EP3CLS150F484I7 - Cyclone III 150K LE FPGA | Intel | 484-FBGA
부품 번호: EP3CLS150F484I7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $158.5 | $158.50 |
| 10 | $142.65 | $1,426.50 |
| 100 | $126.8 | $12,680.00 |
| 500 | $113.95 | $56,975.00 |
| 1,000 | $101.1 | $101,100.00 |
EP3CLS150F484I7 개요
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, programmable interconnects, and embedded resources such as memory blocks, multipliers, and high-speed transceivers. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, but offer substantially higher logic density, parallel processing, and DSP capability, making them the workhorse of custom digital hardware design. The Cyclone III family specifically targets low-power, high-volume applications with logic densities from 5K to 200K logic elements.
Key features of the EP3CLS150F484I7 include 150,000 logic elements (LEs), 6,480 Kbits of embedded RAM, 166 DSP blocks (18x18 multipliers), 4 phase-locked loops (PLLs), and 226 maximum user I/O pins. The 'LS' variant adds a robust security feature set including configuration bitstream encryption and JTAG-based read-back protection via on-chip Advanced Encryption Standard (AES) acceleration. The 484-ball FBGA package uses a 1.0 mm ball pitch suitable for multi-layer PCBs with standard assembly tolerances.
Architecturally, the Cyclone III LS device integrates eight I/O banks with programmable drive strength, slew rate, and bus hold. The Logic Array Block (LAB) consists of 16 Logic Elements, each containing a 4-input look-up table (LUT), a programmable register, and a carry chain. Embedded Memory blocks (M9K) provide true dual-port operation at up to 315 MHz, and DSP blocks operate at up to 260 MHz for fixed- and floating-point arithmetic.
Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment systems, factory automation controllers, portable medical instrumentation, and communications infrastructure. The wide I/O count and large memory bandwidth also make this device suitable for video bridging and protocol conversion. The 'LS' security features particularly suit applications where bitstream IP protection is critical, such as military, aerospace, and licensed commercial products.
When designing with this device, verify that the Quartus II design tool supports the EP3CLS150F484I7 device variant. Power supply decoupling requires multiple bulk and high-frequency capacitors placed close to the device's VCCINT, VCCA, and VCCIO supply pins. Thermal management must account for the industrial -40C to +85C operating range, with adequate PCB copper and airflow to dissipate junction heat at high toggle rates.
This page synthesizes Cyclone III LS datasheet parameters, drop-in alternative FPGA candidates, and practical board-level design notes not found in the manufacturer datasheet alone - including same-package F484 ball-map compatibility checks and recommended companion configuration memory.
드롭인 대체품: EP3CLS150F484I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3CLS150F484I7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Embedded Multipliers (18x18), Logic Elements (LE).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3CLS150F484C8N
✅ 드롭인✓ 재고 있음
$115.2 / 개
데이터시트 보기 →EP3CLS150F484C8
✅ 드롭인✓ 재고 있음
$119 / 개
데이터시트 보기 →EP3CLS150F484C7N
✅ 드롭인✓ 재고 있음
$102.75 / 개
데이터시트 보기 →EP3CLS150F484C7
✅ 드롭인✓ 재고 있음
$720 / 개
데이터시트 보기 →EP3C120F484I7
✅ 드롭인✓ 재고 있음
$595.8 / 개
데이터시트 보기 →EP3CLS150F484I7 최대 정격 & 전기적 특성
| Family | Cyclone III LS |
| Logic Elements | 150,000 |
| Embedded Memory | 6,480 Kbits |
| DSP Blocks | 166 (18x18 multipliers) |
| PLLs | 4 |
| Maximum User I/O | 226 |
| 패키지 | 484-ball FBGA (F484) |
| Ball Pitch | 1.0 mm |
| 동작 온도 | -40C to +85C (Industrial) |
| Process Technology | 60 nm low-power CMOS |
| Supply Voltage (VCCINT) | 1.2 V |
| Configuration | AES-encrypted bitstream support (LS feature) |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant |
| Security Feature | On-chip AES bitstream encryption |
| Programming Interface | JTAG / Active Serial / Passive Serial |
EP3CLS150F484I7 484-ball fbga (f484) 핀 구성 가이드
EP3CLS150F484I7(484-ball fbga (f484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3CLS150F484I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3CLS150F484I7 적합 용도: 7 애플리케이션s: Industrial Motor Control, Video Surveillance / Image Processing, Automotive Infotainment, Factory Automation Controllers, Portable Medical Instrumentation, Communications Protocol Bridging, Test & Measurement Instrumentation.
