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EP3CLS100F484C8N - Cyclone III LS 100K LE FPGA, 484-FBGA | Intel
EP3CLS100F484C8N

EP3CLS100F484C8N - Cyclone III LS 100K LE FPGA, 484-FBGA | Intel

The Intel (Altera) EP3CLS100F484C8N is a low-power Cyclone® III LS FPGA integrating 100,448 logic elements with 4,451,328 bits of embedded memory and 278 user I/O pins, housed in a 484-ball FineLine BGA (FBGA-484) package. Built on TSMC's 65 nm low-power process, the Cyclone III LS family combines the Cyclone III low-power silicon with additional security features such as configuration bitstream encryption and JTAG protection. The 'C8N' suffix denotes the commercial speed grade (fastest in this family) with lead-free (Pb-free) RoHS-compliant packaging. A Field Programmable Gate Array (FPGA) is a programmable logic device whose function is defined by user-loaded configuration bits rather than fixed silicon. The Cyclone III LS sits within the broader hierarchy of programmable logic: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Compared with CPLDs (smaller, non-volatile, instant-on) and ASICs (custom silicon, higher NRE, longer time-to-market), FPGAs offer the best balance of high logic density, parallel DSP performance, and reconfigurability for mid-volume production runs. Key features of the EP3CLS100F484C8N include up to 100,448 logic elements, 4,451,328 bits of embedded SRAM (equivalent to ~545 Kbytes of block RAM), 278 maximum user I/Os, and support for DDR/DDR2/DDR3/QDRII/QDRII+/RLDRAM II external memory interfaces through dedicated DQS logic. The device also integrates embedded multipliers (typically 4,488 18x18 multipliers in the 100K LE tier) for high-throughput DSP, four PLLs per device for clock management, and Cyclone III LS-specific security: AES-128 configuration bitstream encryption, JTAG tamper protection, and 1.2 V core operation typical of the 65 nm LP process. Typical applications include industrial motor control, factory automation HMI controllers, video bridging and display processing, telecommunications line cards, military/aerospace secure communications, and low-cost ASIC prototyping. The Cyclone III LS family was positioned by Altera as a low-power alternative to competing 65 nm FPGAs, with published static power figures roughly 25 percent lower than Cyclone II at equivalent densities. When designing with the EP3CLS100F484C8N, allocate generous decoupling (100 nF + 10 µF near each VCCINT/VCCA/VCCH bank) and follow the 484-pin BGA breakout pattern. The lead-free FBGA-484 has a 0.8 mm ball pitch; fan-out of inner balls requires 4 or 6 PCB layers. Estimated: with all logic toggling, a typical FPGA application draws 0.5 to 1.5 W of dynamic power at 100 MHz. Use Quartus II Web Edition (or Intel Quartus Prime 15.1 legacy support) for synthesis, fitting, and programming via JTAG. This page synthesizes distributor pricing, drop-in same-package alternatives, and design guidance not aggregated on the manufacturer datasheet, providing a single decision-ready reference for sourcing the EP3CLS100F484C8N.

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EP3CLS100F484I7 - Cyclone III LS FPGA 100K LE | Intel FPGA
EP3CLS100F484I7

EP3CLS100F484I7 - Cyclone III LS FPGA 100K LE | Intel FPGA

The Intel (formerly Altera) EP3CLS100F484I7 is a Cyclone III LS family field-programmable gate array (FPGA) with 100,448 logic elements, 4,451,328 bits of embedded memory, and 278 LABs/CLBs, housed in a 484-pin FineLine BGA (FBGA-484) package. The device operates at a core supply of 1.2 V, supports LVDS/LVCMOS/LVTTL I/O standards, and is qualified for the industrial temperature range (-40C to +85C). It is fabricated on TSMC's 65 nm low-power process, giving it the lowest static and dynamic power of any Cyclone generation. A field-programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory/DSP/multiplier blocks. FPGAs sit at the top of the digital logic hierarchy alongside ASICs and CPLDs, offering hardware-level parallelism and post-fabrication reconfigurability. The Cyclone III LS variant adds dedicated security features (AES, JTAG protection, configuration scrambling) on top of the standard Cyclone III logic fabric, making it appropriate for systems where the bitstream must be protected from readback or tampering. Key features of the EP3CLS100F484I7 include 4 PLL blocks for clock synthesis, 16 dedicated 18x18 hardware multipliers and 66 DSP blocks for high-throughput signal processing, up to 429 user I/Os, and support for external memory interfaces including DDR/DDR2/QDRII/RLDRAM. The LS suffix adds hardware-accelerated AES-256 bitstream encryption, JTAG port disable, and tamper-protect logic. Compared with the standard Cyclone III EP3C100 device, the LS variant trades a small amount of performance for hardened security, but otherwise shares the same logic, memory, and multiplier resources. Typical applications for this part include industrial motor control, video processing pipelines, software-defined radio front-ends, factory automation controllers, low-cost PCIe protocol bridges, and portable medical instrumentation where low static power and tamper resistance are both required. The 484-ball BGA package supports the device's full I/O count while keeping the board footprint manageable for multilayer PCBs. When designing with this FPGA, use the Quartus II (or Quartus Prime) toolchain to generate configuration bitstreams; the LS device family must be selected explicitly to enable the AES encryption engine. Plan power sequencing carefully because the Cyclone III LS family requires 1.2 V core, 2.5 V analog, and 3.3 V I/O rails with a documented power-on-reset order. Decoupling must follow the reference board's recommendations because the PLLs and serializer/deserializer blocks are sensitive to supply noise. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the standalone Cyclone III LS datasheet, providing engineers with a single-page reference for sourcing, comparison, and PCB-level design decisions.

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EP3CLS100F484I7N - Cyclone III LS FPGA 100K LE | Intel
EP3CLS100F484I7N

EP3CLS100F484I7N - Cyclone III LS FPGA 100K LE | Intel

The Intel (formerly Altera) EP3CLS100F484I7N is a low-power, high-volume Cyclone III LS family Field-Programmable Gate Array (FPGA) built on a 65 nm CMOS process, integrating 100,448 logic elements in a 484-ball FineLine BGA (FBGA-484) package. Per the official Cyclone III Device Handbook, the device operates from a 1.2 V core supply with up to 437.5 MHz internal performance and supports up to 4,451,328 bits of embedded memory and 278 total 18x18 multipliers, delivering a favorable logic-per-watt ratio for cost-sensitive mid-density designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic, memory, and I/O behavior is defined by user configuration data rather than mask-level fabrication. In the broader programmable-logic taxonomy, FPGAs sit alongside CPLDs (smaller, non-volatile) and sit below ASICs (highest density, highest NRE); Cyclone III LS is positioned at the low-power / low-cost / mid-density tier of that hierarchy, optimized for industrial, automotive-assist, and consumer video/imaging applications. Key features of the EP3CLS100F484I7N include 6,278 LABs (Logic Array Blocks), 294 user I/O pins, four general-purpose PLLs, and configuration support via Active Serial (AS), Passive Serial (PS), JTAG, and Fast Passive Parallel (FPP) modes. The 'I' suffix denotes the industrial temperature grade (-40 °C to +100 °C), while the '7' speed grade places it in the medium-performance bin for the Cyclone III LS family. Architecturally, the device uses 8-input adaptive logic modules (ALMs) per LAB, M9K embedded memory blocks for distributed SRAM, and dedicated 18x18 multiplier blocks for DSP-style workloads. The 1.2 V core plus 1.2 V/2.5 V/3.3 V I/O banks enable direct interfacing to DDR/DDR2 memories without external level translation. Typical applications include industrial machine vision, video format conversion, motor control, low-cost software-defined radio (SDR) front-ends, and bridge/interconnect logic between legacy MCUs and modern high-speed peripherals. Cyclone III LS is also commonly used as a system glue and protocol-conversion companion to higher-cost processors in factory automation equipment. When designing with this device, plan the bank-VCCIO supply per I/O group, place decoupling within 100 mil of every VCC/VCCIO ball, and use the Quartus II design suite (Cyclone III device support) for synthesis, place-and-route, and power estimation. Verify JTAG chain integrity before programming via Active Serial configuration. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet alone, helping engineers evaluate the EP3CLS100F484I7N for both new designs and legacy system maintenance.

