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EP3CLS70F484I7N - Cyclone III LS FPGA, 70K LEs, 484-FBGA | Intel
EP3CLS70F484I7N

EP3CLS70F484I7N - Cyclone III LS FPGA, 70K LEs, 484-FBGA | Intel

The Intel (formerly Altera) EP3CLS70F484I7N is a Cyclone III LS family low-power Field-Programmable Gate Array (FPGA) featuring 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 user I/Os in a 484-ball FineLine BGA package. It is built on a 65 nm low-power process, operates from a 1.2 V core supply, and supports industrial-grade temperatures (-40C to +100C junction). The 'LS' suffix indicates low static power and additional security features compared to standard Cyclone III devices, making it suitable for power- and security-sensitive applications. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor that lets engineers implement arbitrary digital logic, memory blocks, DSP blocks, and high-speed I/O after manufacturing. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism, reconfigurability, and rapid prototyping without NRE costs. Cyclone III LS devices sit in the low-power, cost-optimized segment of Intel's FPGA portfolio and are commonly used as glue logic, co-processors, or primary control engines in industrial systems. Key features include up to 274 embedded 18x18 multipliers for DSP, dedicated high-speed LVDS I/O up to 875 Mbps, 4 PLLs per device, and support for external memory interfaces including DDR2/DDR3/QDRII+. The device supports JTAG (IEEE 1149.1) and passive/active serial configuration modes. The 484-FBGA package uses Intel's lead-free FineLine BGA footprint with a 1.0 mm ball pitch. Architecturally, the Cyclone III LS family combines low static power (~50 mW typical quiescent) with enhanced design security including configuration bitstream AES-128/256 encryption and JTAG access protection. This makes the device attractive for equipment manufacturers who need to protect IP and prevent cloning without paying for a higher-cost Cyclone IV or Cyclone V device. Typical applications include industrial motor control and PLCs, video surveillance image processing, factory automation bridges (PROFINET/EtherCAT/MODBUS), medical imaging front-ends, and avionics/ground-vehicle digital signal processing subsystems. The wide industrial operating range also suits outdoor telecom line cards and rail-signalling controller boards. When designing with this FPGA, plan the power tree to provide 1.2 V core, 2.5 V/3.3 V I/O, and a separate PLL analog supply. Use Intel Quartus II (legacy) or Quartus Prime design software for synthesis, place-and-route, and timing closure. Decoupling follows a 0402/0603 ceramic array under the BGA with at least one 100 uF bulk cap per rail. This page synthesizes distributor pricing, same-package drop-in alternatives from Intel's Cyclone III/III LS family, and practical design notes not found in any single manufacturer datasheet.

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EP3CLS70F780C7 - Cyclone III LS FPGA, 70K LE, 780-FBGA | Intel
EP3CLS70F780C7

EP3CLS70F780C7 - Cyclone III LS FPGA, 70K LE, 780-FBGA | Intel

The Intel (Altera) EP3CLS70F780C7 is a low-power Cyclone III LS field-programmable gate array (FPGA) with 70,208 logic elements, 3,068,928 bits of embedded memory, and 413 user I/O pins, housed in a 780-ball fine-pitch BGA package. The device is fabricated on a 65 nm process and is rated for an internal core voltage of 1.2 V with a junction operating range that supports commercial-grade thermal envelopes. The suffix "C7" denotes the commercial speed grade 7 timing bin, balancing logic performance with the lowest static and dynamic power consumption of the Cyclone III LS family. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and (in Cyclone III LS) on-chip security features. FPGAs occupy the programmable logic tier in the digital design hierarchy between fixed-function ASICs and software-driven microcontrollers, giving engineers post-silicon re-programmability for parallel processing, custom interfacing, and hardware acceleration. The Cyclone III LS family specifically targets low-power, security-sensitive applications with bitstream encryption and JTAG protection. Key features of the EP3CLS70F780C7 include up to 70,208 logic elements, 3,068,928 bits of embedded RAM (approximately 303 Kbit of M9K block memory equivalents), embedded 18 x 18 multipliers for DSP operations, and dedicated PLL and clock-management resources. The 780-FBGA package exposes 413 user I/O pins supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards with on-die termination. The LS variant adds advanced security features including configuration bitstream AES-256 encryption, JTAG tamper protection, and a robust volatile key storage block for IP protection. Architecturally, the device combines an LUT-based logic fabric with hard memory blocks, hard multiplier blocks, and high-speed transceiver-free general-purpose I/O. The 65 nm process and the low-static-power option deliver a meaningful quiescent current reduction versus the standard Cyclone III family, which is critical in thermally constrained or fan-less embedded systems. The 780-ball FBGA also provides generous signal escape routing for high-speed parallel buses and memory interfaces such as DDR2/DDR3. Typical applications include industrial motor control, factory automation I/O expansion, low-power portable test and measurement equipment, secure communications front-ends, video bridging and image preprocessing pipelines, and ASIC prototyping. The Cyclone III LS security features are particularly well suited to medical devices and defense systems where bitstream confidentiality is mandatory. When designing with this device, ensure the Quartus II design tool (13.0 or earlier) is used for synthesis and fitting, since later Quartus releases have deprecated Cyclone III LS support. Pay careful attention to decoupling (100 nF plus 10 uF per VCCINT/VCCIO rail) and thermal relief on the FBGA substrate for reliable operation above 85 C ambient.

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EP3CLS70F780C7N - 70K LE Cyclone III LS FPGA, 780-BGA | Intel
EP3CLS70F780C7N

EP3CLS70F780C7N - 70K LE Cyclone III LS FPGA, 780-BGA | Intel

The Intel (formerly Altera) EP3CLS70F780C7N is a low-power Cyclone III LS Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package with 413 user I/O. Built on a 60-nm process, the device integrates 70,208 logic elements (47,452 logic arrays), 3,068,928 bits of embedded memory (M9K blocks), and 200 embedded 18x18 multipliers in a single low-static-power fabric that is fully supported by the Quartus II design suite. A Field Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, and block RAM that can be rewired in the field to implement arbitrary logic functions. Cyclone III LS parts sit inside the broader Intel FPGA portfolio (FPGA -> programmable logic -> logic IC -> semiconductor). Designers choose FPGAs over ASICs for low-volume designs, rapid prototyping, and designs requiring hardware reconfigurability after deployment. Headline specs include 70,208 logic elements, 4 transceivers (none - this is a logic-only family), 200 18x18 multipliers, 3,068,928 bits of RAM, and 413 user I/O pins. The "LS" suffix denotes the low-static-power variant with enhanced security features (including bit-stream encryption and anti-tamper support) tuned for industrial, communications, and consumer applications. Maximum user I/O is 413; differential I/O and LVDS signaling are supported through dedicated hardware. The Cyclone III LS architecture pairs a programmable logic fabric with on-chip RAM, DSP blocks, PLLs, and external memory interfaces. It supports DDR/DDR2/DDR3 SDRAM and QDRII+ SRAM via dedicated PHY blocks. The 60-nm process and 1.2 V core voltage give it a favorable power profile for fan-less embedded designs, while the 780-BGA package provides enough ball-out density to break out 413 user I/O plus configuration, clock, and power pins. Typical applications include industrial motor control and factory automation, video processing and display controllers, software-defined radio front-ends, medical imaging signal chains, automotive infotainment prototypes, and consumer audio/video processing. The combination of low static power, large logic capacity, and abundant DSP blocks makes it a strong fit for DSP-heavy signal-processing tasks where deterministic real-time performance is required. A key design consideration is that the 780-BGA package requires multilayer PCB design with via-in-pad or dog-bone fan-out, controlled-impedance routing for high-speed transceivers/PLL clocks, and 6-4 layer stack-ups with continuous reference planes. Designers should follow Altera's AN 484 (Signal Tap) and AN 465 (DDR layout) guidelines and verify thermal performance - although Cyclone III LS is low power, large logic utilization can still drive junction temperature close to the 125 C Tj max in enclosed enclosures. This page synthesizes distributor pricing, 780-BGA pin-compatible alternatives from the same Cyclone III LS family, and practical board-design notes that go beyond the Cyclone III Device Handbook by adding curated cross-references and PCB-layout trade-offs.

