EP2A25F672I7N - APEX II 900K Gates FPGA | Intel / Altera
부품 번호: EP2A25F672I7N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $220 | $22,000.00 |
| 500 | $195 | $97,500.00 |
| 1,000 | $175 | $175,000.00 |
EP2A25F672I7N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks, embedded memory blocks, and programmable routing that the designer programs after manufacture. APEX II sits within Intel/Altera's programmable logic hierarchy as a high-density, multi-vendor-standard logic family: FPGA -> programmable logic -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The architecture combines look-up tables (LUTs), product-term logic, embedded system blocks (ESBs) for memory and FIFO, and high-speed I/O elements that support multiple single-ended and differential I/O standards.
Key features of the EP2A25F672I7N include 24,320 logic elements, embedded memory for distributed and block RAM, dedicated high-speed I/O supporting LVDS and other differential signaling, four phase-locked loops (PLLs) for clock management, and a 672-ball FC-FBGA package that maximizes I/O count while minimizing board area. The device supports in-system programming through the IEEE 1149.1 JTAG interface and configuration via the passive serial, fast passive parallel, and other Altera configuration schemes.
Architecturally, APEX II combines a MultiCore architecture with embedded system blocks for memory and arithmetic, supporting complex system-on-chip designs including on-chip microprocessors, custom DSP datapaths, and high-bandwidth bus interfaces. The 0.15 µm process provides a balance between density and static power consumption, while the 1.5 V core voltage reduces dynamic power dissipation relative to older 2.5 V families.
Typical applications include telecommunications line cards, high-speed serial protocol bridging, ASIC prototyping, image processing pipelines, and industrial automation controllers. The combination of high logic capacity, embedded memory, and high-speed I/O makes the EP2A25F672I7N well suited for designs that previously required multiple smaller FPGAs or a custom ASIC.
When designing with this part, plan power distribution carefully: a 672-ball BGA requires a multi-layer PCB with dedicated power and ground planes, and the 1.5 V core supply typically needs a separate regulator such as a low-dropout (LDO) or DC-DC converter. Use Altera Quartus II design software for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, same-brand APEX II variants, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP2A25F672I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A25F672I7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Process Technology, Configuration Method, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A25F672I6
✅ 드롭인✓ 재고 있음
$178 / 개
데이터시트 보기 →EP2A25F672I-9
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP2A25F672I-7
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP2A25F672C9N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP2A25F672ES
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP2A25F672I7N 최대 정격 & 전기적 특성
| Family | APEX II |
| Logic Elements (Cells) | 24,320 |
| Typical Gate Count | 900,000 |
| Maximum Internal Frequency | 500 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage | 1.5 V |
| 패키지 | 672-ball FC-FBGA |
| Pin/Ball Count | 672 |
| 실장 유형 | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (I) |
| Speed Grade | 7 |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Design Software | Quartus II |
| 수명 주기 상태 | Not Recommended for New Designs (NRND) |
EP2A25F672I7N 672-ball fc-fbga 핀 구성 가이드
EP2A25F672I7N(672-ball fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A25F672I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A25F672I7N 적합 용도: 6 애플리케이션s: Telecommunications Line Card Interface, ASIC Prototyping and Emulation, Industrial Automation Controller, Image Processing Pipeline, Software Defined Radio (SDR) Baseband, High-Speed Data Acquisition System.
Telecommunications Line Card Interface
The EP2A25F672I7N's 24,320 logic elements and high-speed LVDS-capable I/O make it well-suited for telecom line cards requiring multi-gigabit serial protocol bridging. Its 500 MHz internal frequency and embedded system blocks enable on-chip FIFO buffering for inter-lane deskew, while the 672-ball FC-FBGA provides the pin density needed to route 16+ high-speed serial lanes. According to Altera application notes, APEX II supports the I/O voltage and impedance standards required by SONET/SDH framer interfaces when paired with an external PHY.
추천
ASIC Prototyping and Emulation
The 900,000-gate capacity of the EP2A25F672I7N positions it as an ASIC prototyping platform for designs of moderate complexity, such as custom microcontrollers, DSP pipelines, or peripheral subsystems. Engineers can map RTL blocks one-to-one to APEX II logic elements, validate system-level behavior at near-ASIC clock rates, and use JTAG-based debug to inspect internal signals. The industrial temperature grade also supports bring-up in chassis and environmental chambers. Quartus II provides synthesis compatibility with Verilog and VHDL targeting the APEX II architecture.