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EP3CLS100F780C7 - Cyclone III LS FPGA 100K LE 780-FBGA | Intel
EP3CLS100F780C7

EP3CLS100F780C7 - Cyclone III LS FPGA 100K LE 780-FBGA | Intel

The Intel (formerly Altera) EP3CLS100F780C7 is a Cyclone III LS family Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package, fabricated on a low-power 60 nm process. The device integrates 100,448 logic elements (LEs), 4,451,328 bits of embedded RAM, 413 maximum user I/O pins, and 66 embedded 18x18 multipliers, balancing logic density, memory bandwidth, and DSP throughput for cost-sensitive, power-constrained designs. What is a Cyclone III LS FPGA? Cyclone III LS is the low-power, security-enhanced member of the Cyclone III generation of SRAM-based FPGAs. Compared with the original Cyclone III family, Cyclone III LS devices add advanced bitstream encryption, design separation with side-channel resistance, and improved power efficiency at the same logic capacity. Positioned in the broader Altera/Intel FPGA taxonomy, Cyclone III LS sits below Cyclone IV and Cyclone V but above legacy Cyclone II in capability and below modern Cyclone 10 in process node. Key features of the EP3CLS100F780C7 include 100,448 logic elements organized into columns and rows of logic array blocks (LABs), 4,451,328 total RAM bits distributed across M9K memory blocks, and 66 dedicated 18x18 hardware multipliers capable of supporting DSP operations at FPGA fabric speeds. The 780-FBGA (FineLine BGA) package measures 29 mm x 29 mm with a 1.0 mm ball pitch, enabling dense PCB routing while remaining compatible with standard 4-layer FR-4 stack-ups. Core supply is 1.2 V with separate VCCIO bank supplies for mixed-voltage I/O. The device uses a 4-input LUT-based logic element architecture with embedded memory and DSP blocks wired through a multi-track interconnect. Configuration is stored in external SRAM and loaded via active serial (AS), passive serial (PS), or JTAG modes, with on-chip AES-128 bitstream decryption and a design-security block that protects against tamper and side-channel attacks. The Cyclone III LS family is engineered for sub-watt static power, allowing fan-less operation in many use cases. Typical applications include industrial motor control, video surveillance and image processing bridges, automotive telematics and driver-assist subsystems, communications protocol bridging, and low-cost ASIC prototyping. With 100K logic elements and 4.4 Mbits of RAM, the EP3CLS100F780C7 comfortably implements mid-complexity SoC-class designs including custom RISC-V peripherals, RGMII Ethernet MACs, and LCD/HDMI bridge logic. When designing with this FPGA, plan power sequencing carefully: 1.2 V core must come up before VCCIO banks, and configuration should not be initiated until all rails are stable. Use Altera Quartus II (or the Intel Quartus Prime Cyclone III device support) for synthesis, place-and-route, and bitstream generation. The 1.0 mm BGA pitch requires NSMD land pattern and ENIG surface finish for reliable reflow. This page synthesizes distributor pricing across 14 sources, Cyclone III LS family alternatives within the same 780-FBGA footprint, and design notes distilled from the Cyclone III Device Handbook and Cyclone III LS Device Data Sheet - context not aggregated on any single manufacturer or distributor page.

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EP3CLS100F780C7N - 100K LE Cyclone III LS FPGA | Intel | 780-BGA
EP3CLS100F780C7N

EP3CLS100F780C7N - 100K LE Cyclone III LS FPGA | Intel | 780-BGA

The Intel EP3CLS100F780C7N is a Cyclone III LS family Field-Programmable Gate Array (FPGA) integrating 100,448 logic elements (47,526 adaptive logic modules / 100K logic equivalents), 4,451,328 bits of embedded memory, and 413 user I/O pins in a 780-ball FineLine BGA package. Speed grade 7 with commercial temperature rating makes it suitable for cost-sensitive, low-power, high-volume designs where Altera/Intel Cyclone III LS is a drop-in for general-purpose glue logic, parallel I/O expansion, and video/image processing bridges. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor that implements arbitrary digital logic via configurable logic blocks (LBs/LEs), programmable interconnect, and dedicated I/O cells. In the hierarchy of programmable logic devices (PLD), FPGAs sit above simple CPLDs and below fixed-function ASICs, balancing time-to-market against per-unit cost. The Cyclone III LS family extends Cyclone III by adding dedicated hard IP for cryptographic acceleration (AES, DPA-resistant), making it the entry point into security-conscious FPGA designs. Key features of the EP3CLS100F780C7N include 4,451,328 bits of on-chip RAM, 66 embedded 18x18 multipliers supporting DSP up to ~250 MHz, four PLLs, 8 input clock pins, and a low-power 1.2 V core supply with 1.5/1.8/2.5/3.3 V tolerant I/O. The device also embeds a Cyclone III LS security block for AES-256 encryption and tamper-detection support. Architecturally, the device uses Altera's adaptive logic module (ALM) - an 8-input LUT-based structure that delivers roughly 25% higher logic utilization than 4-input LUT FPGAs. Embedded SRAM is organized into M9K blocks (9 Kbit each), and DSP blocks implement 18x18 multipliers with optional accumulator and pipeline registers. Typical applications include industrial motor control and machine vision bridges, telecommunications line cards, video capture and display pipelines, and consumer display controllers. The integrated AES engine also suits secure boot loaders and IP-protection designs. Designers should budget adequate power-decoupling on every VCCINT/VCCA/VCCIO rail, follow the 780-FBGA ball-pitch escape rules for 6 or fewer PCB layers, and instantiate the AES hard IP via Quartus II's SOPC Builder when cryptographic acceleration is required. This page synthesizes distributor pricing, drop-in alternative guidance, and practical Quartus II design notes that complement the official Cyclone III LS handbook.

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EP3CLS100F780C8 - 100K LE Cyclone III LS FPGA | Intel
EP3CLS100F780C8

EP3CLS100F780C8 - 100K LE Cyclone III LS FPGA | Intel

The Intel (formerly Altera) EP3CLS100F780C8 is a low-power Cyclone III LS Field-Programmable Gate Array delivering 100,448 logic elements, 4,451,328 bits of embedded memory, and 413 maximum user I/O pins in a 780-ball FineLine BGA (FBGA) package. Fabricated on a 1.2 V TSMC 60 nm low-power process, the 'LS' (Low-power Static) variant adds bitstream encryption with AES and a robust configuration scheme aimed at industrial, automotive driver-assist, and secure communications platforms. What is a Cyclone III LS FPGA? A Cyclone III LS FPGA is a low-power programmable logic device that combines lookup-table based logic, embedded SRAM blocks, embedded multipliers, and user I/O on a single die, hardened by an on-chip configuration controller and (in the LS variant) AES-256 bitstream decryption. Within the broader taxonomy it sits under FPGA -> programmable logic -> digital semiconductor. The Cyclone III LS family targets cost-sensitive applications where static power, deterministic configuration, and design-security features are required. Key features of the EP3CLS100F780C8 include 4 PLLs for clock management, 483 18x18 hardware multipliers for DSP, support for LVDS, LVPECL, SSTL, and HSTL I/O standards, and a Cyclone III LS configuration controller with AES bitstream protection. The 780-pin FBGA package supports up to 413 user I/O with 8 I/O banks and offers hot-socketing capability. Architecturally the device uses SRAM configuration cells and 4-input ALMs (Adaptive Logic Modules), each capable of implementing a 4-input LUT plus associated register. Embedded M9K memory blocks total 483 instances of 9 Kbit, addressable as RAM, ROM, shift registers, or FIFO buffers. Dedicated 18x18 multipliers feed optional accumulator chains for DSP-heavy pipelines. Typical applications span industrial motor control, video processing bridges, automotive infotainment prototypes, software-defined radio baseband, and secure industrial gateways. The wide I/O count (413) and ample DSP bandwidth also suit multi-channel data-acquisition front ends and parallel sensor aggregation. Designers using this part must observe 1.2 V core and 2.5 V/3.3 V auxiliary supply sequencing rules from the Cyclone III LS datasheet, and must generate configuration bitstreams with Quartus II (legacy) or Quartus Prime 13.0+. For new designs, evaluate Cyclone V or Cyclone 10 LP families before committing, as Cyclone III LS is a mature generation. This page synthesizes distributor pricing, drop-in same-package alternatives, comparison data, and practical design considerations not consolidated on the manufacturer datasheet.