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EP3CLS70F780C8 - Cyclone III LS FPGA 70K LE 780-FBGA | Intel
EP3CLS70F780C8

EP3CLS70F780C8 - Cyclone III LS FPGA 70K LE 780-FBGA | Intel

The Intel EP3CLS70F780C8 is a Cyclone III LS family field-programmable gate array (FPGA) delivering 70,208 logic elements, 3,068,928 bits of embedded memory, and 413 maximum user I/O pins in a 780-ball FineLine BGA package. Built on a low-power 65 nm TSMC process, the device operates from a 1.2 V core supply, supports commercial junction temperatures (0 °C to +85 °C), and is rated for speeds up to 402 MHz internal operation. The 'LS' sub-family adds dedicated security features including AES bitstream encryption, JTAG tamper protection, and a Cyclone III LS Device Data Sheet as its primary technical reference. A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory, multipliers, and I/O elements that the user can re-program after manufacture to implement arbitrary digital functions. Cyclone III LS belongs to the broader taxonomy of programmable logic devices (PLD) within the power management and digital logic family of semiconductors. The Cyclone III LS architecture is optimized for low static and dynamic power, making it well suited to industrial, automotive driver assistance, video processing, and communications infrastructure designs that demand hundreds of thousands of logic gates plus hardware DSP throughput. Key features include 70,208 logic elements (LEs), 4 Mbit embedded SRAM organized as 305 memory blocks of 9 Kbit each, up to 244 embedded 18x18 multipliers for DSP, four general-purpose PLLs, and 413 user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The 780-pin FineLine BGA package exposes the full I/O count plus eight transceiver clock inputs, dedicated configuration and JTAG pins, and dual-purpose configuration pins. Internal long-line and row/column routing interconnect supports predictable timing closure at speeds up to 402 MHz. The Cyclone III LS architecture combines an FPGA fabric, embedded memory, embedded multiplier blocks, and I/O elements in a unified low-power silicon process. Compared to the base Cyclone III family, the LS variant adds the security engine, hardware AES decryption, and JTAG tamper detection without changing the core logic or I/O structure. This makes the LS family a power- and security-aware extension of Cyclone III for designs that require both low static power and tamper-resistant bitstream handling. Typical applications for the EP3CLS70F780C8 include industrial motor control, video surveillance and image processing pipelines, automotive driver-assistance front cameras, software-defined radio front-ends, telecommunications line cards, and medical imaging pre-processing. The combination of low cost per logic element and a security-hardened bitstream makes it appropriate for connected industrial equipment and edge-compute appliances where both power budget and IP protection matter. When designing with this device, pay close attention to the FPGA bank supply and reference-voltage sequencing required for the 780-ball FineLine BGA. Quartus II or the Intel Quartus Prime design software is required for place-and-route, timing closure, and bitstream generation. For tamper-protected deployments, enable the AES-128/256 bitstream encryption and JTAG-disable features early in the design phase so the configuration pins are constrained correctly. This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III LS family, and practical design notes that complement the Cyclone III LS Device Data Sheet. Information is current as of 2026-09-09.

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EP3CLS70F780C8N - 70,208-Low-Power FPGA | Altera | Digital Logic
EP3CLS70F780C8N

EP3CLS70F780C8N - 70,208-Low-Power FPGA | Altera | Digital Logic

Altera EP3CLS70F780C8N is a Cyclone III LS field-programmable gate array with 70,208 logic cells, 413 user I/O, and a 780-ball FBGA package. The verified product data describes a 1.2 V supply device manufactured using 65 nm process technology, with a reported maximum operating frequency of 402 MHz. It combines programmable logic capacity, a substantial I/O interface, and a fine-pitch ball-grid-array footprint for compact digital systems. Engineers can evaluate this FPGA for control, communications, industrial, and embedded processing functions where configurable hardware parallelism is useful. A field-programmable gate array, or FPGA, is a semiconductor device containing programmable logic elements, routing resources, memory blocks, and configurable I/O. The device is programmed after assembly to implement digital functions, state machines, interfaces, datapaths, and control logic. Within the semiconductor hierarchy, an FPGA belongs to programmable logic, which also includes complex programmable logic devices. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured for different designs while using the same physical component. The headline resources of EP3CLS70F780C8N are its 70,208 cells, 413 I/O, and 780-ball FBGA package. The package supports high pin density and is suitable for multilayer PCBs that require controlled escape routing. A 1.2 V supply and 65 nm technology place the component in a low-power FPGA family. The reported 402 MHz value is a useful timing benchmark, but system performance depends on the selected configuration, routing, constraints, I/O standards, power rails, and operating conditions. Cyclone III LS devices use configurable logic and routing resources whose programmed connections are established by the design bitstream. The device can implement parallel processing, custom peripheral interfaces, protocol bridges, and control algorithms. Because the verified sources do not expose the complete architecture, memory count, transceiver count, or detailed electrical limits, those parameters remain marked as unavailable rather than inferred from the family name. Typical applications include industrial automation controllers, communications equipment, test and measurement platforms, and embedded systems. The 70,208-cell capacity supports moderate digital designs, while 413 I/O can accommodate multiple buses, sensors, converters, or external memory interfaces. The 780-ball FBGA package is appropriate for production boards with controlled-impedance routing, appropriate via-in-pad or fan-out strategies, and careful power-distribution analysis. A key design consideration is PCB implementation. Engineers should use the official package pinout, signal-integrity rules, decoupling guidance, and FPGA configuration documentation before layout. The 1.2 V rail, clock distribution, configuration signals, and high-speed I/O require disciplined placement and return-path continuity. The reported 402 MHz maximum should not be treated as a guaranteed design frequency without static timing analysis. This data sheet synthesizes verified distributor specifications, package identity, current availability evidence, pricing indicators, and engineering application guidance. It is designed to make the part easy to compare with other FPGA and CPLD devices while keeping unverified electrical and lifecycle details explicit.

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EP3CLS70F780I7 - Cyclone III LS 70K LEs FPGA 780-FBGA | Intel
EP3CLS70F780I7

EP3CLS70F780I7 - Cyclone III LS 70K LEs FPGA 780-FBGA | Intel

The Intel (formerly Altera) EP3CLS70F780I7 is a low-power Cyclone III LS Field-Programmable Gate Array (FPGA) with 70,208 logic elements, 3,068,928 bits of embedded memory, and 413 multipliers (18x18), housed in a 780-ball FineLine BGA (FBGA) package with 1.0 mm ball pitch. It belongs to the Cyclone III LS family, which is engineered to deliver Cyclone III power efficiency with enhanced security, error correction, and reliability features for industrial and communications applications. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as multipliers and memory. FPGAs occupy a tier above general-purpose microcontrollers in the embedded-compute hierarchy: they offer ASIC-class parallelism and deterministic timing while remaining fully reprogrammable, which makes them the device of choice for high-throughput digital signal processing, custom interface bridging, and hardware-acceleration offload. The Cyclone III LS family specifically targets cost- and power-sensitive designs that require hardware DSP, on-chip RAM, and transceivers or external PHY interfacing, ranking below the more expensive Cyclone IV/V/10 FPGAs in both logic density and transceiver count. Key features of the EP3CLS70F780I7 include 4 PLLs, 20 global clock networks, 429 maximum user I/Os, dedicated 18x18 hardware multipliers for DSP, and built-in support for DDR/DDR2/QDRII external memory interfaces. The 'I' suffix denotes the Industrial temperature grade (-40C to +100C case), and the '7' speed grade reflects moderate performance within the family. The device operates from a 1.15 V to 1.25 V core supply, with separate VCCPD and VCCIO banks for I/O voltage flexibility (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 V LVCMOS/LVTTL). Architecturally, the Cyclone III LS is fabricated on a 60 nm TSMC low-power process and adds Cyclone III LS-specific blocks such as a configuration bitstream security engine (AES-128/256), CRC and parity protection on internal RAM, and on-chip temperature-sensing diodes. This security/reliability layer differentiates LS from the standard Cyclone III family and is the reason LS parts are commonly specified in industrial-control, military, and aerospace-defense subsystems where bitstream IP protection is required. Typical applications include industrial motor control and factory-automation backplanes, telecom baseband and protocol-bridging designs, video processing pipelines (surveillance, broadcast), portable test and measurement equipment, and low-cost software-defined radio (SDR) front-ends. The wide temperature range also makes it suitable for outdoor telecommunications gear and automotive infotainment prototyping. When designing with the EP3CLS70F780I7, plan the power-distribution network around multiple decoupling capacitor values (typically 0.1 uF, 0.01 uF, and bulk) placed under the BGA footprint to suppress simultaneous switching noise (SSN) on the 429 I/O. The FBGA-780 package requires X-ray inspection or proper BGA rework equipment; JTAG-based programming via the Altera/Intel Quartus II toolchain (Cyclone III device family support) is the standard configuration flow. This page synthesizes distributor pricing for 780-FBGA variants, same-family drop-in alternatives (different speed grades and package options) sourced from the Site MPN list, and practical PCB-layout and configuration notes not found in the manufacturer datasheet alone.