Industrial Motor Control
The EP3CLS150F484I7 suits industrial motor control systems where multiple axes of field-oriented control (FOC) must run in parallel. The 166 DSP blocks deliver up to 260 MHz 18x18 multiplies per block, enabling real-time Park/Clarke transforms and PID loops at 50 us cycle times for 4 to 6 axes. With 226 user I/Os the device accepts encoder feedback (QEP, SSI, EnDat) and drives PWM outputs directly to gate drivers without external logic. The AES bitstream encryption protects proprietary control firmware from reverse engineering - critical when competitors could otherwise clone IP. Industrial temperature grade (-40C to +85C) and the FBGA package's compact footprint simplify integration into sealed drives and inverter cabinets.
추천
Video Surveillance / Image Processing
The EP3CLS150F484I7 fits video surveillance and image processing pipelines that require real-time pixel processing at HD resolutions. Its 6,480 Kbits of embedded M9K memory supports line buffers for 1920x1080 60 fps video (approx. 4.9 Mbits per frame buffer), and 166 DSP blocks enable 2D convolution, Sobel edge detection, and motion estimation within the FPGA fabric without external DSP chips. The 226 user I/Os accept MIPI CSI-2 or parallel RGB input from image sensors and output to HDMI or LVDS displays. AES bitstream protection safeguards proprietary video analytics IP. The industrial temperature range allows deployment in outdoor PoE camera enclosures.
추천
Automotive Infotainment
Although the EP3CLS150F484I7 is not AEC-Q100 qualified, it is widely used in non-safety-critical automotive infotainment subsystems where the -40C to +85C industrial temperature grade covers cabin environments. The 150K logic elements and 226 I/Os drive multi-display head units combining a digital instrument cluster, central infotainment touchscreen, and rear-seat entertainment displays. The DSP blocks accelerate audio decoding (MP3, AAC, FLAC) and the M9K memory blocks store graphic frame buffers. AES encryption protects the infotainment boot image and licensed UI assets. For safety-critical ADAS or instrument-cluster designs, migrate to AEC-Q100 qualified Cyclone IV or Cyclone V devices.
추천
Factory Automation Controllers
The EP3CLS150F484I7 enables programmable logic controllers (PLCs) and distributed I/O modules in factory automation systems. Its 226 I/Os accept digital inputs from sensors, contactors, and limit switches, and drive transistor outputs to solenoids, relays, and motor starters. The 4 PLLs synthesize independent clocks for PROFIBUS, PROFINET, EtherCAT, or Ethernet/IP industrial communication stacks running in the FPGA fabric. The 150K logic elements implement soft-core CPUs (Nios II) and protocol stacks without external ASICs. AES bitstream encryption protects factory floor IP from industrial espionage. The FBGA package is well-suited to sealed IP67 enclosures where vibration resistance is required.
추천
Portable Medical Instrumentation
The EP3CLS150F484I7 fits portable patient monitoring devices such as pulse oximeters, ECG Holter recorders, and ultrasound front-end boards where low-power operation and DSP performance are both required. The 60 nm low-power Cyclone III process consumes roughly 0.5 W at moderate toggle rates, enabling battery-powered operation. The 166 DSP blocks implement digital filtering (FIR, IIR) for bio-signal conditioning in real time. The 6,480 Kbits of M9K memory buffers waveform samples between processing and wireless transmission (BLE, Wi-Fi). The AES bitstream encryption protects patient data algorithm IP. The industrial temperature range supports both clinical and field-use environments.
추천
Communications Protocol Bridging
The EP3CLS150F484I7 excels at communications protocol bridging between legacy and modern interfaces - common in industrial gateway and telecom line-card designs. The 4 PLLs provide independent clock domains for SPI, I2C, UART, PCIe Gen1, SGMII, and SRIO interfaces simultaneously, while the 150K logic elements implement soft PHYs and MAC layers. The 6,480 Kbits of embedded memory buffers packet payloads during rate adaptation. The 226 user I/Os accept multiple parallel LVCMOS or LVDS buses. AES bitstream encryption protects routing protocol implementations. Industrial temperature range ensures deployment in outdoor telecom cabinets and industrial control rooms.