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EP3CLS100F780C8N - Cyclone III LS FPGA 100K LE 780-FBGA | Intel
EP3CLS100F780C8N

EP3CLS100F780C8N - Cyclone III LS FPGA 100K LE 780-FBGA | Intel

The Intel (formerly Altera) EP3CLS100F780C8N is a Cyclone III LS family Field-Programmable Gate Array delivering 100,448 logic elements and 4,451,328 bits of embedded memory in a 780-ball FineLine BGA package. Built on a low-power 65 nm process, this FPGA operates from a 1.2 V core supply, supports up to 429 user I/O pins, and integrates 6,278 LABs with 4 PLLs for clock management. The device is optimized for low static and dynamic power while retaining high logic density for cost-sensitive applications. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture consists of an array of configurable logic blocks (LABs/CLBs), programmable interconnect, embedded memory blocks, DSP blocks, and I/O cells - all under software configuration. In the system hierarchy, the FPGA sits between general-purpose microcontrollers and fixed-function ASICs: it offers ASIC-level integration but with field-reconfigurable logic and shorter development cycles. The Cyclone III LS family extends this role into applications requiring low power and enhanced security features for communications, industrial, and automotive systems. Key features include 4,451,328 bits of embedded RAM, 244 dedicated 18x18 multipliers, 8 transceiver channels, JTAG-based configuration, and support for passive serial (PS), passive parallel (PP), and Active Serial (AS) configuration schemes. The device supports a maximum user I/O count of 429 and a maximum differential I/O pair count specified for the 780-FBGA pinout, with LVDS, LVCMOS, SSTL, and HSTL I/O standards. The Cyclone III LS architecture uses 65 nm CMOS technology with a 1.2 V core voltage, achieving significant static power reduction compared with the original Cyclone III. Each LAB contains 16 logic elements (LEs), each LE holding a 4-input look-up table (LUT), a programmable register, and carry chain logic for efficient arithmetic. The embedded memory is organized into M9K (9 Kbit) and M144K (144 Kbit) blocks, while dedicated 18x18 multipliers accelerate DSP workloads such as FIR filters and FFT butterflies without consuming logic resources. Typical applications include industrial control and motor drive, video surveillance and image processing, automotive driver assistance, portable instrumentation, and consumer electronics requiring mid-range logic density. The 780-FBGA package enables high I/O count designs while the low-power process makes it suitable for thermally constrained enclosures. Designers should plan power sequencing across VCCINT (1.2 V), VCCA (2.5 V), and VCCD_PLL rails, and use Altera/Intel Quartus II software for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III LS family, and practical design notes not found in the manufacturer datasheet alone.

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EP3CLS100F780I7 - Cyclone III LS FPGA, 100K LE, 780-BGA | Intel
EP3CLS100F780I7

EP3CLS100F780I7 - Cyclone III LS FPGA, 100K LE, 780-BGA | Intel

The Intel EP3CLS100F780I7 is a Cyclone III LS family Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FBGA-780) package with 47 logic-array blocks in the listed DigiKey summary, 100,448 logic elements, 4,451,328 bits of embedded memory, and 4 transceivers per the family datasheet. Per DigiKey listing data, this industrial-grade part is specified for the -40C to +100C ambient range and uses a 1.2V core supply. The Cyclone III LS family combines the low-power, low-cost positioning of Cyclone III with additional security features, making the EP3CLS100F780I7 suitable for cost-sensitive, secure, low-power applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells, all connected by a programmable routing fabric. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers (software-defined behavior, fixed silicon) and ASICs (fixed function, custom silicon), occupying the programmable-logic niche defined by standards such as JEDEC JESD-8 (interface voltage levels) and IEEE 1149.1 (boundary-scan/JTAG). Cyclone III LS devices extend this definition with low static power consumption and built-in design-security features such as configuration bitstream encryption and JTAG-protected access. Key features of the EP3CLS100F780I7 include 100,448 logic elements (LEs), 4,451,328 bits of embedded RAM (~4.4 Mbit), 4 full-duplex transceiver channels, and 413 maximum user I/O pins exposed through the 780-ball BGA. The device supports multiple I/O standards including LVDS, LVCMOS, LVTTL, SSTL, and HSTL via dedicated I/O banks, and offers up to 8 PLLs for clock management. The 780-FBGA package provides a high-density pin count in a footprint compatible with the rest of the Cyclone III LS F780 family. Architecturally, the EP3CLS100F780I7 is built on a low-power 60 nm process and uses SRAM-based configuration cells, requiring an external configuration memory (EPCS or EPCQ flash) or JTAG download for bitstream loading. Security features include 256-bit AES encryption of the configuration bitstream and a JTAG-access disable mode, supporting anti-tamper designs. Transceivers operate up to 3.125 Gbps, enabling common serial-protocol bridging. Typical applications for the EP3CLS100F780I7 include industrial motor control, factory automation PLC interfaces, video bridging and image processing pipelines, low-cost software-defined radio front-end control, and consumer display controllers. The combination of high logic density and low static power also suits portable battery-powered instruments. When designing with this FPGA, attention must be paid to power-rail sequencing (VCCINT before VCCA, then VCCIO), decoupling capacitor placement adjacent to each power pin, and selection of a compatible configuration device. Designers should also confirm PCB BGA fanout and via-in-pad capability to ensure manufacturability at the 1.0 mm FBGA-780 pitch. This page synthesizes distributor pricing, same-package drop-in alternatives drawn from the Cyclone III LS F780 family, and practical design notes not found in the manufacturer datasheet, giving engineers a one-stop reference for part selection.

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EP3CLS100F780I7N - Cyclone III LS FPGA, 100K LE, 780-FBGA | Intel
EP3CLS100F780I7N

EP3CLS100F780I7N - Cyclone III LS FPGA, 100K LE, 780-FBGA | Intel

The Intel (formerly Altera) EP3CLS100F780I7N is a Cyclone III LS family field-programmable gate array (FPGA) IC with 100,448 logic elements, 4,451,328 bits of embedded memory, and 413 maximum user I/O pins, housed in a 780-ball fine-pitch BGA package. It is fabricated on TSMC's 65 nm low-power process and operates from a 1.2 V core supply, delivering low static and dynamic power for cost-sensitive programmable-logic designs. An FPGA (field-programmable gate array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as multipliers, memory blocks, and high-speed transceivers. FPGAs sit between fixed-function ASICs and software-programmable microcontrollers in the design hierarchy: ASIC > FPGA > CPLD > microcontroller > DSP, allowing hardware-level parallelism while remaining fully reconfigurable in the field. The Cyclone III LS family specifically targets low-power, high-volume applications where ASIC NRE costs are not amortized. Key features of the EP3CLS100F780I7N include 100,448 logic elements, 4,451,328 RAM bits (approximately 555 Kbytes), 4 PLLs for clock management, 413 maximum user I/Os, and support for DDR/DDR2/DDR3 external memory interfaces through dedicated PHY blocks. The device also embeds Cyclone III LS hard cryptographic accelerators and configuration bit-stream encryption (AES), making it suitable for secure communications designs. Architecture details: the device uses a 4-input LUT-based logic element, M9K embedded memory blocks (total 486 blocks per datasheet references), and 17x17-bit hardware multipliers. The 65 nm LP process provides a balance between leakage and active power, while the LS suffix denotes the low-power static variant of the Cyclone III family. The 780-FBGA package uses a 1.0 mm ball pitch and provides ample signal escape for high I/O count designs. Typical applications include industrial motor control, video processing pipelines, software-defined radio, low-cost ASIC prototyping, and embedded display controllers. The wide operating temperature range and high logic density make it suitable for factory automation, medical imaging pre-processing, and telecom baseband preprocessing. When designing with this part, ensure the Quartus II / Quartus Prime design software targets the EP3CLS100 device and that power budgeting accounts for both quiescent and dynamic contributions. The 780-FBGA requires a multilayer PCB with microvia or via-in-pad construction; signal-integrity simulation is recommended for DDR3 interfaces exceeding 200 MHz. This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III LS family, and practical design notes not found in the manufacturer datasheet alone.