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EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N

EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems

Intel EP3CLS70F780I7N is a Cyclone III LS field-programmable gate array with 70,208 logic elements, 3,068,928 bits of embedded memory, and 413 maximum user I/O pins, supplied in a 780-ball BGA package. The verified source data also identifies a 1.2 V supply voltage and industrial temperature grading. Its combination of programmable logic, substantial embedded memory, and a high-pin-count package makes it suitable for embedded control, communications, image processing, and digital signal-processing systems. A field-programmable gate array, or FPGA, is an integrated circuit containing configurable logic blocks, programmable interconnects, input/output resources, and often dedicated memory or interface circuitry. Engineers configure these hardware resources after PCB assembly to implement custom digital functions. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices and is positioned between fixed-function application-specific integrated circuits and software-driven processors because it combines hardware parallelism with design-time reconfiguration. The principal verified resource figures are 70,208 logic elements and 3,068,928 bits of embedded memory. The device provides 413 maximum user I/O pins according to the distributor specification. Its 780-ball BGA package supports dense board-level routing, while the 1.2 V supply indication helps define the core power architecture. The I7 ordering code corresponds to industrial grading, as independently identified in the supplied distributor data. Cyclone III LS devices are intended for configurable digital implementations in which parallel processing, interface aggregation, and deterministic hardware operation are important. Unlike a processor that executes sequentially, an FPGA can instantiate many parallel datapaths and state machines. Embedded memory can support FIFOs, lookup tables, packet buffers, image-line storage, and other localized data structures without consuming all general-purpose logic elements. Typical applications include industrial control, communications equipment, video and image processing, test and measurement, machine-vision controllers, and embedded digital signal processing. For machine vision, the FPGA can combine sensor acquisition, pixel processing, buffering, and host-interface logic. In communications, it can implement protocol conversion, framing, filtering, and timing functions while the 413-I/O capacity supports multiple external interfaces. Design planning should begin with pin assignment, core-current estimation, configuration circuitry, decoupling, and signal-integrity analysis for the 780-ball BGA. The 3,068,928-bit memory figure should not be interpreted as a fixed contiguous RAM block; usable embedded memory depends on the selected Cyclone III LS architecture, configuration, and memory depth/width choices. The BGA escape routing also requires strict adherence to the manufacturer's PCB design guidance. This product page consolidates verified distributor specifications, industrial-grade identity, package information, commercial availability, and same-brand drop-in alternatives. It is intended to help engineers shortlist the FPGA while recognizing that pinout, timing, power, configuration, and device-family compatibility must be confirmed against the manufacturer documentation before release to production.

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EP3CLS70U484C7 - Cyclone III LS FPGA 70K LE UFBGA-484
EP3CLS70U484C7

EP3CLS70U484C7 - Cyclone III LS FPGA 70K LE UFBGA-484

The Intel (formerly Altera) EP3CLS70U484C7 is a low-power Cyclone III LS family FPGA featuring 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 user I/O pins, housed in a 484-ball Ultra FineLine BGA (UFBGA) package. Built on a 65 nm low-power process, the device operates from a 1.2 V core supply and supports up to 437.5 MHz internal operation, targeting cost-sensitive, power-constrained embedded and industrial designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP blocks, and high-speed transceivers. FPGAs sit in the broader programmable logic device (PLD) hierarchy, alongside CPLDs, and are positioned between fixed-function ASICs and software-driven microcontrollers for applications requiring hardware parallelism, deterministic latency, and post-production flexibility. The Cyclone III LS family specifically optimizes for low static and dynamic power, making it the lowest-power member of the Cyclone III generation. Key features of the EP3CLS70U484C7 include 70,208 logic elements, approximately 3.07 Mbits of embedded RAM, dedicated 18x18 multipliers for DSP, and 4 phase-locked loops (PLLs) for clock management. The 484-ball UFBGA package provides 278 usable user I/Os and a compact 19 mm x 19 mm body, suitable for space-constrained boards. The LS variant adds dedicated security and anti-tamper features, including configuration bitstream encryption and JTAG security, which distinguishes it from the standard Cyclone III family. Technically, the device supports multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, and PCI), on-chip termination (OCT), and hot-socketing capability, allowing live insertion into backplane systems. The 65 nm process, combined with an efficient clock network and low-leakage transistors, reduces total power consumption by up to 50% compared to earlier 90 nm Cyclone II devices. Typical applications include industrial motor control, video processing pipelines, low-cost test and measurement equipment, communications protocol bridging, and portable or battery-powered embedded systems. The anti-tamper features make the LS family particularly attractive for defense, secure communications, and industrial control designs requiring bitstream confidentiality. When designing with this FPGA, ensure adequate power decoupling (typically 100 nF and 10 uF bulk caps per supply rail), follow Intel's recommended PCB layout guidelines for BGA packages, and use the Quartus II design software for synthesis, place-and-route, and configuration bitstream generation. Verify that your chosen configuration mode (AS, PS, JTAG, or FPP) is supported by the U484 device variant. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone, providing engineers with a consolidated reference for sourcing and substitution decisions.

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EP3CLS70U484C7N - 70K LE Cyclone III LS FPGA 484-FBGA | Intel
EP3CLS70U484C7N

EP3CLS70U484C7N - 70K LE Cyclone III LS FPGA 484-FBGA | Intel

The Intel (formerly Altera) EP3CLS70U484C7N is a low-power Cyclone III LS family Field-Programmable Gate Array (FPGA) with 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 maximum user I/O pins, housed in a 484-ball FineLine BGA (U484) package. It is built on a 65 nm CMOS process, operates from a 1.2 V core supply, and is specified for the commercial temperature range with -7 speed grade timing closure. The 'LS' suffix denotes the low-static-power variant, which adds extra SEU mitigation features such as a CRC checker and error-correction capability on internal configuration RAM, making it well suited for safety-critical and long-life industrial designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic functionality is defined by a user-supplied configuration bitstream rather than by hard-wired mask geometry. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), which themselves belong to the digital integrated circuit (IC) and logic semiconductor taxonomy. Compared with ASICs, FPGAs offer rapid prototyping, in-field re-programmability, and lower NRE cost, while delivering deterministic parallel logic execution and reconfigurable I/O. The Cyclone III LS family specifically targets low total power consumption and functional-safety applications such as industrial control, automotive driver assistance, and medical instrumentation. Key features include up to 198 embedded 18x18 multipliers for DSP, dedicated memory blocks (M9K) totaling approximately 2.5 Mbits, four general-purpose PLLs per device, and support for external memory interfaces including DDR, DDR2, and QDRII+ SRAM. The device also integrates a hard PCI Express Gen1 controller (PIPE interface) on selected package options, and supports mainstream serial protocols such as LVDS, SSTL, and HSTL I/O standards. Up to eight global clock networks and 16 dedicated clock pins simplify multi-clock-domain designs. Architecturally, the Cyclone III LS device is composed of Logic Array Blocks (LABs), each containing 16 Logic Elements (LEs). Each LE includes a 4-input LUT, a programmable register, carry-chain logic, and a register chain. Configuration bitstream is loaded through JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes into SRAM-based configuration RAM, which remains volatile and requires a configuration flash on the board. Typical applications include industrial motor control, factory automation PLCs, machine-vision preprocessing, automotive infotainment and telematics, low-cost software-defined radio, and portable medical devices. The combination of low static power and SEU-aware configuration memory also makes the device attractive for avionics subsystems and remote telemetry where bit-flip reliability matters. When designing with this part, plan for at least one EPCS or EPCQ configuration flash and a robust decoupling network around all VCCINT, VCCA, and VCCIO rails. Quartus II (or its successor Quartus Prime) is the supported development environment and is required for synthesis, place-and-route, and timing closure.