추천
Test & Measurement Instrumentation
The EP3CLS150F484I7 powers benchtop test and measurement instruments such as arbitrary waveform generators, logic analyzers, and protocol exercisers. The 226 user I/Os connect to test pin electronics at up to 200+ MHz LVDS, while the 166 DSP blocks implement real-time DSP (FFT, windowing, correlation) on captured waveforms. The 6,480 Kbits of embedded memory stores deep acquisition buffers (millions of samples). The 4 PLLs synthesize independent sampling clocks for multi-channel ATE systems. AES bitstream protection safeguards proprietary test IP. The industrial temperature range supports laboratory and production-floor environments with consistent timing margins across temperature.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3CLS150F484I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3CLS150F484C8N | EP3CLS150F484C8 | EP3CLS150F484C7N | EP3CLS150F484C7 | EP3C120F484I7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Logic Elements | 150,000 | 150,000 | 150,000 | 150,000 | 150,000 | 120,000 (-20%) |
| Embedded Memory | 6,480 Kbits | 6,480 Kbits | 6,480 Kbits | 6,480 Kbits | 6,480 Kbits | 3,888 Kbits |
| DSP Blocks | 166 | 166 | 166 | 166 | 166 | 244 |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) |
| Security (AES Encryption) | Yes (LS family) | Yes (LS family) | Yes (LS family) | Yes (LS family) | Yes (LS family) | No (Cyclone III, not LS) |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- AES bitstream encryption with on-chip decryption engine (vs EP3C120F484I7)
- Higher logic density in same F484 footprint (vs EP3C120F484I7)
- Industrial temperature range coverage (vs EP3CLS150F484C8N)
- Higher memory density than lower-tier Cyclone III LS parts (vs EP3CLS100F484I7)
설계 노트
The EP3CLS150F484I7 requires multiple separate power rails: VCCINT (1.2 V for core logic), VCCA (2.5 V for PLLs and analog), VCCIO (1.2 V to 3.3 V per I/O bank), and VCCPD (3.3 V for pre-drivers). Each rail needs at least one 10 uF bulk ceramic plus four 0.1 uF high-frequency decoupling capacitors placed within 5 mm of the respective supply pins. Estimated core current draw at 50% toggle rate is approximately 800 mA; verify with the Early Power Estimator (EPE) tool before finalizing the power tree.
At maximum junction temperature of 100C and ambient of +85C, allowable junction rise is only 15C. The F484 FBGA package has a typical theta_JA of approximately 11 C/W with adequate PCB thermal via array (at least 9 thermal vias under the central die area connected to internal ground planes). For designs at high toggle rates exceeding 60% across all 150K LEs, attach a small heatsink or use forced airflow to keep junction temperature within margins.
The 484-ball FBGA package with 1.0 mm pitch requires a 4-layer or 6-layer PCB with micro-via or via-in-pad technology for signal breakout. Use 0.5 oz copper on outer layers and 1 oz on inner power/ground planes. Escape routing on the top layer should fan out to 0.1 inch (2.54 mm) pitch headers. Match all differential pair traces to within 5 mil length mismatch for LVDS signals to preserve signal integrity at >500 MHz toggle rates.
Do not confuse EP3CLS150F484I7 (Cyclone III LS, with AES security) with EP3C120F484I7 (Cyclone III standard, no security) or with the automotive EP3CLS150F484I7N-A variant. Also note that 'I7' and 'C7' indicate industrial and commercial temperature grades respectively - using a commercial-grade part outside 0C to +85C causes timing failure. Configuration memory selection matters: use EPCS64 (64 Mbit) or larger for designs approaching the full 150K-LE capacity, otherwise bitstream overflow corrupts configuration.
For high-speed LVDS or LVTTL interfaces running above 200 MHz, place series termination resistors (22 to 33 ohm) within 3 mm of the FPGA output pin to dampen reflections. Use the FPGA's programmable drive strength and slew rate control to fine-tune edge rates; slower slew rates reduce EMI at the cost of setup/hold margin. The Cyclone III device handbook section on high-speed I/O provides specific termination and layout guidelines per I/O standard.
규정 준수 정보
RoHS compliant per Intel material declarations. Not AEC-Q100 qualified - use automotive-grade Cyclone IV or Cyclone V devices for safety-critical automotive applications. Industrial temperature grade -40C to +85C.