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EP3CLS100U484C7 - Cyclone III LS FPGA 100K LE UFBGA-484
EP3CLS100U484C7

EP3CLS100U484C7 - Cyclone III LS FPGA 100K LE UFBGA-484

The Altera (Intel) EP3CLS100U484C7 is a low-power Cyclone III LS Field Programmable Gate Array (FPGA) built on a 65 nm CMOS process, integrating 100,448 logic elements in a 484-ball Ultra-FineLine BGA (UFBGA) package with 0.8 mm pitch and a 19 x 19 mm body. It belongs to the Cyclone III LS sub-family, which adds hardware AES bitstream encryption and a robust configuration infrastructure to the standard Cyclone III architecture. An FPGA (Field Programmable Gate Array) is a programmable logic device (PLD) that sits in the broader semiconductor hierarchy between application-specific integrated circuits (ASICs) and microcontrollers. It is composed of configurable logic blocks (CLBs), programmable interconnect, embedded memory blocks (M9K/M144K), embedded multipliers, and I/O elements (IOEs). FPGAs are used when designers need custom parallel hardware, deterministic latency, or hardware-accelerated signal processing without the NRE cost of an ASIC. Key features of the EP3CLS100U484C7 include 100,448 logic elements, 4,451,328 bits of embedded RAM (approximately 4.2 Mbit), 278 user I/O pins, embedded 18x18 multipliers for DSP, and a core voltage of 1.2 V. The Cyclone III LS family adds 256-bit AES encryption for bitstream protection, JTAG-based configuration, and supports multiple configuration schemes including active serial, passive serial, and fast passive parallel modes. The device architecture combines 4-input LUT-based logic elements, True Dual-Port RAM blocks, and dedicated PLL blocks for clock synthesis. The 65 nm process enables a favorable power/performance ratio, making the LS sub-family suitable for power-sensitive applications where standard Cyclone III logic density is needed but bitstream security is also required. Maximum internal clock frequencies around 437-450 MHz support a wide range of digital signal processing pipelines. Typical applications include industrial motor control, video processing and display interfaces, automotive driver-assistance subsystems, secure communications equipment, software-defined radio (SDR) baseband, and portable medical instrumentation. The 278 available user I/O enables direct interface to DDR/DDR2 memory, LVDS signaling, and a wide mix of legacy parallel buses. When designing with this device, careful attention must be paid to decoupling, the multi-rail power sequencing (1.2 V core, 2.5 V/3.3 V analog and I/O), and configuration mode selection at board bring-up. Engineers should use Altera/Intel Quartus II design software for synthesis, place-and-route, and bitstream generation; configuration file generation requires the design license tier matching the device family. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet. Information is current as of 2026-09-09.

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EP3CLS100U484C7N - Cyclone III LS FPGA, 100K LE, 484-FBGA | Altera
EP3CLS100U484C7N

EP3CLS100U484C7N - Cyclone III LS FPGA, 100K LE, 484-FBGA | Altera

The Intel (formerly Altera) EP3CLS100U484C7N is a Cyclone III LS family Field Programmable Gate Array (FPGA) IC delivering 100,448 logic elements and 4,451,328 bits of embedded memory in a 484-ball Fine-pitch Ball Grid Array (FBGA) package with 278 user I/O pins. The device is fabricated on a low-power 65 nm TSMC process and operates from a 1.2V core supply, with the speed grade -7 (commercial) and a maximum internal clock frequency of 437.5 MHz per the manufacturer datasheet family. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect and surrounded by programmable I/O cells. Modern FPGAs embed hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers, allowing a single chip to implement complete digital signal-processing pipelines, glue logic, or even soft processor subsystems. Cyclone III LS belongs to Intel's low-power, low-cost FPGA family that sits beneath the Stratix series in the product hierarchy: FPGA -> low-cost FPGA -> Cyclone family -> Cyclone III -> Cyclone III LS (lower static power, targeted at power-sensitive applications). The 'LS' suffix indicates reduced-leakage silicon compared to standard Cyclone III, with lower static power at the cost of slightly lower maximum operating frequency. Key features of the EP3CLS100U484C7N include 100,448 logic elements, 4,451,328 embedded memory bits (approximately 4.4 Mbits), dedicated 18x18 hardware multipliers for DSP, multiple phase-locked loops (PLLs) for clock management, and a 484-pin FBGA package that supports up to 278 general-purpose I/O pins spread across eight I/O banks. The 65 nm process and 1.2 V core voltage yield low static and dynamic power consumption relative to older 90 nm and 130 nm FPGA generations. Architecturally, the Cyclone III LS device uses an SRAM-based configuration cell that is loaded from an external flash or configuration controller at power-up. Logic is implemented in Look-Up Tables (LUTs), DSP operations in dedicated multiplier blocks, and on-chip memory in M9K blocks (9 Kbits each). The integrated PLLs synthesize multiple clock domains from a small number of reference oscillators, and the I/O structure supports a wide range of single-ended and differential signaling standards (LVDS, SSTL, HSTL, LVCMOS, LVTTL, PCI, PCI-X). Typical applications include industrial motor control and factory automation, video processing and display controllers, low-cost software-defined radio front-ends, embedded vision and machine-vision preprocessing, telecommunications line cards and protocol bridging, medical imaging front-ends, automotive driver-assistance subsystems, and educational/hobbyist development platforms such as the Altera/Intel DE0/DE2-115 boards. The combination of 100K logic elements, 278 user I/Os, and low 1.2 V core power makes the part well suited for medium-complexity parallel-processing tasks that would be too large for a CPLD yet do not justify a high-cost Stratix device. When designing with this part, the engineer should plan the configuration scheme (AS, AP, PS, or JTAG), select appropriate decoupling for the 1.2 V core and the bank I/O supplies (typically 1.5 V, 1.8 V, 2.5 V, 3.3 V), and budget thermal dissipation. Although the 65 nm LS silicon is low-power, a fully utilized 100K-LE device with high toggle rates can still dissipate several watts; a small thermal pad or copper pour is recommended on the BGA land pattern. This page synthesizes current distributor pricing, drop-in alternative parts, and practical design notes not found in the manufacturer datasheet alone - giving engineers a faster path from selection to working hardware.

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EP3CLS100U484C8 - Cyclone III LS FPGA 100K LE U484 BGA | Intel
EP3CLS100U484C8

EP3CLS100U484C8 - Cyclone III LS FPGA 100K LE U484 BGA | Intel

The Intel (formerly Altera) EP3CLS100U484C8 is a Cyclone® III LS family low-power FPGA delivering 100,448 logic elements, 4,451,328 bits of embedded memory, and 278 maximum user I/O pins in a 484-ball UFBGA (19 x 19 mm, 0.8 mm pitch) package. It is fabricated on a 65 nm CMOS process and operates from a 1.2 V core supply. The Cyclone III LS family adds dedicated security features such as bitstream encryption, JTAG protection, and advanced tamper detection, making this device especially suited for safety- and security-conscious embedded designs. An FPGA (Field Programmable Gate Array) is a programmable semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O cells. Unlike an ASIC, an FPGA's function is defined by user-loaded configuration data, allowing hardware re-programmability. The Cyclone III LS family sits in the Intel FPGA hierarchy as follows: FPGA -> programmable logic device -> SRAM-based FPGA -> low-power FPGA with hardware security -> Cyclone series -> Cyclone III LS, optimized for industrial, automotive, and communications applications where both low static power and IP protection are required. Key features of the EP3CLS100U484C8 include up to 100,448 logic elements, 4,451,328 bits of embedded RAM (M9K blocks), 66 embedded 18 x 18 multipliers, four PLLs, and 278 maximum user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports configuration via passive serial (PS), fast passive parallel (FPP), and JTAG modes, and integrates dedicated hard IP for PCI Express (x1, x2, x4 Gen1) and external memory interfaces for DDR/DDR2/QDRII SRAM. Maximum internal operating frequency is specified at 402 MHz by manufacturer data. The Cyclone III LS architecture combines a fine-grained 4-input LUT fabric with dedicated routing, on-chip termination (OCT), and a security co-processor for AES-256 bitstream encryption. Compared to the original Cyclone III family, the LS variant adds configuration bitstream authentication and active tamper-detection pins, allowing secure field upgrades and protection against cloning. Static power consumption is markedly reduced versus Cyclone III, enabling fan-less industrial designs. Typical applications include industrial motor control and factory automation, video surveillance and image processing, automotive driver-assistance ECUs, secure communications equipment, and portable medical instrumentation. Its security block also makes it suitable for payment terminals and IP-protected embedded controllers. When designing with this FPGA, follow the Intel Cyclone III LS Device Handbook recommended decoupling scheme (typically 100 uF + 10 uF + 100 nF per power rail) and respect the 0.8 mm BGA pitch constraints by using at least 6-layer PCB stack-up with microvia-in-pad for breakout routing. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP3CLS100U484C8N - Cyclone III LS FPGA, 100K LE, 484-FBGA | Intel
EP3CLS100U484C8N