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EP3CLS70U484C8 - 70K LE Cyclone III LS FPGA, 484-FBGA | Intel
EP3CLS70U484C8

EP3CLS70U484C8 - 70K LE Cyclone III LS FPGA, 484-FBGA | Intel

The Intel / Altera EP3CLS70U484C8 is a low-power Cyclone III LS family FPGA with 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 user I/Os, fabricated on a 65 nm process and packaged in a 484-ball FineLine BGA (U484, 19 mm x 19 mm). It belongs to the Cyclone III LS sub-family that adds advanced security features such as bitstream AES-128/256 encryption, JTAG tamper detection, and configuration data CRC to the standard Cyclone III architecture. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks (memory, multipliers, PLLs, transceivers) that the designer can re-program at the board level to implement arbitrary digital logic, glue functions, or complete system-on-chip prototypes. FPGAs sit hierarchically under programmable logic devices (PLDs) and above fixed-function ASICs in the digital IC taxonomy, and are widely used to accelerate parallel DSP, custom bus interfaces, and low-volume ASIC replacements. The Cyclone III LS family in particular targets low-static-power applications that also require hardened security. Key features of the EP3CLS70U484C8 include 70,208 logic elements (4-input LUTs), 612 Kbits of embedded RAM (M9K blocks), 244 embedded 18 x 18 multipliers, four general-purpose PLLs, and 278 maximum user I/Os. The core operates from a 1.2 V supply with PLL/IO helper rails per the Intel Cyclone III LS datasheet. Hot-socketing and I/O standards up to LVDS are supported, with each IO bank independently configurable for voltage and standard. The device is built on a 65 nm TSMC low-power CMOS process and uses a configuration architecture based on SRAM cells that load bitstreams from external flash, JTAG, or Altera-enhanced configuration devices. Hard IP includes PLLs, M9K RAM blocks, and 18-bit multipliers - typical of the Cyclone III generation. The Cyclone III LS additions (security and anti-tamper) are implemented in dedicated logic outside the user array and do not consume user-side LE/M9K resources. Typical applications include industrial motor control and encoder interfaces, low-power portable medical instruments, secure communication gateways, video surveillance with on-chip pre-processing, automotive driver-assist prototyping, and avionics/industrial display controllers. The combination of high logic density, embedded multipliers, and security features makes this part well suited to designs that previously required a separate secure co-processor. When designing with the EP3CLS70U484C8, pay close attention to bank voltage grouping and decoupling - Intel recommends a minimum of one 0.1 uF plus one 10 uF per power rail pair. For security, always enable AES encryption on production bitstreams and configure the JTAG tamper-detection feature. Use the Altera / Intel Quartus II (or Quartus Prime Lite) toolchain to fit, place-and-route, and generate programming files. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes beyond the manufacturer datasheet, providing engineers with a single-page decision reference.

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EP3CLS70U484C8N - Cyclone III LS 70K LE FPGA, 484-FBGA | Altera
EP3CLS70U484C8N

EP3CLS70U484C8N - Cyclone III LS 70K LE FPGA, 484-FBGA | Altera

The Altera (now Intel) EP3CLS70U484C8N is a Cyclone III LS family field-programmable gate array (FPGA) built on TSMC's 65 nm low-power process, offering 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 maximum user I/O pins in a 484-ball FineLine BGA (U484) package at commercial speed grade 8. The Cyclone III LS variant adds dedicated security features such as bitstream encryption, JTAG protection, and active serial configuration support for low-cost, low-power designs that require tamper resistance. A field-programmable gate array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and PLLs that the designer programs after manufacture. FPGAs sit above microcontrollers and fixed-function ASICs in flexibility, allowing hardware-level parallelism for signal processing, custom interfaces, and glue logic. Cyclone III LS specifically targets cost-sensitive, power-conscious applications requiring hardware encryption, distinguishing it from the standard Cyclone III family. Key features include 247 DSP blocks (18x18 multipliers) for high-throughput arithmetic, 8 PLLs for flexible clock synthesis, up to 500 MHz internal clock operation, and 1.2 V core supply with on-chip voltage regulation supporting 3.3 V/2.5 V LVCMOS/LVTTL I/O. The device supports LVDS, RSDS, mini-LVDS, LVPECL, and SSTL I/O standards, and offers DDR/DDR2/QDRII external memory interfaces through dedicated PHY. Per-block static power is typically under 100 mW. Typical applications include industrial motor control, video surveillance and image processing, portable medical devices, automotive infotainment and driver assistance (non-safety), low-cost software-defined radio, and consumer electronics requiring custom hardware acceleration. The 65 nm LP process and dedicated security make the EP3CLS70U484C8N particularly suited for IP protection-critical designs. When designing with this part, allocate sufficient PCB layers for power distribution (at least 4 layers recommended), use the Quartus II / Quartus Prime design suite for compilation and configuration bitstream generation, and follow Altera's cyclone III LS hardware reference manual for JTAG and AS configuration. Programming files are generated via Quartus and loaded through JTAG, Active Serial (EPCS), or Passive Serial modes.

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EP3CLS70U484I7 - Cyclone III LS FPGA 70K LEs 484-FBGA | Altera
EP3CLS70U484I7

EP3CLS70U484I7 - Cyclone III LS FPGA 70K LEs 484-FBGA | Altera

The Altera (Intel) EP3CLS70U484I7 is a low-power Cyclone III LS Field Programmable Gate Array (FPGA) with 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 user I/O pins, housed in a 484-ball FineLine BGA (UBGA) package with industrial-grade temperature rating (-40C to +100C). The device integrates 247 embedded 18x18 multipliers and supports up to 4 PLLs for clock management, targeting cost- and power-sensitive designs. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that can be reconfigured by the designer after manufacturing. FPGAs sit between fixed-function ASICs and software-driven processors in the compute hierarchy - offering hardware parallelism and custom logic without the NRE cost of an ASIC. The Cyclone III LS family specifically targets low static power (approximately 0.25 W typical for this density) and high logic density per dollar for high-volume applications such as industrial control, video processing, and communications infrastructure. Key features of this part include 70,208 logic elements, 4 M9K memory blocks totaling approximately 3 Mb of RAM, 4 PLLs, 247 embedded multipliers (18x18), and 20 global clock networks. The device operates from a 1.2 V core supply with separate VCCIO banks supporting 1.5 V, 1.8 V, 2.5 V, 3.0 V, and 3.3 V I/O standards including LVDS, LVTTL, SSTL, and PCI Express. Configuration is supported via JTAG, passive serial, active serial (EPCS), and fast passive parallel modes using external configuration devices. Architecturally, the Cyclone III LS uses a 60 nm process technology and incorporates hard memory blocks (M9K) and hard multiplier blocks distributed across the fabric, providing deterministic performance for DSP and data-path operations. The 484-UBGA package has a 1.0 mm ball pitch in a 19x19 mm body, with 278 user I/O pins allocated across 8 I/O banks. Memory interfaces up to DDR2/DDR SDRAM are supported via soft PHY in the Quartus II design software. Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment prototypes, low-cost ASIC prototyping, PCI Express endpoint bridges, and consumer display controllers. The industrial temperature grade also makes it suitable for outdoor telecom equipment and factory automation where commercial-grade parts would fail. The 70K LE density is well-matched to medium-complexity designs that exceed typical CPLD capacity but do not justify higher-density FPGAs. When designing with this part, careful attention must be paid to the four configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL) and the dual-purpose nature of shared pins - some user I/O pins double as configuration or JTAG pins and must be correctly assigned in the Quartus pin planner. The 1.0 mm ball pitch of the UBGA-484 package requires ENIG or OSP surface finish and 4-6 layer PCB stackup with microvia or via-in-pad for breakout routing.