추천
Industrial Automation Controller
Industrial motion controllers and PLCs benefit from the EP2A25F672I7N's combination of 24,320 logic elements, embedded memory for axis trajectory buffers, and rugged industrial temperature grade. The device can implement multi-axis PID loops, encoder interfaces (incremental, SSI, EnDat via LVDS), and fieldbus bridges (PROFIBUS, CANopen, EtherCAT slave) on a single chip. The 672-ball FC-FBGA package supports the high pin count needed to fan out to many optically isolated I/O channels, while the 0.15 µm process gives predictable timing closure at industrial operating temperatures.
추천
Image Processing Pipeline
Real-time image processing pipelines for machine vision, medical imaging, or video broadcast benefit from the EP2A25F672I7N's embedded system blocks, which can be configured as dual-port RAM or FIFO buffers for line/frame storage. The 500 MHz internal frequency supports real-time convolution, color-space conversion, and edge-detection filters at HD video rates. High-speed LVDS I/O enables direct connection to CMOS image sensors and HDMI/DVI transmitters. Quartus II includes reference designs for common vision algorithms, simplifying time-to-market for vision integrators.
추천
Software Defined Radio (SDR) Baseband
Software-defined radio baseband processors use the EP2A25F672I7N's high logic density to implement digital down/up-conversion, channelization, and modulation/demodulation in reconfigurable logic. The device's embedded multipliers and DSP-friendly routing support efficient implementation of FIR filters and FFT cores, while high-speed differential I/O interfaces cleanly to ADC/DAC converters. The industrial temperature grade is suitable for outdoor base-station and tactical radio enclosures.
추천
High-Speed Data Acquisition System
High-speed data acquisition cards for test-and-measurement use the EP2A25F672I7N to buffer ADC samples, perform on-FPGA decimation, and stream data over PCIe or proprietary high-speed serial links. The 672-ball FC-FBGA package provides the pin count needed to interface multiple parallel ADCs and a high-bandwidth host interface simultaneously. Embedded memory blocks serve as circular sample buffers, while dedicated PLL blocks generate low-jitter ADC sampling clocks. Industrial temperature grade supports deployment in lab and field environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A25F672I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A25F672I6 | EP2A25F672I-9 | EP2A25F672I-7 | EP2A25F672C9N | EP2A25F672ES |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA | 672-ball FC-FBGA | 672-ball FC-FBGA | 672-ball FC-FBGA | 672-ball FC-FBGA |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Speed Grade | 7 | 6 (faster) | 9 (slower) | 7 | 9 | ES |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Commercial | Engineering Sample |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Maximum Internal Frequency | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | Engineering Sample |
주요 차별점
- Highest density in the APEX II family at 24,320 logic elements (vs EP2A15F672I8)
- Industrial temperature grade for harsh-environment deployment (vs EP2A25F672C9N)
- Speed grade 7 provides balanced performance vs cost (vs EP2A25F672I6)
설계 노트
The 672-ball FC-FBGA package requires a multi-layer PCB (typically 8+ layers) with dedicated power and ground planes and microvia-in-pad or via-on-pad technology for breakout. Escape routing beneath the BGA must follow the manufacturer's recommended land pattern with appropriate solder mask-defined (SMD) or non-solder-mask-defined (NSMD) pads. Plan for X-ray inspection post-assembly because BGA solder joints cannot be visually inspected.
The 1.5 V core supply must be generated by a low-impedance regulator (LDO or DC-DC) with bulk decoupling placed within 25 mm of the BGA. According to Altera application notes, APEX II devices require at least 12 bulk decoupling capacitors distributed across the package periphery plus high-frequency 0.1 µF and 0.01 µF capacitors at every power pin group. Use a multi-rail sequencing circuit if the design includes 2.5 V or 3.3 V I/O supplies to avoid latch-up.
Do not attempt to migrate an APEX II design to Quartus Prime releases newer than 13.0, because APEX II device support was removed. Retain Quartus II 13.0 (or Web Edition 13.0) on a dedicated legacy workstation to regenerate configuration bitstreams. Also confirm JTAG chain ordering carefully when the EP2A25F672I7N shares the chain with other devices; mismatched TCK frequencies can cause configuration failures.
The FC-FBGA package exposes a die-side thermal pad that should be soldered to a thermally conductive land on the PCB for heat dissipation. For industrial temperature designs running at full 500 MHz toggle rates, provide thermal vias under the package and consider a heatsink or forced-air cooling to keep the junction below 100 °C. Estimated: at 1.5 V core and full utilization, dynamic power can exceed 3-4 W, depending on toggle rate.
규정 준수 정보
RoHS, REACH, lead-free and halogen-free status must be verified per specific date code and lot documentation. AEC-Q100 is not applicable because this is a commercial/industrial programmable logic device, not an automotive-grade IC.