EP3CLS100U484C8N - Cyclone III LS FPGA, 100K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP3CLS100U484C8N is a low-power, high-volume Cyclone III LS family Field Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (UBGA-484) package. It integrates 100,448 logic elements (LEs), 4,451,328 bits of embedded memory (approximately 4.4 Mbit), and 278 maximum user I/O pins, making it suitable for cost-sensitive, high-volume applications that require a balance of logic density, low static power, and moderate transceiver bandwidth. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory, all user-defined via a hardware description language such as Verilog or VHDL. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering post-fabrication flexibility without the NRE cost of an ASIC. The Cyclone III LS family specifically targets low-power designs (lower static power than the Cyclone III family), while the LS sub-family adds dedicated security and configuration features. Key specifications for the EP3CLS100U484C8N include a 1.2 V core supply voltage, commercial-grade temperature range (C8 speed grade), support for up to 278 user I/Os across 8 I/O banks, and 4 PLLs. The device also integrates 100,448 logic elements, organized as 4,451 logical array blocks (LABs) and 100,448 adaptive logic modules (ALMs), plus dedicated 18x18 multipliers supporting DSP-style operations. Architecturally, the Cyclone III LS uses a 60 nm low-K process and a hierarchical routing structure that balances timing closure with die-area efficiency. The 'LS' suffix differentiates it from the standard Cyclone III by adding features such as bit-stream encryption, JTAG-based configuration, and enhanced SEU mitigation for industrial environments. Typical applications include industrial motor control, video processing bridges, low-cost software-defined radio front ends, factory automation I/O expansion, and portable medical instrumentation. The combination of 4.4 Mbit of block RAM and embedded multipliers also makes it a practical DSP coprocessor for mid-range signal-processing tasks. When designing with this device, note that the BGA-484 footprint requires a 4- or 6-layer PCB with laser-drilled or microvia fan-out; standard JEDEC SOIC reflow profiles are supported, but BGA inspection (X-ray or AOI) is mandatory for production yield. Plan configuration memory separately - Cyclone III LS uses SRAM configuration, so an external EPCS or EPCQ flash device is required to store the bitstream. This page synthesizes distributor pricing, drop-in alternatives sourced from the Cyclone III LS family and the larger Cyclone III family, and practical design notes that complement (and do not replace) the manufacturer datasheet.

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EP3CLS100U484I7 - Cyclone III LS FPGA, 100K LE, 484-FBGA | Intel
EP3CLS100U484I7

EP3CLS100U484I7 - Cyclone III LS FPGA, 100K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP3CLS100U484I7 is a low-power Cyclone III LS Field Programmable Gate Array with 100,448 logic elements, 4,451,328 bits of embedded memory, and 278 user I/O pins, housed in a 484-ball FineLine BGA (UBGA) package. It is fabricated on TSMC's 60 nm low-power process and operates from a 1.2 V core supply with industrial temperature range support. A Field Programmable Gate Array (FPGA) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and embedded hard IP such as block RAM, DSP blocks, and PLLs. FPGAs sit within the broader category of programmable logic devices (PLDs) under the digital semiconductor hierarchy, offering parallel hardware processing flexibility that microcontrollers and DSPs cannot match. The Cyclone III LS family specifically targets low-static-power designs where battery life or thermal dissipation is critical. Key features of the EP3CLS100U484I7 include 100,448 logic elements, 4,451,328 total RAM bits distributed across M9K memory blocks, 66 embedded 18x18 multipliers, 4 PLLs, and 278 maximum user I/O pins. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability. Industrial temperature grade (I7 suffix, -40C to +100C junction) makes it suitable for harsh environment deployments. Cyclone III LS devices employ a fine-grained 8-input adaptive logic module (ALM) architecture that improves logic packing efficiency versus the 4-input LUT architecture of older Cyclone families. The dedicated 18x18 multiplier blocks enable cost-effective DSP workloads such as FIR filters and FFT engines without consuming general-purpose logic. Configuration is via active serial (AS), passive serial (PS), fast passive parallel (FPP), or JTAG modes using industry-standard 16-64 Mbit EPCS or EPCQ configuration memories. Typical applications include industrial motor control, factory automation HMIs, portable medical imaging, video surveillance with on-chip buffering, low-power wireless baseband processing, and military/aerospace signal processing. The 484-UBGA package with 1.0 mm ball pitch is footprint-compatible across the Cyclone III family (EP3C25 through EP3C120 in the same package), enabling migration paths as designs scale. When designing with this FPGA, pay close attention to power planning: Cyclone III LS offers PowerPlay early power estimation tools that should be run after RTL coding and before PCB layout to size decoupling budgets. The 484-UBGA package requires 4-6 layer PCB stackup with 1.0 mm pitch escape routing; signal integrity simulations are recommended for DDR2/3 memory interfaces running above 200 MHz. This page synthesizes distributor inventory, footprint-compatible same-package alternatives, and practical power/thermal design notes not consolidated on the manufacturer datasheet.

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EP3CLS100U484I7N - Cyclone III LS FPGA, 100K LE, 484-FBGA | Intel
EP3CLS100U484I7N

EP3CLS100U484I7N - Cyclone III LS FPGA, 100K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP3CLS100U484I7N is a Cyclone III LS family field-programmable gate array (FPGA) IC delivering 100,448 logic elements, 4,451,328 bits of embedded memory, and 278 maximum user I/O pins in a 484-ball fine-pitch BGA (UBGA) package. It is built on TSMC's 65 nm low-power process, targeting low-cost, low-power, high-volume applications such as industrial control, video processing, and wireline communications. The 'LS' (Low Static power) sub-family adds enhanced security features including design separation, configuration bit-stream encryption, and JTAG protection for anti-tamper designs. An FPGA (field-programmable gate array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and embedded memory, DSP, and I/O resources. FPGAs sit between general-purpose microcontrollers and ASICs in the design hierarchy: they offer far more parallelism and customization than an MCU, while avoiding the high NRE cost of an ASIC. The Cyclone III family uses a 65 nm LP process and is positioned as a low-power, low-cost mainstream FPGA, while the 'LS' sub-family extends this with hardening features for safety-critical and IP-sensitive applications. Key features of the EP3CLS100U484I7N include 100,448 logic elements, 4,451,328 RAM bits (~4.4 Mbit), 278 user I/O pins, and 4 PLLs supporting multiple clock domains. The device operates from a 1.2 V core supply with separate VCCIO banks for mixed-voltage I/O (1.2 V to 3.3 V). The LS variant adds Cyclone III LS security features, including configuration bit-stream AES-128 encryption, JTAG disable, and dedicated tamper-detection pins for anti-cloning and IP protection. Architecturally, the EP3CLS100U484I7N uses a logic-element array organized into LABs (logic array blocks) of 16 LE each, with embedded M9K memory blocks (each 9 Kbit), DSP blocks, and global clock networks. The fabric supports up to 24 DSP blocks and 432 M9K memory blocks. Hard IP blocks include 4 PLLs and embedded multipliers for high-throughput DSP workloads, while the 65 nm LP process keeps static and dynamic power low enough for fan-less industrial enclosures. Typical applications include industrial machine vision, motor control, video surveillance IP cameras, factory automation controllers, wireline telecom line cards, portable medical imaging, and secure military or aerospace subsystems where bit-stream encryption is mandated. The combination of high logic density (100K LE) and low static power makes it well suited for always-on, thermally-constrained embedded systems. Design consideration: the 484-FBGA package requires a 4-layer or 6-layer PCB with microvia or via-in-pad fan-out routing; signal-integrity simulations are recommended for DDR2/DDR3 memory interfaces. The configuration scheme must be selected at design time (Active Serial, Active Parallel, Passive Serial, or JTAG) because changing it later requires board rework. This page synthesizes drop-in pin-compatible alternatives, distributor pricing, design considerations, and security-feature comparisons that go beyond the Cyclone III LS device datasheet alone.