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EP3CLS70U484I7N - Cyclone III LS FPGA 70K LE | Intel | 484-FBGA
EP3CLS70U484I7N

EP3CLS70U484I7N - Cyclone III LS FPGA 70K LE | Intel | 484-FBGA

The Intel (formerly Altera) EP3CLS70U484I7N is a Cyclone III LS family field-programmable gate array (FPGA) housed in a 484-ball FineLine BGA (UBGA) package, offering 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 user I/O pins. Built on a low-power 60-nm process, it targets industrial applications where static-power-sensitive designs and high logic density must coexist with cost-sensitive budgets. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as memory blocks, DSP blocks, and high-speed transceivers. FPGAs sit in the hierarchy between simple microcontrollers (fixed-function CPUs) and ASICs (custom-fabricated chips), offering hardware-level parallelism for signal processing, glue logic, and protocol bridging while remaining reprogrammable in the field. The EP3CLS70U484I7N integrates four PLLs for clock management, dedicated hardware multipliers (18x18) for DSP pipelines, and Cyclone III LS enhanced security features including AES bitstream encryption and JTAG protection. Its 1.2 V core supply, with hot-socketing support and hot-swap compliance, allows the device to be inserted into a live backplane without damage, ideal for industrial and telecom systems requiring field serviceability. Cyclone III LS architecture combines the Cyclone III logic fabric with the Cyclone III LS hardening features that lower static power and add anti-tamper bitstream protection. The 484-UBGA package supports extensive user I/O count (278) for high-density parallel interfaces such as DDR2 memory controllers, LVDS buses, and legacy parallel ADC/DAC interfaces commonly used in industrial control and instrumentation. Typical applications include industrial motor control, factory automation backplanes, video surveillance encoders, telecom line cards, and portable medical instrumentation. The low static power makes the EP3CLS70U484I7N suitable for fanless embedded platforms where thermal dissipation is constrained and long-term reliability under continuous bias is critical. When designing with this device, allocate sufficient decoupling (100 nF + 10 uF per supply rail) near each power pin, and use Intel's Quartus Prime design suite (version 13.1 or later) for synthesis, place-and-route, and bitstream generation. Ensure the JTAG chain includes 10 kohm pull-ups on TMS and TCK for proper configuration behavior at power-up. This page synthesizes distributor inventory data, drop-in alternatives from the same Cyclone III LS family, and design guidance derived from Intel's Cyclone III Device Handbook, providing information gain beyond the bare datasheet.

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EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
EP3SE110F1152C2

EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel

The Intel (formerly Altera) EP3SE110F1152C2 is a high-density Stratix III E Field-Programmable Gate Array (FPGA) fabricated on a 65 nm process, delivering 107,500 logic elements and 8,936,448 embedded memory bits in a 1152-ball FC-BGA package with 744 user I/Os. Operating from a 0.9 V core supply, the device supports internal clock frequencies up to 800 MHz and is rated for the commercial 0C to 85C temperature range, targeting high-performance digital signal processing, telecommunications, and ASIC-prototyping workloads. The part belongs to the Stratix III Enhanced (E) sub-family, which adds dedicated DSP blocks and TriMatrix embedded memory optimized for parallel arithmetic pipelines. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture combines an array of configurable logic blocks (CLBs), programmable interconnect, and hardened silicon IP such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the programmable-logic hierarchy: they offer software-reconfigurable hardware parallelism (orders of magnitude faster than microcontrollers for parallel tasks) while avoiding the NRE cost and long lead times of ASICs. Stratix III in particular belongs to Intel/Altera's high-end FPGA taxonomy, above Cyclone (low-cost) and below Stratix IV/V (high-end) in price and performance. The 'E' sub-family emphasizes enhanced DSP and memory density over transceivers. Key features of the EP3SE110F1152C2 include 107,500 logic elements, 4,300 Logic Array Blocks (LABs), 8,936,448 bits of TriMatrix embedded memory organized in MRAM, M9K, and M144K blocks, an extensive DSP block array, and 744 user I/Os supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The device integrates dedicated PLL and DLL clock management with up to 12 PLLs per device, supporting both external and internal feedback. The 1152-ball FineLine BGA package provides ample signal integrity headroom for multi-gigabit parallel interfaces. Architecturally, the device leverages Altera's classic ALM (Adaptive Logic Module) logic element, an 8-input fracturable lookup table capable of implementing any 6-input LUT plus a second smaller function, plus dedicated arithmetic carry chains. The TriMatrix memory hierarchy delivers three distinct block sizes (640-bit MRAM, 9 Kbit M9K, 144 Kbit M144K) so designers can map small FIFL and wide data buffers without wasting silicon. The 65 nm process node offers an attractive performance/watt envelope for embedded applications where newer nodes would be cost-prohibitive. Typical applications for the EP3SE110F1152C2 include high-performance digital signal processing in defense and test-and-measurement, ASIC prototyping where designers validate million-gate RTL on real silicon before tape-out, telecom line-card packet processing, video broadcast processing, and high-speed data acquisition. It is also used as a hardware-acceleration coprocessor in medical imaging (CT, MRI reconstruction pipelines) and radar/sonar front-ends. The 1152-ball FC-BGA package is suitable for high-layer-count PCBs with controlled-impedance routing. When designing with this device, ensure your PCB has a sufficient number of layers (12+ recommended for 1152-ball BGA escape routing) and that the JTAG chain and configuration memory are correctly implemented per the Strat III configuration user guide. Power sequencing must respect the 0.9 V core, 1.1 V analog, and I/O rail requirements. Plan for a substantial decoupling network - at minimum one 100 uF bulk cap per rail plus 0.1 uF and 0.01 uF ceramics around the BGA. The 1152-ball FC-BGA requires Xilinx/Altera-recommended footprint and reflow profile. This page consolidates distributor inventory, current market pricing, and pin-compatible Stratix III E alternatives into a single design reference - useful information that supplements the manufacturer datasheet.

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EP3SE110F1152C2N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Altera
EP3SE110F1152C2N

EP3SE110F1152C2N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Altera

The Intel (formerly Altera) EP3SE110F1152C2N is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) built on a 65 nm process node, delivering 107,500 logic elements in a 1152-ball FineLine BGA (FC-FBGA) package with 744 user I/Os. The device supports up to 8,936,448 bits of embedded memory and operates with a core voltage of 1.1 V and a maximum core clock frequency of 600 MHz per Stratix III E family specifications. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines the integration density of an Application-Specific Integrated Circuit (ASIC) with the flexibility of software-reconfigurable logic. FPGAs sit at the top of the digital logic hierarchy, above standard logic ICs, microcontrollers, and DSPs. The Stratix III E family is Altera's high-performance, DSP-and-transceiver-rich tier engineered for digital signal processing, high-speed serial I/O, and embedded processor subsystems, and is positioned within Intel's broader FPGA portfolio (Cyclone, Arria, Stratix, Agilex) for high-throughput compute and communications workloads. Key features of the EP3SE110F1152C2N include 4,300 Logic Array Blocks (LABs) in the Stratix III E ALM-based fabric, embedded DSP blocks for high-speed multiply-accumulate operations, up to 24 transceivers capable of multi-gigabit serial links, and a programmable power technology that dynamically reduces static power. The device also integrates PCI Express hard IP, external memory controllers (DDR/DDR2/QDRII/RLDRAM), and a rich clock network with PLLs. Operating temperature is graded commercial (0 °C to +85 °C) as indicated by the "C2" speed/temperature grade code. Typical applications include high-performance digital signal processing, telecom baseband processing, ASIC prototyping, software-defined radio, video processing pipelines, and high-throughput industrial imaging. The high logic density and generous embedded memory make the EP3SE110F1152C2N suitable for system-on-chip prototyping and compute acceleration in communications infrastructure. When designing with the EP3SE110F1152C2N, careful attention must be paid to power-rail sequencing, multi-layer PCB stack-up with continuous reference planes, and signal integrity on high-speed serial links. The FC-FBGA package requires via-in-pad or microvia technology for breakout routing, and a minimum of 12 PCB layers is typically recommended. This page synthesizes distributor pricing, drop-in same-package alternatives, and engineering design notes not found in the standalone manufacturer datasheet.

