-addressable memory) resources, while the MultiCore interconnect combines LUT-based fine-grained logic with embedded megablocks. This places APEX II FPGAs in the broader hierarchy of programmable logic devices (PLDs) -> FPGAs -> high-density FPGAs -> embedded-block FPGAs. Key features of the EP2A40B652C9 include up to 1.5 million system gates, embedded system blocks for memory and special functions, MultiCore interconnect architecture, support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, LVDS), and PLLs for clock management. The 652-pin BGA package provides ample I/O for memory-intensive and bus-intensive designs, while supporting JTAG boundary-scan configuration via the IEEE 1149.1 standard interface. The device is configured via the serial or parallel configuration scheme typical of the APEX II family, with configuration data stored in SRAM cells. This means the device must be reconfigured at each power-up using an external configuration memory or a configuration controller, making it suitable for prototyping, system-level testing, and production designs that benefit from field-upgradeable logic. Typical applications include telecommunications infrastructure, DSP co-processing, high-speed data acquisition, network switches and routers, and embedded industrial controllers. The wide I/O count also supports multi-channel memory interfaces and high-bandwidth bus bridging. When designing with this device, ensure adequate power-rail decoupling with 0.1 µF ceramic capacitors placed close to each power pin. Thermal management should account for the BGA thermal resistance; a multi-layer PCB with thermal vias under the BGA is recommended for full industrial-temperature operation.

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EP2A40B724C7 - APEX II FPGA 1.5M Gates 540 I/O FCBGA | Intel (Altera)
EP2A40B724C7

EP2A40B724C7 - APEX II FPGA 1.5M Gates 540 I/O FCBGA | Intel (Altera)

The Intel (formerly Altera) EP2A40B724C7 is a member of the APEX II Field-Programmable Gate Array (FPGA) family fabricated on a 0.15 µm all-layer copper process with up to eight metal layers, integrating 1,500,000 system gates, 38,400 logic elements, and 655,360 bits of embedded RAM. Housed in a 724-ball FineLine BGA (FCBGA) package measuring 35 mm x 35 mm, the device delivers 540 user I/O pins and supports 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport I/O standards for high-speed interconnect. An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital logic through configuration memory after manufacturing. APEX II sits in the device hierarchy as FPGA -> programmable logic -> logic IC -> integrated circuit, combining Look-Up Table (LUT)-based logic, embedded memory blocks, and high-speed I/O on a single die. APEX II specifically targets high-density, high-bandwidth designs that previously required ASICs or custom gate arrays. Key features of the EP2A40B724C7 include 562 MHz maximum internal operating frequency, 1.5 V core supply (1.425 V to 1.575 V), built-in PLLs for clock management, MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, and dedicated high-speed True-LVDS channels capable of 1 Gbps data rates. The device also provides 4 PLLs, double-data-rate (DDR) support, and in-system programmability through the IEEE 1149.1 JTAG interface. The APEX II architecture uses a MultiCore architecture combining fine-grain logic elements (LEs), embedded system blocks (ESBs) usable as either dual-port RAM, ROM, or CAM, and FastTrack interconnect. The 0.15 µm copper process enables higher integration density and lower power-per-gate than the 0.18 µm and 0.25 µm predecessors such as APEX 20K and FLEX 10K families. Typical applications include telecommunications line cards and baseband processing, high-speed serial I/O bridging, network routers and switches, DSP co-processing in test & measurement equipment, and ASIC prototyping. The 540 user I/O count makes it suitable for parallel bus-centric designs such as processor interfaces, memory controllers, and legacy industrial backplanes. When designing with this device, ensure 1.5 V core decoupling uses low-ESR ceramic capacitors placed within 5 mm of each power pin. The 1.5 V supply must be ramped monotonically to prevent in-rush currents. Configuration via JTAG or passive serial configuration PROM (EPC family) should be validated on the bench before mass production. This page synthesizes distributor pricing, drop-in compatible APEX II variants, and practical design notes for the EP2A40B724C7 - information not consolidated on any single distributor page.

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