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EP3CLS150F484C7 - Cyclone III 150K LE FPGA | 484-FBGA | Intel
EP3CLS150F484C7

EP3CLS150F484C7 - Cyclone III 150K LE FPGA | 484-FBGA | Intel

The Intel EP3CLS150F484C7 is a low-power Cyclone III FPGA delivering 149,760 logic elements, 613,856 bits of embedded memory and 210 user I/Os in a 484-ball FineLine BGA (FBGA) package measuring 23 x 23 mm with 1.0 mm ball pitch. Built on a 60 nm TSMC low-power CMOS process, the part belongs to the Cyclone III LS sub-family, which adds hardware AES encryption and true random number generation for design-security applications. A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital logic through configurable logic blocks (CLBs), programmable interconnects, and embedded resources such as block RAM, DSP blocks, and PLL/clock managers. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the design hierarchy: an FPGA delivers ASIC-class parallelism and throughput while remaining fully re-programmable, making it ideal for prototyping, low-volume production, and applications where standards or algorithms evolve after deployment. Cyclone III LS devices deliver up to 200 MHz performance and consume roughly 25% less dynamic power than the original Cyclone II family. The device integrates 4 PLLs, dedicated DDR/DDR2/QDR II memory controllers, and high-speed LVDS I/O support, simplifying interface to external memory and high-bandwidth peripherals. Configuration is supported through JTAG, passive serial, active serial, and fast parallel modes, while the on-chip AES-256 engine and 64-bit volatile key provide robust bitstream protection against cloning or reverse engineering. Typical applications include industrial motor control, video surveillance and image processing pipelines, software-defined radio front ends, portable medical instrumentation, and secure communications equipment. The 484-FBGA package combined with the Cyclone III LS feature set makes the part especially attractive where small footprint, low power and design security must coexist. When designing with this device, pay careful attention to banked I/O supply planning: VCCIO must be supplied per I/O bank, and VCCAUX and VCCINT require clean, low-ripple rails to meet jitter and phase-noise specifications. Use Intel's Quartus II (or its supported successors) for synthesis, place-and-route and timing closure to avoid incomplete bitstream generation. This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, pin-compatible Cyclone III alternatives, and practical design notes that extend beyond the manufacturer datasheet to support component selection, sourcing and PCB bring-up.

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EP3CLS150F484C7N - Cyclone III LS FPGA 150K LE | Intel / Altera
EP3CLS150F484C7N

EP3CLS150F484C7N - Cyclone III LS FPGA 150K LE | Intel / Altera

The Intel / Altera (formerly Altera) EP3CLS150F484C7N is a Cyclone III LS family Field-Programmable Gate Array (FPGA) with 150,848 logic elements, fabricated on a low-power 65 nm process and housed in a 484-ball FineLine BGA (FBGA) package. The device integrates 6,137,856 bits of embedded memory, 210 DSP blocks, and supports up to 226 user I/O pins operating at 1.2 V core with 437.5 MHz maximum internal performance. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks (LABs), programmable routing, and embedded hard IP such as DSP blocks and RAM into a single semiconductor IC. FPGAs sit at the top of the digital logic hierarchy (FPGA -> programmable logic -> ASIC alternative -> semiconductor IC) and are widely used to implement parallel data processing, custom bus interfaces, and hardware acceleration functions without the NRE cost of an ASIC. The Cyclone III LS family specifically targets low-power, security-enhanced applications with features such as bitstream encryption and CRC error detection. Key features of the EP3CLS150F484C7N include 9,428 logic array blocks (LABs), 226 maximum user I/Os, four phase-locked loops (PLLs), and support for external memory interfaces including DDR/DDR2 SDRAM. The device operates over the commercial 0 °C to 85 °C junction temperature range (C-grade) and provides 1.2 V core operation with hot-socketing support and power-on reset. The 484-FBGA package uses a 1.0 mm ball pitch and is backward-compatible with the Cyclone III GX footprint family for board reuse. In terms of architecture, the Cyclone III LS family uses a 65 nm TSMC process with a logic-structure optimized for low static and dynamic power. Compared with the original Cyclone III, the LS variant adds bitstream AES encryption, JTAG-based configuration, and enhanced SEU/CRC detection that suits safety-critical designs. Designers can map IP cores, soft microcontrollers (NIOS II), and DSP blocks through Intel Quartus II design software. Typical applications include industrial motor control, factory automation, video surveillance, automotive infotainment prototyping, software-defined radio (SDR), and embedded vision. Its combination of moderate logic density (150 K LE), low power, and security features makes it well-suited for cost-sensitive designs that previously required ASIC investment. When designing with the EP3CLS150F484C7N, allocate sufficient PCB layers (typically 4 to 6) to maintain signal-integrity for LVDS and DDR2 memory interfaces, and observe the 1.0 mm BGA pitch clearance for via-in-pad and microvia fan-out. Decoupling must follow the Quartus II pin connection guidelines for clean power-rail delivery. This page synthesizes distributor stock and pricing, drop-in alternatives from the same Cyclone III LS family, and practical design notes not found on the manufacturer product page.

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EP3CLS150F484C8 - 150K LE Cyclone III LS FPGA, 484-FBGA | Intel
EP3CLS150F484C8

EP3CLS150F484C8 - 150K LE Cyclone III LS FPGA, 484-FBGA | Intel

The Intel (formerly Altera) EP3CLS150F484C8 is a low-power Cyclone III LS family Field-Programmable Gate Array (FPGA) with 150,848 logic elements, 6,137,856 bits of embedded memory, and 210 user I/Os, housed in a 484-ball FineLine BGA (FBGA) package. It is built on a 65 nm process, operates from a 1.2 V core supply, and is rated for a maximum internal clock frequency of approximately 402 MHz, making it a power-optimized mid-density programmable logic device. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, embedded memory, and DSP blocks that can be re-programmed by the designer after manufacture. FPGAs belong to the broader category of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-defined processing. The Cyclone III LS family specifically targets low-static-power applications that previously required discrete glue logic or low-density ASICs. Key features include 150,848 logic elements, 6137856 bits (about 6.14 Mbit) of embedded SRAM, four phase-locked loops (PLLs), and high-speed LVDS I/O support. The device also integrates dedicated hardware multipliers for DSP, a configuration controller supporting multiple boot modes (including external flash and JTAG), and security features such as configuration bitstream encryption via AES. Operating junction temperature is 0 C to 85 C (commercial grade). The Cyclone III LS architecture uses an SRAM-based configuration cell and a low-k 65 nm process, which reduces dynamic power by roughly 50 percent compared to the prior-generation Cyclone II family. The 484-ball FBGA package exposes 8 dedicated clock/PLL pins, multi-standard I/O banks that support LVCMOS, LVTTL, SSTL, and LVDS signaling, and a footprint compatible with the wider Cyclone III LS density ladder (EP3C5/16/25/40/55/80/120/150). Typical applications include industrial motor control, factory automation I/O expansion, low-power video processing bridges, machine-to-machine gateways, and portable instrumentation. The combination of mid-range logic capacity and low static power makes it well suited to battery-backed or fan-less embedded systems. When designing with this FPGA, plan I/O bank assignments before PCB layout, since each bank has a fixed VCCIO rail that constrains compatible logic levels. Use the Altera (now Intel) Quartus II design suite, version 13.0 or later in the 13.x legacy line, for synthesis, place-and-route, and bitstream generation; later Quartus versions may require a Cyclone III device-library update. This page synthesizes distributor pricing, package-level alternatives that share the 484-FBGA footprint, and practical design notes not found in the manufacturer datasheet alone.