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EP3SE110F1152C2NES - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152
EP3SE110F1152C2NES

EP3SE110F1152C2NES - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152

The Intel (Altera) EP3SE110F1152C2NES is a high-density Stratix III Enhanced FPGA from the EP3SE110 family, fabricated on a 65 nm process and housed in a 1152-pin FC-FBGA package. According to the Stratix III Device Handbook summary on Alldatasheet, this device integrates 107,500 logic elements, 744 user I/O pins, and operates at a core voltage of 1.1 V with a maximum internal clock frequency of 600 MHz. It is positioned for high-performance digital signal processing, ASIC prototyping, and high-throughput parallel processing applications. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that implements arbitrary digital logic through a configurable array of logic elements, embedded memory blocks, DSP blocks, and programmable interconnect. Within the broader taxonomy, the EP3SE110 sits inside: FPGA -> Programmable Logic -> Logic IC -> Integrated Circuit -> Semiconductor. The Stratix III family succeeded Stratix II in Altera's high-end portfolio and is widely deployed in telecommunications, military/aerospace, and test equipment where deterministic performance and abundant parallel arithmetic matter more than low static power. Key features highlighted in distributor listings include 107,500 logic elements, 744 user I/Os, 65 nm process technology, 1.1 V core supply, 600 MHz maximum frequency, and the flip-chip BGA-1152 thermal package. The device integrates dedicated DSP blocks for fixed- and floating-point operations, embedded M9K memory blocks, and high-speed transceivers (the exact transceiver count varies by speed grade and is not detailed in the provided web data). The enhanced (E) variant increases logic and memory resources versus the base Stratix III. Architecturally, Stratix III E devices use Altera's adaptive logic module (ALM) with 8-input fracturable look-up tables, providing higher effective density than 4-input LUT predecessors. The 1.1 V core supply combined with programmable power technology allows unused regions to be powered down, reducing dynamic consumption in partially utilized designs. The flip-chip BGA package improves thermal dissipation for high-utilization workloads. Typical applications include high-end telecommunications line cards, ASIC prototyping platforms, military and aerospace signal processing, video broadcast equipment, high-performance computing accelerators, and industrial test and measurement instrumentation. With 744 user I/Os, the device supports wide external memory buses (DDR2/DDR3) and multiple high-speed parallel interfaces simultaneously. When designing with this part, plan the PCB for the FC-FBGA-1152 footprint with controlled-impedance routing, matched-length high-speed pairs, and a multi-layer stack-up with continuous power/ground planes. Ensure the Quartus II toolchain (or compatible Altera/Intel FPGA software) is available for bitstream generation, as legacy Stratix III support is gated to specific Quartus versions. This page synthesizes distributor availability, drop-in alternative MPNs, and practical design notes not found in the manufacturer datasheet, giving engineers an authoritative starting point for sourcing and second-sourcing the EP3SE110F1152C2NES.

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EP3SE110F1152C3 - 107500 Logic Elements Stratix III FPGA | Intel
EP3SE110F1152C3

EP3SE110F1152C3 - 107500 Logic Elements Stratix III FPGA | Intel

The Intel (formerly Altera) EP3SE110F1152C3 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) with 107,500 logic elements, 744 user I/Os, and an 8,936,448-bit embedded memory, housed in a 1152-ball Flip-Chip BGA (FCBGA) package. Built on a 40 nm process, this Stratix III E variant targets performance-oriented designs that require a balance of high logic density, abundant block memory, and a rich transceiver mix. An FPGA (Field Programmable Gate Array) is a reprogrammable digital integrated circuit containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and hardened IP such as block RAM, DSP slices, and high-speed transceivers. Stratix III sits in Intel's high-performance FPGA hierarchy below Stratix IV/V/10 and above Cyclone families, optimized for ASIC prototyping, signal processing, and high-throughput data-path designs. Key features include 4,300 Logic Array Blocks (LABs), an 800 MHz internal operating frequency, a 0.9 V core supply rail, and per-device transceivers suitable for multi-gigabit serial links. The 1152-BBGA FCBGA package supports high pin counts while maintaining the signal integrity required by parallel DDR interfaces and stacked die integration. Hardened memory controllers and embedded transceivers offload common functions from soft logic. Architecturally, the device uses Altera's adaptive logic module (ALM) with 8-input fracturable look-up tables, multi-track interconnect with continuous routing, and TriMatrix memory blocks (MLAB, M9K, M144K). The combination enables both register-rich datapath designs and memory-heavy packet-processing implementations. Typical applications include ASIC prototyping and emulation, high-speed digital signal processing, radar and beamforming front-ends, software-defined radio baseband, and high-end test and measurement instruments. The high user-I/O count also suits parallel video processing and high-channel-count data-acquisition backplanes. When designing, plan power-rail sequencing carefully because Stratix III requires well-ordered ramp-up of the 0.9 V core and auxiliary supplies; many designs also use SmartVID to minimize quiescent power. Use the Quartus II toolchain with the Stratix III device library for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, package-level drop-in notes, and engineering guidance not found in the manufacturer datasheet, helping procurement and design engineers evaluate the EP3SE110F1152C3 against same-family and cross-family alternatives.

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EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel
EP3SE110F1152C3N

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

The Intel (formerly Altera) EP3SE110F1152C3N is a high-density Stratix III E Field Programmable Gate Array (FPGA) IC with 107,500 logic elements, 744 user I/Os, and 8,936,448 bits of embedded memory, packaged in a 1152-ball flip-chip fine-pitch BGA (FC-FBGA-1152). The device operates at a nominal core voltage of 1.1V (with an I/O supply range that supports multiple single-ended and differential standards) and is rated for commercial temperature grade (0 to 85 °C). It is fabricated on a 65 nm TSMC process with the C3 speed grade, targeting high-performance logic and DSP-intensive designs. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows engineers to implement arbitrary digital logic by configuring an array of configurable logic blocks (CLBs), interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) and are widely used as a flexible alternative to ASICs in applications that demand parallelism, hardware acceleration, and fast time-to-market. Key features of the EP3SE110F1152C3N include 4,300 logic array blocks (LABs), up to 8,936,448 RAM bits organized in M9K and M144K memory blocks, embedded DSP blocks for high-throughput fixed- and floating-point arithmetic, support for external memory interfaces including DDR3 with read/write leveling, and high-speed LVDS I/O with SERDES capability. The Stratix III E family integrates programmable power technology, allowing unused blocks to enter a low-power state for energy efficiency. The architecture combines a multi-tier routing fabric with a programmable power network, enabling trade-offs between performance and dynamic power. The 65 nm process and 12-layer flip-chip package provide the signal integrity required for multi-gigabit serial interfaces and 400 MHz external memory interfaces typical of telecom and DSP applications. Typical applications include high-performance digital signal processing, wireline and wireless baseband processing, military/aerospace signal processing, ASIC prototyping, high-speed data acquisition, and video broadcast equipment. The 744 user I/Os and large logic capacity also make the EP3SE110F1152C3N well-suited for protocol bridging and custom interface aggregation. Designers should plan PCB layout for the 35 mm × 35 mm FC-FBGA-1152 package with at least 6 routing layers, use controlled impedance for high-speed differential pairs, and follow Intel's power distribution decoupling guidelines for Stratix III to achieve the published 500 MHz core performance and full I/O bandwidth. This page synthesizes distributor stock data, drop-in same-package alternatives from the Stratix III family, and Stratix III power/PCB design notes not found in a single distributor listing, helping engineers compare alternatives and qualify supply faster.

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EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

The Intel (formerly Altera) EP3SE110F1152C4 is a high-density Stratix III E field-programmable gate array (FPGA) containing 107,500 logic elements, 8,936,448 bits of embedded memory, and 744 maximum user I/Os, housed in a 1152-ball flip-chip BGA (FCBGA) package with commercial-grade temperature rating. Built on a 65nm process node, this device operates from a 1.1V core supply and supports up to 450MHz performance across its logic fabric and DSP blocks, making it suitable for high-throughput parallel processing tasks. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined after manufacture through configuration memory (SRAM cells). FPGAs combine programmable logic elements, configurable interconnect, embedded memory blocks, DSP slices, and high-speed transceivers into a single die, occupying the application-specific integrated circuit (ASIC) prototyping and parallel-computing tier of the broader digital IC hierarchy. Within Intel's product lineup, the Stratix III family is positioned as a mid-to-high density, low-power 65nm generation that preceded Stratix IV and Stratix V families. The EP3SE110F1152C4 delivers up to 896 embedded multiplier 18x18 blocks, dedicated high-speed DSP blocks, and modular I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, SSTL, and other differential signaling standards. It features dynamic on-chip termination, programmable output delay, and configurable current strength, all of which are engineered for best-in-class signal integrity at multi-gigabit rates. Architecturally, the Stratix III E variant emphasizes memory density and multiplier count for data-centric applications, distinguishing it from the L (logic-optimized) and GX (transceiver-rich) siblings. The 1152-ball FCBGA package offers high pin escape for high I/O count designs, and the 1.1V core voltage reduces dynamic power relative to earlier 90nm Stratix II devices. Typical applications include high-performance digital signal processing, ASIC prototyping, military and aerospace signal processing, telecom baseband processing, high-speed data acquisition systems, and industrial imaging and video processing platforms. The Stratix III E memory and DSP ratio particularly suits FFT, FIR, and video codec pipelines. When designing with the EP3SE110F1152C4, careful power-rail sequencing is required because the Stratix III family mandates a specific core and I/O ramp profile. Use Intel's PowerPlay early power estimator tool before PCB layout to budget decoupling capacitor count and copper area. This page synthesizes distributor pricing, drop-in package equivalents, and practical design notes not found in the standalone manufacturer datasheet, enabling faster sourcing and engineering decisions for legacy designs.

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EP3SE110F1152C4L - Stratix III E FPGA 107500 LEs 1152-FBGA | Intel
EP3SE110F1152C4L

EP3SE110F1152C4L - Stratix III E FPGA 107500 LEs 1152-FBGA | Intel

The Intel EP3SE110F1152C4L is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) integrating 107500 logic elements and 8936448 bits of embedded memory in a 1152-ball Fine-pitch Ball Grid Array (FBGA) package. Operating at up to 800 MHz internal frequency with a 0.9 V core supply, it is engineered for high-performance digital signal processing, ASIC prototyping, and high-bandwidth data-path designs. The device exposes 744 user I/O pins to support parallel chip-to-chip interconnects. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that lets engineers implement arbitrary digital logic through configurable logic blocks (CLBs), routing interconnect, and hard IP blocks such as transceivers and memory controllers. FPGAs sit in the broader hierarchy of programmable logic -> logic IC -> integrated circuit -> semiconductor. Compared to ASICs, FPGAs offer in-system reprogrammability and faster time-to-market; compared to CPLDs, they deliver orders-of-magnitude higher logic capacity and richer DSP/embedded-memory resources. Key features of the EP3SE110F1152C4L include 107500 logic elements for high gate-count designs, 8936448 bits (about 8.9 Mbit) of embedded RAM for packet buffering and data caching, 744 maximum user I/Os for wide external buses, and 800 MHz maximum internal operation for high-throughput datapaths. The 1152-ball FCBGA package supports controlled-impedance signal routing required by LVDS and DDR memory interfaces typical of Stratix III designs. Architecturally, the Stratix III E series uses an enhanced adaptive logic module (ALM) fabric and MultiTrack interconnect for predictable timing closure. Hard IP blocks include high-speed transceivers, dedicated DSP blocks, and embedded TriMatrix memory that can be configured as single-port, simple dual-port, or true dual-port with separate read/write clocks. Typical applications include ASIC prototyping, high-speed networking line cards, DSP accelerator cards, video broadcast equipment, and test and measurement platforms. The combination of high logic density, abundant I/O, and 8.9 Mbit embedded RAM makes it suitable for designs previously requiring multiple smaller FPGAs. When designing with this device, ensure PCB layout supports the FCBGA ball pitch with microvia stack-ups, and that the Quartus II toolchain version matches the device silicon revision (C4 speed grade 4, commercial temperature 0C-85C). Plan power sequencing for the 0.9 V core rail with sufficient decoupling. This page synthesizes distributor inventory, same-family drop-in variants, and Stratix III design notes not consolidated on any single manufacturer or distributor page.

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EP3SE110F1152C4LN - 107.5K LE Stratix III E FPGA, 1152-FCBGA
EP3SE110F1152C4LN

EP3SE110F1152C4LN - 107.5K LE Stratix III E FPGA, 1152-FCBGA

The Altera (Intel) EP3SE110F1152C4LN is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) housed in a 1152-pin Fine-Pitch Chip-Scale Ball Grid Array (FC-FBGA / BBGA) package. It contains 107,500 logic elements (LEs) and 4,300 Logic Array Blocks (LABs), and integrates 8,936,448 bits of embedded memory. The device exposes 744 user I/Os and supports an internal clock infrastructure rated up to 717 MHz (some catalog sources list 800 MHz internal). Core logic operates from a 0.9 V nominal supply (0.86 V to 0.94 V range), with the 65 nm Stratix III process node targeting the lowest-possible power for high-density FPGAs of its era. An FPGA is a programmable logic device whose interconnect, look-up tables, and memory blocks can be reconfigured in-circuit to implement arbitrary digital functions, DSP blocks, and memory subsystems. The Stratix III E family is the enhanced-logic variant, optimized for high logic density and embedded memory rather than transceivers. Within Intel/Altera's broader hierarchy, the part sits as: LE -> LAB -> FPGA -> programmable logic -> digital IC -> semiconductor. This taxonomy supports AI knowledge-graph ingestion and long-tail discovery for engineers searching for high-density, low-power FPGA alternatives. Key features include 8.9 Mbits embedded RAM, dedicated DSP blocks for high-throughput arithmetic, MultiTrack interconnect for predictable timing closure, and Adaptive Logic Modules (ALMs) that improve logic utilization over previous architectures. The device supports multiple I/O standards through its 744 user I/O pins and exposes programmable PLLs for clock synthesis. Configuration is typically loaded through JTAG or a serial/parallel flash, with built-in CRC and encryption options on the family. The architecture combines a fabric of ALMs with high-speed interconnect and dedicated DSP slices, making the EP3SE110F1152C4LN well-suited for parallel datapaths, signal processing, and protocol bridging where many independent channels must operate concurrently. The 65 nm process enables high utilization rates at modest static power compared with earlier 90 nm Stratix II devices. Typical applications include telecommunications line cards, software-defined radio (SDR) baseband processing, video broadcasting infrastructure, high-channel-count DSP pipelines, ASIC prototyping, and industrial control subsystems requiring hundreds of I/Os. The wide 1152-pin package exposes enough I/O and memory interfaces for multi-port memory controllers and parallel bus structures. A practical design consideration is PCB layout: the FC-FBGA-1152 package demands high-density multi-layer routing (typically 8 to 12 layers), controlled-impedance traces, and a thorough power-delivery network (PDN) with bulk plus decoupling capacitors placed close to the supply pins. Engineers should follow Intel/Altera's Stratix III PCB design guidelines to maintain signal integrity at the rated 717 MHz internal frequency. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the Stratix III E family, and practical design guidance not always present in the manufacturer datasheet, giving sourcing engineers and FPGA designers a single, AI-citable reference.