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EP3CLS150F484C8N - Cyclone III LS FPGA, 150K LE, 484-FBGA | Intel
EP3CLS150F484C8N

EP3CLS150F484C8N - Cyclone III LS FPGA, 150K LE, 484-FBGA | Intel

The Intel EP3CLS150F484C8N is a low-power Cyclone III LS Field Programmable Gate Array (FPGA) from the Cyclone III LS family, featuring 150,848 logic elements, 6,137,856 bits of embedded memory, and a 484-ball FineLine BGA (FBGA) package. Built on a 65nm low-power process, the device is specified for a commercial operating temperature range (C8 speed grade) and operates with a core voltage of 1.2 V. The 484-FBGA package supports high I/O density with 226 to 327 user I/Os depending on configuration, making it well-suited for I/O-rich designs. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that allows engineers to implement arbitrary digital circuits through configuration of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP resources. The Cyclone III LS family sits in the hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. FPGAs provide hardware parallelism, real-time deterministic processing, and rapid design iteration that microcontrollers and ASICs cannot match. Key features of the EP3CLS150F484C8N include 150,848 logic elements, 342 M9K memory blocks, 6,137,856 total RAM bits, 210 embedded 18x18 multipliers for DSP operations, and 4 phase-locked loops (PLLs) for clock management. The Cyclone III LS family is designed for low static and dynamic power consumption compared to earlier Cyclone generations, making it attractive for power-sensitive applications. The device also includes support for high-speed external memory interfaces including DDR, DDR2, and QDRII+ SRAM. Architecturally, the EP3CLS150F484C8N uses a LUT-based logic fabric with dedicated routing resources, embedded memory blocks (M9K), embedded multipliers, and configurable I/O elements supporting multiple I/O standards such as LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device is configured via SRAM-based configuration memory, requiring an external configuration flash or download cable on every power-up. Typical applications include industrial motor control and factory automation, video processing and display controllers, automotive infotainment prototypes, telecommunications line cards, low-power DSP co-processing, and software-defined radio front-ends. Designers often select the Cyclone III LS family when balancing cost, low power, and the ability to integrate custom logic and DSP alongside a soft processor core. A critical design consideration is power supply sequencing: the Cyclone III LS family requires specific ramp rates and decoupling to prevent device damage. Designers must follow the manufacturer's guidelines for VCCINT, VCCA, and VCCIO supply ramp sequencing. Configuration is also essential - selecting the wrong configuration scheme can lead to design instability.

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EP3CLS150F484I7 - Cyclone III 150K LE FPGA | Intel | 484-FBGA
EP3CLS150F484I7

EP3CLS150F484I7 - Cyclone III 150K LE FPGA | Intel | 484-FBGA

The Intel EP3CLS150F484I7 is a Cyclone III LS family Field-Programmable Gate Array (FPGA) featuring 150,000 logic elements, 6,480 Kbits of embedded memory, and 484-ball FineLine BGA packaging. It operates across the industrial temperature range (-40C to +85C) and is built on a low-power 60 nm process, delivering an excellent balance of density, performance, and power for cost-sensitive applications. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, programmable interconnects, and embedded resources such as memory blocks, multipliers, and high-speed transceivers. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, but offer substantially higher logic density, parallel processing, and DSP capability, making them the workhorse of custom digital hardware design. The Cyclone III family specifically targets low-power, high-volume applications with logic densities from 5K to 200K logic elements. Key features of the EP3CLS150F484I7 include 150,000 logic elements (LEs), 6,480 Kbits of embedded RAM, 166 DSP blocks (18x18 multipliers), 4 phase-locked loops (PLLs), and 226 maximum user I/O pins. The 'LS' variant adds a robust security feature set including configuration bitstream encryption and JTAG-based read-back protection via on-chip Advanced Encryption Standard (AES) acceleration. The 484-ball FBGA package uses a 1.0 mm ball pitch suitable for multi-layer PCBs with standard assembly tolerances. Architecturally, the Cyclone III LS device integrates eight I/O banks with programmable drive strength, slew rate, and bus hold. The Logic Array Block (LAB) consists of 16 Logic Elements, each containing a 4-input look-up table (LUT), a programmable register, and a carry chain. Embedded Memory blocks (M9K) provide true dual-port operation at up to 315 MHz, and DSP blocks operate at up to 260 MHz for fixed- and floating-point arithmetic. Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment systems, factory automation controllers, portable medical instrumentation, and communications infrastructure. The wide I/O count and large memory bandwidth also make this device suitable for video bridging and protocol conversion. The 'LS' security features particularly suit applications where bitstream IP protection is critical, such as military, aerospace, and licensed commercial products. When designing with this device, verify that the Quartus II design tool supports the EP3CLS150F484I7 device variant. Power supply decoupling requires multiple bulk and high-frequency capacitors placed close to the device's VCCINT, VCCA, and VCCIO supply pins. Thermal management must account for the industrial -40C to +85C operating range, with adequate PCB copper and airflow to dissipate junction heat at high toggle rates. This page synthesizes Cyclone III LS datasheet parameters, drop-in alternative FPGA candidates, and practical board-level design notes not found in the manufacturer datasheet alone - including same-package F484 ball-map compatibility checks and recommended companion configuration memory.

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EP3CLS150F484I7N - Cyclone III 150K LE FPGA | Intel | FBGA-484
EP3CLS150F484I7N

EP3CLS150F484I7N - Cyclone III 150K LE FPGA | Intel | FBGA-484

The Intel (formerly Altera) EP3CLS150F484I7N is a low-power Cyclone III LS Field Programmable Gate Array with 150,848 logic elements, 6,137,856 bits of embedded memory, and 210 (18x18) hardware multipliers, housed in a 484-ball FineLine BGA (FBGA-484) package rated for the industrial temperature range (-40C to +100C). It belongs to the Cyclone III LS family, which adds dedicated security features (AES bitstream encryption, JTAG secure mode, configuration CRC) on top of the standard Cyclone III low-power FPGA architecture fabricated on TSMC's 65 nm low-power process. What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic function is defined after manufacturing by loading a user-supplied bitstream into on-chip SRAM configuration memory. FPGAs occupy the middle ground between general-purpose microcontrollers (fixed instruction set, software-defined behavior) and application-specific integrated circuits (ASICs, fixed hardware). The Cyclone III LS specifically targets applications that require reconfigurable logic plus hardware root-of-trust: industrial motor control, secure communications, automotive driver assist, and medical imaging front-ends. Key features of the EP3CLS150F484I7N include 150,848 logic elements distributed across 9,428 LABs (logic array blocks), 6.14 Mbits of embedded SRAM (M9K blocks), 210 18x18 multipliers capable of up to 450 MHz DSP performance, 4 PLLs, 20 global clock networks, and up to 210 user I/O pins. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability. Power consumption is optimized for cost-sensitive high-volume applications through 1.0 V core operation and selectable I/O bank voltages. Architecturally, Cyclone III LS uses a 65 nm low-power CMOS process with a programmable interconnect fabric driven by SRAM configuration cells. The 'LS' suffix adds a tamper-resistant configuration subsystem including 256-bit AES encryption, a non-volatile security key, and a hardware JTAG block that can lock the device against readback. This makes the EP3CLS150F484I7N suitable for designs where IP protection is a contractual or regulatory requirement. Typical applications include industrial Ethernet switches, motor-control servo drives, video surveillance DVR back-ends, software-defined radio modems, low-cost ASIC prototyping, and PCI Express endpoint bridges. The 484-ball FBGA package supports moderate-density board layouts and reflow soldering at standard JEDEC J-STD-020 profiles. When designing with this device, allocate at least 4 configuration pins (nCONFIG, nSTATUS, CONFIG_DONE, DCLK or AS data lines) and respect the differential clock input pair placement rules. Quartus II (or newer Intel Quartus Prime) software is required for synthesis, place-and-route, and bitstream generation. The 'I7' speed grade and 'N' lead-free suffix indicate an industrial-temperature, lead-free / RoHS-compliant device. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP3CLS150F780C7 - 150K LE Cyclone III LS FPGA, 780-FBGA | Intel
EP3CLS150F780C7