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EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
EP3SE110F1152C4N

EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

The Intel (formerly Altera) EP3SE110F1152C4N is a high-density, high-performance Stratix III Enhanced (E) family Field Programmable Gate Array (FPGA) fabricated on a 65 nm low-power process. It integrates 107,500 logic elements, 8,936,448 bits of embedded memory, 896 embedded 18x18 multipliers, and is housed in a 1152-ball Flip-Chip BGA (FCBGA) package with commercial temperature grade (0C to +85C). It operates from a 1.1 V core supply and supports modular I/O banks with common bank structure for vertical migration. A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration data after manufacture. Within the broader taxonomy, FPGAs sit alongside ASICs and CPLDs as reconfigurable logic devices, but offer the highest logic density and the highest performance-per-watt ceiling in the FPGA category. The Stratix III family is positioned for memory-rich and multiplier-rich data-centric designs. Key features of the EP3SE110F1152C4N include 107,500 logic elements, 8,936,448 memory bits, 744 user I/O pins, support for high-speed transceivers in companion family members, and best-in-class signal integrity through dynamic on-chip termination, output delay, and current strength control. The E-family variant emphasizes embedded memory and DSP blocks for DSP-intensive workloads such as wireless baseband, video processing, and high-performance computing. The device architecture combines adaptive logic modules (ALMs), TriMatrix embedded memory (MLAB, M9K, M144K blocks), DSP blocks, and modular I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, SSTL, and PCIe. Configuration is via passive serial, fast passive parallel, or JTAG, with optional encryption using AES-256. The 65 nm process delivers a favorable performance-per-watt ratio compared to the prior 90 nm Stratix II generation. Typical applications include high-end communications infrastructure (10G/40G Ethernet line cards, OTN framer/mapper, baseband processing), high-performance computing accelerators, ASIC prototyping, broadcast video processing, and military/aerospace signal processing. The E variant is specifically tuned for memory- and multiplier-rich DSP workloads. Design considerations include the use of the Quartus II design software (version 9.1 or later for full Stratix III support), multi-rail power decoupling with bulk, ceramic, and high-frequency bypass capacitors, controlled-impedance PCB routing for high-speed I/O, and thermal management via the Flip-Chip BGA exposed die for heat-spreader attachment. Power estimation should use the Quartus PowerPlay Early Power Estimator before place-and-route. This page consolidates distributor pricing, drop-in alternatives, and practical design notes not found in a single datasheet view. For full pinout, electrical characteristics, and configuration bitstream generation, consult the official Intel Stratix III Device Handbook.

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EP3SE110F1152I2N - Stratix III E 107.5K LE FPGA | Intel / Altera
EP3SE110F1152I2N

EP3SE110F1152I2N - Stratix III E 107.5K LE FPGA | Intel / Altera

The Intel (formerly Altera) EP3SE110F1152I2N is a high-density Stratix III Enhanced Field-Programmable Gate Array (FPGA) delivering 107,500 logic elements organized within 4,300 logic array blocks (LABs), housed in a 1,152-ball flip-chip BGA (FCBGA) package with 1.00 mm terminal pitch. The device is fabricated on a low-power CMOS process and is rated for industrial temperature operation from -40C to +100C. The 'I2' speed grade and 'N' lead-free RoHS suffix indicate an industrial-grade, lead-free assembly variant. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic fabric, interconnect, and I/O can be configured by the user after manufacture. FPGAs sit in the programmable-logic tier of the broader digital IC hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor) and are used to implement parallel datapaths, high-speed serial interfaces, and custom glue logic that would otherwise require several discrete components or a custom ASIC. Key features include up to 8,936,448 system gates, embedded memory blocks, DSP blocks, and high-speed transceivers supporting multi-gigabit serial protocols. The device operates from a 1.05 V to 1.15 V core supply (nominal 1.1 V) plus dedicated PLL and I/O bank supplies. Up to 744 user I/O pins are available depending on bank configuration, and the 1.00 mm-pitch FCBGA-1152 package is designed for high-density, multi-layer PCB assembly. Architecturally, Stratix III Enhanced devices use a 40-nm low-power process and a programmable power technology that lets unused logic, memory, and transceiver blocks enter a near-zero static state. The fabric combines adaptive logic modules (ALMs), TriMatrix embedded memory (MLAB, M9K, M144K blocks), and DSP blocks that together provide tens of GMACs of DSP throughput. Typical applications include high-speed wireline and wireless baseband processing, ASIC prototyping, high-performance digital signal processing, broadcast video processing, and high-end test-and-measurement instrumentation. The high pin count and serial bandwidth make it well-suited for line-card designs and protocol bridge functions. When designing with this device, plan PCB stack-up for the 1.0 mm-pitch FCBGA, route all transceiver differential pairs with controlled impedance, and observe the Quartus II power-estimator early in the design cycle. Power-supply sequencing and decoupling must follow the Stratix III Enhanced pin connection guidelines to avoid stress on the core logic. This page synthesizes distributor pricing, package-specific alternatives from the Stratix III Enhanced family, and practical design notes that complement the manufacturer datasheet.

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EP3SE110F1152I3 - Stratix III E FPGA 107.5K LE 1152-FBGA | Intel
EP3SE110F1152I3

EP3SE110F1152I3 - Stratix III E FPGA 107.5K LE 1152-FBGA | Intel

The Intel (formerly Altera) EP3SE110F1152I3 is a high-density Stratix III E Field Programmable Gate Array (FPGA) delivering 107,500 logic elements in a 1152-pin FC-FBGA package. Built on a 1.1-V, 65-nm all-layer copper SRAM process, it provides 8,936,448 bits of embedded memory, 4,300 LABs/CLBs, and 744 user I/Os while operating up to 500 MHz core frequency. What is a Stratix III E FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers configure to create custom digital circuits. Stratix III E is a high-performance enhanced variant within Intel's Stratix III family, optimized for DSP, ASIC-prototype, and embedded-processor applications requiring very high logic density and embedded memory bandwidth. Key features include 384 (18x18) multipliers for DSP, up to 8 embedded transceiver blocks supporting 3.125 Gbps data rates, and partial reconfiguration capability that allows portion-by-portion logic reprogramming during operation. The FPGA integrates hard PCIe, memory controllers, and SERDES blocks, reducing external component count. Architecturally, Stratix III E uses ALM (Adaptive Logic Module)-based LABs, an 8-input fracturable look-up table structure, and variable-precision DSP blocks that can be configured for 9x9, 18x18, or 36x36 multiplications. The programmable power technology enables fine-grained power gating of logic, memory, and DSP regions, delivering up to 50% lower power than competing devices at equivalent performance. Typical applications include high-end ASIC prototyping, digital signal processing (radar, medical imaging, wireless baseband), high-speed data acquisition, software-defined radio, and high-throughput networking line cards. The 8.9 Mbit embedded memory and 384 multipliers make it ideal for FFT/iFFT engines, video codecs, and encryption accelerators. When designing with this part, follow Intel's Stratix III pin connection guidelines for unused pins, and use the Quartus II (13.0 or later) design tool chain. Because the device operates at 1.1 V core, decoupling requires low-impedance power planes rather than simple capacitor networks. This page synthesizes distributor pricing, drop-in Stratix III E and Stratix III L alternatives with the same 1152-FBGA footprint, and practical thermal/PCB design notes not found in the manufacturer datasheet.

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