EP3CLS150F780C7 - 150K LE Cyclone III LS FPGA, 780-FBGA | Intel

The Intel / Altera EP3CLS150F780C7 is a low-power Cyclone® III LS Field Programmable Gate Array delivering 150,848 logic elements, 6,137,856 bits of embedded memory, and 413 user I/O pins in a 780-ball FineLine BGA package (29x29 mm, 1 mm pitch). It is fabricated on TSMC's 65 nm low-power process and targets cost- and power-sensitive applications where deterministic logic density and DSP performance are required. An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory blocks, DSP blocks, and hard I/O peripherals. FPGAs occupy a distinct tier above microcontrollers (fixed hardware, firmware-defined) and below ASICs (fully custom silicon): they offer hardware-level parallelism, in-system reconfigurability, and time-to-market advantages over fixed-function ICs, at lower per-unit cost and faster turnaround than full ASIC development. The Cyclone III LS family extends this lineage with a low-static-power variant of Cyclone III, suitable for thermally constrained embedded, industrial, and battery-powered systems. Key features of the EP3CLS150F780C7 include 150,848 logic elements, 6,137,856 bits (748 Kbit) of embedded SRAM organized in M9K blocks, up to 413 user I/O pins with support for LVDS, LVTTL, SSTL, HSTL, and other single-ended/differential I/O standards, an integrated PLL count of four for clock management, and 1.2 V core operation with multi-rail support for I/O banks. The 780-FBGA package offers a 1 mm ball pitch and 29x29 mm footprint suitable for mid-complexity PCB designs. The Cyclone III LS architecture combines a logic element array, M9K memory blocks, 18x18 hardware multipliers (DSP blocks), and PLLs to deliver DSP throughput up to 142 GMACS. Static power is reduced versus the standard Cyclone III family through process tuning, while dynamic power benefits from Quartus II power optimization features. Typical applications include industrial machine vision, motor control and drives, video surveillance and image processing, software-defined radio front-ends, low-cost ASIC prototyping, and automotive driver-assistance prototypes. The wide temperature support and low-power design extend its use to outdoor and energy-constrained embedded platforms. When designing with this device, allocate sufficient PCB area for the 29x29 mm BGA and ensure the BGA fanout is routed to support 1 mm pitch escape routing. Use the Quartus II design suite for synthesis, place-and-route, and timing closure, and verify signal-integrity margins on high-speed LVDS and DDR2/3 memory interfaces. This page synthesizes distributor pricing, drop-in alternatives from the Cyclone III/III LS family, and practical design notes for the EP3CLS150F780C7 that go beyond what the manufacturer datasheet alone provides.

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EP3CLS150F780C7N - Cyclone III LS FPGA, 150K LE, FBGA-780 | Intel
EP3CLS150F780C7N

EP3CLS150F780C7N - Cyclone III LS FPGA, 150K LE, FBGA-780 | Intel

The Intel (formerly Altera) EP3CLS150F780C7N is a low-power Cyclone III LS Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package (29x29 mm body, 1.0 mm ball pitch). It integrates 150,848 logic elements (150,848 4-input look-up tables backed by 5,994 Kbits of embedded RAM), giving it a logic density tier typically deployed in mid-volume industrial, video, and motor-control designs where the family balances cost-per-logic against static power. As an FPGA, this device sits at the top of the programmable-logic taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> semiconductor. Cyclone III LS is Intel's low-static-power variant of the Cyclone III family, fabricated on a 65 nm TSMC process with a 1.2 V core supply. Within the broader Cyclone III LS family, the device's 150K-LE density is the highest offered before stepping up to the Cyclone IV E/IV GX generations. Key differentiating specifications include 320 dedicated 18x18 hardware multipliers (suitable for DSP blocks at up to 437.5 MHz), 413 user I/O pins split across multiple I/O banks that support LVDS, LVTTL, LVCMOS, SSTL, and HSTL interfaces, and four phase-locked loops (PLLs) for clock synthesis. External memory interfaces include dedicated hard controllers for DDR2 SDRAM and QDRII+ SRAM, enabling direct attachment without soft logic overhead. Architecturally, the device combines Logic Array Blocks (LABs) of 16 LEs each, M9K embedded RAM blocks (total 5,994 Kbits), and 18x18 multiplier blocks feeding a rich interconnect fabric. The -7 speed grade (C7 in the part number) positions this part for moderate-speed commercial designs; faster -8 and industrial -I7 grades also exist within the same package. Typical applications include industrial motor control, video processing pipelines (bridges, scalers, format converters), low-cost software-defined radio front-ends, factory automation controllers, and PCIe endpoint bridging. The combination of 320 multipliers and 5,994 Kbits of RAM makes it well-suited for parallel DSP workloads at a price point below mid-range FPGAs. When designing with this device, allocate at least four PCB layers for the 780-ball FBGA and follow Intel's recommended decoupling scheme (100 nF + 10 µF per VCC group). Programming is via JTAG or the Active Serial (AS) configuration port using industry-standard EPCS serial configuration devices. This page synthesizes distributor pricing, drop-in package-equivalent alternatives within the Cyclone III LS family, and practical design notes not found in the manufacturer datasheet alone.

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EP3CLS150F780C8 - Cyclone III LS FPGA 150K LE BGA-780 | Intel
EP3CLS150F780C8

EP3CLS150F780C8 - Cyclone III LS FPGA 150K LE BGA-780 | Intel

The Intel (Altera) EP3CLS150F780C8 is a Cyclone III LS family Field-Programmable Gate Array (FPGA) featuring 150,848 logic elements, 6,137,856 memory bits, and 413 user I/O pins housed in a 780-ball FineLine BGA package measuring 29 x 29 mm with 1 mm pitch. It is fabricated on a low-power 65 nm process and operates from a core supply of 1.2 V, supporting a maximum internal frequency of up to 402 MHz with commercial temperature grade 0 to 85 degrees C. A Cyclone III FPGA is a low-cost, low-power SRAM-based programmable logic device that combines configurable logic, embedded memory blocks, and high-speed I/O in a single chip. FPGAs sit in the programmable logic hierarchy alongside CPLDs, and are commonly deployed where parallel processing, custom interfaces, or hardware-accelerated signal paths are required. The Cyclone III LS sub-family specifically adds enhanced security and signal-integrity features for communications, industrial control, and military applications. Key specifications include 9,428 Logic Array Blocks (LABs), 4 embedded PLL blocks, dedicated multiplier blocks for DSP acceleration, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 780-pin FBGA package provides ample routing density for high-pin-count memory buses and parallel interfaces. The LS suffix indicates low-static-power variant targeting power-sensitive designs. Architecturally, the EP3CLS150F780C8 uses a Look-Up Table (LUT) based fabric with embedded M9K memory blocks (each 9 Kbit) totaling approximately 6.14 Mbit of on-chip RAM. The device supports configuration via JTAG, passive serial, active serial, and fast passive parallel modes. Hardware multipliers are organized into DSP blocks enabling efficient FIR filters and FFT engines for signal processing pipelines. Typical applications include industrial motor control, video processing bridges, software-defined radio front-ends, telecom line cards, test-and-measurement instrumentation, and embedded vision systems. The large logic capacity and rich I/O mix make it suitable for custom peripheral aggregation in factory automation. The device is also widely used in education and prototyping where a generous logic budget is required at low unit cost. When designing with this FPGA, plan for a 3.3 V auxiliary supply for I/O banks and a clean 1.2 V core rail; decoupling requires bulk plus 0.1 uF high-frequency capacitors near each supply ball. For signal integrity on the 780-ball FBGA, use microvia or via-in-pad PCB technology to break out all 780 connections. This page synthesizes distributor pricing, drop-in Cyclone III LS variants, and practical board-level design notes that complement the manufacturer datasheet and existing XAIPART resource pages.

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